Abstract: A sputtering target which is composed of a sintered body of an oxide which contains at least indium, tin, and zinc and includes a spinel structure compound of Zn2SnO4 and a bixbyite structure compound of In2O3. A sputtering target includes indium, tin, zinc, and oxygen with only a peak ascribed to a bixbyite structure compound being substantially observed by X-ray diffraction (XRD).

Abstract: An electrically conductive wire (D) is provided which is constructed on the basis of copper and which includes a core (1) as well as a layer (2) metallically connected to the layer (2), while the layer (2) has a proportion of the wire cross section which is between 20% and 50% of the cross section of the wire. The core (1) on the one nano and the layer (2) surrounding the core (1) consist of different materials on the basis of copper.

Abstract: The present invention relates to a method of forming copper nanowires with a metallic coating. In a preferred embodiment, the metallic coating is copper. Due to the metal coating, the nanowires become magnetically guidable and chemically stable. As such, the nanowires can be used to form nanomesh. Further, the nanowire and nanomesh of the present invention can be used as transparent electrodes that are used in TV, PC, touch-control, and solar industries.

Abstract: A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer.

Abstract: An iridium oxide coating for application on an external surface of an electrode of a medical lead is described. The iridium coating is applied using pulse DC sputtering. The coating provides the electrode with an increased double layer capacitance and a reduced electrical impedance. The iridium oxide coating is characterized as having a dense structure with a surface morphology having the general appearance of a fractal or cauliflower shape. The pulse DC sputtered iridium oxide coating is achieved through a mixture ratio of oxygen and argon gases, a sputtering power of between 75 to 125 W, a chamber pressure ranging from about 20-30 mTorr, and a frequency ranging from 50 kHz to 150 kHz. The coated electrode may be used to facilitate the injection of electrical charge stimulation and/or monitor biorhythms of cardiac and neurological tissue.

Abstract: An electric wire contains a conductive wire having at least a groove structured on the surface of the conductive wire, and an additional wire to be filled into the groove. The groove is provided on an outer surface of the conductive wire along a longitudinal direction of the conductive wire. The additional wire is inserted in the groove.

Abstract: An electronic-component lead terminal includes a lead terminal one end of which is connectable to an electronic component and the other end of which is connectable to an electrode, and a solder-wicking prevention area formed on a surface of the lead terminal so as to intersect a solder-wicking direction oriented from the other end toward the one end, the solder-wicking prevention area including a plurality of portions projecting to a downstream side in the solder-wicking direction.

Abstract: A composite oxide sintered body includes In, Zn, and Sn, and has a relative density of 90% or more, an average crystal grain size of 10 ?m or less, and a bulk resistance of 30 m?cm or less, the number of tin oxide aggregate particles having a diameter of 10 ?m or more being 2.5 or less per mm2 of the composite oxide sintered body.

Abstract: A composite conductor 10, including an internal layer 11 having a conductive material A, the conductive material A having fatigue strength of at least 150 MPa after being subjected to 106 cycles of cyclic loading in a fatigue test, and an external layer 12 having a conductive material B, the external layer coating the internal layer 11, the conductive material B having tensile strength higher than that of the conductive material A, the tensile strength being at least 250 MPa, in which the composite conductor 10 has fracture resistance to a sudden load and impact as well as bending durability.

Abstract: An electric wire includes a conductive portion 11 made of a material having a volume resistivity higher than that of copper, wherein the volume resistivity of the conductive portion is specified so that, in a frequency range in which the electric wire is used, a ratio of AC resistance of the conductive portion 11 to AC resistance of reference copper wire is less than 1.

Abstract: A conductor for a communications cable includes an elongated metal wire and a metal sheet that includes a plurality of carbon nanotubes that at least partially surrounds the elongated metal wire. The metal wire may include copper, and the metal sheet may likewise include copper and may be welded to an outside surface of the metal wire to surround the metal wire. This conductor may be used in a variety of communications cables that carry high frequency signals.

Abstract: A method for preparing a nanometal-polymer composite conductive film includes the steps of (1) mixing a metal oxide with a polymer solution; (2) coating a substrate with a solution resulting from step (1), followed by drying the resultant solution to form a film; (3) performing thermal treatment on the film formed in step (2); and (4) sintering the film thermally treated in step (3). The method dispenses with any reducing agent or dispersing agent but allows nanometallic particles to be formed in situ and thereby reduces surface resistance of the polymer film efficiently.

Abstract: According to one embodiment, a manufacturing method of an electronic component comprises laminating aluminum plates via a nickel member in at least a part thereof; forming a bus bar having welded portions and non-welded portions by welding part of the laminated aluminum plates and the nickel member at positions; and welding an electrode terminal of an electronic component to the aluminum plates and the nickel member.

Abstract: In some embodiments, a system includes a first portion, a second portion, and a third portion of an electrical conductor. Each portion is electrically coupled to the other two portions. The first, second, and third portions are configured such that substantially no current induced in and/or supplied to the first portion is conducted to the third portion of the electrical conductor. The third portion of the electrical conductor is also thermally coupled to the first and second portions of the electrical conductor. The third portion of the electrical conductor is configured to transfer thermal energy from the first portion of the electrical conductor to an edge portion of the laminated composite assembly.

Abstract: The invention forms a Sn coating layer and a Cu—Sn alloy coating layer having a suitably controllable planar shape in a PCB terminal. A group of Sn coating layers being as a plurality of essentially parallel lines is formed as the surface coating layer, and a Cu—Sn alloy coating layer 2 is exposed on the outermost surface on both sides of Sn coating layers each constituting the group of Sn coating layers. The Sn coating layers have a width of 1 to 500 ?m, an interval between adjacent Sn coating layers is 1 to 20000 ?m, and an outermost maximum height roughness in a terminal insertion direction is at most 10 ?m.

Abstract: There is provided a lead frame including a plurality of plating layers formed on both an upper surface and a lower surface of a base material including a metal, wherein an upper outermost plating layer of an upper part of the lead frame is a silver plating layer including silver, and a lower outermost plating layer of a lower part of the lead frame is a gold plating layer including gold.

Abstract: The present invention relates to a terminal structure and an electronic device having the terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni3P, laid on the first layer; and a third layer containing a first intermetallic compound of an Ni—Cu—Sn type, laid on the second layer; and a solder layer on the third layer of the terminal. A second intermetallic compound of an Ni—P—Sn type partly covers a surface of the second layer on the third layer side and a maximum thickness of the second intermetallic compound in a lamination direction is from 0.05 to 0.7 ?m.

Abstract: A composite conductor is disclosed having an elongate support with an outer surface of a whisker-forming metallic, the conductor further having a carbon nanotube yarn intertwined with the elongate support. The yarn is infiltrated by self-assembled whiskers from the whisker forming metallic.

Abstract: Composite structural components are disclosed that include electrically conducting fibers providing multiple signal or paths to electrical components disposed on or adjacent the material. The signal paths may therefore be embedded in the structural component as an intrinsic reinforcing element. Also disclosed are materials for making up the structure and fabrics and methods for the production thereof.

Abstract: A high-speed transmission cable conductor includes a core material includes mainly copper, and a surface treated layer formed around a surface of the core material. The surface treated layer includes an amorphous layer including a metal element having a higher affinity for oxygen than the copper, and oxygen.

Abstract: Provided is a conductive paste, an electrode for a semiconductor device manufactured by using the conductive paste, a semiconductor device and a method for manufacturing the semiconductor device. The conductive paste includes conductive powder made of a plurality of conductive particles and silver powder made of a plurality of silver particles. The conductive particles includes a base material made of ceramics and a conductive layer configured to cover at least a part of an outer surface of the base material. The ratio of the mass of the conductive layer relative to the total mass of the conductive particles is 10% or more by mass, and the ratio of the mass of the conductive powder relative to the total mass of the conductive powder and the silver powder is 25% or less by mass.

Abstract: An electrode for transcutaneously transmitting electronic signals with a first layer that is designed to retain a liquid, also at least as a result of a capillary force, and an electrically conductive polymer layer, which contains conductive particles. The first layer is partially permeated by the polymer layer such that it protrudes out of said polymer layer on at least one first side. The first layer is designed to retain a liquid, also at least as a result of a capillary force, and the electrode includes an electrode contacting layer which is partially embedded in the polymer layer, such that it protrudes out of the polymer layer on a second side opposite the first side.

Abstract: There is provided a wiring material including a core layer made of metal and a clad layer made of metal and a fiber in which the core layer is copper or an alloy containing copper and the clad layer is formed of copper or the alloy containing copper and the fiber having a thermal expansion coefficient lower than that of copper, the wiring material having a stacked structure in which at least one surface of the core layer is closely adhered to the clad layer, and the fiber in the clad layer is arranged so as to be parallel to the surface of the core layer.

Abstract: A composite oxide sintered body includes In, Zn, and Sn, and has a relative density of 90% or more, an average crystal grain size of 10 ?m or less, and a bulk resistance of 30 m?cm or less, the number of tin oxide aggregate particles having a diameter of 10 ?m or more being 2.5 or less per mm2 of the composite oxide sintered body.

Abstract: The invention relates to an electrical contact coating for an electrically conductive substrate, preferably a substrate made of copper, a copper-based alloy or a copper-plated substrate in particular for a high-temperature application in an electric or hybrid motor vehicle, with a layered arrangement which can be applied to the substrate and which has two layers, the one layer comprising a transition metal and the other layer a noble metal, with an intermediate layer being provided between the two layers of the layered arrangement, which intermediate layer comprises copper, and one of the two layers being an outer layer. Further, the invention relates to an electrical or electromechanical contact element for a high-temperature application, to an electrical, electronic and/or electro-optical connector, and to the use of copper or a layer comprising copper for a coating, in particular an electrical contact coating, preferably for high-temperature applications.

Abstract: A bonding wire for semiconductor includes: a core wire of copper or a copper alloy; a coating layer containing palladium and having a thickness of 10 to 200 nm; and an alloy layer formed on a surface of the coating layer. The alloy layer contains a noble metal and palladium and having a thickness of 1 to 80 nm. The noble metal is either gold or silver, and a concentration of the noble metal in the alloy layer is not less than 10% and not more than 75% by volume.

Abstract: A wire bonding joint structure of a joint pad in which electroless surface treatment plating layers of joint pads configured by a nickel layer/a palladium layer/a gold layer are connected to each other by a metal wire and when the metal wire is joined to the electroless surface treatment plating layer, a depth of the wire bonding pad formed by wedge deformation is 1.0 m or more. The electroless surface treatment layer of the joint pad can lower strength and hardness of the wire bonding pad of which the surface is treated to improve follow-up capability between a gold wire and the bonding pad, such that a joint area between the gold and the bonding pad is maximized, thereby increasing joinability at the wire bonding finish process by wedge pressure and greatly improving wire bonding workability.

Abstract: A wire is provided for producing a sliding contact, wherein at least an inner core of the wire consists of a copper-silver alloy. A sliding contact is also provided having at least one such wire, wherein a counter-contact is provided whose conductive surface has at least one of the wires touch against it. The spring force of the wire acting on the conductive surface of the counter-contact effects electrical contacting between the wire and the counter-contact and the counter-contact is mobile with respect to the wire, such that the surface of the wire slides over the counter-contact when the counter-contact moves. Components having the sliding contact are also provided, including a potentiometric sensor, potentiometer, sliding dolly regulator, position sensor, rotary switch, electrical motor, generator, wind turbine, slip ring system, actuator, or current collector.

Abstract: A composite electric wire that includes an electric wire body (W) composed of center conductors made of copper (CU) and outer-layer conductors made of aluminum (AL) and coated with copper. The outer-layer conductors are arranged to extend in a Z-direction along the outer circumferences of the center conductors (CU) and to enclose the center conductors (CU).

Abstract: A composite core for use in electrical cables, such as high voltage transmission cables is provided. The composite core contains at least one rod that includes a continuous fiber component surrounded by a capping layer. The continuous fiber component is formed from a plurality of unidirectionally aligned fiber rovings embedded within a thermoplastic polymer matrix. The present inventors have discovered that the degree to which the rovings are impregnated with the thermoplastic polymer matrix can be significantly improved through selective control over the impregnation process, and also through control over the degree of compression imparted to the rovings during formation and shaping of the rod, as well as the calibration of the final rod geometry. Such a well impregnated rod has a very small void fraction, which leads to excellent strength properties. Notably, the desired strength properties may be achieved without the need for different fiber types in the rod.

Abstract: A collective conductor includes a plurality of conductive wires that is arranged collectively; and a copper foil that is wound around the collectively-arranged conductive wires and fusion-bonded to the conductive wires, and the copper foil has a tin plating on the side in contact with the conductive wires.

Abstract: A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have a different grain sizes. An average grain size of the core material may several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed.

Abstract: The present invention relates to a terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni3P, laid on the first layer; a third layer containing a first intermetallic compound of an Ni—P—Sn type, laid on the second layer; and a fourth layer containing a second intermetallic compound of an Ni—Cu—Sn type, laid on the third layer; and a solder layer on the fourth layer of the terminal. Ra2 is larger than Ra1, where Ra1 is a surface roughness of the third layer on the second layer side and Ra2 is a surface roughness of the third layer on the fourth layer side.

Abstract: According to one embodiment, a light-transmitting metal electrode includes a metal layer. The metal layer is provided on a major surface of a member and includes a metal nanowire and a plurality of openings formed with the metal nanowire. The thin layer includes a plurality of first straight line parts along a first direction and a plurality of second straight line parts along a direction different from the first direction. A maximum length of the first line parts along the first direction and a maximum length of the second line parts along the direction different from the first direction are not more than a wave length of visible light. A ratio of an area of the metal layer viewed in a normal direction of the surface to an area of the metal layer viewed in the normal direction is more than 20% and not more than 80%.

Abstract: Aspects of the invention are directed to an electrode for use in an electronic device. The electrode comprises a plurality of nanostructures and a passivating film. Each nanostructure in the plurality of nanostructures contacts or is fused to one or more other nanostructures in the plurality of nanostructures. The passivating film at least partially covers the plurality of nanostructures and comprises one or more layers of graphene.

Abstract: A method, and structures for implementing enhanced interconnects for high conductivity applications. An interconnect structure includes an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane. A winded graphene ribbon is carried around the electrically conductive interconnect member, providing increased electrical current carrying capability and increased thermal conductivity.

Abstract: In a thin film device including a thin film electrode which has a main electrode layer formed of tungsten, a thin film electrode having a low resistivity is realized. There is provided a thin film device including a thin film electrode that has an underlayer and a main electrode layer formed on the underlayer. The underlayer is formed of a titanium-tungsten alloy having a crystalline structure with a wavy-like surface morphology, and the main electrode layer is formed of tungsten having a crystalline structure with a wavy-like surface morphology.

Abstract: Disclosed herein is an electrical component including a substrate comprising an electroconductive filler in a first polymeric binder, and a coating layer adhered to at least a portion of the substrate surface, the coating layer comprising a nanostructured electroconductive particulate dispersed in a polymeric binder, such as an epoxy resin. A method of making the component also is disclosed, comprising obtaining a substrate containing an electroconductive filler in a polymeric binder, dispersing a nanostructured electroconductive particulate filler in a liquid that includes a solvent and/or a reactive diluent to form a dispersion, mixing the dispersion with a liquid resin to form a coating mixture, applying the coating mixture to the substrate, and crosslinking the applied coating mixture to form the coated substrate.

Abstract: The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface>third interface, and second interface>third interface.

Abstract: An electrical transmission line for transmitting electricity is made of a composite material in which aluminum and a plurality of carbon nanotubes are combined, and a weight ratio of the carbon nanotubes to the aluminum is 0.5 to 3 wt %. The carbon nanotubes are oriented at an angle within 30° along a length direction of the electrical transmission line.

Abstract: The present invention provides an electrode composite that has a reaction interface with a large area and can constitute a photoelectric element having high electron transport properties between the reaction interface and the electrode. The electrode composite of the present invention includes a first electrode and a conductive particle layer stacked on the first electrode. The conductive particle layer includes conductive particles containing acicular particles. The conductive particle layer has a three-dimensional porous network structure that is formed by the interconnection of the conductive particles. The three-dimensional network structure is joined to the first electrode. The conductive particle layer contains pores having a pore size of 50 nm or more in a total volume of 50% or more based on the volume of all pores in the conductive particle layer.

Abstract: An electronic device includes a metallic conducting lead having a surface. A pre-solder coating over the surface consists essentially of tin and one or more dopants selected from Al or a rare earth element.

Abstract: A method of forming a low-resistance, high-reliability through/embedded electrode is provided, where the electrode can be arranged in a higher density according to the miniaturization of the semiconductor manufacturing technology. This method includes the step of filling an opening 51 of a substrate 50 with a paste 56 of a first conductive material and drying the paste 56; the step of solid-phase sintering the paste 56 filled in the opening 51, generating a first porous conductor 57; the step of applying a paste of a second conductive material so as to cover the first conductor 57; and the step of melting the paste of the second conductive material by heat treatment, impregnating the second conductive material into the first conductor 57.

Abstract: A copper foil for a printed circuit having a roughened layer on a surface of a copper foil by way of copper-cobalt-nickel alloy plating, a cobalt-nickel alloy plated layer formed on the roughened layer, and a zinc-nickel alloy plated layer formed on the cobalt-nickel alloy plated layer, wherein the total amount of the zinc-nickel alloy plated layer is 150 to 500 pg/dm2, the lower limit of the nickel ratio in the alloy layer is 0.16, the upper limit thereof is 0.40, and the nickel content is 50 pg/dm2 or more.

Abstract: An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, the binder part having an ion content of more than 0 ppm to about 100 ppm.

Abstract: There is provided a bonding wire for semiconductor, capable of ensuring a favorable wedge bondability even when bonded to a palladium-plated lead frame, superior in oxidation resistivity and having a core wire of copper or a copper alloy. This bonding wire comprises: a core wire of copper or a copper alloy; a coating layer containing palladium and having a thickness of 10 to 200 nm; and an alloy layer formed on a surface of the coating layer, such alloy layer containing a noble metal and palladium and having a thickness of 1 to 80 nm. The aforementioned noble metal is either silver or metal, and a concentration of such noble metal in the alloy layer is not less than 10% and not more than 75% by volume.

Abstract: The invention relates to a strip or foil (1) made from aluminium or an aluminium alloy that has an external oxide layer. The object of providing a strip or foil made from aluminium or an aluminium alloy in which the thermal and/or electrical conductivity remains consistently high regardless of the formation of an aluminium oxide layer is solved by arranging thermally and/or electrically highly conductive functional particles on one or both sides of the strip or foil, which functional particles at least partly penetrate the oxide layer of on the strip or foil.

Abstract: Provided are a CNT plating metal composite with high conductivity and wherein metal plating is plated onto the inside of a high-density CNT aggregate, and a production method for same. Also provided is a method for patterning the CNT plating metal composite. A CNT metal composite is provided including a CNT aggregate formed by adhering a metal onto a plurality of CNTs, wherein when an X-ray diffraction analysis is performed using a Cu-K? ray as a radiation source, an intensity ratio between a peak having the greatest intensity belonging to the metal and a peak having the greatest intensity belonging to an oxide of the metal is 10 or more and the volume resistance is 2×10?6 ?cm or more and 5×10?3 ?cm or less.

Abstract: The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.

Abstract: To provide an electrically conducting member for electrophotography which can not easily come to change in electrical resistance value even upon application of direct current and also has made any ion conducting agent kept from bleeding. The electrically conducting member has an electrically conducting substrate and an electrically conducting layer; the electrically conducting layer containing an epichlorohydrin rubber having in the molecular structure at least an alkylene oxide (AO) unit, an epichlorohydrin (ECH) unit and a unit having a sulfonate ion; the AO unit being at least one unit of an ethylene oxide unit, a propylene oxide unit and a butylene oxide unit; and the AO unit(s) in the rubber being in a content of 5 to 60% by mass in total and the ECH unit in the rubber being in a content of 30% by mass or more.