Abstract: A conductor for connecting terminals of a battery in which a conductor for connecting terminals (8) can be easily welded to both positive-electrode terminal (1) and negative-electrode terminal (4), and an assembled battery using the same are provided. The conductor for connecting terminals (8) is formed in such a manner that a plate-shaped part (8a) including an aluminum member is overlapped with a plate-shaped part including a second metal having a melting point higher than that of the aluminum member, a first region having the exposed aluminum member and a second region having the exposed second metal are formed in one surface, and the second metal is exposed to a region opposed to the second region, in the other surface. The conductor for connecting terminals (8) connects the positive-electrode terminal (1) including the aluminum member of a non-aqueous electrolyte secondary battery (7) to the negative-electrode terminal (4) of another battery.

Abstract: Disclosed is an elastic electric contact terminal including an elastic foam core having a sheet form, a non-foam rubber coating layer adhered to upper and lower surfaces of the elastic foam core and continued along any one side surface of the elastic foam core, and a heat-resistant polymer film, one side of which is adhered to the non-foam rubber coating layer in an enclosing manner and the other side of which is integrally formed with a metal layer.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

Abstract: The invention describes nanocomposites containing carbon nanotubes (CNTs), methods of making the nanocomposites and devices using the nanocomposite materials. Combining CNTs with capacitor materials such as VN provides composite materials having unique supercapacitor properties.

Abstract: A diamond electrode having an oxidation resistant diamond film which will not separate from the electrode during electrolysis with highly oxidizing materials. The thickness of the diamond film is 20 pm or more and the diamond film should preferably cover opposite side surfaces of a substrate in such a manner as to also cover end surfaces 2a of the substrate. The surfaces of the substrate are covered with a plurality of diamond layers to form the film using repeated steps of forming separate diamond layers with each diamond layer having a thickness of 10 to 30 pm on one of the surfaces of the substrate and then forming a diamond layer having a thickness of 10 to 30 pm on the other surface of the substrate. Thus, it is possible to form a nonporous surface of diamond layer and prevent deterioration of an electrode caused by the separation of a diamond film.

Abstract: An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar.

Abstract: A transparent conductive film includes: a first conductor layer formed of a first transparent conducting oxide having a first specific resistance; and a second conductor layer that is laminated on the first conductor layer, has a second specific resistance that is equal to or larger than the first specific resistance and equal to or smaller than 1*106 ?*cm, and is formed of a second transparent conducting oxide including titanium.

Abstract: A core for an electrical conductor. The core includes an inner core component, an intermediate cladding component and an outer cladding component. The inner core component comprises a plurality of glass based stranded members in a first resin matrix. The intermediate cladding component surrounds the inner core component and comprises a plurality of carbon stranded members in a second resin matrix. The outer cladding component surrounds the intermediate cladding component and comprises a plurality of glass based stranded members in a third resin matrix. The first resin matrix and the second resin matrix are substantially independent of each other, meeting at a boundary. An electrical conductor as well as a manufacturing method is likewise disclosed.

Abstract: An electrical transmission line for transmitting electricity is made of a composite material in which aluminum and a plurality of carbon nanotubes are combined, and a weight ratio of the carbon nanotubes to the aluminum is 0.5 to 3 wt %. The carbon nanotubes are oriented at an angle within 30° along a length direction of the electrical transmission line.

Abstract: Disclosed is a lead wire for a solar cell having excellent bondability with a solar cell. The solar cell lead wire (10) has a band plate-shaped electroconductive material (12) that is formed with straight-angled cross-sectional shape and is covered by a molten solder plating layer (13), with the thickness of the oxide film on the surface of the molten solder plating layer (13) being 7 nm or less.

Abstract: A multilayer structure including a transparent conductive thin film and a molybdenum metal thin film wherein difference of internal stress between the transparent conductive thin film and the molybdenum metal thin film is 1600 MPa or less.

Abstract: Provided is an electric contact member which reduces, to the utmost, peel-off of a carbon film that is caused at the time of use of the electric contact member having at least an edge to keep stable electric contact over a long period of time. Disclosed is an electric contact member which repeatedly contacts with a device under test at a tip part of the electric contact member in which the tip part has an edge, the electric contact member comprising: a base material; an underlying layer comprising Au, Au alloy, Pd or Pd alloy, which is formed on a surface of the base material of the tip part; an intermediate layer which is formed on a surface of the underlying layer; and a carbon film comprising at least one of a metal and a carbide thereof which is formed on a surface of the intermediate layer, wherein the intermediate layer has a lamination structure comprising: an inner layer comprising Ni or Ni alloy; and an outer layer comprising at least one of Cr, Cr alloy, W and W alloy.

Abstract: A composite electrode for an electricity storage device of the present invention includes: a substrate; a whisker or a fiber which is made of at least one of a metal and a metal compound and is formed on the substrate; and a coating layer which contains an active material and is formed on at least a part of a surface of the whisker or the fiber.

Abstract: A composite coating on metal strips or prestamped metal strips with an improved friction coefficient and/or good contact resistance and/or good friction corrosion resistance and/or good wear resistance and/or good formability includes carbon nanotubes and/or fullerenes and a metal. A method for producing a metal strip coated according to the invention with carbon nanotubes and/or fullerenes and a metal is also disclosed.

Abstract: Disclosed is a plated flat conductor including a flat conductor of copper or a copper alloy and a plated layer formed on a surface of the flat conductor. The plated layer includes a first intermetallic compound layer of Cu3Sn disposed on the surface of the flat conductor, a second intermetallic compound layer of Cu6Sn5 formed on the first intermetallic compound, and a superficial layer formed on the second intermetallic compound layer. The superficial layer is plating material of pure tin or a tin alloy and has an average thickness from about 0.3 ?m to 1.0 ?m and a maximum thickness of about 1.0 ?m or less. A volume ratio of the second intermetallic compound layer to the first intermetallic compound layer is about 1.5 or more.

Abstract: A wire having an outer shell and a core, the core including at least a first plurality of core segments that may be made of a first core material and a second plurality of core segments that may be made of a second core material different from the first core material. The first and second core segments are arranged in a periodic alternating arrangement along the length of the wire. The outer shell may be made of a metal, such as a biocompatible metal, and the core segments may be made of different materials to provide periodic material properties along the length of the wire.

Abstract: The invention relates to an electric conductor (21), in particular a heating conductor, having a supporting structure and an electrically conducting conductor material whereby the supporting structure is formed from a fiber composite (11) and the conductor material comprises a carbonaceous material (22) that adheres to the fiber composite.

Abstract: Solder materials, such as a solder paste, and contact surfaces for solder connections are provided in which a metal stearate is used as a flux. The metal stearate is applied either as a solid layer on the solder particles or as contact surfaces or is present as a dispersion or solution in a binder. Advantageously, such materials allow one to avoid the use of classical fluxes. In particular, non-resin solder materials can be provided. A simplified storage and processability of the solder materials results, while at the same time producing comparatively better solder connections. The ability to use metal stearates as a flux is achieved if the first oxide of the metals used is formed from pure metal at lower oxygen activity (ao) than the first chromium oxide of chromium, preferably lower than the first titanium oxide of titanium, and if the metal stearate is present in a sufficient amount.

Abstract: An electronic device includes a metallic conducting lead having a surface. A pre-solder coating over the surface consists essentially of tin and one or more dopants selected from Al or a rare earth element.

Abstract: A tension-resistant electrical conductor includes a central core wire and at least a first inner wire layer and a second outer wire layer arranged over the central core wire. The central core wire is made of copper or a copper alloy. The first inner wire layer includes, in the circumferential direction, an alternating sequence of copper wires and wires having higher tensile strength, arranged over the central core wire, and the second outer wire layer, and any further outer wire layer, is composed exclusively of copper wires.

Abstract: An electrical interconnect includes first and second electrical contacts to be electrically connected, each electrical contact having a plurality of electrically conductive nanowires extending outwardly from a respective electrical contact; and the nanowires of the first electrical contact configured to mesh with the nanowires of the second electrical contact such that an electrical connection is established between the first electrical contact and the second electrical contact. A method for interconnecting electrical contacts includes meshing a first array of electrically conductive nanowires extending from a first electrical contact with a second array of electrically conductive nanowires extending from a second electrical contact so as to establish an electrical connection between said first and second electrical contacts.

Abstract: There is provided a room-temperature superconductor that has a very simple structure and enters a state of superconductivity at room temperature. Also, there is provided a method for making the room-temperature superconductor. Further, there is provided a protonic conductor having superconductivity at room temperature. The room-temperature superconductor comprises a substance composed of graphene and a proton donor.

Abstract: The invention provides a solder structure which is least likely to develop Sn whiskers and a method for forming such a solder structure. The solder structure includes an Sn alloy capable of a solid-liquid coexistent state and an Au (or Au alloy) coating covering at least part of the surface of the Sn alloy. The Au covering is a film that covers and coats at least part of the surface of the Sn alloy. As a preferable mode, the Au coating forms a netlike structure on the surface of the Sn alloy. The thickness of the Au coating is, for instance, 1 to 5 ?m.

Abstract: A high-performance bonding wire that is suitable for semiconductor mounting technology, such as stacked chip bonding, thinning, and fine pitch mounting, where wire lean (leaning) at an upright position of a ball and spring failure can be suppressed and loop linearity and loop height stability are excellent. This bonding wire for a semiconductor device includes a core material made of a conductive metal, and a skin layer formed on the core material and containing a metal different from the core material as a main component; wherein a relationship between an average size (a) of crystal grains in the skin layer on a wire surface along a wire circumferential direction and an average size (b) of crystal grains in the core material on a normal cross section, the normal cross section being a cross section normal to a wire axis, satisfies an inequality of a/b?0.7.

Abstract: A solid oxide fuel cell, solid oxide electrolyzer, and associated interconnect structure is disclosed for use in solid oxide electrolytic devices that use chrome-containing components, such as solid oxide fuel cells and solid oxide oxygen-generators. The invention provides a reliable and durable interconnect for both structural and electrical components of such devices. In general, the interconnect structure relies on a dual-layer, high-temperature seal which provides an effective diffusion barrier for both chrome and oxygen. As a result of the described interconnect, corrosion or loss in electrical conductivity in such solid oxide electrolytic devices is avoided. Also, a novel structure for such solid oxide electrolytic devices is disclosed, which provides an economical and high-integrity structure that utilizes the disclosed interconnect structure.

Abstract: Composite structural components are disclosed that include electrically conducting fibres providing multiple signal or paths to electrical components disposed on or adjacent the material. The signal paths may therefore be embedded in the structural component as an intrinsic reinforcing element. Also disclosed are materials for making up the structure and fabrics and methods for the production thereof.

Abstract: The present invention is in relation to a composition of electrode material in the form of a coating, said composition represented by formula Mn1-xO/C, wherein Mn1-xO is the monoxide of manganese with x is ?0 and ?0.1 and C is carbon. In addition, the invention also provides a process for deposition of aforementioned composition in the form of a nanocomposite coat on the electrode of an electrochemical capacitor in the fields of automobile, aerospace engineering and applications, very large scale integrated circuits (VLSI) technology, micro-electro-mechanical systems (MEMS) and combinations thereof.

Abstract: An active electrode structure is disclosed that includes fullerenes produced by a carbo-thermal carbide conversion of a conductive carbide without a metal catalyst. Also disclosed is an electrode that includes a fullerene covalently bonded to a conductive carbide, the fullerene being an aligned or non-aligned array. The carbide substrate having a surface coating of covalently bonded fullerenes is characterized in that the peak separation of a cyclic voltammogram for the conductive carbide having a surface layer of the fullerene is less than about 150 mV at a scan rate of 5 mV/s in a 4 mM ferricyanide, 1M KCl solution. The fullerene may include about 50% or less non-crystalline carbon and about 5% or less of a transition metal that interferes with the ability of the active electrode structure to transfer electrons or detect an analyte.

Abstract: The present invention is a fiber-polymer composite-supported conductor with a fiber-polymer composite core and a tubular metal conductor. The tubular metal conductor is on the core. Substantially all mechanical tension resulting from the disposition of the conductor is borne by the fiber-polymer composite core.

Abstract: An electric wire contains a conductive wire having at least a groove structured on the surface of the conductive wire, and an additional wire to be filled into the groove. The groove is provided on an outer surface of the conductive wire along a longitudinal direction of the conductive wire. The additional wire is inserted in the groove.

Abstract: A process for manufacturing an electrode utilizing electron beam (EB) or actinic radiation to cure electrode binding polymers is provided. A process is also disclosed for mixing specific actinic or EB radiation curable chemical precursors with electrode solid particles, application of the mixture to an electrode current collector, followed by the application of actinic or EB radiation to the current collector for curing the polymer, thereby binding the electrode material to the current collector. Lithium ion batteries, electric double layer capacitors, and components produced therefrom are also provided.

Abstract: A liquid borne emulsion of varying formulations comprising a powdered metal in a base liquid incorporating a thickening agent component is adapted to a specific metal and type of electrical connection in a specific environment to enhance the electrical conductivity at the electrical connection, reducing the effect of the environment over time of the metals within the electrical connection, increasing the surface area of the electrical connection, reducing the effect of vibration upon the electrical connection to prevent separation and loss of contact to the electrical connection and reducing the signal noise generated by metal to metal movement resulting from an imperfect contact in an electrical connection.

Abstract: This invention aims to enhance efficiency of a sieve and to greatly improve productivity of a sifting operation. There is provided a sieve comprising a metal plate including long holes, wherein the long holes are plurally provided such that lines extending in length directions thereof cross one another.

Abstract: The present invention provides a terminal structure 14 including a terminal 12 having a conductor 40 containing at least one metal selected from the group consisting of gold, silver, and copper, a first layer containing phosphorus and nickel disposed on the conductor 40, and a second layer having a nickel/phosphorus atomic ratio smaller than that of the first layer and containing Ni3P disposed on the first layer; and solder 70 disposed on the second layer of the terminal 12, while the second layer has a thickness of at least 0.35 ?m; and a module substrate 100 having the terminal structure.

Abstract: A conductive wire includes an aramid fiber and at least one layer attached about the aramid fiber, the at least one layer including at least one of aligned carbon nanotubes and graphene platelets.

Abstract: A composite conductor for electric current comprises a core made of a first material and a jacket made of a second material, wherein the second material has a lower electrical conductivity than the first material. The second material is oxidation-resistant at temperatures up to at least 600° C., in particular at temperatures up to at least 800° C., in particular at temperatures up to at least 900° C. A fuel cell system comprises at least one fuel cell, to which a composite conductor according to the present invention is connected. A manufacturing method for a composite conductor comprises following steps: Provision of a core made of a first material and encasing the core by a second material having a lower electrical conductivity than the first material. The second material is oxidation-resistant at temperatures up to at least 600° C., in particular at temperatures up to at least 800° C., in particular at temperatures up to at least 900° C.

Abstract: A composite material, the composite material comprising a prepreg, said prepreg comprising at least one polymeric resin and at least one conductive fibrous reinforcement, electrically conducting particles dispersed in the polymeric resin and a top layer of a metal-coated carbon fibre comprising a further resin component, wherein the metal comprises one or more metals selected from nickel, copper, gold, platinum, palladium, indium and silver.

Abstract: A conductive wire includes a plurality of thermoplastic filaments each having a surface, and a coating material having a plurality of carbon nanotubes dispersed therein. The coating material is bonded to the surface of each thermoplastic filament. The thermoplastic filaments having the coating bonded thereto are bundled and bonded to each other to form a substantially cylindrical conductor.

Abstract: A conductive wire includes a thermoplastic filament having a circumference and a plurality of coating layers dispersed about the circumference of the thermoplastic filament. The coating layers include a plurality of conductive layers comprising aligned carbon nanotubes dispersed therein and at least one thermoplastic layer between each pair of conductive layers.

Abstract: It is an object of the present invention to provide a highly-functional bonding wire which can reduce damages at a neck part, has good linearity of loops, stability of loop heights, and stability of bonded shape of a bonding wire, and can cope with semiconductor packaging techniques, such as low looping, thinning, achievement of a fine pitch, and three-dimensional packaging. A semiconductor-device bonding wire comprises a core member formed of an electrically-conductive metal, and a skin layer mainly composed of a face-centered cubic metal different from the core member and formed thereon. The percentage of <100> orientations in crystalline orientations in the lengthwise direction in the surface of the skin layer is greater than or equal to 50%.

Abstract: Hybrid conductors capable of achieving enhanced conductivity and current capacity over a wide range of frequencies are disclosed. The hybrid conductors may be used in electrical or thermal applications, or combinations of both. One method of fabricating such hybrid conductors includes complexing conductive metal elements (e.g., silver, gold, copper), transition metal elements, alloys, wires, or combinations thereof, with carbon nanotube materials. In the alternative, the hybrid conductors may be formed by doping the carbon nanotube materials in salt solutions.

Abstract: The invention relates to a contact unit and particularly a solder pin, and a method for producing a contact unit, comprising a body having a metal core and a tin layer surrounding the metal core. The tin layer is thereby designed as a duplex layer, and comprises a radially inner layer overlay of matte tin and a radially outer layer overlay of glossy tin.

Abstract: To produce an aluminum wire covered with copper, capable of retaining its original electrical and mechanical properties when used in environments in which the temperatures exceed 150° C., the wire is produced by a method during which a material foreign to copper and to aluminum is introduced in a small amount at the interface between the aluminum core and the copper layer. The material has the effect of retarding the precipitation of copper in the aluminum and the growth of Guinier-Preston zones. The wire is produced by a known method of reducing the diameter of a composite bar and the foreign material is introduced into the interface between the copper and the aluminum during production of the composite bar so as to be present in trace amounts after reduction of the diameter.

Abstract: Provided is a transparent conductive film exhibiting high conductivity together with excellent transparency, and also exhibiting film strength tolerant to a washing treatment and a pattern forming treatment while maintaining conduction to an electronic device layer formed on an transparent conductive layer. Also disclosed is a method of manufacturing a transparent conductive film possessing a transparent substrate and provided thereon, a transparent conductive layer containing a metal nanowire, possessing the steps of forming a layer containing a crosslinking agent on the substrate, coating a coating solution containing a metal nanowire onto the layer containing the crosslinking agent, drying the coating solution, and conducting a treatment by which the crosslinking agent is reacted.

Abstract: An object of the present invention is to provide a high-performance bonding wire that is suitable for semiconductor mounting technology, such as stacked chip bonding, thinning, and fine pitch mounting, where wire lean (leaning) at an upright position of a ball and spring failure can be suppressed and loop linearity and loop height stability are excellent. This bonding wire for a semiconductor device includes a core material made of a conductive metal, and a skin layer formed on the core material and containing a metal different from the core material as a main component; wherein a relationship between an average size (a) of crystal grains in the skin layer on a wire surface along a wire circumferential direction and an average size (b) of crystal grains in the core material on a normal cross section, the normal cross section being a cross section normal to a wire axis, satisfies an inequality of a/b?0.7.

Abstract: The present invention provides a bonding wire improved in formability of a ball part, improved in bondability, good in loop controllability, improved in bonding strength of a wedge connection, securing industrial production ability as well, and mainly comprised of copper which is more inexpensive than gold wire, that is, provides a bonding wire for a semiconductor device comprised of a bonding wire having a core material having copper as its main ingredient and a surface covering layer over the core material and of a conductive metal of a composition different from the core material, characterized in that the surface covering layer has as its main ingredients two or more types of metals selected from gold, palladium, platinum, rhodium, silver, and nickel and the surface covering layer has a concentration gradient of one or both of a main ingredient metal or copper in the wire radial direction.

Abstract: Provided is a composite electric wire, which is intended to realize a light weight and improve a mechanical strength at the same time and which is enabled to improve the reliability by avoiding the problem of oxide coating or electric erosion so that the electric wire may be easily handled for use as a car-mounted wire harness. The composite electric wire comprises an electric wire body (W) composed of center conductors (AL) and outer-layer conductors (CU) arranged to extend in a Z-direction along the outer circumferences of the center conductors (AL) and to enclose the center conductors (AL). In the electric wire body (W), the center conductors (AL) composed of copper-coated aluminum element wires (20) of a (1+6) number are sectionally positioned at the center portion of the electric wire body (W) in an X-Y plane, and the outer-layer conductors (CU) composed of twelve copper element wires (10) are positioned in the outer circumference portion arranged around the center portion of the X-Y plane.

Abstract: Provided is a composite electric wire, which is intended to realize a light weight and improve a mechanical strength at the same time and which is enabled to improve the reliability by avoiding the problem of oxide coating or electric erosion so that the electric wire may be easily handled for use as a car-mounted wire harness. The composite electric wire comprises an electric wire body (W) composed of center conductors (CU) and outer-layer conductors (AL) arranged to extend in a Z-direction along the outer circumferences of the center conductors (CU) and to enclose the center conductors (CU). In the electric wire body (W), the center conductors (CU) composed of copper element wires (10) of a (1 +6) number are sectionally positioned at the center portion of the electric wire body (W) in an X-Y plane, and the outer-layer conductors (AL) composed of twelve copper-coated aluminum element wires (20) are positioned in the outer circumference portion arranged around the center portion of the X-Y plane.

Abstract: There is a highly reliable semiconductor module having a satisfactory bonding strength in the electrical bonded portion. In the semiconductor module 10, a semiconductor chip 11 is mounted on a circuit board 20. In the circuit board 20, on an insulating ceramic substrate 21 is formed a metal circuit plate 22 on which the semiconductor chip 11 is implemented. The semiconductor chip 11 and metal circuit plate 22 are connected with each other by an aluminum bonding wire 23. In the connected portion between the metal circuit plate 22 and bonding wire 23, a coating layer 24 for excellent conjunction therebetween is mounted. The coating layer 24, as shown in an enlarged diagram, is made up of a nickel (Ni) layer 241, a P-distributed palladium (Pd) layer 242, and an Au layer 243 in increasing order. To the P-distributed Pd layer 242 is added P (phosphorous) and, the P concentration on the Ni layer 241 is higher than that on the Au layer side 243.

Abstract: Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.