With Heat Sink Patents (Class 174/16.3)
  • Patent number: 7969728
    Abstract: A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: June 28, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Dong-Bo Zheng, Meng Fu, Chun-Chi Chen
  • Patent number: 7969730
    Abstract: A portable computer having a partially sealed cooling system is disclosed. The portable computer contains heat transfer materials that function to remove heat from a sealed area of the portable computer to an unsealed area where the heat may be more effectively dissipated. A portable computer having a power source shield is also disclosed. The shield may be formed to partially surround a portion of the power source, and may be formed by partially enclosing a power source in a conductive material; forming an opening in the conductive material on one side of the power source; installing the power source near an edge of the electronic device; and orienting the power source so that the opening faces the edge of the electronic device.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: June 28, 2011
    Assignee: Motion Computer, Inc.
    Inventors: John Doherty, Mike Collins, Todd Steigerwald, Phillip Bagwell
  • Patent number: 7969742
    Abstract: A bracket is used to mount a heat sink to a printed circuit board (PCB). The heat sink can dissipate heat for an electronic component mounted on the PCB. Cantilevers can be detached from the bracket, and replaced by other cantilevers with different sizes to mount a plurality of heat sinks having different sizes.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: June 28, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Lei Liu
  • Patent number: 7965506
    Abstract: A heat sink apparatus and method are provided for allowing air to flow directly to an integrated circuit package thereunder. In use, a heat sink is provided including an upper portion with a plurality of fins, and a lower portion configured for allowing air to flow directly to an integrated circuit package thereunder.
    Type: Grant
    Filed: August 22, 2007
    Date of Patent: June 21, 2011
    Assignee: NVIDIA Corporation
    Inventors: Zhihai Zack Yu, Don Le
  • Patent number: 7965511
    Abstract: The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other embodiment where a heat generating component can be functionally and operatively coupled. In an embodiment, the vapor configuration is modified to include fins that define a cross-flow heat exchanger where the vapor from the vapor chamber serves as the fluid in the vertical cross-flow in the heat exchanger and natural or forced cooling air serves as the horizontal cross-flow for the heat exchanger.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: June 21, 2011
    Assignee: ATI Technologies ULC
    Inventor: Gamal Refai-Ahmed
  • Patent number: 7961473
    Abstract: An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket.
    Type: Grant
    Filed: December 24, 2009
    Date of Patent: June 14, 2011
    Assignee: International Business Machines Corporation
    Inventors: Mark S. Bohannon, Derek I. Schmidt, Pat Gallarelli
  • Patent number: 7961471
    Abstract: An information processing apparatus having improved cooling efficiency is disclosed. The information processing apparatus includes a first chassis and a second chassis separated from each other at a prescribed distance, the first chassis accommodating a substrate on which high heat generating parts such as a CPU and a chipset are mounted, and the second chassis accommodating low heat generating and low heat resistance parts. Because of this structure, the first chassis and the second chassis are thermally isolated, and the surface area of the apparatus is increased, thereby improving the cooling efficiency of the apparatus.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: June 14, 2011
    Assignee: Ricoh Company, Ltd.
    Inventors: Satoshi Odanaka, Hayato Watanabe
  • Patent number: 7957149
    Abstract: Apparatus for securing or retaining a heatsink. The heatsink retention apparatus includes a heatsink module that cooperates with first and second spring loaded latches secure to a circuit board on opposing sides of a heat-generating component. The heatsink module includes a handle pivotally secured to opposing sides of the heatsink body, and bails pivotally secured to the handle. In addition, the bails extend downward to dispose a lower bail member adjacent the spring loaded latches. As the handle pivots between a first position to raise the bails and a second position to lower the bails, the bails automatically move from a locked position to an unlocked position. Each of the spring loaded latches include a hook and at least one pre-loaded spring to transfer a minimum downforce to the lower bail members when the bails are raised. Accordingly, embodiments may be operated from the top of the heatsink without the use of tools, while providing a desired downforce over a range of heatsink heights.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: June 7, 2011
    Assignee: International Business Machines Corporation
    Inventors: Richard Barina, Bruce Desrosiers, Michael French, David L. Hager, Michael S. June, John P. Scavuzzo, Scott Womble
  • Patent number: 7954332
    Abstract: Systems and methods for controlling the temperature of an electrical device is described. The system includes a heat sink system in conjunction with a thermoelectric assembly. The systems and methods are particularly suitable in NEMA-4 electrical enclosures used in electrical submersible pump applications.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: June 7, 2011
    Assignee: Alkhorayef Petroleum Company
    Inventor: Tomasz M. Orlowski
  • Patent number: 7957148
    Abstract: A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: June 7, 2011
    Assignee: International Business Machines Corporation
    Inventors: Pat Gallarelli, David J. Jensen, Vinod Kamath, Brian M. Kerrigan
  • Patent number: 7952881
    Abstract: A thermal-electrical assembly (200) provides with improved heat sinking, electrical shielding and electrical grounding. The thermal-electrical assembly is configured using a shield (202) having a windowed aperture (204), a pliable frame (206) formed of thermally and electrically conductive material having contours (210) that fit within and are retained by the windowed aperture, and a thermal insert (208) formed to fit within the pliable frame. The combination of pliable frame 206 and thermal insert (208) close off the shield (202) while providing contact areas for dissipating heat from heat generating circuitry or components. Communication devices, such as portable radios having tight space constraints, can incorporate the thermal-electrical assembly (200) to minimize electrical emissions while maximizing heat dissipation.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: May 31, 2011
    Assignee: Motorola Solutions, Inc.
    Inventors: Salvador P. Magana, Dennis A. Byk, Sean C. Cadogan, Charles E. Kline, Arthur E. Petela, Sanjay K. Roy
  • Patent number: 7948750
    Abstract: An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: May 24, 2011
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Jui-Wen Hung, Nien-Tien Cheng, Ping-Yang Chuang
  • Patent number: 7948756
    Abstract: A heat dissipation device includes a base, a connecting member and a wire-shaped clip. The base thermally contacts with an electronic component mounted on a printed circuit board. The connecting member encloses the base therein and is secured to a periphery of the base. A plurality of clasps extends upwardly from the connecting member. The clip is clasped by the clasps of the connecting member to be attached thereto. The clip is pressed downwardly to engage with a plurality of hooks of a bracket around the electronic component of the printed circuit board to make the base intimately contact with the electronic component.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: May 24, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventor: Juan Du
  • Patent number: 7940528
    Abstract: An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable thermal transfer members. The thermal transfer plate contacts the thermal generating element and includes a plurality of recesses. Each of the movable thermal transfer members has a weight end and a free end. The weight end is accommodated in the recess. The thermal energy produced by the thermal generating element is conducted to the movable thermal transfer members via the thermal transfer plate. When the casing is tilted by a certain angle, the movable thermal transfer member swings relative to the thermal transfer plate, such that the free end thereof points to a direction opposite to that of an acceleration of gravity under a normal state.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: May 10, 2011
    Assignee: Inventec Corporation
    Inventors: Feng-Ku Wang, Ting-Chiang Huang, Shaw-Fuu Wang, Sheng-Jie Syu
  • Patent number: 7933126
    Abstract: A solid state relay having an internal heat sink for dissipating heat produced by a solid state switching device. The relay being enclosed within a nonmetallic housing and mountable on a DIN type rail system.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: April 26, 2011
    Assignee: Schneider Electric USA, Inc.
    Inventor: Dipin Jain
  • Patent number: 7929308
    Abstract: A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: April 19, 2011
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sang Kuk Choi, Hyun Tak Kim, Byung Gyu Chae, Bong Jun Kim
  • Patent number: 7924567
    Abstract: A clip includes a main body, a pair of locking members integrally formed at opposite ends of the main body, and a securing member secured onto one of the locking members. The one locking member includes an upper portion, a lower portion wider than the upper portion, and a step between the upper and lower portions. The securing member includes a handling portion and an engaging portion extending downwardly from the handling portion. A pair of flanges are formed on the engaging portion facing the main body and abutting the step. A clearance is defined between the flanges and the engaging portion receiving the upper portion. One of the engaging portion and the one locking member forms an engaging hole, and the other one forms a hook engaging into the engaging hole.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: April 12, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventor: Xin-Xiang Zha
  • Patent number: 7916469
    Abstract: A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: March 29, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Jun Cao, Qing-Song Xu, Chun-Chi Chen
  • Patent number: 7903420
    Abstract: A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: March 8, 2011
    Assignee: Asustek Computer Inc.
    Inventors: Chao-Tsai Chung, Kuo-Jung Hsu
  • Patent number: 7903417
    Abstract: An electrical circuit assembly includes an electrical circuit substrate having a first side; a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from the second side; and a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of the first side of the electrical circuit substrate with the first side of the base plate.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: March 8, 2011
    Assignee: Deere & Company
    Inventors: Ronnie Dean Stahlhut, Clement Vanden Godbold, Jeffrey Gerald Hopman, Kartheek Karna, James Arthur Springer, John Lopes Alves, Lise Alves, legal representative
  • Patent number: 7903415
    Abstract: An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the stop portion, a front inclined guiding portion extending slantwise forward toward the first side from the stop portion, and at least one fixture for installing the airflow guider to a heat sink. In light of the structure, the airflow guider can be coordinately installed to various kinds of heat sinks and provide additional thermal dissipation.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: March 8, 2011
    Assignee: Tai-Sol Electronics Co., Ltd.
    Inventors: Ko-Pin Liu, Yue-Ping Dai
  • Patent number: 7903419
    Abstract: A heat dissipation device for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a retention module (30) resting on the printed circuit board, a heat sink (20) disposed on the retention module for contacting the electronic component, a clip (40) for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (50), a gasket (62) engaging with the back plate, and a bracket (64) being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks (6202) contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: March 8, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hao Li, Jun Long, Tao Li
  • Patent number: 7903413
    Abstract: A system and method are provided including a first thermal component adapted for thermal communication with an integrated circuit, and a second thermal component adapted for thermal communication with the first thermal component upon engagement therewith. Further provided is a coupler slidably coupled to the first thermal component and/or the second thermal component. In use, such coupler is capable of a first orientation for disengaging, the first thermal component and the second thermal component, and a second orientation for engaging the first thermal component and the second thermal component.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: March 8, 2011
    Assignee: NVIDIA Corporation
    Inventors: Glenn A. Wernig, Ryan C. Tong, Charles E. Buffington
  • Patent number: 7896611
    Abstract: A cooling system includes a moving rotor system which in turn includes: a disk on which a plurality of heat conducting structures are distributed, the heat conducting structures having a cross section optimized for maximum surface area to footprint area; the heat conducting structures having a shape to optimize the heat transfer coefficient between the structures moving through the ambient fluid; and a mechanism for generating a mass fluid flow over the conducting structures so that the heat conducting structures are persistently cooled.
    Type: Grant
    Filed: January 3, 2007
    Date of Patent: March 1, 2011
    Assignee: International Business Machines Corporation
    Inventors: Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha
  • Patent number: 7889503
    Abstract: An electronic appliance includes a circuit board mounted with an electronic-circuit component. The circuit board is covered with a shield, and a metallic heat-dissipating member is arranged on the electronic-circuit component. The shield is grounded on the circuit board, and arranged such that at least one of the surfaces is in the vicinity of the heat-dissipating member. The heat-dissipating member is grounded on the circuit board by a ground member, and at the periphery of the ground member, magnetic members are arranged.
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: February 15, 2011
    Assignee: Nintendo Co., Ltd.
    Inventors: Takeshi Nagareda, Yasuhisa Kitano, Sadayoshi Hattori
  • Patent number: 7889502
    Abstract: A circuit assembly including a substrate which has a dielectric layer, a heat spreader layer located at a first surface of the substrate, a heat generating component located at a second surface of the substrate, and a thermal pathway in thermal connection between the heat spreader layer and the heat generating component.
    Type: Grant
    Filed: November 4, 2005
    Date of Patent: February 15, 2011
    Assignee: GrafTech International Holdings Inc.
    Inventors: Bradley E. Reis, James R. Cartiglia
  • Patent number: 7885071
    Abstract: A heat dissipation arrangement for communication chassis includes a chassis body defining an inner receiving space and being divided into at least one heat receiving portion and at least one heat dissipation portion; a first heat pipe set arranged in the receiving space to connect the heat receiving portion to the heat dissipation portion, so that heat absorbed by the heat receiving portion can be quickly transferred via the first heat pipe set to the heat dissipation portion; and at least one thermal module including a plurality of radiating fins and at least one second heat pipe, which is connected to the heat dissipation portion and extended through the radiating fins, allowing part of the heat transferred to the heat dissipation portion to be transferred to the radiating fins. The thermal module provides additional heat dissipating area, so that the communication chassis can provide excellent heat dissipation effect.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: February 8, 2011
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chiu-Mao Huang, Chang-Moou Huang
  • Patent number: 7885075
    Abstract: A heat dissipation device comprises a heat spreader and heat pipe soldered thereon via a heat conducting material. The heat spreader defines a plurality of cavities in an inner side surface thereof, the heat conducting material is received in the cavities, and the heat pipe contacts and is soldered to the inner side surface of the heat spreader.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: February 8, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei Li, Yi-Qiang Wu, Chun-Chi Chen
  • Patent number: 7881061
    Abstract: An electronic apparatus includes a PCB with a heat generating electronic component disposed thereon, a heat sink, and a mounting device for mounting the heat sink onto the heat generating electronic component. The mounting device includes a mounting frame and a wire clip. The mounting frame surrounds the heat sink, and includes two first mounting arms and two second mounting arms disposed above the first mounting arms. The first mounting arms abut on the PCB. A pair of engaging wings are formed on the second mounting arms. The wire clip includes a pivot axle pivotably attached to the mounting frame and two resilient arms at opposite sides of the mounting frame. The resilient arms abut against the heat sink and engage with the engaging wings, thereby exerting a resilient force on the heat sink toward the heat generating electronic component.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: February 1, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jer-Haur Kuo, Xin-Xiang Zha, Ye-Fei Yu, Jun Li
  • Patent number: 7866825
    Abstract: A blind (10) for a projector includes a bracket (20) mounted to the projector, and a folded fin (30) fixed on the bracket and covering a hot air vent of the projector. The folded fin includes a plurality of parallel fins (32) and a plurality of upper and lower tabs (34, 36) interconnecting the fins. Each of the fins defines an angle of 135 degrees with a plane defined by the lower tabs. Furthermore, a projection of each of the fins on the plane defined by the lower tabs overlaps a part of a corresponding adjacent fin. Thus, the blind can prevent a light leakage from the projector, while allow a heated airflow to be expelled out of the projector simultaneously.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: January 11, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hui Shen, Gen-Ping Deng, Yi-Qiang Wu
  • Patent number: 7864536
    Abstract: A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: January 4, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Qin Li, Yu-Hsu Lin, Jeng-Da Wu, Chih-Hang Chao
  • Patent number: 7859842
    Abstract: A heat sink for cooling a component is disclosed. A medium flows around the heat sink by at least sectional guidance of a main flow and a secondary flow of the medium, the main flow being separated from the secondary flow up to a constriction. After the constriction the secondary flow merges with the main flow.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: December 28, 2010
    Assignee: Siemens Aktiengesellschaft
    Inventors: Klaus Busch, Christian Scharf, Christoph Wiesner
  • Patent number: 7852630
    Abstract: A heat dissipation device includes a base, a first heat pipe, a first heat sink, a second heat pipe, a thermoelectric cooler and a second heat sink. The first heat pipe includes a first end and a second end. The first end of the first heat pipe is connected to the base. The second end of the first heat pipe is connected to a bottom of the first heat sink. The second heat pipe includes a first end and a second end. The first end of the second heat pipe is connected to the base. The second end of the second heat pipe is connected to a top end of the thermoelectric cooler. The second heat sink is mounted on a bottom of the thermoelectric cooler and located at a side of the first heat sink. The thermoelectric cooler spaces apart from the heat generating member. As such, the water generated by the thermoelectric cooler during a cooling process won't spread to the heat generating member and a short circuit of the heat generating member can be avoided.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: December 14, 2010
    Assignee: Cooler Master Co., Ltd.
    Inventor: Chia-Chun Cheng
  • Patent number: 7848105
    Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: December 7, 2010
    Assignee: Apple Inc.
    Inventors: Steven Holmes, Douglas L. Heirich
  • Patent number: 7839630
    Abstract: A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is polyurethane foam.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: November 23, 2010
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Jin-Gong Meng, Cheng-Jen Liang
  • Patent number: 7839643
    Abstract: A heat spreader is provided for use with a memory module. The memory module has at least a first side with a first plurality of integrated circuits thereon. The heat spreader includes a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side, and to be substantially thermally isolated from at least one integrated circuit on the first side. The heat spreader further includes a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: November 23, 2010
    Assignee: Netlist, Inc.
    Inventor: Enchao Yu
  • Patent number: 7821785
    Abstract: A baffle has a slot, with the slot positioned between first and second adjacent components when the baffle is installed above the components. A pair of heatsinks are inserted into the slot, with at least one heatsink having a heat dissipating portion that remains above the slot after insertion into the slot. A spring is inserted into the slot between the pair of heatsinks.
    Type: Grant
    Filed: April 20, 2009
    Date of Patent: October 26, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Matthew D. Neumann
  • Patent number: 7821789
    Abstract: A heat dissipating apparatus includes a heat sink, a blower, and a fan. The blower and the fan can be mounted together via a connection element. The heat sink defines an accommodating space. The blower and the fan can be positioned to the heat sink via the connection element, with the blower being accommodated in the accommodating space. The heat dissipating apparatus can achieve an optimal heat dissipating effect.
    Type: Grant
    Filed: August 12, 2009
    Date of Patent: October 26, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chia-Shin Chou, Xiao-Zhu Chen, Zhen-Xing Ye
  • Patent number: 7817428
    Abstract: An electrical enclosure system for transferring heat from a closed environment, includes an electrical device having a heat-generating part, and a polymer-based ventless housing for protecting the electrical device from environmental contaminants. The ventless housing fully encloses the electrical device and includes a base layer forming an impact-resistant portion of the ventless housing. The base layer includes one or more open areas in close proximity to the heat-generating part. The ventless housing further includes an integrated thermally conductive layer that forms a heat-flow path for conducting heat away from the heat-generating part towards an exterior environment. The integrated thermally conductive layer is molded around the base layer such that portions of the integrated thermally conductive layer cover the open areas of the base layer.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: October 19, 2010
    Inventors: David Randall Greer, Jr., Jeffrey J. Farago
  • Patent number: 7817423
    Abstract: Disclosed is a design for a computer enclosure. Heat is passed from the heat-generating components directly to a non-conductive liquid coolant. Some of the heat is expelled directly to the environment via a heatsink “chimney”, and some is expelled with the help of a thermoelectric heat pump.
    Type: Grant
    Filed: February 28, 2007
    Date of Patent: October 19, 2010
    Inventor: Graham Andrew Morehead
  • Patent number: 7817424
    Abstract: A heat sink assembly includes an air duct, a heat sink and a fan. The air duct defines an air guiding channel therein. The heat sink is configured to contact a heat source to dissipate heat from a heat source. The heat sink includes a plurality of heat pipes. The heat sink is placed on one side of the air guiding channel, and the heat pipes contacts the air duct to transmit heat to the air duct. The fan is placed on the other side of the air guiding channel to communicate with the heat sink via the air duct. The fan forces air to flow through the air guiding channel to the heat sink to dissipate heat on the air duct and the heat sink.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: October 19, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yu-Ling Jiang, Zhi-Jiang Yao, Ning-Yu Wang
  • Patent number: 7817420
    Abstract: An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: October 19, 2010
    Assignee: Olympus NDT
    Inventors: Michael Drummy, Ronald S Collicutt
  • Patent number: 7808789
    Abstract: The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat sink positioned in thermal contact with the heat sink and a circuit board component on a wiring board, the auxiliary heat sink having a plurality of slots located in a central portion of the auxiliary heat sink, wherein the auxiliary heat sink is both mechanically compliant and thermally conductive with both the heat sink and the circuit board component.
    Type: Grant
    Filed: November 2, 2007
    Date of Patent: October 5, 2010
    Assignee: BAE Systems Controls Inc.
    Inventors: Stephen Arthur McKeown, Gary Geno Stefani, David Reed Benedict, Andrew Karl Crane
  • Patent number: 7800901
    Abstract: An improved system for cooling a power supply of a welding or plasma cutting system, and an improved configuration of a power supply. The system cools achieves the improvement in configuration and cooling by mounting electrical components to a circuit board and then to a heat sink. Electrical components are also mounted to a common panel that improves the circulation of air. A central panel supporting the power supply heat sink and components allows a smaller and more compact design while maintaining proper temperatures. Electromagnet cooling is improved by modifying electromagnetic cores to conduct heat to the heat sink, and by the use of thermally conducting polymers.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: September 21, 2010
    Assignee: Hypertherm, Inc.
    Inventors: Dennis M. Borowy, Michael F. Kornprobst, Ronald E. Morris
  • Patent number: 7796387
    Abstract: A heat dissipation apparatus includes a heat sink and a fan. The heat sink defines a recessed space at a center of a top end thereof, and an engaging groove in an inner circumference of the top end of the heat sink surrounding and communicating with the space. The fan includes a frame and an impeller assembled to the frame. A plurality of legs extends downwardly from the frame. Each of the legs includes a hook at a free end thereof. The hooks of the legs engage in the engaging groove of the heat sink for securely mounting the fan in the recessed space of the heat sink. Heat pipes extend through the heat sink and connect with a base.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: September 14, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hong-Bo Deng, Di-Qiong Zhao, Ye Chen
  • Patent number: 7791888
    Abstract: An electronic control apparatus can be reduced in size and cost by eliminating certain parts such as a power board, etc. The apparatus includes a housing, a heat sink attached to one end of the housing, semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements. The heat sink is composed of a heat sink main body, and an anodized aluminum film formed at least on a surface of the heat sink main body at a side at which the power device is mounted thereon, and the heat sink main body has outer peripheral end faces arranged in opposition to inner wall surfaces of an opening portion of the housing.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: September 7, 2010
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tsutomu Tominaga, Masahiro Kimata, Takayuki Kifuku, Shuzo Akiyama, Tadayuki Fujimoto
  • Patent number: 7787251
    Abstract: A printed circuit board employing a heat sink retaining apparatus and method of use is disclosed. In one form of the disclosure, a heat sink apparatus can include a heat sink operable to be coupled to a first portion of a printed circuit board having an integrated circuit, and a retaining mechanism operably coupled along a first surface of the heat sink. The retaining mechanism can be coupled to a second portion of the printed circuit board to produce a tension between the first surface of the heat sink and the second portion of the printed circuit board.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: August 31, 2010
    Assignee: Dell Products, LP
    Inventor: Edmond I. Bailey
  • Patent number: 7787247
    Abstract: A cooling mechanism to dissipate thermal energy generated by the heat generating components of a graphics card assembly. An apparatus includes a circuit board having at least one heat generating component affixed thereto. The apparatus also includes a fan and carrier therefor including a heat sink plate having a portion thermally coupled to the heat generating component. The heat sink plate includes a means for forming at least one slot proximate the portion. The fan is adapted to direct airflow cross the portion. The thermal energy generated by the heat generating component is transferred to the fan carrier and ultimately removed from the fan carrier by the airflow. The airflow inducts a secondary airflow drawn through the slot during operation thereby to enhance transfer of the thermal energy from the heat generating component.
    Type: Grant
    Filed: December 11, 2007
    Date of Patent: August 31, 2010
    Assignee: EVGA Corporation
    Inventor: Tai-Sheng Han
  • Patent number: 7787249
    Abstract: Systems and methods for printed board assembly isolated heat exchange are provided. In one embodiment, a printed board assembly comprises: at least one electrical power layer; at least one electrical ground layer; a first signal layer having a first signal routing area providing electrical trace connections for signals and a first heat exchange chassis fill conductor area located adjacent to a periphery of the first signal routing area; at least one thermal interface coupled to a chassis for conducting heat from the printed board assembly to the chassis; and at least one via conductively coupling the first heat exchange chassis fill conductor area to the at least one thermal interface.
    Type: Grant
    Filed: February 3, 2009
    Date of Patent: August 31, 2010
    Assignee: Honeywell International Inc.
    Inventor: Lance L. Sundstrom
  • Patent number: 7779895
    Abstract: A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: August 24, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Jun Cao, Qing-Song Xu