Abstract: A printed circuit board (PCB) for reducing a size of a semiconductor package and a semiconductor package including the same are provided. The PCB includes a substrate base including a chip attach area disposed on a top thereof, a top pad and a bottom pad respectively disposed on the top and a bottom of the substrate base, a first top solder resist layer formed on the top of the substrate base and including a first pad opening corresponding to the top pad and covering the chip attach area, a second top solder resist layer formed on the first top solder resist layer and including a second pad opening corresponding to the top pad and a chip attach opening corresponding to the chip attach area, and a bottom solder resist layer formed on the bottom of the substrate base and including a third pad opening corresponding to the bottom pad.

Abstract: Semiconductor structure and fabrication methods are provided. The semiconductor structure includes a first wafer having a first metal layer therein and having a first material layer thereon, and a second wafer having a second metal layer therein and having a second material layer thereon. An alignment process and a bonding process are preformed between the first wafer and the second wafer, such that the first material layer and the second material layer are aligned and in contact with one another to provide a first alignment accuracy between the first metal layer and second metal layer. A heating process is performed on the first material layer and the second material layer to melt the first material layer and the second material layer to provide a second alignment accuracy between the first metal layer and second metal layer. The second alignment accuracy is greater than the first alignment accuracy.

Abstract: A method for producing a printed circuit board (13, 15, 16) with multilayer subareas in sections, characterized by the following steps: a) providing at least one conducting foil (1, 1?) and application of a dielectric insulating foil (3, 3?) to at least one subarea of the conducting foil; b) applying a structure of conducting paths (4, 4?) to the insulating layer (3, 3?); c) providing one further printed circuit board structure; d) joining of the further printed circuit board structure with the conducting foil (1, 1?) plus insulating layer (3, 3?) and conducting paths (4, 4?) by interposing a prepreg layer (5, 85; 18, 18?), and e) laminating the parts joined in step d) under pressing pressure and heat; and a printed circuit board produced according to this method.

Abstract: Provided are a transparent conductive laminate, a transparent electrode including the transparent conductive laminate, and a manufacturing method for the transparent conductive laminate.

Abstract: The present invention provides a plastic substrate, including: a polyimide film; a hard coating layer formed on one side of the polyimide film; and a transparent electrode layer formed on the other side of the polyimide film. The plastic substrate has excellent light transmittance high hardness characteristics, superior ITO processability and flexibility. Further, the plastic substrate can function as both a window film and an electrode film when it is applied to a touch screen panel. Thus, the present invention provides a touch screen panel which can be slimmed by reducing the number of laminated films including the plastic substrate.

Abstract: A fluid pressure actuated device for establishing electrical contact includes a substrate defining a chamber, a flexible membrane having a first side facing a first direction away from the substrate and a second side facing into the chamber in a second direction opposite the first direction, and an electrically conducting contactor mounted on the first side of the flexible membrane. The flexible membrane extends and withdraws moving the electrically conducting contactor in the first direction and second direction respectively when fluid pressure is increased and decreased in the chamber. The flexible membrane includes at least two concentric frustum portions that narrow in opposite directions, including a central frustum portion and a second frustum portion that encircles the central frustum portion. Multiple chambers may be maintained in pressure equilibrium by at least one channel for the concurrent extension of multiple membranes and contactors.

Abstract: Various aspects of the instant disclosure relate to pressure sensing methods and apparatuses. As may be implemented in accordance with one or more embodiments, an apparatus includes a plurality of structures having respective surface areas that are implemented to contact at least one of an electrode and other ones of the structures. The structures operate with the electrode to provide an electrical indication of pressure by effecting a change in the respective surface areas in response to an elastic compression or expansion of the structures, and providing a change in electrical impedance between the structures and the electrode based on the change in the respective surface areas.

Abstract: In various embodiments, a sensor apparatus is provided. The sensor apparatus includes a sensor device having a plurality of electrical contacts; a housing having a plurality of sidewalls; and a metal carrier structure, which extends into the housing in a manner passing through two mutually opposite sidewalls from the plurality of sidewalls. The metal carrier structure is embodied in a resilient fashion at least in the direction of a sidewall through which the metal carrier structure extends. The sensor device having the plurality of electrical contacts is mounted in a resilient fashion on the metal carrier structure and is electrically conductively connected to the metal carrier structure by the plurality of contacts.

Abstract: A method includes applying a backside passivation layer to an inactive surface of an electronic component and to enclose a through via nub protruding from the inactive surface. The method further includes laser ablating the backside passivation layer to reveal a portion of the through via nub. The backside passivation layer is formed of a low cost organic material. Further, by using a laser ablation process, the backside passivation layer is removed in a controlled manner to reveal the portion of the through via nub. Further, by using a laser ablation process, the resulting thickness of the backside passivation layer is set to a desired value in a controlled manner. Further, by using a laser ablation process, the fabrication cost is reduced as compared to the use of chemical mechanical polish.

Abstract: An electronic apparatus includes a base substrate, the base substrate including an interconnect. The electronic apparatus further includes a first die including a first semiconductor device, the first semiconductor device being coupled to the interconnect, and further includes a second die including a second semiconductor device, the second semiconductor device being coupled to the interconnect. The first and second die are attached to the base substrate in opposite orientations.

Abstract: An automatic test equipment (ATE) unit, which incorporates a mass interconnect system. The mass interconnect system is provided with a universal mounting table for use with receiver and test interface modules for electronically mounting and testing a variety of different types of electronic components or unit under test thereon. The mounting table test interface module incorporates MEMS based spring contacts to provide high-speed micro test-channels in order to establish signal connectivity between the components or unit under test and the tester, and which maintain the signal integrity up to 50 GHz without significant signal loss distortion.

Abstract: An imprinted micro-structure includes a substrate having a first layer in relation thereto. First, second, and third micro-channels are imprinted in the first layer and have first, second, and third micro-wires respectively located therein. A second layer is adjacent to and in contact with the first layer. Imprinted first and second connecting micro-channels including first and second connecting micro-wires are in contact with the first and second micro-wires respectively and are isolated from the third micro-wire. A third layer is adjacent to and in contact with the second layer and has an imprinted bridge micro-channel with a bridge micro-wire contacting the first and second connecting micro-wires and separate from the third micro-wire so that the first and second micro-wires are electrically connected and electrically isolated from the third micro-wire.

Abstract: A MEMS device includes: a base substrate; a first wiring disposed on the base substrate using a first structure; a second wiring disposed on the base substrate using the first structure and a second structure connected to the first structure; and a MEMS element connected with the first wiring and the second wiring and arranged on the base substrate, wherein the first wiring and the second wiring include a crossing portion where the first wiring and the second wiring cross each other, and at the crossing portion, the first structure of the first wiring and the second structure of the second wiring cross each other.

Abstract: Polymer binders, e.g., crosslinked polymer binders, have been found to be an effective film component in creating high quality transparent electrically conductive coatings or films comprising metal nanostructured networks. The metal nanowire films can be effectively patterned and the patterning can be performed with a high degree of optical similarity between the distinct patterned regions. Metal nanostructured networks are formed through the fusing of the metal nanowires to form conductive networks. Methods for patterning include, for example, using crosslinking radiation to pattern crosslinking of the polymer binder. The application of a fusing solution to the patterned film can result in low resistance areas and electrically resistive areas. After fusing the network can provide desirable low sheet resistances while maintaining good optical transparency and low haze. A polymer overcoat can further stabilize conductive films and provide desirable optical effects.

Abstract: A capacitive transparent conductive film comprises: a transparent substrate, comprises a first surface and a second surface which is opposite to the first surface; a light-shield layer, formed at the edge of the first surface of the transparent substrate, the light-shield layer forms a non-visible region on the first surface of the transparent substrate; and a polymer layer, formed on the first surface of the transparent substrate, and covering the light-shield layer, the surface of the polymer layer is patterned to form a meshed trench, the trench is filled with conductive material to form a sensing region on the surface of the polymer layer. The capacitive transparent conductive film can effectively protect the conductive material and has low cost and good conductivity. A preparation method of the capacitive transparent conductive film is also provided.

Abstract: The present invention provides an electroconductive sheet and a touch panel which do not impair visibility in a vicinity of an electrode terminal in a sensing region. In an electroconductive sheet which has an electrode pattern constructed of a metal thin wire and an electrode terminal that is electrically connected to an end of the electrode pattern, a transmittance of the electrode pattern is 83% or more, and when the transmittance of the electrode pattern is represented by a %, a transmittance of the electrode terminal is controlled to be (a-20)% or more and (a-3)% or less.

Abstract: A patterned transparent conductor includes: (1) a substrate; (2) first additives at least partially embedded into a surface of the substrate within a first area of the surface corresponding to a lower sheet resistance portion; and (3) second additives at least partially embedded into the surface of the substrate within a second area of the surface corresponding to a higher sheet resistance portion. A sheet resistance of the higher sheet resistance portion is at least 100 times a sheet resistance of the lower sheet resistance portion.

Abstract: An article comprising a conductive film comprising conductive structures, and a first resistive element patterned into a first portion of the conductive film. In at least some cases, the conductive structures may comprise nanostructures, such as, for example, nanowires. Silver nanowires are exemplary conductive structures. In some useful applications, the first resistive element may be part of a circuit, such as, for example, a Wheatstone bridge.

Abstract: A transparent conductor, a method for preparing the same, and an optical display including the same, the transparent conductor including a base layer; and a conductive layer on the base layer, the conductive layer including metal nanowires and a matrix, wherein the transparent conductor has a transmissive b* value of about 1.5 or less, and the matrix is prepared from a matrix composition including a tri-functional monomer and one of a penta-functional monomer or a hexa-functional monomer a base layer; and a conductive layer formed on the base layer and including metal nanowires and a matrix, wherein the transparent conductor has a transmissive b* value of about 1.5 or less, and the matrix is formed of a composition including a penta- or hexa-functional monomer and a tri-functional monomer.

Abstract: Electrically conductive films and methods for making them. The films include at least two patterns, the first of which, alone, would be visible, but with the addition of one or more other patterns, becomes invisible to the unaided human eye. These films are useful in applications where invisible patterning is desirable, such as, for example, devices employing touch screens.

Abstract: The invention relates to an electrically conductive system comprising a substrate and at least one conductive track adhered onto the substrate, wherein the substrate is composed of at least a polyamide and the conductive track is made out of an electrically conductive material and wherein the conductive track is adhered to the substrate by an jet printing technique followed by sintering. The invention further relates to a process for the production of an electrically conductive system and to its uses.

Abstract: A conductive micro-wire structure includes a substrate. A plurality of spaced-apart electrically connected micro-wires is formed on or in the substrate forming the conductive micro-wire structure. The conductive micro-wire structure has a transparency of less than 75% and greater than 0%.

Abstract: An method for preparing a flexible transparent electrode film that has a high transmittance and low sheet resistance without having to go through a separate heating process by using cesium, and a flexible transparent electrode film prepared thereby, the method including: applying a nanowire transparent conductive film on a high molecular base material film; coating the nanowire transparent conductive film with a sol-gel solution wherein titanium dioxide and cesium are mixed; and welding the nanowire.

Abstract: Provided are a method of forming an upper electrode of a nanowire array and a nanowire array having an upper electrode formed thereon. The method includes a step of placing a polymeric thin film layer, a step of pressing, a step of treating a mixed solution, a step of etching, and a step of depositing an electrode material, such that the upper electrode is reliably formed in a state in which the polymeric thin film layer is formed on a portion of the nanowire, thereby making it possible to implement various nano-devices based on the nanowire array aligned on a substrate having a large area.

Abstract: An imprinted multi-level micro-wire structure includes a substrate and a first layer formed over the substrate. The first layer includes first micro-wires formed in first micro-channels imprinted in the first layer. A second layer is formed in contact with the first layer. The second layer includes second micro-wires formed in second micro-channels imprinted in the second layer. At least one of the second micro-wires is in electrical contact with at least one of the first micro-wires.

Abstract: The invention relates to a method for the functionalisation of metal nanowires and the use of said nanowires. The functionalisation method of the invention includes a step comprising the formation of a self-assembled monolayer on at least part of the external surface of metal nanowires, using a compound of formula R1—Zn—R2, wherein Z is S or Se, and n is equal to 1 or 2, and R1 is a hydrogen atom or an acyl group or a hydrocarbon group comprising between 1 and 100 carbon atoms and R2 is an electron-attracting or -donating group. The method if the invention is particularly suitable for use in the field electrode production.

Abstract: The present disclosure provides an article having (a) a substrate having opposing first and second surfaces; and (b) a conductor micropattern disposed on the first surface of the substrate. The conductor micropattern has a plurality of traces defining a plurality of open area cells. The conductor micropattern has an open area fraction greater than 80% and a uniform distribution of trace orientation. Each of the traces is non-linear and has a trace width from 0.5 to 10 micrometer. The articles are useful in devices such as displays, in particular, touch screen displays useful for mobile hand held devices, tablets and computers. They also find use in antennas and for EMI shields.

Abstract: The present invention provides an optically transparent electrode being resistant to corrosion regardless of the shape of the pattern and enabling uniform electroless plating thereon regardless of the shape of the pattern. The optically transparent electrode has, on a support, an optically transparent electrode unit and a peripheral wire unit formed of at least one peripheral wire, of which one end is electrically connected with the optically transparent electrode unit and the other end is connected with the outside, and the optically transparent electrode unit and the peripheral wire unit are formed of the same metal. The line width of at least one metal wire forming the peripheral wire unit is not uniform, and when the at least one metal wire is divided into a thinnest metal wire segment A and the other metal wire segment B electrically connected with the metal wire segment A, the line width of the metal wire segment A is 1.

Abstract: A touch panel has an active area and a non-active area disposed at an outer side of the active area defined therein. The touch panel includes a support member and a conductive layer formed on the support member and including an electrode part in the active area to sense touch and a wiring part disposed in the non-active area to be connected to the electrode part. In the non-active area, the wiring part is disposed on the support member and the electrode part is partially disposed on the wiring part.

Abstract: A multi-layer micro-wire structure includes a substrate having a substrate edge. A first layer is formed over the substrate extending to a first layer edge. One or more first micro-channels are imprinted in the first layer, at least one imprinted first micro-channel having a micro-wire forming at least a portion of an exposed first connection pad in the first layer. A second layer is formed over the first layer extending to a second layer edge. One or more second micro-channels are imprinted in the second layer, at least one imprinted second micro-channel having a micro-wire forming at least a portion of an exposed second connection pad in the second layer. The second-layer edge is farther from the substrate edge than the first-layer edge for at least a portion of the second-layer edge so that the first connection pads are exposed through the second layer.

Abstract: The present disclosure provides a touch panel, including at least a plurality of first electrode axes, a plurality of second electrode blocks. Each first electrode axis and corresponding second electrode block are disposed at the same level, staggered and electrically isolated from each other. Each first electrode axis is an uninterrupted structure. The touch panel of the present disclosure provides a new electrode pattern, and since all electrodes are disposed at the same level, therefore the electrodes can be formed simultaneously, thereby decreasing the cost of manufacturing process.

Abstract: A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.

Abstract: A photocurable composition includes an acid-generating compound, a multifunctional epoxy resin, and an epoxysilane oligomer represented by the following Structure (I): wherein R1 is a substituted or unsubstituted alkyl group, R2 is a substituted or unsubstituted linear, branched, or cyclic alkyl group or an alkyl ether residue substituted with an epoxide, R3 is hydrogen or a substituted or unsubstituted alkyl, and x+y?2. The photocurable composition can be provided as a photoresist layer on a substrate, and can then be imprinted to form a pattern of micro-channels. These micro-channels can be filled with a conductive composition (ink) and used to form an entrenched pattern of micro-wires to provide a transparent conductive electrode.

Abstract: An imprinted micro-structure includes a substrate having a first layer in relation thereto. First, second, and third micro-channels are imprinted in the first layer and have first, second, and third micro-wires respectively located therein. A second layer is adjacent to and in contact with the first layer. Imprinted first and second connecting micro-channels including first and second connecting micro-wires are in contact with the first and second micro-wires respectively and are isolated from the third micro-wire. A third layer is adjacent to and in contact with the second layer and has an imprinted bridge micro-channel with a bridge micro-wire contacting the first and second connecting micro-wires and separate from the third micro-wire so that the first and second micro-wires are electrically connected and electrically isolated from the third micro-wire.

Abstract: An imprinted micro-structure includes a substrate having an edge area and a central area separate from the edge area. A cured bottom-layer, connecting layer, and top layer are formed over the substrate, each with a corresponding imprinted micro-channel having a cured micro-wire. The bottom micro-wire is in the central area and the edge area. The connecting-layer micro-wire contacts at least a portion of the bottom-layer micro-wire in the edge area. A cured edge micro-wire in the top layer contacts at least a portion of the connecting-layer micro-wire in the edge area. A top-layer micro-wire is located in a top-layer micro-channel and is separate from the edge micro-wire and bottom micro-wire. The bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire.

Abstract: Provided is a translucent conductive patterned member in which, as the metal pattern portion itself has a translucency, the metal pattern portion is hardly visible, and scattering caused by a moiré or diffraction is reduced, and in which it is also provided with sufficient conductivity. The translucent conductive patterned member is provided with a base layer formed by using a compound containing a nitrogen atom and a conductive pattern portion having a translucency in which the conductive pattern portion is formed on at least one part of the base layer by using silver or an alloy containing silver as a main component.

Abstract: A photosensitive conductive paste includes an epoxy acrylate (A) including a urethane bond, a photopolymerization initiator (B), and a conductive filler (C), wherein an added amount of the conductive filler (C) is 70 to 95% by weight with respect to the total solids in the photosensitive conductive paste.

Abstract: A transparent conductor includes a base layer, and a transparent conductive film on one or both sides of the base layer, the transparent conductive film including a metal nanowire, where the base layer includes a retardation film. An optical display apparatus includes the transparent conductor. The transparent conductor may compensate for a viewing angle of the optical display apparatus.

Abstract: An electrode element using a silver nano-wire and a manufacturing method thereof are provided, according to which the electrode element has reinforced bonding of wire unit structures with low-temperature heat treatment and easily applicable as a polymer substrate, while improving haze phenomenon, deteriorating adhesion force of silver nano-wire layer, surface roughness and changing resistance over time. The manufacturing method of electrode element includes steps of forming a silver nano-wire layer on a substrate, coating an organo-metal (OM) compound solution on top of the silver nano-wire layer, reinforcing bonding of junctions formed between wire unit structures with a thermal energy locally generated at the junctions by surface Plasmon, by irradiating light onto the silver nano-wire layer with the OM compound coated thereon, and treating surface by applying sol-gel solution on the silver nano-wire layer treated by the Plasmon.

Abstract: Provided is a transparent conductive film wherein an electrically conductive region is converted to an electrically insulating region more readily and rapidly than traditional conductive films and the level difference between the electrically conductive region and the electrically insulating region is smaller. The transparent conductive film has an electrically conductive region 4 and an electrically insulating region 5. The electrically conductive region 4 contains a resin component 10, a metal nanowire 2 and an insulation-promoting component 3. The insulation-promoting component 3 has a light absorption higher than that of the metal nanowire 2. The electrically insulating region 5 is defined by a region which contains a resin component 10 but not the metal nanowire 2 or a region which contains a resin component 10 and additionally a metal nanowire 2 having an aspect ratio of smaller than that of the metal nanowire 2.

Abstract: A conductive film may be provided that includes a base member, a first hard coating layer formed on a surface of the base member, and a conductive layer formed on the first hard coating layer. The conductive layer may include conductors composed of a nano-material forming a network structure.

Abstract: Discloses herein is a patterned transparent conductive electrode, comprises a substrate and a substantial single conductive layer on top of the substrate. The single conductive layer comprises a first region having a network of metal nanowires; and a second region, having a metal/metal oxide nanowire in a core shell structure.

Abstract: Discloses herein is a patterned transparent conductive electrode, comprises a substrate and a substantial single conductive layer on top of the substrate. The single conductive layer comprises a first region comprising a network of silver nanowires and means for protecting the nanowire from surface oxidation; and a second region, comprising a plurality of metal nanowires and means for protecting nanowire from surface oxidation, and metal oxide nanowires.

Abstract: A conductive member includes a substrate, conductive layers that are provided on both surfaces of the substrate, and contain a conductive fiber having an average minor axis length of 150 nm or less and a matrix, and intermediate layers that are provided between the substrate and the conductive layers, and contain a compound having a functional group capable of interacting with the conductive fiber, and, when surface resistance values of the two conductive layers are represented by A and B respectively, and an A value is equal to or greater than a B value, A/B is in a range of 1.0 to 1.2.

Abstract: Provided is a method of manufacturing a nanowire, including: forming a plurality of grid patterns on a grid base layer; forming a sacrificial layer on the grid base layer on which the grid patterns are formed; producing a nanowire grid structure by forming a nanowire base layer on the sacrificial layer; forming a nanowire by wet etching the nanowire base layer; and separating the grid patterns from the nanowire by etching the sacrificial layer. Thus, the method can be provided with the following advantages; Because a wet etching time is adjusted, a width and a height of the nanowire to be produced can be adjusted; the nanowire can be produced at room temperature with a low cost; the nanowire can be produced in large quantities; and in spite of the mass production, the nanowire having high uniformity can be produced.

Abstract: A capacitive transparent conductive film comprises: a transparent substrate, comprises a first surface and a second surface which is opposite to the first surface; a light-shield layer, formed at the edge of the first surface of the transparent substrate, the light-shield layer forms a non-visible region on the first surface of the transparent substrate; and a polymer layer, formed on the first surface of the transparent substrate, and covering the light-shield layer, the surface of the polymer layer is patterned to form a meshed trench, the trench is filled with conductive material to form a sensing region on the surface of the polymer layer. The capacitive transparent conductive film can effectively protect the conductive material and has low cost and good conductivity. A preparation method of the capacitive transparent conductive film is also provided.

Abstract: A transparent conductive film, includes: a transparent substrate, wherein a transparent substrate includes a body and a flexible board, a width of flexible board is less than that of the body, and the body includes a sensing area and a border area located at an edge of the sensing area; a conduction line, disposed on a transparent flexible substrate; a first conductive layer and a second conductive layer, disposed on two sides of the sensing area opposite to each other; a first electrode trace and a second electrode trace, disposed on the border area, and the first conductive layer and the conduction line are electrically connected through a first electrode trace; the second conductive layer and the conduction line are electrically connected through a second electrode trace. The production efficiency of the above transparent conductive film is improved.

Abstract: A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board has an upper surface. The patterned metal layer is disposed on the board and includes a first electrode, a second electrode, plural first pads and plural second pads. The first pads and the second pads are alternatively disposed on the upper surface in parallel. Parts of the first (second) pads are electrically connected to the first (second) electrode. The other parts of first pads and the other parts of second pads are electrically connected to each other. Each first pad and the adjacent second pad define a device bonding area. The heat generating elements are respectively disposed in the device bonding areas. There are multiple trenches between the two adjacent device bonding areas. The heat dissipating channels are disposed in the trenches.

Abstract: The present invention provides a plastic substrate, including: a polyimide film; a hard coating layer formed on one side of the polyimide film; and a transparent electrode layer formed on the other side of the polyimide film. The plastic substrate has excellent light transmittance high hardness characteristics, superior ITO proccessability and flexibility. Further, the plastic substrate can function as both a window film and an electrode film when it is applied to a touch screen panel. Thus, the present invention provides a touch screen panel which can be slimmed by reducing the number of laminated films including the plastic substrate.

Abstract: A large-area transparent conductive element easy to form a fine pattern includes a substrate having a surface, and transparent conductive portions and transparent insulating portions that are alternately provided on the surface in a planar manner. At least one type of unit section including a random pattern is repeated in at least either the transparent conductive portions or the transparent insulating portions.