Abstract: Electrically continuous shielding elements for use in communication cables are described. A shielding element may include a base layer of dielectric material extending in a longitudinal direction, and a plurality of longitudinally spaced segments of electrically conductive material may be formed on the base layer. A respective fusible element may be positioned between each adjacent set of longitudinally spaced segments included in the plurality of longitudinally spaced segments. Each fusible element may provide electrical continuity between the adjacent set of longitudinally spaced segments, and each fusible element may have a minimum fusing current between 0.001 amperes and 0.500 amperes.

Abstract: An interposer (110) has contact pads at the top and/or bottom surfaces for connection to circuit modules (e.g. ICs 112). The interposer includes a substrate made of multiple layers (110.i). Each layer can be a substrate (110S), possibly a ceramic substrate, with circuitry. The substrates extend vertically. Multiple interposers are fabricated in a single structure (310) made of vertical layers (310.i) corresponding to the interposers' layers. The structure is diced along horizontal planes (314) to provide the interposers. An interposer's vertical conductive lines (similar to through-substrate vias) can be formed on the substrates' surfaces before dicing and before all the substrates are attached to each other. Thus, there is no need to make through-substrate holes for the vertical conductive lines. Non-vertical features can also be formed on the substrates' surfaces before the substrates are attached to each other. Other embodiments are also provided.

Abstract: A method of winding a flexible cable, a carrying equipment and a gimbal are provided. The method is used for electrical connection in the carrying equipment, and includes winding a multilayer flexible cable provided in layered stack on a carrier device to form a winding structure, and the winding structure includes at least one force offsetting unit including a first bending part and a second bending part bent in opposite directions.

Abstract: A system for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.

Abstract: A capacitive sensor having a bending portion and a flat portion and bendable in the bending portion includes a plurality of first transparent electrodes, a plurality of second transparent electrodes, a coupling member, and a bridge wiring member. The first transparent electrodes are arranged in a first direction. The second transparent electrodes are arranged in a second direction crossing the first direction. The coupling member is provided integrally with either the first transparent electrodes or the second transparent electrodes. The bridge wiring member is provided separately from the first transparent electrodes or the second transparent electrodes, to which the coupling member is not provided, in a portion where the bridge wiring member crosses the coupling member. A direction in which the coupling member extends in the bending portion is different from a direction in which the coupling member extends in the flat portion.

Abstract: Disclosed is an organic light-emitting display panel, which comprises a substrate, the substrate comprises a display region and a non-display region, wherein, the non-display region comprises: an insulating layer, which is provided on the same side as the array layer and provided with at least one groove by which the substrate is exposed; a metal layer, which comprises a first part and a second part, the first part covers the groove and contacts the substrate at the bottom of the groove, and the second part covers an outside of the groove and contacts the insulating layer; and at least one bank, contacting the second part, and wherein the bank comprises an organic material.

Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

Abstract: A capacitive sensor bonded to a panel having a flat-surface portion and a curved-surface portion includes a plurality of first transparent electrodes, a plurality of second transparent electrodes, a coupling member, and a bridge wiring member. The first transparent electrodes are arranged in a first direction. The second transparent electrodes are arranged in a second direction crossing the first direction. The coupling member is provided integrally with either the first transparent electrodes or the second transparent electrodes. The bridge wiring member is provided separately from the first transparent electrodes or the second transparent electrodes, to which the coupling member is not provided, in a portion where the bridge wiring member crosses the coupling member. A direction in which the coupling member extends in a portion bonded to the curved-surface portion is different from a direction in which the coupling member extends in a portion bonded to the flat-surface portion.

Abstract: A display device includes a substrate having a first area, a second area, and a bending area disposed between the first area and the second area. An inner wiring is disposed in the first area. An outer wiring is disposed in the second area. An interlayer insulating layer covers the inner wiring and the outer wiring, and includes a first contact hole. A conductive layer is disposed on the interlayer insulating layer, and is connected to the inner wiring or the outer wiring through the first contact hole. An inorganic protective layer covers at least a portion of the conductive layer and includes an inorganic insulating material.

Abstract: In one general aspect, an integrated passive device (IPD) die includes at least one passive component that is embedded in an insulator material disposed on a front surface of a substrate. The IPD die includes a through-substrate via (TSV) extending from the backside of the substrate toward the front surface of the substrate. The TSV defines interconnect access to at least one passive component embedded in the insulator material disposed on the front surface of the substrate. The substrate has a thickness less than three-quarters of an original thickness of the substrate.

Abstract: The present disclosure provides a display panel and a backlight module opposite to the display panel. A circuit board is arranged at a first edge of the display panel, the circuit board is folded to extend from a first surface of the display panel away from the backlight module to a second surface of the backlight module away from the display panel, and at least one folding portion is arranged at a portion of the circuit board between the display panel and the backlight module. The display module further includes a cell tape configured to connect the display panel to the backlight module. The cell tape includes: a first region, attached to an edge of the first surface of the display panel; a second region, attached to an edge of the second surface of the backlight module; and a folding region, which is arranged between the first region and the second region, and connects the first region to the second region.

Abstract: Transducers are provided including a piezoelectric block having first and second opposing surfaces; a first conductive flexible support layer on the first surface of the piezoelectric block, the first flexible support layer having a first thickness; and a second flexible support layer on the second surface of the piezoelectric block, the second flexible support layer having a second thickness. Related devices are also provided.

Abstract: A multilayer board includes a flexible base material including laminated insulator layers and curved along an X-axis direction on a plane orthogonal or substantially orthogonal to a lamination direction, an interlayer connection conductor on the flexible base material, and a notch pair on the flexible base material at positions symmetrical or substantially symmetrical in the X-axis direction with respect to a position of the interlayer connection conductor, the notch pair extending in a Y-axis direction orthogonal or substantially orthogonal to the X-axis direction on the plane. The interlayer connection conductor is within a region defined by the notch pair and lines respectively joining ends of the notch pair in the Y-axis direction. A radius of curvature of a region of the flexible base material between the notch pair in the X-axis direction being greater than curvature radii of regions outside of the notch pair.

Abstract: An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

Abstract: A flexible electronic display is provided. The display includes a substrate having a plurality of rigid portions, at least one display circuit positioned on a surface of each of the plurality of rigid portions, and at least one flexible interconnect electrically connected to the at least one display circuit. The at least one interconnect is flexible such that each of the plurality of rigid portions may be folded or stretched relative to one another.

Abstract: An electronic circuit board includes a plurality of hard rigid board portions each of which has an insulating insulator and a conductive circuit pattern and electrically connects a mounted electronic component to the circuit pattern; and at least one soft flexible board portion which has an insulating insulator, has a conductive circuit pattern electrically connected to each of the circuit patterns of at least two rigid board portions among the plurality of rigid board portions, and is integrated with the rigid board portions which are electrically connected to the circuit pattern of the flexible board portion. The insulator of the flexible board portion is provided with a through-hole at a place where the circuit pattern of the flexible board portion is not stacked.

Abstract: Provided is a stretchable circuit board including: a stretchable base material having stretchability and including a stretchable wiring line on one main surface; an electrode formed on at least the main surface of the stretchable base material and connected to the stretchable wiring line; an adhesive layer directly or indirectly bonded to the main surface on which the electrode is formed and formed in a region of the main surface other than an electrode region including the electrode; and an adhesive layer separator detachably bonded to the adhesive layer and having an opening formed at a position corresponding to at least part of the electrode region.

Abstract: A device (10; 10?) for connecting battery cells (30), characterized by: a multiplicity of cell connectors (14) for electrically connecting terminals (36) of the battery cells (30), and a carrier (12; 12?) for mechanically connecting the cell connectors (14) to one another.

Abstract: A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps: providing at least two elements (1, 3) of insulating material coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material, wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties. Furthermore a printed circuit board (10) or sub-assembly thereof is provided.

Abstract: A printed wiring board includes: an insulating base material; a first conductive layer disposed on a main surface of the insulating base material in a first region and a second region defined on a plane along the main surface; a second conductive layer disposed on a main surface of the first conductive layer in the first region; and an insulating layer disposed on the main surface of the first conductive layer in the second region. The ratio of a first evaluation value E1 to a second evaluation value E2 is 0.91 or more and 0.99 or less. The first evaluation value E1 is an evaluation value of strength of a first laminated part in the first region and the second evaluation value E2 is an evaluation value of strength of a second laminated part in the second region.

Abstract: A semiconductor package structure including a first semiconductor package is provided. The first semiconductor package includes a first redistribution layer (RDL) structure having a first surface and a second surface opposite thereto. A first semiconductor die is disposed on and electrically coupled to the first surface of the first RDL structure. A first molding compound is disposed on the first surface of the first RDL structure and surrounds the first semiconductor die. A plurality of solder balls or conductive pillar structures is disposed in the first molding compound and electrically coupled to the first semiconductor die through the first RDL structure. A method for forming the semiconductor package is also provided.

Abstract: A foldable display device is discussed, which is capable of shielding the folding region of a housing, to which a flexible display panel is coupled, so as to prevent exposure of the folding region to the outside upon an operation of folding the housing, and which is capable of improving the flatness of the flexible display panel when the flexible display panel or the housing returns from the folded state to the unfolded state.

Abstract: A multilayer board includes a first base material substrate including insulating base material layers that are laminated, a second base material substrate laminated on the first base material substrate to straddle a stepped portion, and a third base material substrate laminated on the second base material. The first base material substrate includes first and second conductor patterns respectively provided on surfaces in contact with the second base material substrate. The third base material substrate includes third and fourth conductor patterns. The second base material substrate includes a first interlayer connection conductor connecting the first and third conductor patterns, and a second interlayer connection conductor connecting the second and fourth conductor patterns, and has a higher flowability than the first and third base material substrates during lamination.

Abstract: The present invention relates to a chemically strengthened glass, in which CT1 and CT5 satisfy CT5/CT1?0.85, the CT1 satisfies CT1>?38.7×ln(t/1000)+48.2 [MPa] and an internal energy density rE satisfies rE?23.3×t/1000+15 [kJ/m2]. CS is a surface compressive stress value [MPa], ? (x) is a compressive stress value [MPa] at a position x in a depth direction, DOL is a compressive stress depth [?m], and t is a sheet thickness [?m].

Abstract: Electronic devices (4, 24) are mounted in sequence or series along a plurality of laterally spaced discrete lines (10) on a sheet of non-conductive flexible planar support material (50). The sheet is slit or stripped between said lines to create at least two yarns each in the form of a strip bearing a series of said devices. The width of each strip can be substantially the same as that of the mounted device or devices and is normally less than twice that of the device or devices. The thickness of the support material is normally no more than 10 ?m, and with the width of the devices typically being no more than 800 nm, a strip bearing the devices can thus be used as a yarn or strip for use in many applications, both functional and decorative, either alone or within a sleeve.

Abstract: A stretchable circuit board includes a stretchable substrate, a stretchable conducting film placed on one surface of the stretchable substrate and elongated in a first direction, an electric element placed on the one surface of the stretchable substrate, and a covering portion that covers a part of the stretchable conducting film and at least a part of the electric element, wherein, when an area of a first section as a section along an outer circumference of the covering portion in the stretchable conducting film is referred to as a first area and an area of a second section as a section of the stretchable conducting film orthogonal to the first direction in a location apart from the outer circumference of the covering portion toward outside is referred to as a second area, the first area is larger than the second area.

Abstract: A method of manufacturing a component carrier is disclosed. The method includes forming a through hole between a first main surface and a second main surface of an electrically insulating layer structure by removing material from at least one of the main surfaces of the electrically insulating layer structure, in particular by irradiating at least one of the main surfaces of the electrically insulating layer structure with at least one laser shot. The at least one main surface from which material is removed, is not covered by an electrically conductive layer structure at least in a surface region in which the through hole is to be formed. Subsequent to formation of the through hole, at least partially filling the through hole and at least partially covering the main surfaces of the electrically insulating layer structure by an electrically conductive filling medium.

Abstract: The present invention relates to an integrated circuit packaging, comprising: a plurality of electrical circuits using a first patterned conductive layer (103) formed by using a masking material (102); a second patterned conductive layer (105) having disposed on at least one side of the first patterned conductive layer (103); and a first dielectric layer (106) made from a laminating means, wherein the first patterned conductive layer (103) and the second patterned conductive layer (105) are disposed within the first dielectric layer (106), such that at least one side of the first dielectric layer (106) are located at the same plane with the first patterned conductive layer (103).

Abstract: A printed circuit board is provided. The printed circuit board includes a flexible region. The flexible region includes a first copper layer, a first dielectric layer, a second copper layer, an adhesive layer, and a first metal layer, in the order listed. The first metal layer includes a metal film having a tensile strength greater than the first and second copper layers and greater than the dielectric layer.

Abstract: A touch panel sensor includes a substrate and an electrode having a detection electrode and an extraction electrode connected to a detection electrode. The electrode, in any cross-section thereof in the thickness direction, includes a metal layer which occupies at least part of the cross-section. The metal layer of the detection electrode and the metal layer of the extraction electrode are formed integrally at a joint between the detection electrode and the extraction electrode. The detection electrode includes a conductive mesh having conductive wire arranged in a mesh pattern, the conductive wire having a height of not less than 0.2 ?m and not more than 2 ?m and a width of not less than 1 ?m and not more than 5 ?m. The conductive wire of the conductive mesh each have a base surface on the substrate side, and a flat top surface located opposite to the base surface.

Abstract: Certain aspects of the present disclosure are directed to an integrated circuit (IC) package. The IC package generally includes an IC and a shielding sidewall disposed adjacent to the IC. In certain aspects, the IC comprises a first layer coupled to the shielding sidewall, a second layer comprising a first signal path, and a third layer disposed below the first layer and coupled to the shielding sidewall, wherein the second layer is disposed between the first layer and the third layer. In some cases, the IC also includes a plurality of vias configured to couple the first layer to the third layer, wherein at least a portion of the first signal path is disposed in an inner shielding region that spans from the first layer to the third layer and spans from the shielding sidewall to the plurality of vias.

Abstract: A resin multilayer substrate includes a substrate main body including first, second, and third wiring portions connected to one another by a connecting portion. First, second and third external connection terminals are respectively included in the first, second and third wiring portions. The first external connection terminal includes a conductor exposed at a surface of the substrate main body. The second and third external connection terminals include connectors mounted on conductors on the surface of the substrate main body. An auxiliary mounting conductor is disposed between the first external connection terminal and the second and third external connection terminals on the surface of the substrate main body.

Abstract: Embodiments include devices and method related to a foldable printed circuit board that may be used in SSD applications. One embodiment relates to a foldable printed circuit board comprising a first rigid portion, a second rigid portion, and a first flexible region coupling the first rigid portion to the second rigid portion. The foldable printed circuit board also includes a third rigid portion and a second flexible region coupling the second rigid portion to the third rigid portion, wherein the first rigid portion and the third rigid portion each have a width that is less than that of the second rigid portion. Other embodiments are described and claimed.

Abstract: To improve signal transmission characteristics of a high frequency signal of 80 GHz or higher. A semiconductor device includes a wiring board having a structure in which a signal via structure and a grounding via structure have mutually overlapping portions in plan view.

Abstract: A thin film capacitor includes a capacitor body formed by alternately stacking first and second electrode layers and a dielectric layer on a substrate, and having the second electrode layer disposed in an uppermost portion thereof, and a stress alleviation layer formed on the uppermost second electrode layer. The stress alleviation layer is formed of a material having a coefficient of thermal expansion higher than those of the substrate and the dielectric layer.

Abstract: An impedance spectroscopy biosensor is provided that is fabricated on a stretchable substrate. The stretchable substrate is integrated with an impedance biosensor that undergoes cyclic strain without cracking. The biosensor is formed by curing an elastomer precursor while on a pre-tensioned membrane that includes a conductive electrode. The resulting elastomeric material is released from the support after curing which releases the pre-tensioned state to produce the biosensor.

Abstract: A method comprises bonding a first surface of an interposer wafer with a first exterior surface of a photonic wafer assembly. The photonic wafer assembly comprises one or more optical devices coupled with one or more metal layers and with one or more first optical waveguides. The method further comprises forming, from a second surface opposite the first surface, a plurality of first conductive vias extending at least partway through the interposer wafer and coupled with the one or more metal layers. The method further comprises forming, at the second surface, a plurality of first conductive pads coupled with the plurality of first conductive vias. The method further comprises forming one or more second conductive pads coupled with the one or more metal layers. The one or more second conductive pads are accessible at a second exterior surface of the photonic wafer assembly opposite the first exterior surface.

Abstract: A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.

Abstract: An image surface-side group lens (18) is mounted on a flexible printed board (FPC) (2) by appropriately adjusting a height from the FPC (2) to the image surface-side group lens (18). A camera module (1) includes a sensor mounted on the FPC (2) and the image surface-side group lens (18) arranged on the sensor (14), in which the image surface-side group lens (18) is mounted on the FPC (2) with an adhesive (22) being interposed between the FPC (2) and an edge portion of the image surface-side group lens (18) on a side opposing the sensor (14).

Abstract: There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display.

Abstract: A display device is provided, and includes a display panel, a polarizer layer, and a cover layer. The polarizer layer is disposed on the display panel and has a first thickness. The cover layer is directly formed on the polarizer layer and has a second thickness. The cover layer has a pencil hardness greater than or equal to 6H, and the first thickness is greater than the second thickness.

Abstract: The present invention relates generally to electric circuit testing, building, or implementing using a breadboard style PCB. Aspects of the present invention include eliminating the need to use hookup wires when building and testing electric circuits on PCBs. In embodiments, a PCB system having rows and columns of signal tie points connected in a breadboard layout and using an embedded wire and a solder bridge to form partial connections between signal tie points. In embodiments, the embedded wire and solder bridge is capable of connecting a column of signal tie points. In embodiments, the embedded wire and solder bridge is capable of connecting a power rail to a signal tie point. Thus, a circuit can be implemented and tested by applying a small amount of solder to the solder bridge without the need for hookup wires.

Abstract: An electronic device may be provided with a display such as an organic light-emitting diode display. The display may include an array of display pixels formed on a polymer substrate layer. The polymer substrate layer may include an contiguous layer of polyimide that forms a substrate layer in additional structures such as a polymer film and a flexible printed circuit. A first transition region may be interposed between the display and the polymer film, and a second transition region may be interposed between the polymer film and the flexible printed circuit. Metal traces may be formed on the polymer film and on the flexible printed circuit. A display driver integrated circuit may be mounted to the traces on the polymer film. The polymer film may form a U-shaped bend. The flexible printed circuit may be coupled to a printed circuit board in the device using hot bar solder connections.

Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

Abstract: In one example an electronic device comprises a chassis and a printed circuit board coupled to the chassis and comprising a body formed from a plurality of laminate layers, and at least one receptacle formed in the body and comprising at least one data connector positioned in the receptacle to provide a communication connection. Other examples may be described.

Abstract: Provided are display devices. The display device comprises: a printed circuit board (PCB); an under-panel sheet which is disposed on the PCB and in which a groove recessed from a surface facing the PCB toward an opposite surface is defined; and a sensor which is disposed on the PCB and in the groove, wherein one or more openings are defined in the PCB in plan view, and the PCB comprises a first area and a second area divided by the openings interposed between the first area and the second area, wherein the first area is an area where the sensor is disposed, and the second area is an area where a portion of the under-panel sheet in which the groove is not defined is disposed.

Abstract: An antenna module includes a resin multilayer substrate including a plurality of base materials that are flexible. The resin multilayer substrate includes a rigid portion at which a first number of stacked layers of the base materials is relatively large and a flexible portion at which a second number of stacked layers of the base materials is relatively small. A radiating element including a conductor pattern is provided at the rigid portion. A transmission line including a conductor pattern and electrically connected to the radiating element is provided at the flexible portion. A frame-shaped conductor that surrounds the radiating element when viewed in a direction in which the base materials are stacked is provided at either the rigid portion or the flexible portion, or both the rigid portion and the flexible portion.

Abstract: A curved liquid crystal display panel includes an upper substrate having a curved shape, a liquid crystal layer, a lower substrate having a curved shape, where the lower substrate is combined with the upper substrate and the liquid crystal layer is disposed between the upper substrate and the lower substrate, and a heating line disposed on at least one of the upper substrate and the lower substrate and which provides heat to the liquid crystal layer such that a temperature of the liquid crystal layer increases.

Abstract: A touch-control display device includes a driving module, a display panel having a first force touch-control component and a self-capacitance type touch control-electrode, and a backlight module disposed with the display panel and having a second force touch-control component, with a variable gap formed between the first force touch-control component and the second force touch-control component. The first touch-control component comprises a plurality of first electrodes arranged in a matrix. The second force touch-control component is an electrical conductive layer. The self-capacitance type touch-control electrode comprises a plurality of second electrodes arranged in a matrix.

Abstract: An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.