Shielded Patents (Class 174/350)
  • Patent number: 8129629
    Abstract: An arrangement for reducing the electric field strength on the face of an electrode, wherein the face of the electrode is surrounded by at least one electric barrier, and a shielding electrode having a defined voltage potential is disposed in the vicinity of the face of the electrode. By using a retaining element that can be connected directly to the face of the electrode, the shielding wires can be quickly and easily positioned and fixed relative to the face of the electrode and the shielding electrode relative to the face.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: March 6, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventors: Jens Hoppe, Dietmar Jahnel, Klaus Müller, Johann Schlager
  • Publication number: 20120037420
    Abstract: Apparatus, systems and methods for electronic device protection are provided. A particular apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate. The conductive members are arranged to form a first discontinuous mesh, where each conductive member of a cell is separated from conductive members of adjacent cells by a gap and a cavity is defined in the non-conductive substrate at a location of each gap.
    Type: Application
    Filed: August 16, 2010
    Publication date: February 16, 2012
    Applicant: The Boeing Company
    Inventors: Tai A. Lam, Minas H. Tanielian
  • Patent number: 8116099
    Abstract: Provided is a circuit board device, wherein degrees of freedom are provided for a GND connecting position among plural printed boards, and noise shield and/or heat sink effects are provided. An electronic device provided with the circuit board device and a GND connecting method are also provided. Circuit board device (100) includes a pair of printed boards (110, 120), noise generating component (112) and/or heat generating component (122), and metal plate (140). Printed boards (110, 120) include mounting surfaces and GND connecting terminals (111, 121) arranged on the respective mounting surfaces, and the mounting surfaces are arranged to face each other. Noise generating component (112) and/or heat generating component (122) is mounted on the mounting surface of at least one of a pair of printed boards (110, 120).
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: February 14, 2012
    Assignee: NEC Corporation
    Inventor: Akihito Kubota
  • Publication number: 20120020416
    Abstract: A flexible cable is provided in which a transmission characteristic can be ensured in a high frequency band, and electromagnetic noises can be suppressed. A flexible cable 11 includes a sheet-like base member (dielectric substance) 1; an adhesive (dielectric substance) 2 which bonds the base member 1 to a cover member (dielectric substance) 3; a shield member 4 which covers the cover member 3 and is bonded or printed to the cover member 3 to suppress electromagnetic noises to be radiated; and a top coating member 5 which covers the shield member 4 to protect the shield member 4.
    Type: Application
    Filed: March 30, 2010
    Publication date: January 26, 2012
    Applicant: Panasonic Corporation
    Inventors: Takuma Shimura, Takashi Akita, Osamu Shibata
  • Patent number: 8093505
    Abstract: Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit device includes a first circuit substrate (101) and a second circuit substrate (102) which are arranged in parallel such that their substrate surfaces are opposed to each other. The peripheral portion of the first circuit substrate (101) and the peripheral portion of the second circuit substrate (102) are connected to each other by connection members (10a to 10d) having a wiring member (103) and a thermal hardening anisotropic conductive sheet (107), thereby performing electric connection.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: January 10, 2012
    Assignee: Panasonic Corporation
    Inventors: Manabu Gokan, Akihisa Nakahashi, Takayuki Hirose, Yoko Kasai, Kohichi Tanda
  • Patent number: 8076591
    Abstract: The invention relates to circuit boards and to screening circuits and components on such boards from stray rf interference when they are mounted as arrays or stacks of such circuit boards. The circuit boards (12, 14) are individually screened by conductive screening layers (16, 18) as known in the art and the individual screening layers are coupled together by layered interconnects (34) which connect corresponding screening layers (16, 18) of the individual circuit boards (12, 14) together, instead of by vias.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: December 13, 2011
    Assignee: BAE Systems plc
    Inventors: Martin Joseph Agnew, Gary David Panaghiston, Murray Jerel Niman, Nicholas Chandler
  • Patent number: 8078121
    Abstract: A spacer for use in a mobile device fills the space between a component assembly and a housing. The spacer includes a layer of compressible material for insertion between the component assembly and the housing. A plurality of compressible features are provided on a face of the layer. Upon insertion of the component assembly and assembly of the housing, the compressible features are compressed to fill a gap between the component assembly and the housing without over-compressing the main body of the spacer, allowing the body of the spacer to cushion any subsequent impact to the mobile device.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: December 13, 2011
    Assignee: Research In Motion Limited
    Inventors: Herrebertus Tempelman, Robert W. Phillips
  • Publication number: 20110266045
    Abstract: A shield-can includes a shield member defining a perforated portion to form a peripheral frame and a top plate, the top plate is enabled to be separated from the peripheral frame.
    Type: Application
    Filed: August 25, 2010
    Publication date: November 3, 2011
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: LI-ZHI XIONG, LIAN-WEI CHEN, YONG CHEN, CHENG-RUI LIU, LIANG QIU
  • Publication number: 20110253441
    Abstract: A noise dampening tape and gasket material for reducing or preventing unwanted electromagnetic interference from escaping or entering an enclosure. The noise dampening gasket includes an inner core section, a carbon material layer surrounding the inner core section, an insulating layer surrounding the carbon material layer, and a metal shield layer surrounding the insulating layer. The noise dampening tape includes a metal shield layer, an insulating layer adjacent to and in contact with the metal shield layer, a carbon material layer adjacent to and in contact with the insulating layer, and an adhesive layer disposed on a surface of the carbon material layer. A second adhesive layer can be disposed on a surface of the metal shield layer.
    Type: Application
    Filed: June 29, 2011
    Publication date: October 20, 2011
    Applicant: MIXZON INCORPORATED
    Inventors: Robert L. Doneker, Kent G. R. Thompson
  • Publication number: 20110240359
    Abstract: A shielding system for protecting a drive by wire system includes a conductive computer shield that may be tied electrically to chassis ground for encasing computers within the drive by wire system, and a conductive bus shield that may also be tied electrically to chassis ground for encasing busses that carry signals between the computers within the drive by wire system.
    Type: Application
    Filed: February 23, 2011
    Publication date: October 6, 2011
    Inventors: GERALD MILTON WINTERS, JR., Roy Franklin Wilt
  • Publication number: 20110242787
    Abstract: An input/output cable port assembly and electromagnetic interference (EMI) attenuation method are provided. The port assembly includes a cable port structure for an electronics rack with an opening for input/output cables to pass therethrough, and a first and a second partition. The first and second partitions couple to the cable port structure and reside within the opening. The first partition includes at least one ferrite inductor portion and the second partition includes at least one second ferrite inductor portion. The partitions are configured to be disposed adjacent to each other as adjoining partitions within the cable port structure, and when disposed as adjoining partitions, the first and second ferrite inductor portions mate and define a ferrite inductor with a central opening for input/output cable(s) of the electronics rack to pass. The ferrite inductor attenuates electromagnetic interference resulting from transient or steady state currents on the cable(s) passing therethrough.
    Type: Application
    Filed: March 31, 2010
    Publication date: October 6, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Alma JAZE, Alan H. KNIGHT, John M. SKILLMAN, Kwok M. SOOHOO
  • Patent number: 8031039
    Abstract: It is an object of the present invention to provide a separate type magnetic shield apparatus which has high access performance to a magnetically shielded space, in which magnetic shielding is very effectively achieved.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: October 4, 2011
    Assignees: Kyushu University, National University Corporation, Nippon Steel Composite Co., Ltd.
    Inventors: Ichiro Sasada, Toshikazu Takeda
  • Publication number: 20110232956
    Abstract: An Electronic Isolation Chamber With Unimpeded Hand Entry is disclosed. The somewhat “open” appearance of the Electromagnetic Isolation Chamber goes contrary to teachings in the art of RF shielding and enclosures. A sleeve through an aperture in the chamber is worn by an operator, and with the placement of an operator's arm there through, the electromagnetic shielding is completed and the volume contained within the chamber is electromagnetically isolated from the environment exterior to the chamber. This novel arrangement allows an operator to work with bare hands, thus providing more tactile interaction with a device under test and also reducing the tendency for shorting that is present when wearing conductive gloves. A shielded window and an interior light may be included to facilitate viewing of a device within the chamber during operation of the device.
    Type: Application
    Filed: March 24, 2010
    Publication date: September 29, 2011
    Inventor: John G. Ramsey
  • Patent number: 8025752
    Abstract: A method of fabricating a conductive composite wherein at least one predetermined electrical access area of a conductive material is coated with a maskant. The conductive material is included in a composite ply lay-up which is cured and then the maskant is removed from the conductive material.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: September 27, 2011
    Assignee: Raytheon Company
    Inventors: William H. Fossey, Jr., Laura A. Cuthbert, Joseph A. Sarcione
  • Patent number: 8018739
    Abstract: A high reliability radiation shielding integrated circuit apparatus comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose of tolerance of the circuit die. In one embodiment, an integrated circuit apparatus for use in high reliability applications is disclosed. The integrated circuit apparatus is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.
    Type: Grant
    Filed: March 8, 2010
    Date of Patent: September 13, 2011
    Assignee: Maxwell Technologies, LLC
    Inventor: Janet Patterson
  • Publication number: 20110209749
    Abstract: The present invention relates to methods and apparatuses for transferring pattern, a flexible display panel, a flexible solar cell, an electronic book, a thin film transistor, an electromagnetic-shielding sheet, and a flexible printed circuit board applying thereof.
    Type: Application
    Filed: December 28, 2010
    Publication date: September 1, 2011
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Min Yang YANG, Bong-chul KANG
  • Patent number: 8004860
    Abstract: An electrical device comprising an electronic component mounted to a surface of a printed circuit board, a ground connection on said surface, and electromagnetic interference (EMI) shielding. The EMI shielding includes an electrical insulator coating the electronic component, the insulator contacting the surface, and a conductive layer covering the electrical insulator, and contacting the electrical insulator and the ground connection.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: August 23, 2011
    Assignee: Texas Instruments Incorporated
    Inventor: James F. Salzman
  • Publication number: 20110192642
    Abstract: Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.
    Type: Application
    Filed: April 4, 2011
    Publication date: August 11, 2011
    Inventors: Anthony A. Anthony, William M. Anthony
  • Patent number: 7995355
    Abstract: The present invention provides a configuration of an electronics enclosure, including a computer chassis in which three-dimensional shapes that may be in the form of a partial or quarter-sphere or cube or other periodic “patterns” may be stamped, molded, cut, or extruded into a lid and a five-sided “box” to provide improved EMI shielding, such that the need for gaskets is reduced or eliminated.
    Type: Grant
    Filed: January 10, 2006
    Date of Patent: August 9, 2011
    Assignee: Stealthdrive, Inc.
    Inventor: Paul Douglas Cochrane
  • Patent number: 7986533
    Abstract: A shielding assembly comprises at least two shielding modules, each comprising a frame and a cover mounted on the frame. Each of the at least two covers comprises a plurality of engaging portions and a plurality of slots between each two adjacent engaging portions, and one portion of one of the at least two frames abuts one portion of another of the at least two frames. Each of the plurality of engaging portions of one of the at least two covers is received in a corresponding slot of another of the at least two covers to connect the at least two shielding covers to form a cover to reduce electromagnetic interference for an electronic components positioned on a circuit board.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: July 26, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wen-Jia Ren, Xiao-Yan Qin
  • Publication number: 20110174531
    Abstract: A cable includes first and second twisted pairs of insulated conductors and a central core. The central core includes a hub and a separator extending outwardly from the hub to an end segment. The separator extends between the first and second twisted pairs to separate the first and second twisted pairs along at least a portion of a length of the cable. The cable also includes a conductive shield extending at least partially around the first and second twisted pairs and the central core. The end segment of the separator extends between the shield and the first twisted pair and is engaged with the shield. The first twisted pair is spaced apart from the shield.
    Type: Application
    Filed: January 15, 2010
    Publication date: July 21, 2011
    Inventors: Michael Joseph Rubera, Michael Thomas Gromko, Richard Walter Speer
  • Patent number: 7983058
    Abstract: Shielding structure for use in an electronic device comprising a housing and an electronic substrate which is arranged in the housing and which includes electronic parts, wherein the housing includes at least a surface facing the electronic parts, the surface being made of an electrically conductive substance. There is disposed a shielding member made of electrically conductive material comprising a frame-shaped section disposed on the printed board to surround a periphery of the electronic parts and a leaf spring section disposed to project from an upper-edge section of the frame-shaped section toward the inside of the frame-shaped section and upwardly in an inclined direction. The shielding member is disposed on the electronic substrate, and the surface made of an electrically conductive substance of the housing pushes the leaf spring section to be brought into contact therewith.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: July 19, 2011
    Assignee: NEC Corporation
    Inventor: Takeshi Ishihara
  • Patent number: 7977583
    Abstract: A shielded cable interface module having cable receiving grooves extending laterally to an edge of the board, each including a center conductor groove, an insulator groove, and a shield groove. A center conductor via and a shield via extend through the board. A conductor plane on the cable termination side surrounds the cable receiving grooves. The conductor plane includes a non-conductor region within the conductor plane adjacent to each of the conductor center conductor grooves. Ground vias associated with the cable receiving grooves are spaced apart from and partially surround the center conductor via outside and adjacent to the non-conductor region, the ground vias extend through the printed circuit board from the cable termination side to the system interface side.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: July 12, 2011
    Assignee: Teradyne, Inc.
    Inventors: Roya Yaghmai, Frank B. Parrish, Steven Hauptman
  • Publication number: 20110155444
    Abstract: A method of metallizing the surface of a substrate electrolessly, by spraying one or more oxidation-reduction solutions thereonto. The steps of this method include: a) physical or chemical treatment to reduce the surface tension of the substrate before metallization; b) electroless metallization of the surface of the substrate treated in step a), by spraying one or more oxidation-reduction solutions in the form of one or more aerosols thereonto; and c) formation of a top coat on the metallized surface. Compact devices for implementing this method and the products obtained are also disclosed.
    Type: Application
    Filed: July 30, 2009
    Publication date: June 30, 2011
    Inventor: Samuel Stremsdoerfer
  • Patent number: 7968012
    Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: June 28, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Martin L. Rapp, Jeff McFadden, Frank T. McNally
  • Patent number: 7965517
    Abstract: A digital camera contains a circuit board and a battery box inside a housing. The housing and the battery box are made of plastic. The housing is fixed to the battery box with a tapping screw. A conductive plate for preventing the tapping screw from being charged is arranged between the housing and the battery box. Projections of the conductive plate penetrate into thread grooves of the tapping screw. The conductive plate transmits static electricity of the tapping screw to a grounding member of the circuit board.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: June 21, 2011
    Assignee: FUJIFILM Corporation
    Inventors: Kazuya Mayumi, Shinji Suzuki, Takao Takasu
  • Patent number: 7961479
    Abstract: A shield can includes a frame having a hole in the top wall thereof, and an enclosure attached to the frame and covering the hole. The frame and the enclosure are formed by punching a metallic piece, the enclosure corresponds to the hole in shape and size, the enclosure is fixed to the upper surface of the top wall. The invention also discloses the method for fabricating the shield can.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: June 14, 2011
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventor: Qi Wang
  • Publication number: 20110132653
    Abstract: Coaxial cable shielding. In one example embodiment, a coaxial cable includes a center conductor surrounded by a dielectric, a conductive tape surrounding the dielectric, and a jacket surrounding the conductive tape. The conductive tape includes a conductive layer and a bonding agent layer immediately adjacent to the conductive layer. The conductive tape defines first and second edge sections that each borders an interior section. The conductive tape is wrapped around the dielectric such that the first edge section overlaps with the second edge section. The bonding agent layer extends over only at most a portion of the first edge section such that at least a portion of the conductive layer in the first edge section is immediately adjacent to at least a portion of the conductive layer in the second edge section.
    Type: Application
    Filed: December 4, 2009
    Publication date: June 9, 2011
    Applicant: JOHN MEZZALINGUA ASSOCIATES, INC.
    Inventor: Noah Montena
  • Patent number: 7952881
    Abstract: A thermal-electrical assembly (200) provides with improved heat sinking, electrical shielding and electrical grounding. The thermal-electrical assembly is configured using a shield (202) having a windowed aperture (204), a pliable frame (206) formed of thermally and electrically conductive material having contours (210) that fit within and are retained by the windowed aperture, and a thermal insert (208) formed to fit within the pliable frame. The combination of pliable frame 206 and thermal insert (208) close off the shield (202) while providing contact areas for dissipating heat from heat generating circuitry or components. Communication devices, such as portable radios having tight space constraints, can incorporate the thermal-electrical assembly (200) to minimize electrical emissions while maximizing heat dissipation.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: May 31, 2011
    Assignee: Motorola Solutions, Inc.
    Inventors: Salvador P. Magana, Dennis A. Byk, Sean C. Cadogan, Charles E. Kline, Arthur E. Petela, Sanjay K. Roy
  • Patent number: 7952889
    Abstract: A stacking structure (20) of printed circuit board is provided. The stacking structure includes a first printed circuit board (22), a second printed circuit board (24), and at least one electronic component. The first printed circuit board has a first shielding frame (262) arranged thereon, and the second printed circuit board has a second shielding frame (264) arranged thereon. The second printed circuit board is stacked on the first printed circuit board. The at least one electronic component is disposed on at least one opposite surfaces of the first and the second printed circuit board. The first shielding frame is engaged with the second shielding frame for shielding the at least one electronic element. In addition, an electronic device incorporating the stacking structure of printed circuit board (10) is also provided.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: May 31, 2011
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Yuan-Hsiao Chao
  • Patent number: 7952890
    Abstract: An electromagnetic interference shield system is provided. Each EMI shield may include a frame providing the structure around the electronic device components to be shielded, and a cover operative to be placed over the frame to prevent electromagnetic radiation from passing over the frame. Each frame may be coupled to a circuit board, and enclose electronic components in need of shielding. Each cover may be coupled to its corresponding frame using at least one snap that extends from the periphery of the cover towards the frame and circuit board. To minimize the space taken by the EMI shields, the snaps of adjacent covers may be offset or staggered so that opposing snaps engage voids left between snaps of the opposing cover, thus reducing the space needed between adjacent EMI shields by up to the width of a snap.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: May 31, 2011
    Assignee: Apple Inc.
    Inventors: Scott Myers, Erik Wang
  • Patent number: 7940203
    Abstract: In a double glazing where a pair of transparent glass sheets are arranged at an interval by having a spacer at the circumferential end portion and where a hollow layer sealed between the pair of glass sheets is formed, there is provided an electromagnetic absorption board used for wireless LAN, which is characterized in that the thickness of the glass sheet is in a range of 2.5-20 mm, that the thickness of the hollow layer is in a range of 2.5-15 mm, that at least one glass sheet of the pair of glass sheets is formed with a resistive film having a surface resistance (surface resistivity) in a range of 20?/? to 2 k?/?, and that the resistive film is formed on a glass sheet side on the hollow layer side.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: May 10, 2011
    Assignee: Central Glass Company, Limited
    Inventors: Masaaki Katano, Tadashi Onishi, Yoshinori Shirai, Tetsuji Hattori
  • Publication number: 20110100682
    Abstract: A differential signal transmission cable has two conductor wires disposed to be parallel with each other, a flat insulating member collectively covering the two conductor wires, the insulating member having flat portions facing to each other in a direction perpendicular to an alignment direction of the two conductor wires to sandwich the two conductor wires, a shield conductor including a metal foil tape and being wound around an outer periphery of the insulating member, a drain wire provided to contact with the shield conductor at a position corresponding to the flat portion, and a jacket jacketing the drain wire and the shield conductor.
    Type: Application
    Filed: February 9, 2010
    Publication date: May 5, 2011
    Inventors: Hideki NONEN, Takahiro Sugiyama
  • Publication number: 20110094790
    Abstract: A flexible flat circuit cable includes first and second flexible circuit substrates extending in an extension direction. The first flexible circuit substrate has a first surface forming a first conductor layer and an insulation layer, and the second flexible circuit substrate has a first surface forming a second conductor layer and an insulation layer. A bonding material layer is applied at a predetermined section between the first flexible circuit substrate and the second flexible circuit substrate to bond the first and second flexible circuit substrates together in such a way to maintain a predetermined spacing distance between the first and second flexible circuit substrate and forming a gapped segment at sections where no bonding material is applied. The first and second flexible circuit substrates form a cluster section within the gapped segment, which has opposite ends respectively forming first and second connected sections each of which forms a connection plug or is provided with a connector.
    Type: Application
    Filed: January 27, 2010
    Publication date: April 28, 2011
    Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
    Inventors: Gwun-Jin Lin, Chih-Heng Chuo, Kuo-Fu Su
  • Patent number: 7931518
    Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method. A process for the preparation of a light transmissive electromagnetic wave shielding material comprising; (A1) printing a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and (A2) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer 13 on the pretreatment layer 12.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: April 26, 2011
    Assignee: Bridgestone Corporation
    Inventors: Hidefumi Kotsubo, Tatsuya Funaki, Kiyomi Sasaki
  • Patent number: 7916500
    Abstract: A shield for electronic elements of a circuit board includes a frame and a cover, the frame including a peripheral wall comprising a plurality of fixed portions thereon, wherein the fixed portion includes a protrusion and a gap, the protrusion formed on the inner side of the peripheral wall, and the cover has a plurality of folding pieces corresponding to the fixed portions, the folding pieces defines an aperture, and the cover is mounted on the frame, the folding pieces match with the fixed portions correspondingly, the protrusion passes the aperture and locks with the aperture. When the cover is detached, the folding pieces are resisted via the gap to make the protrusion to break away from the aperture of the folding piece, enabling the cover to be opened.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: March 29, 2011
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Zheng Shi, Chih-Chiang Chang, Hong-Wei Zhang
  • Patent number: 7916501
    Abstract: An energy transfer apparatus with a magnetic shield is configured to magnetically couple energy from a fixed location to a mobile or moveable device within a field-activated space of the energy transfer apparatus. Apparatuses include a location sensing surface and a drive coil arranged in relation to a periphery of the location sensing surface. A magnetic shield plate is disposed below the location sensing surface and the drive coil. The shield plate includes a number of radially oriented slots originating at, and distributed about, a periphery of the shield plate.
    Type: Grant
    Filed: April 5, 2010
    Date of Patent: March 29, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: M. Benton Free, Bernard O. Geaghan, Karl P. Hauck, Albert H. Libbey, Billy Lee Weaver
  • Publication number: 20110067916
    Abstract: Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a planar surface that is different from that of the second conductive plate, a connection pattern arranged on a planar surface that is different from that of the second conductive plate, a first stitching via unit configured to connect the first conductive plate to one end of the connection pattern through the planar surface where the second conductive plate is arranged, and a second stitching via unit configured to connect the third conductive plate to the other end of the connection pattern through the planar surface where the second conductive plate is arranged.
    Type: Application
    Filed: December 17, 2009
    Publication date: March 24, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han Kim, Mi-Ja Han, Kang-Wook Bong, Hyo-Jic Jung
  • Publication number: 20110067914
    Abstract: Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.
    Type: Application
    Filed: December 17, 2009
    Publication date: March 24, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyo-Jic Jung, Han Kim, Mi-Ja Han, Kang-Wook Bong, Dae-Hyun Park
  • Publication number: 20110067915
    Abstract: An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate.
    Type: Application
    Filed: December 17, 2009
    Publication date: March 24, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han Kim, Mi-Ja Han, Dae-Hyun Park, Hyo-Jic Jung, Kang-Wook Bong
  • Publication number: 20110067917
    Abstract: Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure, which includes a first dielectric material for interlayer insulation and is for blocking a noise, is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a same planar surface as the first conductive plate, and a stitching via unit configured to connect the first conductive plate and the third conductive plate through the planar surface on which the second conductive plate is arranged. A second dielectric material having a permittivity that is different from that of the first dielectric material is interposed between any two of the first conductive plate, the second conductive plate, and the third conductive plate.
    Type: Application
    Filed: December 22, 2009
    Publication date: March 24, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae-Hyun Park, Han Kim, Kang-Wook Bong
  • Patent number: 7911806
    Abstract: A power inverter for a hybrid automotive vehicle having a case with an interior and at least one electrical port mounted on the case to electrically connect electrical signals from the interior of the case to an exterior device. A cable connector is associated with each electrical port while a non-electrical sensing conductor extends serially through each electrical port and its associated cable connector. A circuit is provided which detects a break in the continuity of the sensing conductor and generates a signal representative of that break in continuity. The non-electrical sensing conductor thus minimizes the emission of EMI from the inverter. Additionally, a circuit board is mounted within the interior of the case by fasteners which minimize the spacing between the circuit board and the case to further reduce EMI emissions.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: March 22, 2011
    Assignee: Hitachi, Ltd
    Inventors: Hiroki Funato, Liang Shao, Makato Torigoe
  • Publication number: 20110061924
    Abstract: Alien crosstalk suppression cores are used to decrease alien crosstalk in communications channels. Electrical communication cables may be provided with alien crosstalk suppression cores. The alien crosstalk suppression cores, which may be ferrite suppression cores, are placed separately on some or all of the twisted pairs within a communication cable. The alien crosstalk suppression cores reduce ANEXT and AFEXT in high-frequency communications when communication cables are installed near one another. Alien crosstalk suppression cores may also be incorporated into other communication channel components, such as on a PCB within a communication jack.
    Type: Application
    Filed: November 22, 2010
    Publication date: March 17, 2011
    Applicant: PANDUIT CORP.
    Inventors: Masud Bolouri-Saransar, David Dylkiewicz, Darren Reigle
  • Patent number: 7889515
    Abstract: In one exemplary embodiment, an electromagnetic interference (EMI) shielding apparatus generally includes a shield and a gasket. The gasket includes at least one tab formed monolithically with the gasket and attached to a support or portion of the gasket. The at least one tab is movable relative to the support from a first, pre-installed configuration in which the at least one tab is generally co-planar with the support to a second, installed configuration in which the at least one tab extends generally outwardly relative to the support. Movement of the at least one tab from the first configuration to the second configuration may position the at least one tab at least partially within the at least one opening of the shield. Frictional engagement of the at least one tab within the at least one opening may help retain the relative positioning of the gasket to the shield.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: February 15, 2011
    Assignee: Laird Technologies, Inc.
    Inventors: Joseph C. Boetto, James R. Fikert
  • Publication number: 20110031005
    Abstract: The present invention discloses a new cable structure. At an exterior of a central conductor, an insulation material and an EM wave resistant material are performed with insulation molding simultaneously, through forming equipment. This new cable structure changes the conventional cable structure, simplifies the way of processing, improves an electricity transmission feature and reduces utilization of materials, thereby not only achieving a market demand for a high transmission speed, but also fulfilling a goal of energy saving and reduction of CO2 release.
    Type: Application
    Filed: August 11, 2010
    Publication date: February 10, 2011
    Inventor: Mao-Chia Chou
  • Publication number: 20110031006
    Abstract: A cable assembly (100) comprises a cable (13), a filter (11) made of magnetic material for anti-EMI and surrounding the cable (13), an insulative main body (12) enclosing the filter (11), at least a pair of flexible prongs (121) extending outwardly from the insulative main body (12); wherein the pair of the flexible prongs (121) with the insulative main body (12) together forming a clip (122,123) with a hole for receiving cables (131,133).
    Type: Application
    Filed: August 10, 2010
    Publication date: February 10, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHI-MING CHEN, JUN ZONG
  • Publication number: 20110026752
    Abstract: A miniature microphone is provided.
    Type: Application
    Filed: July 17, 2009
    Publication date: February 3, 2011
    Inventors: Rongguo Yao, Zhongyuan Liu, Xianbin Wang, Maoqiang Dang, Shaoyang Yao
  • Publication number: 20110024181
    Abstract: Contactless payment cards with on-card microchips are transported in mailers with RF shielding. The RF shielding is designed to prevent communication with and skimming of information from the contactless cards enclosed in the mailers while in transit.
    Type: Application
    Filed: September 17, 2010
    Publication date: February 3, 2011
    Inventor: Simon Phillips
  • Publication number: 20110024182
    Abstract: An apparatus including a conductive sleeve including an outer-conductive surface and an inner passageway that extends from a first end at least partially to a second end. The passageway is adapted to receive and shield a device that provides at least one of a radio frequency path and an electrical current path.
    Type: Application
    Filed: October 14, 2010
    Publication date: February 3, 2011
    Applicant: ADC TELECOMMUNICATIONS, INC.
    Inventors: Jari Taskila, Stephen J. Qualy
  • Patent number: 7880083
    Abstract: The present invention discloses a container or bag with several types of compartments with different forms of electromagnetic/wireless shielding. The types of compartments include a) an electromagnetic/wireless shielded compartment useful for line-of-site type shielding, b) an electromagnetic/wireless shielded compartment useful when a complete shielding enclosure is needed, and c) an unshielded compartment. The line-of-site shielded compartment prevents wireless access to the contents contained within when a complete shielding enclosure is not required, for example, for objects containing RFID tags, such as passports, books, and clothing. The compartment with a complete shielding enclosure prevents wireless access to devices that require a complete Faraday type cage, such as mobile phones, PDAs, or computers. Placing these and other devices within the shielded compartments protects them from remote access, and the data within is shielded from unscrupulous individuals.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: February 1, 2011
    Inventor: Oren Livne