Housing Or Panel Patents (Class 174/377)
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Publication number: 20140218876Abstract: In an aspect, in general, an apparatus includes an electrically conductive housing including a first portion and second portion, the first portion including electronic circuitry. An electromagnetic shield separates the first portion and the second portion and is configured to electromagnetically isolate the electronic circuitry of the first portion from the second portion. The electromagnetic shield includes a plurality of electrically conductive walls partially separating the first portion and the second portion, a plurality of electrically conductive spring loaded fingers extending from an end of at least one of the plurality of electrically conductive walls and configured to contact an inner surface of the housing. Together, the plurality of electrically conductive walls and the plurality of electrically conductive spring loaded fingers separate the first portion and the second portion.Type: ApplicationFiled: February 1, 2013Publication date: August 7, 2014Inventors: Brad Subat, Daniel Hodgkins
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Patent number: 8797750Abstract: A first metal sheet and a second metal sheet are arranged opposite a printed circuit board including a second connector that fits into a first connector that is arranged at one end of a cable. A hole section through which the first connector passes is arranged in each of the first metal sheet and the second metal sheet. The first connector fits into the second connector by passing through each of the hole sections of the first metal sheet and the second metal sheet. The first metal sheet and the second metal sheet support a connector case of the first connector, thus improving the load bearing characteristics of the cable connection.Type: GrantFiled: April 12, 2012Date of Patent: August 5, 2014Assignee: Fujitsu LimitedInventors: Hideki Maeda, Akira Shimasaki
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Publication number: 20140202756Abstract: A braid having a function as an exterior member as well as an electromagnetic shielding function is provided. Also, a wire harness including such a braid in a configuration is provided. A braid is used for a wire harness cabled to a hybrid vehicle. Also, the braid is formed by knitting multiple ultrathin strands in a tubular shape. The braid includes two kinds of strands, a metal strand made of metal having conductivity and a resin strand made of synthetic resin having abrasion resistance etc., and ensures abrasion resistance and impact resistance by the portion made of the resin strand while performing an electromagnetic shielding function by the portion made of the metal strand.Type: ApplicationFiled: March 25, 2014Publication date: July 24, 2014Applicant: YAZAKI CORPORATIONInventors: Hideomi ADACHI, Yoshiaki OZAKI
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Publication number: 20140190734Abstract: Certain embodiments of the present invention provide a duct for a shielded wireway system. The duct includes a bottom wall, two sidewalls extending from the bottom wall, and a plurality of fingers extending from each of the sidewalls. Adjacent fingers are connected by at least one bridging component. The bottom wall, the sidewalls, and a portion of the fingers, including the bridging component, are shielded.Type: ApplicationFiled: March 10, 2014Publication date: July 10, 2014Applicant: Panduit Corp.Inventors: Michael D. Asztalos, Rami A. Mishal, Masud Bolouri-Saransar, Ronald A. Nordin
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Publication number: 20140182924Abstract: An interface pad for suppressing electromagnetic and radio frequency radiation includes first and second generally opposing sides which define a thickness therebetween, with the interface pad exhibiting thermal conductivity, electrical resistivity, and a hardness of between 10-70 Shore 00 at 20° C. The interface pad is capable of attenuating electromagnetic and/or radio frequency radiation that is commonly associated with interference of electronic components.Type: ApplicationFiled: January 3, 2013Publication date: July 3, 2014Applicant: THE BERGQUIST COMPANYInventor: The Bergquist Company
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Publication number: 20140179161Abstract: A wire harness includes an electric wire, a conductive metal shield shell housing a portion of the electric wire, a braided shield covering at least a portion of an outer peripheral surface of the shield shell and extending from an end portion of the shield shell in a lead-out direction of the electric wire to cover the electric wire, and an annular member provided on the outer periphery of the braided shield so as to sandwich the braided shield between itself and the shield shell. The annular member includes an extended portion that extends from the end portion of the shield shell along the lead-out direction of the electric wire.Type: ApplicationFiled: December 20, 2013Publication date: June 26, 2014Applicant: Hitachi Metals, Ltd.Inventor: Masaaki IMAHORI
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Publication number: 20140174814Abstract: An electromagnetic interference shield includes a shell body and a magnetic material layer formed on the shell body. A number of holes are defined in the shell body. A number of through holes are defined in the magnetic material layer aligned with the holes. An electronic device having the electromagnetic interference shield is also provided.Type: ApplicationFiled: May 21, 2013Publication date: June 26, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: CHIH-HAO LIN
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Publication number: 20140159839Abstract: The present invention relates to a protective case incorporating a magnet in a portion facing a magnetism sensor of a portable device, and to a method for controlling the action of turning the screen of the portable device on and off by using same, and relates to an invention for providing a function whereby it is possible to automatically turn the screen on and off depending on the action of the screen-protecting cover of the case, through the use of a method involving the incorporation of a geomagnetic sensor and of a magnet in a position corresponding thereto.Type: ApplicationFiled: February 12, 2014Publication date: June 12, 2014Inventor: Duk Seung KIM
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Publication number: 20140151110Abstract: A shield structure for an electronic apparatus includes a frame member and a shield box. The frame member is a conductive frame to which the wiring substrate is attached and covering a back surface of the wiring substrate. The shield box is formed on a front surface of the wiring substrate having an electronic component mounted thereon, to cover an area of a portion of the front surface. The wiring substrate includes a plurality of connecting portions formed thereon that ground the front surface and the back surface to the frame member. On a side on which the wiring substrate protrudes from the shield box, the shield box includes a shield wall member forming a wall surface substantially perpendicular to the wiring substrate. The shield wall member is grounded to at least one location of the connecting portions of the wiring substrate in the vicinity of the wall surface.Type: ApplicationFiled: November 26, 2013Publication date: June 5, 2014Applicant: KYOCERA Document Solutions Inc.Inventors: Akihiro Masaki, Yoshifumi Okauchi
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Publication number: 20140116770Abstract: Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.Type: ApplicationFiled: November 15, 2013Publication date: May 1, 2014Applicant: X2Y Attenuators, LLCInventors: Anthony A. Anthony, William M. Anthony
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Publication number: 20140104811Abstract: The invention relates to a cooling box (1) for electric or electronic components, consisting of a material. Said cooling box (1) is non-electrically conductive or practically non-electrically conductive, is configured in one piece or multiple pieces and has a cavity (4) that is enclosed by the material, said cavity (4) being closed or provided with at least one opening (2). To improve thermal dissipation, at least one surface region of the cooling box (1) is defined by functions of electrical and/or thermal conductivity.Type: ApplicationFiled: December 6, 2013Publication date: April 17, 2014Applicant: CERAMTEC GMBHInventor: Peter Claus KLUGE
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Publication number: 20140097016Abstract: Disclosed herein are thermoplastic compositions that provide electromagnetic/radio frequency interference (EMI/RFI) shielding characteristics to a molded article. The compositions offer improved delamination behavior. The compositions include a polycarbonate resin, a polysiloxane block co-polycarbonate, a conductive filler capable of providing EMI shielding characteristics and optionally other pigments and/or processing additives. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cameras, or other electronic devices.Type: ApplicationFiled: May 24, 2012Publication date: April 10, 2014Inventor: Hiroshi Miyake
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Patent number: 8681507Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.Type: GrantFiled: January 6, 2012Date of Patent: March 25, 2014Assignee: Delphi Technologies, Inc.Inventor: Edgar Glenn Hassler
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Electromagnetic interference and radio frequency absorbing material and process for forming the same
Patent number: 8679393Abstract: A method for producing an EMI/RF absorbing material including dispersing metallic flakes in a resin. The method also includes providing a first coat of the resin containing dispersed metallic flake to form a first layer. The method further includes providing a second coat of the resin containing dispersed metallic flake to the first layer to form a second layer. At least one of the first or second layers has a substantially uniform distribution of metallic flake throughout a thickness of the first or second layers.Type: GrantFiled: January 27, 2011Date of Patent: March 25, 2014Assignee: Majilite CorporationInventors: Charles M. Willwerth, Himanshu R. Patel, Matthew D. Dodier, John V. Kapeckas -
Publication number: 20140060914Abstract: An enclosure includes a sidewall defining a number of first vents and a shield apparatus installed to the sidewall. The shield apparatus includes a shield plate spaced from the sidewall. A distance between the sidewall and the shield plate is greater than a size of the first vent. The shield plate defines a number of second vents respectively aligning with the first vents.Type: ApplicationFiled: September 4, 2012Publication date: March 6, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHENG-HSIU YANG, PO-CHUAN HSIEH
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Publication number: 20140048326Abstract: A multi-cavity wiring board includes a coreless substrate, an adhesive, and a stiffener having a plurality of apertures with lateral shielding sidewalls. The coreless substrate covers the stiffener and includes electrical pads exposed from the apertures of the stiffener as electrical contacts for semiconductor devices packaged within the apertures. The aperture sidewalls of the stiffener can serve as effective lateral electromagnetic shields for the semiconductor devices within the apertures.Type: ApplicationFiled: August 9, 2013Publication date: February 20, 2014Applicant: Bridge Semiconductor CorporationInventors: Charles W.C. LIN, Chia-Chung WANG
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Publication number: 20140034377Abstract: An RF shield for medical interventional devices includes elongated inner and outer conductive tubes, and an elongated dielectric layer of MRI compatible material sandwiched between the inner and outer conductive tubes and surrounding the inner conductor. The inner and outer conductive tubes are electrically connected to each other at only one of the adjacent end portions thereof. The opposite respective end portions are electrically isolated from each other.Type: ApplicationFiled: February 17, 2012Publication date: February 6, 2014Inventor: Kamal Vij
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Publication number: 20140027171Abstract: The shield can plate for a SMD process in accordance with the present invention, includes: a metal conductive layer which is made of one selected from a group consisting of copper (Cu), zinc (Zn), nickel (Ni), silver (Ag), iron (Fe) and chromium (Cr) or an alloy thereof, or clad metal, performs an electromagnetic shielding function and maintains a physical structure when a shield can is constructed; an insulating layer which is made of one or more of polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), which are crystalline polymers, wherein the insulating layer is laminated on one side of the metal conductive layer; and a silane-based coupling layer interposed between the metal conductive layer and the insulating layer.Type: ApplicationFiled: October 6, 2011Publication date: January 30, 2014Inventors: Min Hwa Song, Eun Gyo Oh
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Patent number: 8638570Abstract: An electromagnetic interference (EMI) shield apparatus includes a shell, a hub, a shield member, a partition plate, a resilient member, and a cover. The hub is rotatably mounted within the shell. The shield member is wrapped around the hub. The partition plate is fastened to and rotatable together with the hub. The cover covered on an open end of the shell. The resilient member is connected between the partition plate and the cover to drive the hub to rotate to reel the shield member. The shield member is made of EMI shield material.Type: GrantFiled: June 30, 2011Date of Patent: January 28, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Lei Liu
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Patent number: 8618425Abstract: In a module having an electrical component, which is situated between two ground planes for electromagnetic shielding, a trough-shaped composite component is provided between an inner and an outer housing, into which the rear side of the inner housing is inserted, the composite component having an insulator trough and, on its inside, a ground plane formed at least on the trough bottom, which forms the shielding of a rear side of the electrical component. The composite component is advantageously designed as an MID component. The outer housing of the module may be manufactured in the two-component injection molding process by extrusion-coating initially using an elastomer and subsequently a thermoplast.Type: GrantFiled: August 1, 2011Date of Patent: December 31, 2013Assignee: Robert Bosch GmbHInventors: Michael Hortig, Peter Kunert
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Publication number: 20130343020Abstract: This invention provides an Electro-Static shielding apparatus, an electronic device, and a method for manufacturing said Electro-Static shielding apparatus. Said Electro-Static shielding apparatus comprises: a base layer; a printed circuit block embedded into the base layer; an Electro-Static shielding layer located on an upper surface of the base layer and at least covering sensitive areas, the sensitive areas are those corresponding to the areas required to be shielded on the printed circuit block; and an insulating layer for at least covering the Electro-Static shielding layer. According to the technical solution of this invention, an effective shielding effect can be achieved, moreover, the manufacture cost can be reduced and a good flatness will be reached.Type: ApplicationFiled: February 6, 2012Publication date: December 26, 2013Applicant: ERICSSON (CHINA) COMMUNICATIONS CO., LTD.Inventors: Qingqing He, Yuanna Hu, Jin Jin
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Publication number: 20130319751Abstract: An electromagnetic interference shielding assembly for use in an electronic device is disclosed. The electronic device includes a circuit board and an alternating current cable including one end connected to the circuit. The electromagnetic interference assembly includes an electromagnetic interference shielding plate. The circuit board is mounted on the electromagnetic interference shielding plate. The alternating current cable includes a segmental portion arranged adjacent to the electromagnetic interference shielding plate. The segmental portion extends substantially parallel to the electromagnetic interference shielding plate. The electromagnetic interference shielding plate defines a plurality of slots each extending in a direction perpendicular to an extending direction of the segmental portion of the alternating current cable. The parallel slots, as a whole, extend along the extending direction of the segmental portion and spatially corresponding to the segmental portion.Type: ApplicationFiled: August 28, 2012Publication date: December 5, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventor: HONG LI
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Publication number: 20130322039Abstract: A cap for a microelectromechanical system device includes a first layer of, e.g., Bismaleimide Triazine (BT) resin material in which a through-aperture is formed, laminated to a second layer of BT resin material that closes the aperture in the first layer, forming a cavity. The first and second layers are laminated with a thermosetting adhesive that is sufficiently thick to encapsulate particles that may remain from a routing operation for forming the apertures. The interior of the cavity, including exposed portions of the adhesive, and the exposed face of the first layer are coated with an electrically conductive paint. The cap is adhered to a substrate over the MEMS device using an electrically conductive adhesive, which couples the conductive paint layer to a ground plane of the substrate. The layer of conductive paint serves as a shield to prevent or reduce electromagnetic interference acting on the MEMS device.Type: ApplicationFiled: May 31, 2012Publication date: December 5, 2013Applicant: STMICROELECTRONICS PTE LTD.Inventors: Jerome Teysseyre, Glenn de los Reyes, Wee Chin Judy Lim
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Publication number: 20130323963Abstract: A cage assembly is provided for receiving a pluggable module. The cage assembly includes a cage having a front end, a mounting side, and an internal compartment. The front end is open to the internal compartment of the cage. The internal compartment is configured to receive the pluggable module therein through the front end. A heat sink is mounted to the mounting side of the cage. The heat sink has a module side that is configured to thermally communicate with the pluggable module. An electromagnetic interference (EMI) gasket extends along at least a portion of an interface between the mounting side of the cage and the module side of the heat sink. The EMI gasket includes electrically conductive spring fingers that are engaged with and electrically connected to the mounting side of the cage.Type: ApplicationFiled: May 30, 2012Publication date: December 5, 2013Applicant: Tyco Electronics CorporationInventors: Matthew David Morrison, Michael John Phillips, Michael Eugene Shirk
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Patent number: 8598690Abstract: A semiconductor device is made by mounting a plurality of semiconductor die to a substrate, depositing an encapsulant over the substrate and semiconductor die, forming a shielding layer over the semiconductor die, creating a channel in a peripheral region around the semiconductor die through the shielding layer, encapsulant and substrate at least to a ground plane within the substrate, depositing a conductive material in the channel, and removing a portion of the conductive material in the channel to create conductive vias in the channel which provide electrical connection between the shielding layer and ground plane. An interconnect structure is formed on the substrate and are electrically connected to the ground plane. Solder bumps are formed on a backside of the substrate opposite the semiconductor die. The shielding layer is connected to a ground point through the conductive via, ground plane, interconnect structure, and solder bumps of the substrate.Type: GrantFiled: January 27, 2012Date of Patent: December 3, 2013Assignee: STATS ChipPAC, Ltd.Inventors: Harry Chandra, Flynn Carson
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Publication number: 20130299229Abstract: A shielding structure for a wire harness includes a seal member which has a wire through hole that allows the wire to pass therethrough while sealing a circumference of the wire. The wire has a structure where an insulating resin layer is formed on an outer circumference of a conductor, and a predetermined range in a length direction of the conductor is coated with a shield layer formed by resin plating to cover an outer circumferential surface of the insulating resin layer. A terminal portion of the wire is passed through the wire through hole of the seal member to be introduced into the shield wall to a position where the shield layer exists, whereby an inner circumference of the wire through hole is made in close contact with the shield layer to cause the shield layer and the seal member to be electrically conducted with each other.Type: ApplicationFiled: December 27, 2011Publication date: November 14, 2013Applicant: YAZAKI CORPORATIONInventors: Hajime Kato, Masahiro Tanaka
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Publication number: 20130284510Abstract: An electromagnetic shielding cover and a device having the same are introduced. The device comprises a casing and is coupled to a base having a printed circuit board on which an electronic component is mounted. The casing is defined with a receiving region. The electromagnetic shielding cover is disposed within the receiving region and coupled thereto. The electromagnetic shielding cover is marked with a plurality of peripheral folding lines. The electromagnetic shielding cover is folded along the peripheral folding lines by an angle to form a plurality of walls and a shielding space. Coupling the casing and the base together allows the electromagnetic shielding cover to shield an electronic component mounted on the circuit board and received in the shielding space, thereby shielding the electronic component from electromagnetic interference. The electronic component can be easily changed and tested during a rework process.Type: ApplicationFiled: June 12, 2012Publication date: October 31, 2013Inventors: SHIH-PO LO, TAN-LUNG CHEN, CHING-FENG HSIEH
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Patent number: 8567459Abstract: An electromagnetic shielding carrying case comprising a front panel hingedly connected to a middle and rear panel. The front and middle panels each comprise an electromagnetic shielding member with a card holding means affixed to each. The carrying case has a closed position wherein upstanding walls of the front and rear panels are brought into engagement with one another so as to form an enclosure around the middle panel, thus shielding contactless smartcards contained within from being scanned by an RFID reader. A releasable locking means holds the front panel closed against the rear panel, and can be unlocked so the front panel pivots open, creating a first open position wherein contactless smartcards can be accessed in both card holding means. The middle panel can also be pivoted open to reveal a receptacle within the rear shell that holds paper currency or one additional card.Type: GrantFiled: March 8, 2011Date of Patent: October 29, 2013Inventor: Michael William Kitchen
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Publication number: 20130279014Abstract: A display mirror assembly for a vehicle having a front shield including a first side and a second side. A partially reflective, partially transmissive element is mounted on the first side. A rear shield is disposed behind the front shield. A display module is mounted between the front shield and the rear shield and includes in order from the front shield: a display; an optic block; a heat sink having an edge lit PCB mounted along a top edge thereof; and a PCB. The front shield is secured to at least one component of the display module with a first retaining feature and the rear shield is secured to at least one component of the display module with a second retaining feature. A housing at least partially surrounds the front shield, display module, and rear shield.Type: ApplicationFiled: March 14, 2013Publication date: October 24, 2013Inventors: Richard T. Fish, JR., Danny L. Minikey, JR., Bradley R. Hamlin, Ethan J. Lee, Eric P. Kern
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Publication number: 20130250534Abstract: A cover shield for a circuit board having a body. A peripheral wall is disposed about an edge of the body. First and second slots each include a first portion that extends through the body and a second portion that extends through the peripheral wall. A barbed tab is disposed between the first and second slots. A notch extends through a portion of the barbed tab. A distinct abutting member is disposed on the peripheral wall.Type: ApplicationFiled: March 21, 2012Publication date: September 26, 2013Applicant: GENTEX CORPORATIONInventor: Lucas G. Schrab
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Publication number: 20130206470Abstract: A shield for a portable electronic device includes a pouch with an opening sized to accommodate the portable device and a flap. The pouch includes shielding material inside the pouch and on the flap. When the flap is closed, the shielding material inside the pouch and the shielding material on the flap together substantially surround the device, thereby substantially preventing RF signals emitted by the device from leaving the shield, and further substantially preventing RF signals impinging on the shield from outside from reaching the device. When the flap is open, the shielding material inside the pouch and the shielding material on the flap leave a gap, thereby allowing RF signals emitted by the device to leave the shield, and further allowing RF signals impinging on the shield from outside to reach the device. The shield further includes a compartment for a charger and one or more power cord adapters.Type: ApplicationFiled: January 22, 2013Publication date: August 15, 2013Inventor: Paul Fitzgerald Davis
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Patent number: 8507808Abstract: A shielding assembly includes a frame including a main body, the main body defining at least one retaining hole; and a cover including a main board, the main panel including retaining elements and rims. The number of the retaining elements is the same as the number of the retaining holes, each rim protruding outwardly from a distal end of one of retaining elements. Each retaining element passes through one of the retaining holes, and each rim is latched with the portions of the frame surrounding the retaining holes.Type: GrantFiled: March 1, 2011Date of Patent: August 13, 2013Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) LimitedInventors: Li-Zhi Xiong, Liang Su, Wen-Jun Liu, Cheng-Rui Liu, Jun-Sheng Qiao, Pei-Chin Kuo
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Publication number: 20130199836Abstract: The present invention is to provide a shield cover and a shield structure which can be improved according to an electromagnetic shielding means. The shield cover by processing a conductive plate slidably includes a front shield portion, a back shield portion, a side shield portion, connections, an entry and a receiving space, and covers a wiring harness 11 as a shield object. The shield cover is formed into a U-shape in a cross-section. The shield structure includes the shield cover and a wall-shaped shield cover engaged with the shield cover.Type: ApplicationFiled: October 20, 2011Publication date: August 8, 2013Applicant: YAZAKI CORPORATIONInventors: Hideomi Adachi, Hidehiko Kuboshima
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Publication number: 20130188328Abstract: Provided is an assembly and process for isolating internal regions of an electromagnetic cavity from interfering electromagnetic radiation. The assembly includes a first portion defining a first electrically conducting broad wall and an elongated, electrically conducting isolating wall, coupled to and extending away from the first broad wall. The assembly also includes a second portion defining a second electrically conducting broad wall and an elongated, electrically conducting trough defined therein. The trough is sized to accept at least a portion of the isolating wall. The first and second portions are adapted for assembly in a facing arrangement in which the isolating wall is aligned with the trough. When assembled, a tip portion of the isolating wall extends to a uniform depth within the trough, such that the isolating wall-trough combination substantially rejects a transfer of electromagnetic energy across the isolating wall over at least a predetermined range of wavelengths.Type: ApplicationFiled: January 17, 2013Publication date: July 25, 2013Applicant: RAYTHEON COMPANYInventor: RAYTHEON COMPANY
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Publication number: 20130186568Abstract: A Faraday shield and a plasma processing chamber incorporating the Faraday shield is are provided. The plasma chamber includes an electrostatic chuck for receiving a substrate, a dielectric window connected to a top portion of the chamber, the dielectric window disposed over the electrostatic chuck, and a Faraday shield. The Faraday shield is disposed inside of the chamber and defined between the electrostatic chuck and the dielectric window. The Faraday shield includes an inner zone having an inner radius range that includes a first and second plurality of slots and an outer zone having an outer radius range that includes a third plurality of slots. The inner zone is adjacent to the outer zone. The Faraday shield also includes a band ring separating the inner zone and the outer zone, such that the first and second plurality of slots do not connect with the third plurality of slots.Type: ApplicationFiled: October 23, 2012Publication date: July 25, 2013Inventors: Maolin Long, Alex Paterson, Ricky Marsh, Ying Wu, John Drewery
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Publication number: 20130153285Abstract: A magnetic field shielding raised floor panel having a plurality of grain-oriented electrical steel (GOES) sections. The orientation of each GOES section is parallel to a top surface of the section. The plurality of GOES sections can include sidewall and lip portions. The plurality of GOES sections can be perforated to permit air flow through the GOES section. Openings in adjacent perforated GOES sections do not substantially overlap.Type: ApplicationFiled: December 16, 2011Publication date: June 20, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chwen YU, Yung-Ti HUNG, Kuo-An YEH, Tzu-Sou CHUANG, Chien-Teh HUANG
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Publication number: 20130155603Abstract: A supplementary disk-enclosure cover configured to shield a hard-disk drive against electromagnetic interference. The supplementary disk-enclosure cover includes a top, and vertical flanges. The top has an outer perimeter and an inner perimeter. The outer perimeter lies about parallel to the inner perimeter. The top is disposed between the outer perimeter and the inner perimeter and has a flattened annular shape. The vertical flanges are attached to and extend down from the outer perimeter of the top at about right angles to the top. The vertical flanges are configured to cover respective gaps between a disk-enclosure cover and a disk-enclosure base to which the disk-enclosure cover is attached. A disk enclosure that includes the supplementary disk-enclosure cover, and a hard-disk drive that includes the disk enclosure are also provided.Type: ApplicationFiled: December 15, 2011Publication date: June 20, 2013Inventors: Jiro Kaneko, Takeshi Chawanya, Masahiko Tamura, Keiichiroh Kai
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Publication number: 20130153286Abstract: A shielding system for a mobile device and a method for assembling the system are provided. The shielding system includes a Printed Circuit Board (PCB) with a first area and a thickness, and a shield enclosure, spaced apart and above a front side of the PCB at a certain distance, for enclosing components on the PCB. Parts of the shield enclosure are coupled to at least one of a lateral side and a back side of the PCB.Type: ApplicationFiled: December 11, 2012Publication date: June 20, 2013Applicant: Samsung Electronics Co., Ltd.Inventor: Samsung Electronics Co., Ltd.
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Patent number: 8432706Abstract: A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.Type: GrantFiled: December 22, 2009Date of Patent: April 30, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Chang-Sup Ryu
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Patent number: 8426750Abstract: Provided are an electromagnetic shielding structure and a method of manufacturing the electromagnetic shielding structure. The electromagnetic shielding structure shields an electromagnetic wave having a specific frequency band, is miniaturized, and includes a strip line, and a couple of plate structures facing each other and connected to both ends of the strip line. The method of manufacturing the electromagnetic shielding structure is simple. An electromagnetic wave having a specific frequency band is shielded, and variation in electromagnetic shielding performance according to the position of an electromagnetic shielding construction is prevented, thus constructing a reliable electromagnetic shielding concrete building.Type: GrantFiled: September 17, 2009Date of Patent: April 23, 2013Assignee: Kyonggi University Industry & Academia Cooperation FoundationInventors: Hong Min Lee, Joong Kwan Kim
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Publication number: 20130094153Abstract: An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.Type: ApplicationFiled: October 12, 2012Publication date: April 18, 2013Applicant: FINISAR CORPORATIONInventor: FINISAR CORPORATION
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Publication number: 20130083498Abstract: Disclosed herein is a radio frequency shield device that includes, an outer cover having one or more displacement protrusions extending from an outer cover bottom surface and one or more cover fasteners, an inner cover positioned inside the outer cover, wherein at least a portion of the inner cover is deflected downward by the displacement protrusions, and a plurality of fence walls having one or more fence fasteners for interlocking with the cover fasteners, wherein the inner cover is positioned at least partially over the fence walls to form at least one of a primary seal and secondary seal.Type: ApplicationFiled: August 1, 2012Publication date: April 4, 2013Applicant: General Instrument CorporationInventors: Liang Hua Wu, Yueh-Lin Chang, David C. Miller
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Patent number: 8406001Abstract: An electronic housing is provided comprising a first cover assembly combinable with a second cover assembly to house or enclose a printed circuit board therebetween. Each cover assembly includes a cover and a frame, the cover attachable to the frame by bending portions of the cover thereabout. The cover is preferably stamped metal and the frame is preferably injection molded plastic. Each cover may include recesses such that, when the cover is bent around the frame, the cover bends at the recesses and closely engages the frame on multiple mating surfaces. The cover assemblies may be welded together, such as by ultrasonic welding, to form a complete package or housing, and may include intermittingly spaced shear weld features to improve bond strength therebetween. Methods of manufacturing and/or assembling electronic housings and cover assemblies are also provided.Type: GrantFiled: February 25, 2010Date of Patent: March 26, 2013Assignee: DualSonic, Inc.Inventor: Michael Chy Chao
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Publication number: 20130068520Abstract: An electromagnetic shielding device for shielding electromagnetic energy generated by an electronic apparatus. The electromagnetic shielding device includes a base board and a number of protrusions formed on the base board. The length of each protrusion along a direction perpendicular to the base board is adjustable. The amount of electromagnetic energy can be absorbed by the electromagnetic shielding device is adjusted according to the length of the protrusion.Type: ApplicationFiled: April 25, 2012Publication date: March 21, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventor: JUN-WEI WANG
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Publication number: 20130048369Abstract: This is directed to systems and methods for shielding a circuitry region of an electronic device from interference (e.g., EMI) with a removable shield assembly.Type: ApplicationFiled: August 31, 2011Publication date: February 28, 2013Applicant: APPLE INC.Inventors: Shayan Malek, Gregory Stephens, Jared Mitchell Kole, Richard Hung Minh Dinh, Robert Sorensen
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Patent number: 8383959Abstract: A chamber or series of chambers is formed from layers of nested shells and used to manipulate a work product within the chambers. The shells are formed from highly ordered material structures, such as superconductors and metamaterials, and the work product is manipulated using energy that is directed from the outside of the chamber, through the nested shells and into the chamber. The nested shells have an open position and a closed position or have a bridge through which a working material can be passed from one set of nested shells to another set of nested shells. The superconducting shells can be type-1 or type-2, and the metamaterial shells can include any combination of a frequency agile metamaterial, a split ring resonator, an artificial structure of a wire medium, a unit cell of an artificial magnetic metamaterial, metamaterial superlattices and any combination thereof, or other highly ordered composite metamaterials.Type: GrantFiled: December 23, 2008Date of Patent: February 26, 2013Inventor: Stephen Burns Kessler
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Publication number: 20130033843Abstract: Disclosed herein are exemplary embodiments of shielding apparatus, which may be used for providing electromagnetic interference (EMI) shielding to components on a substrate. An exemplary embodiment of a shielding apparatus generally includes a frame configured for installation to a substrate generally about one or more components on the substrate. A pickup member is integrally formed with and releasably attachable to the frame. The pickup member is configured to allow the pickup member and the frame to be picked up. The pickup member is detachable and completely separable from the frame.Type: ApplicationFiled: August 3, 2011Publication date: February 7, 2013Applicant: LAIRD TECHNOLOGIES, INC.Inventor: Paul W. Crotty, JR.
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Publication number: 20130027893Abstract: Disclosed herein are exemplary embodiments of an EMI shielding apparatus. A frame of the apparatus has a sidewall and an inwardly extending lip defining at least one opening along an upper portion of the frame. A reusable cover is attachable to the frame for at least substantially covering opening(s) of the frame. A first border portion of the cover includes one or more sliding members. A second border portion of the cover includes one or more stops. The sliding member(s) and stop(s) are configured to abut, in generally opposed directions, one or more lip edges generally facing the opening(s) when the cover is attached to the frame. The shielding apparatus is operable for shielding the component(s) on the substrate that are within an interior cooperatively defined by the frame and the cover.Type: ApplicationFiled: June 25, 2012Publication date: January 31, 2013Applicant: LAIRD TECHNOLOGIES, INC.Inventors: Igor Vinokur, Gerald R. English
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Publication number: 20130025928Abstract: An electromagnetic interference shielding arrangement comprises a first and a second electro-conductive components that are arranged to be joined. The first electro-conductive component includes a first electro-conductive contact surface. The second electro-conductive component includes a second electro-conductive contact surface and a shielding member extending from the second electro conductive component at a location adjacent the second electro-conductive surface. The arrangement is such that, in the joined configuration of the first and the second electro-conductive components the first and the second electro-conductive surfaces abut to create an electro conductive engagement region that is adjacent the shielding member.Type: ApplicationFiled: April 20, 2010Publication date: January 31, 2013Inventors: Pek Chuan Quek, Mun Ping Wong
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Patent number: 8362370Abstract: The present invention has the object of providing a technology that can facilitate inexpensive shields of individual electronic components with good heat exchange efficiency, the electronic circuit board according to the present invention being provided with: a plurality of conductor parts in a standing state that can extend and contract on a ground pattern that surrounds an electronic component on the electronic circuit board, a conductive plate, and securing members for holding the plate such that the plurality of conductor parts contact the plate in a state in which the conductor parts contract from their natural length.Type: GrantFiled: November 21, 2008Date of Patent: January 29, 2013Assignee: NEC Display Solutions, Ltd.Inventor: Kazuto Satou