Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

Abstract: A reticle compartment defining an enclosed interior adapted to store at least two reticles in a resticle storage portion, including an inlet port, through which a purge gas can enter the enclosed enterior, and an outlet port, through which the purge gas can exit the enclosed interior, wherein the reticle compartment further includes a first diffusor plate arranged in the enclosed interior between the inlet port and the reticle storage portion, wherein the first diffusor plate is provided with openings, through which the purge gas can flow, the openings in a central section of the first diffusor plate being provided with a larger individual opening area and/or providing a large total opening area per unit area than openings in a peripheral section of the first diffusor plate.

Abstract: A reticle compartment defining an enclosed interior adapted to store at least two reticles in a reticle storage portion, including an inlet port, through which a purge gas can enter the enclosed interior, and an outlet port, through which the purge gas can exit the enclosed interior, wherein the reticle compartment further includes a first diffusor plate arranged in the enclosed interior between the inlet port and the reticle storage portion, wherein the first diffusor plate is provided with openings, through which the purge gas can flow, the openings in a central section of the first diffusor plate being provided with a larger individual opening area and/or providing a larger total opening area per unit area than openings in a peripheral section of the first diffusor plate.

Abstract: An apparatus includes a chassis housing a control server compartment, a compute server compartment, and an input and output (IO) subsystem compartment. The apparatus further includes an IO subsystem inserted into the IO subsystem compartment, a compute server inserted into the compute server compartment, and a control server inserted into the control server compartment coupled to the compute server via an Ethernet connection. The IO subsystem includes one or more IO modules, where at least some of the IO modules can be coupled to sensors. The compute server receives the sensor data from the IO subsystem via some PCIe links and generates planning and control data based on the sensor data for controlling the autonomous vehicle. The control server controls and operates the autonomous vehicle by sending control commands to hardware of the autonomous vehicle based on the planning and control data received from the compute server.

Abstract: Methods, tests systems and computers for controlling power delivered to a test volume are provided. According to one aspect, an electromagnetic test system has at least one operational path having a channel emulator output, an amplifier, an attenuator and an antenna. A method includes, for a given desired output power level, C, setting a channel emulator output power to a power level B, and setting the attenuator to a setting A, such that C is a function of B and A. In such embodiments, the attenuation A may be calculated based on an upper limit output power of the channel emulator and the desired output power C.

Abstract: A modular system for containing electronic components has at least one storage bin and a plurality of Radio Frequency Interference (RFI) shielded electronics enclosures. Each RFI shielded electronics enclosure is at least one hollowed-out body; at least one hollowed-out cover, wherein the at least one hollowed-out cover is adapted to mate with the at least one hollowed-out body; and a plurality of fastening devices adapted to secure the at least one hollowed-out cover to the at least one hollowed-out body.

Abstract: A gripping apparatus is configured to grip an object by a claw. The gripping apparatus includes an electric circuit passing through a first claw body, the object, and a second claw body, and a conduction judgment part for judging as to whether or not the electric circuit is electrically conductive. The electric circuit is shut off by a protective member, which protects the object, but becomes electrically conductive when the claw bodies and the object are in direct contact with each other.

Abstract: An apparatus for activating a personal protection arrangement for a vehicle, including a housing, at least one circuit board, and at least one electrical or electronic component, the circuit board having at least one layer for shielding electromagnetic radiation, the circuit board being positioned in the housing in such a way that when the apparatus is mounted in the vehicle, the circuit board shields the electromagnetic radiation that is emitted by the at least one electrical or electronic component at least with respect to the interior of the vehicle. And to a method for manufacturing such an apparatus.

Abstract: A double-sided package module includes a substrate, a first sealing member, a second sealing member, and an extension portion. The substrate includes electronic components positioned on a first surface and a second surface of the substrate. The first sealing member and the second sealing member are positioned on the first surface and the second surface, respectively. The extension portion protrudes from a lateral surface of the substrate into a space between the first sealing member and the second sealing member.

Abstract: A personal computer a smartphone, a tablet, a web server or a cloud server configured for connection to a network of computers or system on a microchip including one or more buffer zones excluding circuitry and two or more zones, each including circuitry. The one or more buffer zones form one or more boundaries separating the zones including circuitry. At least a first of the zones including circuitry includes at least one public unit with a microprocessor and a network communication component. At least a second of the zones including circuitry includes at least one private unit with at least a separate, private network connection and a microprocessor that is a central controller of the computer. The public unit and the at least one private unit can be connected by at least one secure control bus that is isolated from input from a public network.

Abstract: A wireless connector includes a plurality of printed circuit boards (PCBs) (901, 902) disposed within a housing of the electronic system. Each PCB comprises a plurality of transceivers (910a, 910b, 920a, 920b) configured to wirelessly transmit and receive modulated carrier signals (910, 920). Each transceiver in the system is configured to receive signals transmitted by every other transceiver in the system.

Abstract: A system and method for packaging a semiconductor device that includes a structure to reduce electromagnetic coupling is presented. The semiconductor device has a substrate on which a first circuit and a second circuit with inputs and outputs are formed proximate to each other. An isolation structure of electrically conductive material is located between components of the first and second circuits, the isolation structure being configured to reduce inductive coupling between those components during an operation of the semiconductor device. The isolation structure may be positioned on or over exterior surfaces of the semiconductor device housing or inside the housing. In one embodiment, the isolation structure includes a first leg extending transverse to the surface of the substrate and a first cross member connected to and projecting from the first leg over the substrate.

Abstract: In one embodiment a method to evaluate a shielding effectiveness of an enclosed structure, comprising collecting synthetic aperture data from an electromagnetic transmission originating from within the enclosed structure to generate a synthetic aperture dataset, performing angular spectrum processing on the synthetic aperture dataset to generate an angle of arrival dataset and determining a shielding effectiveness parameter from the angle of arrival dataset. Other embodiments may be described.

Abstract: A connector housing is provided and includes a single sheet of material having a top wall, a pair of side walls, rear end wall, a bottom wall, and a pair of partition members. The bottom wall includes a first bottom wall portion integrally connected with one of the pair of side walls, a second bottom wall portion integrally connected with the other of the pair of side walls, and a third bottom wall portion separated from and assembled to the first and second bottom wall portions. The pair of partition members is disposed between the top wall and the bottom wall to divide an inner receiving space that is defined by the top wall, the pair of side walls and the bottom wall into three insertion ports.

Abstract: The present invention discloses a connector housing comprising: an upper housing portion; a lower housing portion located below the upper housing portion; and at least three partition members located an inner space defined by the upper housing portion and the lower housing portion for partitioning the inner space into at least four insertion ports. At least one pair of the at least three partition members are connected to each other through a connecting plate so as to form a frame part in a general “” shape; and the connecting plate is stacked onto a corresponding bottom of the lower housing portion. Thus, the amount of the partition members forming the connector housing is reduced, the structural strength of the entire connector housing may be increased, and a dimensional accuracy of each insertion port is reliably ensured.

Abstract: A connector housing is provide and includes a single sheet of material, a plurality of first connection members, and a plurality of second connection members. The single sheet of material includes a top wall, a pair of side walls, a bottom wall having a first bottom wall portion and a second bottom wall portion connected to the pair of side walls, and a partition member disposed between the top wall and the bottom wall to partition an inner space defined by the top wall, the pair of side walls and the bottom wall. The plurality of first connection members are disposed along one of the pair of longitudinal edge portions, while the plurality of second connection members are disposed along the other of the pair of longitudinal edge portions. The plurality of first connection members are keyed with the plurality of second connection members, respectively.

Abstract: A circuit board assembling structure includes a first casing, a second casing, a dam and a circuit board. The first casing has an outer edge and at least a snap-engaging element. The second casing is coupled to the first casing. The dam is mounted on the first casing. The at least a snap-engaging element is disposed between the outer edge of the first casing and the dam. The circuit board is a resilient carrier which is snap-engaged with the at least a snap-engaging element, such that the circuit board is disposed between the outer edge of the first casing and the dam. Furthermore, an electronic device having the circuit board assembling structure and an assembling method of the electronic device are further provided.

Abstract: An assembly suitable for housing electronic components can include a top shield and a bottom shield, the bottom shield having a conductive outer cover, a wall section, and a laminating portion between the conductive outer cover and the wall section. The laminating portion may include laminating material. A printed circuit board (PCB) may be positioned between the top shield and the bottom shield.

Abstract: A server cabinet includes a bottom side, a top side, a first side wall, a second side wall opposite to the first side wall, a first air inlet tube with a number of air outlets, a second air inlet tube with a number of air outlets, and a number of pairs of adjusting apparatuses. The first air inlet tube is attached to the first side wall and extends from the bottom side to the top side, the second air inlet tube is attached to the second side wall and extends from the bottom side to the top side and the top side and the bottom side are each configured with an opening to receive the first air inlet tube and the second air inlet tube. Each air adjusting apparatus comprises a slidable shielding plate substantially covering the corresponding air outlets.

Abstract: A shield can of a mobile terminal is provided. The shield can of the mobile terminal includes: at least one shield can installed in a main circuit board of the mobile terminal, and at least one separation wall formed between electronic elements in which electromagnetic interference occurs within the shield can. Hence, shield ability can be improved and simplified manufacturing process of the separation wall can reduce cost.

Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

Abstract: A mobile terminal includes a main body; at least one circuit board placed in the main body and comprising an upper surface, a lower surface, and at least one lateral surface; at least one conductive body disposed at the at least one lateral surface of the at least one circuit board and electrically connected to a ground of the at least one circuit board; and at least one shield member mounted on the at least one circuit board. The at least one shield member includes a base portion formed to cover at least part of the upper surface or the lower surface of the at least one circuit board and at least one protrusion portion protruded from the base portion and formed to be electrically in contact with the at least one conductive body.

Abstract: Electromagnetically shielded portable storage devices are disclosed. One such device includes an electromagnetically shielded enclosure having an interior volume, the electromagnetically shielded enclosure including a plurality of shielded walls and sized to be manually carried by a person. The interior volume of the enclosure is isolated from high-frequency electromagnetic energy generated external to the enclosure. The device includes at least one storage device positioned within the interior volume, and at least one communicative connection extending from the at least one storage device to a communicative socket accessible external to the electromagnetically shielded enclosure. The at least one communicative connection is configured to allow access to the storage device by a computing system external to the electromagnetically shielded enclosure.

Abstract: An electromagnetically shielded enclosure is disclosed. One such system includes a continuously welded shell having a top, a bottom, and a plurality of side walls cooperating to enclose an interior volume, the interior volume sized to receive electronic equipment and allow human entry. The enclosure is constructed from electromagnetically conductive materials and includes continuous welds along seams joining each material. The enclosure includes a sally port located within the enclosure. The sally port includes a first door in one of the plurality of side walls and constructed from electromagnetically conductive materials. The sally port also includes a second door constructed from electromagnetically conductive materials. The sally port defines a secondary interior volume within the enclosure sized to allow human entry through either the first or second door.

Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

Abstract: A shield can of a mobile terminal is provided. The shield can of the mobile terminal includes: at least one shield can installed in a main circuit board of the mobile terminal, and at least one separation wall formed between electronic elements in which electromagnetic interference occurs within the shield can. Hence, shield ability can be improved and simplified manufacturing process of the separation wall can reduce cost.

Abstract: According to one embodiment, an electronic apparatus is provided with a first housing that comprises a first ground and a second housing comprising a second ground. The electronic apparatus further comprises (i) a plurality of first protrusions on an inner surface of the first housing, at least one of the plurality of first protrusions comprising, on a peripheral surface thereof, a first conductor electrically connected to the first ground; (ii) a hinge pivotably connecting the first housing and the second housing; and (iii) a cable extending between inside the first housing and inside the second housing through the hinge, supported by the plurality of first protrusions, electrically connected to the first conductor in the first housing, and electrically connected to the second ground in the second housing, the cable electrically connecting the first ground and the second ground.

Abstract: A screw-less fixing assembly for an interface card having a fixing support includes a frame, a movable cover module and an elastic member. The frame has an I/O opening. One side of the I/O opening is provided with an accommodating space. A long plate of the fixing support is positioned to correspond to the I/O opening, and a short plate of the fixing support is received in the accommodating space. The movable cover module is mounted in the accommodating space. The elastic member has an elastic protrusion positioned to correspond to the short plate of the fixing support. The movable cover module is moved to drive the elastic protrusion to tightly fix the short plate of the fixing support to the frame. With this arrangement, the interface card can be rapidly detached from the frame or attached thereto without using screws.

Abstract: There is provided a housing for a rugged handheld device, which includes: a main housing including: a main circuit board space sealed from an exterior environment, for supporting a main circuit board; and a compartment space for supporting a removable compartment for holding a device component for operation of the handheld device, such as a docking connector board, a display assembly, a keyboard assembly, where the compartment space is sealed from the external environment by a removable compartment cover for sealing the compartment space from the exterior environment, independently from the sealing of the main circuit board space and/or the device component placed into the compartment space.

Abstract: A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating positioned on an electrical system having circuit components mounted thereon, the dielectric coating shaped to conform to a surface of the electrical system and having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the conductive coating and the contact pads. The dielectric coating and the conductive coating have a plurality of overlapping pathway openings formed therethrough to isolate a respective shielding area of the conformal structure over desired circuit components or groups of circuit components.

Abstract: A handheld electronic device may include a portable housing and a shielding container within the portable housing. The shielding container may include a shielding frame and a shielding lid carried thereby. A printed circuit board may be within the shielding container. The shielding frame may include a planar base with at least one opening therein, a pair of opposing side walls integrally formed with the base and extending upwardly therefrom, and a pair of opposing end walls integrally formed with the base and extending upwardly therefrom. Also, the shielding frame may include at least one intermediate partition wall integrally formed with the base and extending upwardly therefrom to define a plurality of container compartments. The partition wall may also extend only partway between the opposing side walls to define at least one partition end gap therewith.

Abstract: An optical engine is provided, including an imaging module, a driver module and a connecting unit. The imaging module includes an imaging housing with an imaging space and an imaging unit installed in the imaging space. The imaging housing is made of a conductive material. The driver module includes a driver housing with a driver space and a driver circuit board installed in the driver space. The connecting unit includes at least one of the cables is electrically connected to the imaging unit and the driver circuit board and at least a protruding module protruding from the imaging housing (or the driver housing) to contact with the driver housing (or the imaging housing). The cable is installed in the protruding module made of a conductive material.

Abstract: An electromagnetic interference preventing module is provided. The module includes a metal pad that is disposed on a circuit board. The metal pad includes a soldering portion and a grounding portion that are connected to each other. At least one fixing lug of a connector is soldered to the soldering portion. At least one protrusion of a grounding housing is in contact with the grounding portion, so as to electrically connect the connector with the grounding housing.

Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

Abstract: An electrical assembly comprises a mounting bracket lift assembly and an electrical center. The electrical center is attached to the mounting bracket lift assembly for plugging wiring harness end connectors into the electrical center. The electrical center comprises a lower housing, a circuit board sub-assembly, an upper housing, electrical components such as fuses and relays that plug into the upper housing and a cover. The circuit board sub-assembly includes a power bus bar that provides a power path for the various electrical circuits of the vehicle via the circuit components carried on the circuit board. Three power bus bars that are configured, oriented and located to reduce the foot print of the electrical center and/or to improve the dissipation of heat generated by the electrical center are disclosed.

Abstract: A shielding apparatus has first and second electrically conductive sheets attached to an interior of a housing. A gap between the first and second electrically conductive sheets has a size based on a predefined desired cutoff frequency, and the widths of the first and second electrically conductive sheets are no more than twice the size of the gap. The lengths of the first and second electrically conductive sheets are at least four times the size of the gap.

Abstract: An electromagnetic interference shield system is provided. Each EMI shield may include a frame providing the structure around the electronic device components to be shielded, and a cover operative to be placed over the frame to prevent electromagnetic radiation from passing over the frame. Each frame may be coupled to a circuit board, and enclose electronic components in need of shielding. Each cover may be coupled to its corresponding frame using at least one snap that extends from the periphery of the cover towards the frame and circuit board. To minimize the space taken by the EMI shields, the snaps of adjacent covers may be offset or staggered so that opposing snaps engage voids left between snaps of the opposing cover, thus reducing the space needed between adjacent EMI shields by up to the width of a snap.

Abstract: A thermal-electrical assembly (200) provides with improved heat sinking, electrical shielding and electrical grounding. The thermal-electrical assembly is configured using a shield (202) having a windowed aperture (204), a pliable frame (206) formed of thermally and electrically conductive material having contours (210) that fit within and are retained by the windowed aperture, and a thermal insert (208) formed to fit within the pliable frame. The combination of pliable frame 206 and thermal insert (208) close off the shield (202) while providing contact areas for dissipating heat from heat generating circuitry or components. Communication devices, such as portable radios having tight space constraints, can incorporate the thermal-electrical assembly (200) to minimize electrical emissions while maximizing heat dissipation.

Abstract: An apparatus for electrically shielding electronic components is provided. The apparatus includes a circuit board having a first surface with a plurality of electronic components mounted on the first surface, the first surface having a first region and a second region. The circuit board comprises a ground plane and a trace on the first surface coupled to at least one electronic component in the first region and coupled to at least one electronic component in the second region. The circuit board also comprising a strip of conductive material on the first surface, the strip of conductive material forming a perimeter around the first region of the circuit board, the strip of conductive material coupled to the ground plane, the strip of conductive material defining at least one gap wherein the trace is oriented through the at least one gap. Additionally, a first filtering device is coupled to the trace on a first side of the gap.

Abstract: The present invention discloses a container or bag with several types of compartments with different forms of electromagnetic/wireless shielding. The types of compartments include a) an electromagnetic/wireless shielded compartment useful for line-of-site type shielding, b) an electromagnetic/wireless shielded compartment useful when a complete shielding enclosure is needed, and c) an unshielded compartment. The line-of-site shielded compartment prevents wireless access to the contents contained within when a complete shielding enclosure is not required, for example, for objects containing RFID tags, such as passports, books, and clothing. The compartment with a complete shielding enclosure prevents wireless access to devices that require a complete Faraday type cage, such as mobile phones, PDAs, or computers. Placing these and other devices within the shielded compartments protects them from remote access, and the data within is shielded from unscrupulous individuals.

Abstract: This invention relates to electronic circuit packages designed to hold high frequency circuits operating particularly, but not exclusively, in the microwave, millimeter wave, and sub-millimeter wave bands. The invention provides a package incorporating a cavity in a material for containment of the circuits, wherein the package further incorporates at least one conductive surface mounted on an inner surface extending into the cavity, the conductivity thereof being adapted to be at least partially absorbent to electromagnetic radiation. The conductive surface according to the present invention will tend to attenuate electromagnetic radiation present within the cavity, and so help to prevent undesired coupling from one point to another within the cavity. The conductivity of the conductive material is preferably arranged to match the impedance of the radiation mode estimated or computed to be present within the cavity.

Abstract: The invention relates to an electrical device comprising a supporting substrate (1) which supports electronic components (2) as well as a strip conductor structure for connecting the electronic components (2) and on which an electrically conducting shielding element is disposed that surrounds the strip conductor structure and the components (2). The shielding element is composed of a first pot-type shielding part (7), the edge region of the hole of which rests upon contact areas (5) of a first surface (8) of the supporting substrate (1), said contact areas (5) being connected to a fixed electrical potential, and a second pot-type shielding part (9), the edge region of the hole of which rests upon a second surface (10) of the supporting substrate (1). The shielding parts (7 and 9) can be fastened to the supporting substrate (1) by means of fastening attachments which engage into first recesses (6) of the supporting substrate (1).

Abstract: According to various aspects, exemplary embodiments are provided of shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In one exemplary embodiment, a shielding apparatus generally includes first and second walls. The first wall includes laterally spaced-apart detent protrusions. The second wall includes an edge portion disposed relative to the first wall such that an interface between the edge portion of the second wall and the first wall is substantially sealed against the ingress and/or egress of electromagnetic interference through the interface. The edge portion of the second wall is engaged generally between and laterally confined by the laterally spaced-apart detent protrusions of the first wall, such that the laterally spaced-apart detent protrusions inhibit movement of the second wall relative to the first wall.

Abstract: A shielding assembly (100) for protecting several modules from electromagnetic interference, includes a cage (40) installable on a circuit board (200), a first gasket (20), and a second gasket (50). The cage includes a front end portion (41), a cover (42), a base (48), and at least one interior wall (44). The cover, the at least one interior wall and the base cooperatively define at least two spaces (400) for receiving the modules. The first gasket encircles the front end portion of the cage. The first gasket electrically and mechanically contacts the cover and the base to provide an electromagnetic interference seal between the cage and a device in which the cage is mounted. The second gasket attaches against the cage and the circuit board respectively so as to electrically shield the modules in the cage from electromagnetic interference.

Abstract: A microwave cooker comprises a body having a cooking chamber therein, the cooking chamber having one opened side, a microwave source disposed at the body for supplying microwave to the cooking chamber, a door coupled to the body for opening and closing the cooking chamber, and a multi-stage choke seal formed at the door and having different resonant frequencies and different LC resonant circuits for preventing the microwave from being leaked between the body and the door.

Abstract: A method of manufacturing a chassis assembly to reduce electromagnetic interference is disclosed. The method includes forming a chassis having a chassis cover top portion, a chassis cover step portion, a chassis cover pre-step portion, a hemmed edge, a hemmed lip, and one or more dimpled spring fingers, by forming a first bend at the hemmed edge residing between the hemmed lip and the chassis cover pre-step portion, forming a second bend between the chassis cover step portion and the chassis cover pre-step portion, and forming a third bend between the chassis cover top portion and the chassis cover step portion. The method further including forming a fourth bends between a chassis back top portion and a chassis back. The formed chassis cover is then seated with the chassis back to create a tortuous path.

Abstract: Various embodiments provide EMI shields for substrates having at least one electrical component disposed thereon. In one embodiment, an EMI shield generally includes a cover having first and second protrusions and at least one electrically-conductive member disposed along an inner side of the cover. The electrically-conductive member may be compressed generally between the substrate and the cover when the substrate is captured generally between the electrically-conductive member and the first protrusion. In addition, a compressive clamping force may be generated by the engagement of the first protrusion with the substrate and the compression of the electrically-conductive member. This compressive clamping force may mechanically retain the cover to the substrate, and also compress the electrically-conductive member against at least one electrically-conductive surface disposed on the substrate, to establish electrical conductivity therebetween that is sufficient for EMI shielding performance.

Abstract: According to one exemplary embodiment, a structure comprises an electronic device situated over a substrate of a semiconductor die. The structure further includes a metal cage comprising a number of contacts situated over the substrate and surrounding the electronic device. The contacts form a lateral EMI shield portion of the metal cage. The structure also includes a number of vias connecting a number of metal interconnect segments to the contacts. The metal interconnect segments form a top EMI shield portion of the metal cage.

Abstract: A microwave cooker comprises a body having a cooking chamber therein, the cooking chamber having one opened side, a microwave source disposed at the body for supplying microwave to the cooking chamber, a door coupled to the body for opening and closing the cooking chamber, and a multi-stage choke seal formed at the door, having different resonant frequencies at a frequency region higher than a central frequency of microwave, and having different LC resonant circuits for preventing the microwave from being leaked between the body and the door.

Abstract: The present invention relates to a circuit board mounting panel for electrical appliance, comprising: a base panel disposing a first printed circuit board and a second printed circuit board thereon; a first shield cover disposed on the base panel and mounting the first printed circuit board therein and formed with an opening part in a vertical direction to a surface of the first printed circuit board; and a second shield cover mounting the second printed circuit board therein and inserted into the first shield cover through the opening part and coupled to the base panel. Thus, the present invention provides an improved structure of a shield cover for a circuit board mounting panel for an electrical appliance, thereby minimizing a idle mold that may be produced while developing a circuitry or a PCB.