With Electrical Connector Patents (Class 174/50.52)
  • Publication number: 20080023211
    Abstract: A system and method for connecting supply power to motor control components includes use of a motor control center subunit with moveable supply power contacts. After a motor control center subunit is secured into a motor control center compartment, the supply power contacts may be advanced to engage supply power buses. For disconnection, the supply power contacts may be retracted and isolated from the buses before physical removal of the subunit.
    Type: Application
    Filed: January 19, 2007
    Publication date: January 31, 2008
    Inventors: Edgar Yee, Robert Allan Morris, Scott Edward McPherren, Neal Edward Rowe
  • Patent number: 7307847
    Abstract: The device includes a housing, a locking and release mechanism, an electrical connector, an optical connector, and pathological circuitry. The housing has a top, a bottom, a front, and a back. The locking and release mechanism is attached to the housing. The electrical connector is attached to the back of the housing. The optical connector is attached to the front of the housing. The pathological circuitry handles pathological conditions associated with digital video signals.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: December 11, 2007
    Assignee: Stratos International, Inc.
    Inventors: Luis Torres, Mark Benton, Anthony Kowalkowski, Chris Liston, Cesar Yanez, Bernard Mercado
  • Patent number: 7295440
    Abstract: An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's housing. Unlike conventional heat exchangers that may be used to dissipate heat from power-dissipating components that are housed typically in sheet metal housings, the ICPC described herein provides a cold plate integral to the housing of power electronics, thereby allowing the rapid and efficient removal of heat from the components into the cold plate carrier fluid and out of the system.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: November 13, 2007
    Assignee: Honeywell International, Inc.
    Inventors: Evgeni Ganev, Robert A. Dietrich, Michael A. Quan
  • Patent number: 7286372
    Abstract: A PCB is provided that is suitable for use in applications where EMI control is of interest. The PCB includes circuitry that communicates with an edge connector having edge traces located on its surface. Additionally, embedded traces are disposed within the dielectric material of the PCB, and each embedded trace electrically connects an edge trace with a corresponding median trace located on a surface of the PCB. An embedded ground layer substantially disposed within the dielectric material defines an area within the dielectric material through which the embedded traces pass. Finally, one or more vias are provided that extend through the dielectric material of the PCB and are filled with a conductive material. The vias are electrically connected to the embedded ground layer and configured to electrically communicate with an associated module. In this way, a structure is implemented that facilitates control of electromagnetic radiation emitted by the PCB circuitry.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: October 23, 2007
    Assignee: Finisar Corporation
    Inventors: Lewis B. Aronson, Donald A. Ice
  • Patent number: 7286358
    Abstract: A surface mountable resistor chip assembly, containing an integral heat sink, convective cooling provision exhibits higher continuous-mode power ratings than prior art surface mount resistors having comparable printed circuit board footprints. The preferred embodiments are also configured so as to reduce transient thermal impedance in a manner to exhibit increased power rating under short duration overload conditions. The assembly includes a housing with passages, holes or slotted openings, for the chip assembly and for air flow therethrough, and electrically conductive paths to bring the chip electrical connections out to pads on the housing arranged to make electrical connections to a printed circuit board.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: October 23, 2007
    Assignee: Stackpole Electronic Inc.
    Inventor: Edward T. Rodriguez
  • Patent number: 7281324
    Abstract: A method of simultaneously fabricating a plurality of circuit blocks is presented. Each circuit block is configured for aligned positioning onto a housing of an individual electrical connector. The method includes simultaneously fabricating a plurality of circuits on a single sheet of material and cutting a repeating pattern of holes across the sheet of material. Then the sheet is separated into individual identical sections that have one or more peripheral edge. A circuit board is defined by each section. Each of the sections has a peripheral shape that is defined by the one or more peripheral edges. The peripheral shape is sized and configured to be receivable in only one orientation into a housing of an electrical connector. The holes are cut in the sheet of material such that holes are associated with each peripheral edge of each section.
    Type: Grant
    Filed: April 11, 2005
    Date of Patent: October 16, 2007
    Assignee: Medconx, Inc.
    Inventors: Harold B. Kent, James J. LeVante, Joseph R. Layton, Aaron T. Fine
  • Patent number: 7270577
    Abstract: A connector module and motor utilizing the same. The connector module electrically connects the motor and an external device and includes a printed wiring board and a plurality of pins. The printed wiring board comprises at least one circuit line, each of circuit lines has a first terminal and a second terminal opposite thereto. Each pin has a first end and a second end opposite thereto. The first terminals of the circuit lines are electrically connected to an input port of the motor. The second terminals of the circuit lines are electrically connected to the first ends of the pins separately, and the second ends of the pins are electrically connected to the external device.
    Type: Grant
    Filed: July 14, 2005
    Date of Patent: September 18, 2007
    Assignee: Delta Electronics, Inc.
    Inventors: Chun-Hua Yang, Jin-Juh Hsu
  • Patent number: 7113400
    Abstract: A housing for enclosing an electronic control unit is constructed of a resinous cover and a metallic case having heat conductivity higher than that of the resinous cover. An air intake module is mounted on an engine inside an engine compartment. The air intake module forms an air passage through which air flows from an air inlet toward the engine. The electronic control unit is mounted on the air intake module such that the metallic case is exposed to the air passage in the air intake module and the resinous cover is exposed to the outside of the air intake module, that is, exposed in the engine compartment.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: September 26, 2006
    Assignee: Denso Corporation
    Inventors: Yoshihiro Nagata, Hiroshi Kondo
  • Patent number: 7009847
    Abstract: A connector concealment mechanism for computer peripheral device is proposed, which is designed for use in conjunction with a computer peripheral device equipped with an external connector for the connector to be concealable into the casing of the computer peripheral device when not in use, and be easily ejected out of the computer casing for use to connect the computer peripheral device to a computer unit. This feature allows the computer peripheral device to be more advantageous to use than the prior art due to the fact that it allows the user to conceal the connector into the casing of the computer peripheral device when not in use, without having using a separable cap which would easily get lost as in the case of the prior art, thus making the use of the computer peripheral device more convenient and trouble-free than prior art.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: March 7, 2006
    Assignee: Inventec Multimedia & Telecom Corporation
    Inventors: Kuo-Chang Wu, Yi-Min Tseng, Hsin-Chiang Ho, Ya-Chyi Chou, Kao-Yu Hsu
  • Patent number: 7002084
    Abstract: An electronic digital controller, such as a load cell indicator, is disclosed in which a number of components, such as a circuit board, display, and keypad are placed within an enclosure, and the enclosure is bonded closed, such as using an adhesive, to render the enclosure watertight. The keypad is a touch sensitive, capacitive keypad with no moving parts, and it is housed behind a rigid panel. An optoelectronic transceiver allows for data exchange with an electronic memory device housed in the adhesively sealed enclosure and allows for data exchange and for updating or modification of software code housed therein. Other components, such as another circuit board, a power supply, and block connectors, are placed in an adjacent enclosure, and the circuit boards in the two enclosures are electrically connected. The power supply is preferably a potted AC power supply but may also include a battery.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: February 21, 2006
    Assignee: WeighTech, Inc.
    Inventors: Timothy R. Cox, Ronald T. Pagan, Stephen S. Newell, Steve D. Tull
  • Patent number: 6927336
    Abstract: An interworking interface module for telecommunication switching systems has multiple interworking terminal I/O ports, tracking terminal I/O ports, and system terminal I/O ports, and an indicator lamp are mounted on the external panels of a mounting frame. Multiple connection modules are attached onto the inner surface of a mounting frame used for setting up interconnection between the above terminal I/O ports. Each connection module comprises a switching means, such that a terminal separated from the system connection is automatically switched to connect to a terminal resistor to damp any line oscillation due to open connection. Using the connection modules to interconnect the above terminals of the invention, the present invention is able to reduce the necessary interconnecting components and simplify the procedures for assembling a transit exchange platform, while the original service quality with respect to a line connection is maintained.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: August 9, 2005
    Inventor: Hsun-Chien Huang
  • Patent number: 6888727
    Abstract: A Serial ATA mobile rack is constructed to include a housing having a back panel; an adapter fixedly provided in the back panel of the housing, the adapter comprising a connector formed of a signal segment and a power segment, a signal line disposed at a back side thereof and electrically connected to the signal segment for signal input/output, and a power cord disposed at the back side and electrically connected to the power segment, the power cord having an electric plug; and a circuit board mounted in the back panel of the housing, the circuit board comprising a power input socket adapted to receive external power supply, a power output socket adapted to receive the electric plug of the power cord for power output to the power segment of the adapter; the housing accommodating an inner case holding a data storage device, and a power switch connected between the power input socket and the power output socket for power on/off control.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: May 3, 2005
    Inventor: Cheng Chun Chang
  • Patent number: 6835004
    Abstract: An opto-electronic package is provided for mounting on a module base. The package comprises a generally rectangular package. An optical connector extends from a first side of the package body along an optical axis, generally parallel to the module base. A radio frequency connector extends from a second side of the package body along a RF axis, generally parallel to the module base. A plurality of electronic leads and mounting tabs each extend from at least one of the second side and a third side of the package body. A fourth side of the package body is adjacent the first side and free of connectors, leads, and mounting tabs for mounting the package in a corner of the module formed by first and second module walls. The fourth wall of the package body is positioned adjacent the first module wall and the optical connector extends through the second module wall.
    Type: Grant
    Filed: August 26, 2002
    Date of Patent: December 28, 2004
    Assignee: T-Networks, Inc.
    Inventors: Jason T. Iceman, Walter Jeffery Shakespeare, John Kai Andersen
  • Patent number: 6828502
    Abstract: A fluid release system for removing water within secondary conduits which contain electrical cables extending between a transformer and an electrical meter. The system includes a release valve having a side opening for release of water collected therein. The system further includes a flap connected to pivot between a closed position covering the side opening, and an open position for removal of water collected from secondary conduits connected to the release valve. The release valve is connected to secondary conduits extending between the transformer and the electrical meter installed on an exterior wall of a residential or commercial building. The fluid release system removes water from the secondary conduits before water is transferred to the electrical meter therefore minimizing water damage to the electrical meter and associated circuit breakers. A method of releasing water from within secondary conduits by operation of the release valve is also disclosed.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: December 7, 2004
    Inventor: Gregory L. Green
  • Patent number: 6818825
    Abstract: An electrical power supply assembly for an internal combustion engine. In one embodiment, the assembly includes a dual circuit alternator that provides dual unregulated voltage signals to a supply connector. The supply connector is electrically connected to an input connector. A regulator receives one of unregulated voltage signals from the input connector and provides a regulated voltage signal to one contact at an output connector. A bypass conductor conducts the other unregulated voltage signal from the input connector to another contact at the output connector. The output connector is configured to be electrically connected to a dual load circuit connector. The dual load circuit connector is electrically connected to load circuits having different demands for regulated and unregulated electrical power.
    Type: Grant
    Filed: August 13, 2002
    Date of Patent: November 16, 2004
    Assignee: Briggs & Stratton Corporation
    Inventor: Paul A. Tharman
  • Patent number: 6812404
    Abstract: Feed through assemblies and methods for their manufacture are provided. The feedthrough assemblies include a ferrule, an insulating material contacting the ferrule, and a terminal extending through the ferrule and having first and second areas separated by an area contacting the insulating material. A brazing material contacts the insulating material and the terminal's first area, and a conductive material covers the terminal's second area. The presence of the conductive material causes current density to be dispersed away from the brazing material.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: November 2, 2004
    Assignee: Medtronic, Inc.
    Inventor: Gonzalo Martinez
  • Patent number: 6797887
    Abstract: A glass terminal for high-speed optical communication. The glass terminal includes an eyelet member provided with an inserting hole, a signal lead being inserted into the inserting hole and sealed with the eyelet member using glass filled in the inserting hole and an optical element mounting block fixed to the eyelet member. The optical element mounting block having such a size to cover a range where the inserting hole is arranged. The optical element mounting block is provided with a coaxial hole arranged coaxially with the inserting hole and having a diameter larger than that of the signal lead, the signal lead extending into the coaxial hole. The optical element mounting block also includes a said surface partially cut off so that an outer peripheral surface of the signal lead in the coaxial hole is partially exposed.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: September 28, 2004
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Tetsuya Kojima, Yoshihiko Nakamura
  • Patent number: 6781847
    Abstract: A housing (1) for and electrical device having at least two housing parts (2) and an electrical circuit on a printed-circuit board (5) that can be attached in the housing (1) are proposed. Furthermore, a connection device for the power supply of the device and/or signal transmission to the electronic circuit that is capable of being attached to the housing (1) is provided. After the housing parts (2) are joined, one housing wall (4) that is integral with one of the housing parts (2) forms an interference radiation-proof, chamber-like recess (3) for accommodating the connection device. Furthermore, at least one electrically-conductive contact conductor tracks of the printed-circuit board (6) connected with a ground connection of the housing.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: August 24, 2004
    Assignee: Robert Bosch GmbH
    Inventors: Gert Jakob, Gerd Bohmwetsch, Bernd Eckert
  • Patent number: 6778402
    Abstract: A circuit board on which various electronic components are mounted is contained in a box-shaped resin case. The case is mounted on a bracket made of an iron plate by snap-fitting projections formed on the case to resilient hooks formed on the bracket. To correctly align the projections with respective resilient hooks by pushing down the case toward the bracket in a process of mounting the case on the bracket, a guiding projection slidably contacting one of the hooks and generating a thrusting force is formed on the case. The case is correctly engaged with the bracket by simply pushing down the case toward the bracket because the case is guided by the guiding projection. Thus, the case can be easily mounted on the bracket without fail.
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: August 17, 2004
    Assignee: Denso Corporation
    Inventors: Shoji Nasu, Mitsuru Nakagawa
  • Patent number: 6737579
    Abstract: An arrangement for sealed leading of at least one conductor has a housing having a housing wall which surrounds a housing aperture, a closing part which closes the housing aperture, a seal arranged between the closing part and the housing wall which surrounds the housing aperture, at least one conductor track serving as at least one conductor which is pressure-tightly connected with a conductor track carrier formed by an elastic flexible carrier film, the conductor track carrier being routed between the housing and the closing part, the at least one conductor being insulated from outside and being in close contact with the seal in a closing position of the closing part, the closing part being held to the seal by a closing force, a part of the conductor track carrier having an elastic flexible extension which protrudes within the housing, an electrical component which is movably arranged within the housing, the extension being bent for contacting the at least one conductor track thereon on at an end of the ext
    Type: Grant
    Filed: May 22, 1997
    Date of Patent: May 18, 2004
    Assignee: Robert Bosch GmbH
    Inventors: Helmut Laufer, Wolfgang Fehlmann, Johannes Pflug, Hans-Peter Bauer, Wolfgang Braun, Ewald Eblen, Peter Nordhaus, Peter Zweigle, Elmar Huber, Roland Gronenberg, Jörg Wolke
  • Patent number: 6683250
    Abstract: A protected electronic assembly is provided that includes an electronic device, an outer shell, and an inner layer. The outer shell is preferably made from a rigid polymeric material, located over the electronic device, and adapted to protect the electronic device from an environment. The inner layer is preferably made from a resilient polymeric material, located between the electronic device and the outer shell, and adapted to cushion the electronic device from mechanical shock. A method of making the protected electronic assembly is also provided that includes providing an electronic device, disposing a resilient polymeric material as an inner layer around the electronic device to cushion the electronic device, and injection molding a rigid polymeric material as an outer shell around the resilient polymeric material to protect the electronic device.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: January 27, 2004
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Michael John Luettgen, Susan Marie Degrood
  • Patent number: 6659792
    Abstract: An electric connection box includes a cover fitted on a lower side of a body having mounting portions, and the cover is fixedly secured to a vehicle body. A wire harness is extended outwardly from a portion of the body, disposed near to one corner portion thereof, through an escape groove. Plural lock mechanisms, in which a lock piece portion can be elastically fitted into a lock groove, are provided at fitting peripheral surfaces of the body and cover, and are disposed near to four corner portions thereof respectively. One lock mechanism, disposed near to a position where the wire harness is extended outwardly, has a semi-lock structure, and thus has a smaller retaining force than the other lock mechanisms.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: December 9, 2003
    Assignees: Autonetworks Technologies, Limited, Sumitomo Wiring Systems, Limited
    Inventors: Yuuji Saka, Eriko Yuasa, Takamichi Miyamukai, Hiroyuki Hayashi, Isao Yoneyama, Keiichi Ito, Yoshihide Tsukamoto, Masahiro Takamatsu, Koji Nomura
  • Patent number: 6646854
    Abstract: A lightning suppression attenuator including an enclosure having an interior volume and a coil of conductive wire received within the interior volume of the enclosure. The coil has a first lead extending outwardly through a first opening of the enclosure and a second lead extending outwardly of a second opening in the enclosure. A conductive grit fills a portion of the enclosure. The coil has a central void with turns of wire extending around the central void. The first lead is connected to a first discharge grounding system. The second lead is connected to a second discharge grounding system. The rigid foam material is affixed within the enclosure around the conductive grit and over the coil.
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: November 11, 2003
    Inventors: William J. Fowler, Benjamin P. Fowler
  • Patent number: 6573447
    Abstract: An electric device including a housing having a wall (2) made of solidified polymeric material and at least one electric component (5) which is situated inside the housing and is connected via at least one electric line (4) to at least one electric component which is situated outside or inside the housing, the line (4) being configured to be flexible and being at least partially embedded in the wall (2) of the housing during the molding and solidification of the housing.
    Type: Grant
    Filed: July 6, 2001
    Date of Patent: June 3, 2003
    Assignee: Firma Carl Freudenberg
    Inventors: Günter Trogisch, Peter Schäfer, Stefan Plötz, Martin Quarder
  • Patent number: 6574119
    Abstract: An electronic device, in particular for a motor vehicle, has an electronic component that is disposed in a housing and has one or more connection lugs, is described. A cable leads into the housing and is formed by a corresponding number of lines. It is proposed that each connection lug is connected in an electrically conducting manner to the line assigned to it in the housing by a crimp connection. This achieves a simple construction of the device, with the result that it can be easily produced without great monitoring expenditure.
    Type: Grant
    Filed: December 24, 2001
    Date of Patent: June 3, 2003
    Assignee: Siemens Aktiengesellschaft
    Inventor: Dirk Kaltenbach
  • Patent number: 6552911
    Abstract: An electrical device is proposed which has a housing (1), comprising at least two housing parts (2, 3), and an electronic circuit disposed in the housing (1). A connection device (5) for supplying voltage to the device and/or for signal transmission to the electronic circuit is present that can be secured to the housing (1); the housing parts (2, 3) are joined to one another by laser welding at a joining edge (4). The connection device (5) is provided with a welding flange (8), which comes to rest between the housing parts (2, 3) in such a way that an at least nonpositive connection of the housing parts (2, 3), with enclosure of the connection device (5), can be produced.
    Type: Grant
    Filed: March 1, 2001
    Date of Patent: April 22, 2003
    Assignee: Robert Bosch GmbH
    Inventors: Martin Haupt, Frank Mayer, Jochen Schweinbenz, Peter Schiefer, Ralf Schinzel
  • Patent number: 6509525
    Abstract: A hermetic terminal assembly including a body member with a bottom portion and a surrounding boundary or flange portion with at least one current conducting pin sealed in an opening in the bottom portion. The hermetic terminal assembly may include an over-surface stratum or disk disposed in close fit relation in said body member in facing relation with said bottom and flange portions and/or an electrically insulating coating.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: January 21, 2003
    Assignee: Emerson Electric Co.
    Inventors: Glenn A. Honkomp, Tariq Quadir, Stephanie S. Chapman
  • Patent number: 6492590
    Abstract: A liquid-proof enclosure includes first and second casing members engaging each other to define an interior space for receiving, retaining and protecting an electrical device. Each casing member has a mating flange engaging each other to encase the electrical device. A rib is formed along the mating flange of the first casing member and a corresponding slot is defined along the mating flange of the second casing member for receiving and engaging the rib thereby attaching the first and second casing members together and increasing length of a possible leakage path between the first and second casing members. An opening is defined between the first and second casing members. At least a circumferential slot is defined along a circumferential wall of the opening. A cable retainer retaining a cable forms ribs received in the slot of the opening for attaching the cable retainer to the first and second casing members and to prevent liquid leakage into the enclosure.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: December 10, 2002
    Inventor: Ching Chi Cheng
  • Publication number: 20020148629
    Abstract: A hermetic terminal assembly including a body member with a bottom portion and a surrounding boundary or flange portion with at least one current conducting pin sealed in an opening in the bottom portion. The hermetic terminal assembly may include an over-surface stratum or disk disposed in close fit relation in said body member in facing relation with said bottom and flange portions and/or an electrically insulating coating.
    Type: Application
    Filed: February 11, 2002
    Publication date: October 17, 2002
    Inventors: Glenn A. Honkomp, Tariq Quadir, Stephanie S. Chapman
  • Patent number: 6465729
    Abstract: A method for producing an electrical feedthru wherein a thin liquid conductive film is deposited into a shallow trough of an insulating machinable substrate. The conductive film and substrate are fired and then the resulting bound composite is ground flush with the adjacent surface of the insulating machinable substrate. The surface cohesion of the fired composite, and the resulting high quality surface finish of the grinding operation, combined with an elastomeric seal, create low leakage barriers capable of supporting a pressure differential while allowing isolated electrical conduction across a pressure or vacuum envelope. The method produces a space saving feedthru which allows a high signal line density in a limited space, is relatively simple to assemble, allows for disassembly rework, can be ‘designed into’ unique geometries of varied applications, and which has a single O-ring sealing across all traces.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: October 15, 2002
    Assignee: University of New Hampshire
    Inventors: Mark S. Granoff, Phillip D. Demaine, David Broderick, Stephen Ingemi
  • Patent number: 6449164
    Abstract: An enclosure for housing a printed circuit board is disclosed. The enclosure comprises a shell with an open front and back, a front plate and back plate for attachment flush within, respectively, the open front and back. The front plate and back plate are secured to the shell by locking means. The printed circuit board housed within the enclosure is used as a structural element of the enclosure by rigid attachment to the front plate and back plate.
    Type: Grant
    Filed: January 22, 2002
    Date of Patent: September 10, 2002
    Inventor: Jack Gershfeld
  • Patent number: 6415182
    Abstract: A hermetic ground pin assembly for making an electrical connection between a hermetically sealed enclosure and an external circuit. A case has an aperture and a plug located within the aperture. A low temperature braze alloy is located between the plug and the case to attach the plug within the aperture. Two different pins are attached to opposite sides of the plug. A high temperature braze alloy attaches one of the pins to the plug and the low temperature braze alloy attaches the other pin to the plug.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: July 2, 2002
    Assignee: CTS Corporation
    Inventor: Shawki S. Ibrahim
  • Patent number: 6362424
    Abstract: A hermetic terminal assembly including a body member with a bottom portion and a surrounding boundary or flange portion with at least one current conducting pin sealed in an opening in the bottom portion and an over-surface stratum or disk disposed in close fit relation in said body member in facing relation with said bottom and flange portions and having disk retention means therefore, and preselectively sized and positioned fuse-like burn-off apertures in the current conducting pin to interrupt current conductivity at selected times, temperatures and amperage density.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: March 26, 2002
    Assignee: Emerson Electric Co.
    Inventors: Glenn A. Honkomp, Tariq Quadir, Stephanie S. Chapman
  • Patent number: 6329593
    Abstract: A waterproof LED display has a housing and a circuit board with a plurality of LEDs provided in the housing. A back seat is formed at a rear portion and a back cover is mounted on the back seat. The back seat forms a first rim defining an opening and has a channel defined around the opening. A gasket is provided in the channel. The back seat and the back cover respectively have complementary teeth to engage with each other to form a zigzag path between them. The back cover further has a plurality of vertical slots defined in a bottom portion thereof and a plurality of flexible conduits respectively received in the vertical slots and extended out from the slots. Wires of the circuit board are extended out along the flexible conduits.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: December 11, 2001
    Assignee: Formosa Industrial Computing Inc.
    Inventor: Chung-Chin Yang
  • Patent number: 6307749
    Abstract: An overmolded electronic module and a method for forming the module. The method entails both overmolding a circuit board and underfilling one or more surface-mount circuit devices physically and electrically connected to the board with solder bump connections. The circuit board is supported on a heatsink that thermally contacts a surface of the device opposite the circuit board. The board is optionally then encased on the heatsink with a retainer that includes means for biasing the circuit device against the heatsink. Finally, the circuit board is overmolded with a polymeric material to form an overmolded body that encases the circuit board and the circuit device with the heatsink. The overmold process is carried out so that a portion of the overmolded body completely underfills the circuit device and encapsulates its solder bump connections.
    Type: Grant
    Filed: October 23, 2000
    Date of Patent: October 23, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Jeffery Ralph Daanen, Scott David Brandenburg
  • Patent number: 6300566
    Abstract: An electrical connection configuration connects a circuit carrier to conductor tracks of a conductor-track carrier. Both the circuit carrier and the conductor-track carrier are carried by a base plate. The circuit carrier and the conductor-track carrier have a region in which they overlap and in which they are connected by an electrically conductive adhesive.
    Type: Grant
    Filed: October 4, 1999
    Date of Patent: October 9, 2001
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ulf Scheuerer, Frank Franzen, Christian Fritzsche