Dam Patents (Class 174/523)
  • Patent number: 5403975
    Abstract: A process for producing electronic package components from an aluminum alloy is disclosed. The components have a black color through integral color anodization. The desired color, thickness and surface finish are achieved by regulation of amperage during anodization. The amperage is rapidly raised to in excess of 80 amps per square foot and then allowed to gradually decrease as a function of oxide growth.
    Type: Grant
    Filed: August 31, 1993
    Date of Patent: April 4, 1995
    Assignee: Olin Corporation
    Inventors: Anthony M. Pasqualoni, Deepak Mahulikar, Satish K. Jalota, Andrew J. Brock
  • Patent number: 5395269
    Abstract: An electrical connector of the type having a housing with terminals extending from apertures thereof, is sealed at the aperture entrances around the extending terminal portions. The sealant material is polymerized of a major proportion of at least one vinyl ester resin, a minor proportion of at least one polymerizable acrylic diluent monomer and a polymerization activation system comprising from about 0.025% to about 17% by weight of the resin, by being exposed to actinic radiation selected to activate the system. The polymerized material excludes solder and solvents from the aperture entrances.
    Type: Grant
    Filed: August 26, 1991
    Date of Patent: March 7, 1995
    Assignee: The Whitaker Corporation
    Inventors: Francis F. Koblitz, Thomas M. O'Shea, Lynn K. Snyder
  • Patent number: 5393931
    Abstract: A vacuum chamber housing a cooled CCD for a CCD camera has a hermetic seal provided by a closed loop pattern on the surface of a laminate, printed circuit board having subteranean conductor traces. Electrical access to the CCD is provided, via the traces, by a universal pattern of pivouts subsets of which correspond to the pin patterns of different CCDs. Large numbers of pin connection patterns are achieved by this technique without leaks. A single board embodiment and a mother-daughter board embodiment are described.
    Type: Grant
    Filed: March 4, 1993
    Date of Patent: February 28, 1995
    Assignee: Photmetrics, Ltd.
    Inventor: Derek P. Guenther
  • Patent number: 5386084
    Abstract: An electronic device enclosure is provided having a top and a bottom, preferably each made of a polycarbonate plastic material and having respective lower and upper edges which are the same shape, and an elastomeric cover which fits over the top and wraps around the lower edge thereof so as to seal the joint between the top and the bottom. Preferably, the cover is made of silicone rubber or urethane of a durometer in the range of 40 to 60. Push buttons with associated suspensions are moulded integrally into the cover so as to protrude downwardly through apertures in the top and engage push button switches on the electronic device therein. A display aperture may be provided in the top and, if so, a portion of the cover also wraps around the edges of the display aperture so as to be disposed between the display and the cover.
    Type: Grant
    Filed: July 22, 1993
    Date of Patent: January 31, 1995
    Assignee: II Morrow Inc.
    Inventor: John J. Risko
  • Patent number: 5386342
    Abstract: An integrated circuit device package of this invention includes a flexible substrate having an upper patterned insulative layer, and a lower patterned conductive layer including a plurality of package leads. An integrated circuit die is fixed within a void of the upper surface of the flexible substrate, and is provided with electrical connections to the package leads. A rigid upper protective layer is provided to substantially enclose the integrated circuit die, and at least partially cover the top surface of the upper insulative layer. The integrated circuit device package further comprises a rigid or semi-rigid lower protective layer opposite the upper protective layer. The rigid lower protective layer is prefomed, and preferably is made from a material selected from the group consisting of rigid ceramic, glass, plastic, and combinations thereof.
    Type: Grant
    Filed: December 23, 1993
    Date of Patent: January 31, 1995
    Assignee: LSI Logic Corporation
    Inventor: Michael Rostoker
  • Patent number: 5382754
    Abstract: A central region of the bottom surface of a resin in which a diode chip and a base end portion of each of two lead terminals electrically connected to the chip is burning-treated by irradiating a laser beam in order to remove fat and oil existing in the bottom surface. Thereby, the deterioration of adhesive strength of an adhesive agent for fixing the bottom surface of the resin to a circuit board is prevented.
    Type: Grant
    Filed: March 18, 1993
    Date of Patent: January 17, 1995
    Assignee: Rohm Co., Ltd.
    Inventor: Shigemasa Sunada
  • Patent number: 5381089
    Abstract: A variable reluctance sensor assembly including an open-ended housing which contains a bobbin assembly with an overmolded connector piece. The bobbin contains a ferrous pole piece pressed into a closed-ended cavity within the bobbin, a small disc-shaped rare earth permanent magnet mounted forward of the pole piece, and a magnet wire coil wound upon the bobbin barrel and attached to the customer terminals which carry the output signal. A separate submersible connector is affixed to the integral connector. A front seal ring is stretch fit to the forward flange of the bobbin, and a rear seal ring is stretch fit to the rear section of the sensor housing. The bobbin assembly is slip fit into the housing with magnet forward.
    Type: Grant
    Filed: January 10, 1994
    Date of Patent: January 10, 1995
    Assignee: Component Sales & Consultants, Inc.
    Inventors: David A. Dickmeyer, Kenneth G. Maurer, III, Larry L. Redmon
  • Patent number: 5381301
    Abstract: A polymer-encased capacitor with a pressure sensitive interruption (PSI) system includes a polymer cover attached to a polymer case, the polymer cover having a skirt-less outer portion ultrasonically sealed to an open end portion of the polymer case. The polymer cover does not include flanged or lipped members extending from the outer edge of the cover (i e., "skirt-less") so that application of ultrasonic energy to the cover does not excite modes of vibration in which vibration nodes occur at intervals around the periphery of the cover, thereby providing a more leak-tight and rupture-proof bond between the capacitor case and cover.
    Type: Grant
    Filed: May 11, 1993
    Date of Patent: January 10, 1995
    Assignee: Aerovox Incorporated
    Inventor: Martin Hudis
  • Patent number: 5377076
    Abstract: A housing for an outdoor sensor device may be pivotally connected to a cell seat for permitting the housing to be rotatably positioned and directed for detection. A rotatable arm for pivotally connecting the housing to the cell seat receives electric wires from the seat for connection to the sensor device enclosed within a sealed compartment of the housing. The components of the housing and rotatable arm are provided with waterproof seal means to prevent water from damaging the sensor device.
    Type: Grant
    Filed: December 14, 1993
    Date of Patent: December 27, 1994
    Inventor: Hung-Sheng Wen
  • Patent number: 5317462
    Abstract: To provide a magnetic disk apparatus in which an outline of a seal for hermetically sealing is identical with that of a cover and base having steps at the periphery thereof. In a sealed magnetic disk apparatus in which a cover and base having steps at the periphery thereof are joined together via a seal, two slopes 48 and 50 are provided, in a turned or stairs-like form, at each step portion at the periphery of a cover 60 and a base 40. The first slope 48 descends from the periphery toward the inside, and the second slope 50 connecting to the first slope descends from the inside toward the periphery. The slopes of the cover are provided to mate with those of the base, respectively. A seal 70 has an outline which is substantially identical with that of the cover 60 and the base 40 and includes projections 72 and 74 covering the slopes.
    Type: Grant
    Filed: October 16, 1992
    Date of Patent: May 31, 1994
    Assignee: International Business Machines Corporation
    Inventors: Yoshitaka Kakizaki, Hiroki Kitahori, Kazuhiko Takada
  • Patent number: 5315483
    Abstract: A housing (10) comprises a first housing member (12) having a rib (14) about a substantial portion of the periphery of the first housing member, the rib being on at least two planes (22 and 24). A second housing member (30) having protrusions (32) on portions of the second housing member guides an O-ring (17) towards portions of the rib about the periphery of the first housing member. The O-ring placed on the rib of the first housing member aides in forming a radial seal when the second housing member is coupled to the first housing member.
    Type: Grant
    Filed: October 5, 1992
    Date of Patent: May 24, 1994
    Assignee: Motorola, Inc.
    Inventor: James L. Tracy
  • Patent number: 5302553
    Abstract: The invention is to a semiconductor package and the method of making the package. A moisture resistant coating such as a ceramic, silica or other plastic material is applied over a plastic packaged semiconductor device to seal the package from moisture.
    Type: Grant
    Filed: October 4, 1991
    Date of Patent: April 12, 1994
    Assignee: Texas Instruments Incorporated
    Inventors: Donald C. Abbott, Raymond A. Frechette
  • Patent number: 5289345
    Abstract: A housing for interconnecting an opto-electronic device with a ferrule includes a base and a cover cooperable with the base to define a chamber. The housing also includes an elastomeric board mount, with pylons supporting a substrate, disposed in a sealing relationship between the base and the cover when the same are conjoined and arranged to seal legs on the substrate that extend through the elastomeric board mount.
    Type: Grant
    Filed: June 28, 1990
    Date of Patent: February 22, 1994
    Assignee: BT&D Technologies Ltd.
    Inventors: Anthony A. Corradetti, Edward P. Gargiulo, Leland L. Krauss, Robert W. Hooley
  • Patent number: 5278496
    Abstract: A variable reluctance sensor assembly including an open-ended housing which contains a bobbin assembly with an overmolded connector piece. The bobbin contains a ferrous pole piece pressed into a closed-ended cavity within the bobbin, a small disc-shaped rare earth permanent magnet mounted forward of the pole piece, and a magnet wire coil wound upon the bobbin barrel and attached to the customer terminals which carry the output signal. A separate submersible connector is affixed to the integral connector. A front seal ring is stretch fit to the forward flange of the bobbin, and a rear seal ring is stretch fit to the rear section of the sensor housing. The bobbin assembly is slip fit into the housing with magnet forward.
    Type: Grant
    Filed: May 22, 1992
    Date of Patent: January 11, 1994
    Assignee: Component Sales & Consultants, Inc.
    Inventors: David A. Dickmeyer, Kenneth G. Maurer, III, Larry L. Redmon
  • Patent number: 5272580
    Abstract: The above objectives are achieved in the present invention by providing a top cover and base which are attached at only three points, and which incorporate a number of limiting surfaces on each, cooperating with mating surfaces on the other, to define the proximity of the two parts as assembled, and thus limit and determine the compression of the gasket between the two parts.
    Type: Grant
    Filed: February 25, 1993
    Date of Patent: December 21, 1993
    Assignee: Seagate Technology, Inc.
    Inventors: Thomas A. Hickox, Iraj Jabbari, Ramgopal Battu
  • Patent number: 5268814
    Abstract: In a thermal conduction cooling system used in electronic packaging having a hermetic seal and sealing force between a substrate with mounted electronic devices and a cooling cap to prevent the corrosion of the mounted electronic devices during their operation, an improved seal employing an acrylic film which acts both as a hermetic seal and as an adhesive to provide a suitable sealing force between the cold plate and substrate.
    Type: Grant
    Filed: May 20, 1992
    Date of Patent: December 7, 1993
    Assignee: International Business Machines Corporation
    Inventor: Carl Yakubowski
  • Patent number: 5264661
    Abstract: A hermetically sealed automotive module is disclosed wherein a cover of the module is sealed to a housing of the module by vibration welding. A weld contact surface is defined between the cover and housing of the module when the cover and housing undergo relative reciprocating motion under the application of a force. A method for hermetically sealing a module is also disclosed.
    Type: Grant
    Filed: October 21, 1991
    Date of Patent: November 23, 1993
    Assignee: Ford Motor Company
    Inventor: Michael J. Luettgen
  • Patent number: 5254807
    Abstract: An RPM sensor for anti-lock and/or traction control systems of motor vehicles or for engine speed governing or gasoline or Diesel injection control. The RPM sensor has a housing, receiving electrical components, with a first housing part of plastic that is at least partly enveloped by a second housing part, produced in an injection molding process, likewise from plastic. To attain a moisture-proof, material bond between the two housing parts, a melting element of a plastic having a lower melting point than that of the plastic of the housing parts is disposed in a contact zone between the two housing parts. When the second housing part is formed, the melting element is heated above its melting point, and a material bond of the two housing parts is attained which protects the RPM sensor against moisture dirt, stress, etc.
    Type: Grant
    Filed: March 16, 1992
    Date of Patent: October 19, 1993
    Assignee: Robert Bosch GmbH
    Inventors: Werner Pfander, Kristian Leo, Klaus Heyer, Uwe Kohler, Hans-Jurgen Herderich
  • Patent number: 5247424
    Abstract: A gasket is fabricated with electrical flex cables extending through the gasket in order to electrically communicate from the outside of a vacuum chamber with the electrical devices positioned within a vacuum chamber of a cryogenically cooled module. The gasket is fabricated from elastomeric, dielectric materials such as neoprene to effect a seal between the portions of the vacuum chamber and also to seal between the gasket material and the conductors of the flex cables which pass through the gasket.
    Type: Grant
    Filed: June 16, 1992
    Date of Patent: September 21, 1993
    Assignee: International Business Machines Corporation
    Inventors: Willard S. Harris, Matthew A. Hutchinson, Richard R. Konian, Edward J. Ossolinski, Vincent C. Vasile
  • Patent number: 5243132
    Abstract: The drain hole core for a drain seal fitting includes an elongated elastomeric member having a handle on one end, a rod-like member on the other end, and a integral plug between the handle and rod-like member. The drain hole core is inserted into the drain opening of the drain seal fitting such that the rod-like member extends up into the bore extending through the drain seal fitting and the plug seals the drain opening. A dam seals that area between the electrical wiring and the internal circumferential wall of the lower portion of the drain seal fitting. A sealing compound is then poured into an access opening in the side of the drain seal fitting so as to seal the bore of the drain seal fitting and to cover a portion of the rod-like member. Once the rod-like member is removed, it acts as a mold and provides a drain path from that portion of the bore above the sealing compound to the drain opening. The drain opening is then closed with a drain fitting.
    Type: Grant
    Filed: January 17, 1992
    Date of Patent: September 7, 1993
    Assignee: Cooper Industries, Inc.
    Inventor: Garrett S. Yarbrough
  • Patent number: 5239446
    Abstract: A watertight casing for electronic apparatus includes a first case, a second case and a cover. Sealing members are interposed between the first case and the second case, and between the second case and the cover, respectively. The first and the second cases and the cover are fastened tightly together. The first case is provided with a recess portion into which a printed circuit board is received. The printed circuit board mounts electronic parts on one side thereof, and a battery on the other side. Another sealing member is interposed between the second case and the other side of the printed circuit board.
    Type: Grant
    Filed: May 18, 1992
    Date of Patent: August 24, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tetsuo Matsumura, Takahiro Hayashi
  • Patent number: 5235135
    Abstract: In-situ adjustments to frequency characteristics of an electronic device such as a piezoelectric element (40) can be accomplished by means of a predetermined atmosphere (18) enclosed within a package comprised of a base (12) and a cover (14) and an included amount of sputterable electrode material (22). By attachment of appropriate electric potentials (2), electrode molecules can be sputtered onto the electrode surfaces adjusting the resonant frequency characteristics of a crystal filter.
    Type: Grant
    Filed: February 14, 1992
    Date of Patent: August 10, 1993
    Assignee: Motorola, Inc.
    Inventors: Thomas A. Knecht, Brian M. Mancini, Joseph P. Krause
  • Patent number: 5224021
    Abstract: A surface-mount network device which is to be mounted on a mounting substrate is disclosed. This device has an insulating substrate having wirings and passive elements. A plurality of lead terminals sandwich the insulating substrate from an end face of the insulating substrate. Terminal connection conductors are formed on the main surfaces of the insulating substrate and connect the lead terminals and at least one of the wirings and the passive elements. Sealing material cover at least connecting portions between the terminal connection conductors and the lead terminals. End portions of the lead terminals are bent to extend in a direction substantially parallel to the mounting substrate. This device is to be mounted vertically on the mounting substrate through the bent end portions of the lead terminals.
    Type: Grant
    Filed: October 19, 1990
    Date of Patent: June 29, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kinji Takada, Kazuo Oishi, Syozo Yamashita, Koji Nishida
  • Patent number: 5214246
    Abstract: A package for electronic components and especially hybrid components comprises a base, an enclosure formed by lateral walls and a lid having the function of hermetically sealing the package while bearing on a top end of the lateral walls. At least one lateral wall having through-holes for conductors which serve to establish a connection between the interior of the package and the exterior is provided with at least one longitudinal groove in an upper portion located between the through-holes and the top end of the wall.
    Type: Grant
    Filed: February 13, 1991
    Date of Patent: May 25, 1993
    Assignee: Egide S.A.
    Inventors: Jean-Pierre Maquaire, Jean N. Dody
  • Patent number: 5208728
    Abstract: To make housings used in automotive engineering for holding electronic components suitable for engine compartment installation, complex measures are taken that involve high manufacturing costs. In accordance with the invention, a housing is provided that permits simple production at low cost and affords dependable protection of the electronic systems, in that the electronic components mounted on an electronic carrier are provided with a protective lacquer, and then covered with a flexible and watertight foil as a protection against moisture in such a way that it provides an airtight and watertight seal on an all-round edge formed by a metal plate supporting the electronic carrier. A housing cover forming the housing in conjunction with the metal plate serves as a mechanical protection.
    Type: Grant
    Filed: March 26, 1992
    Date of Patent: May 4, 1993
    Assignee: Telefunken electronic GmbH
    Inventor: Klaus Schirmer
  • Patent number: 5194694
    Abstract: To seal the gaps and openings in the housing of an electrical component, the outside wall of the base of the housing is provided with filling reservoirs from which lead distributing channels leading to sealing locations to be sealed by sealing compound. The distributing channels are subdivided into sub-channels by centrally extending distributing ribs so that the sub-channels provide an increased capillary action for sealing compound deposited into the filling reservoirs.
    Type: Grant
    Filed: June 10, 1991
    Date of Patent: March 16, 1993
    Assignee: Siemens Aktiengesellschaft
    Inventors: Horst Hendel, Herbert Mitschik, Dietrich Schwarz
  • Patent number: 5187642
    Abstract: An integrated circuit board assembly includes two integrated circuit boards. The integrated circuit boards have an electronic circuitry configured on the interior face and a dielectric sealant on the other face. The integrated circuit boards are secured to a frame in such a manner that the interior faces of the integrated circuit boards face inward toward each other. The securing of the frame to the integrated circuit boards is such that it forms a sealed enclosure protecting the electronic circuitry configured therein from the process environment. The exterior faces, however, are exposed to the process environment and are helpful in dissipating heat to the exterior environment.
    Type: Grant
    Filed: August 20, 1991
    Date of Patent: February 16, 1993
    Assignee: The Foxboro Company
    Inventors: Ronald N. Garner, Robert D. Vernon
  • Patent number: 5170012
    Abstract: The present invention is a multi-function gasket adapted to support a plurality of components within a support unit having first and second support members. The multi-function gasket includes a frame portion adapted to be disposed between the first and second support members. The multi-function gasket also includes a support portion adapted to be disposed between first and second components to support the first component against the first support member and the second component against the second support member. The multi-function gasket further includes a web portion interconnecting the frame portion and the support portion to allow the frame portion and the support portion to rotate relative to each other, whereby either one of the first and second components may be removed and the support portion rotated to allow access to the other component.
    Type: Grant
    Filed: April 30, 1991
    Date of Patent: December 8, 1992
    Assignee: Freudenberg-NOK General Partnership
    Inventor: Karl Braconier
  • Patent number: 5155660
    Abstract: A semiconductor device is provided with a base plate on which a circuit board is disposed. A plurality of semiconductor elements such as diodes or transistors are supported on the circuit board and interconnected by circuit wiring. A container for the device includes side walls extending upwardly from the base plate and a top cover extending between the walls. An external terminal connection is provided by an internal terminal and an external terminal that are connected by a flexible wire within the container. The internal terminal has its lower end soldered to the circuit wiring at a predetermined location and its upper end disposed in a seat in the top cover. An upwardly extending slit within the seat receives the end of the internal terminal and a transverse window opens to the slit to receive a transverse protrusion from the upper terminal end. The external terminal extends through the cover with its lower end extending inwardly of the cover where the flexible wire is connected to it.
    Type: Grant
    Filed: September 17, 1991
    Date of Patent: October 13, 1992
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Toshifusa Yamada, Shin Soyano
  • Patent number: 5137767
    Abstract: A partially coated assembly structure and a method for making a ceramic lid for a hermetically sealed package for an EPROM circuit are disclosed. The assembly structure includes, in combination, a ceramic lid, a UV transparent lens, and two fixtures for supporting the lens in the lid. The two fixtures are coated with a non-lens wetting film in predetermined areas where contact is made between the fixtures and the lens, and between the fixtures and the lid. The UV transparent lens is hermetically sealed to the ceramic lid by firing the assembly structure. The assembly structure prevents the lens from attracting foreign particulate matter during firing, thereby leaving the surfaces of the lens clean. The method provides a ceramic lid having a UV transparent lens hermetically sealed thereto, which finds wide use in integrated circuit packages for high-density EPROM's because of the untainted surfaces of the lens.
    Type: Grant
    Filed: August 29, 1990
    Date of Patent: August 11, 1992
    Assignee: Kyocera America, Inc.
    Inventors: Nobuaki Miyauchi, Hiroshi Yonemasu, Bakji Cho, Chong-Il Park
  • Patent number: 5136463
    Abstract: Apparatus for housing outside plant equipment in order to protect the equipment from the possibly harmful effects of weather and an external environment comprises a universal enclosure encompassing the outside plant equipment and having an interior and an exterior. An opening is disposed on the universal enclosure of a size sufficient to afford access to a predetermined portion of the equipment. The predetermined portion of the equipment is mounted adjacent the opening and in the interior of the universal enclosure, and is mounted in a disposition about the opening so as to be accessible only from the exterior of the universal enclosure. In this manner, one desiring to access the equipment may do so only from the exterior of the universal enclosure and will not be required or permitted to enter the interior thereof.
    Type: Grant
    Filed: April 5, 1991
    Date of Patent: August 4, 1992
    Assignee: Reliance Comm/Tec Corporation
    Inventor: James W. Webster
  • Patent number: 5135108
    Abstract: The relay with water tight baseplate includes grooves in the region of the baseplate, through which (the grooves) the joining pins of the relay reach, and the inner space between the grooves and the joining pins is tightly filled with a casting mass. For this better distribution of the casting mass, the rabbet canals are arranged in the baseplate and the glue is positioned in the rabbet canals. The rabbets can hereby be formed as one-sided, open profile canals, or also as an enclosed canal system, which simply strikes the region around the grooves with casting mass (FIG. 1). The relay also includes connecting structure between the baseplate and the cap which utilizes rabbet/groove structure filled with casting mass.
    Type: Grant
    Filed: May 24, 1984
    Date of Patent: August 4, 1992
    Inventors: Wolfgang Nestlen, Gerd Schmitt
  • Patent number: 5130679
    Abstract: An ultrasonic delay line comprises a delay medium provided with transducers on at least a side surface thereof, an insulating substrate having a frame-like body in which a wiring pattern is print-formed and an opening having substantially the same shape as the outer configuration of the delay medium, the delay medium being fitted in the opening so that an electrode of the transducer is electrically connectable with the wiring pattern, and a packaging member covering at least a part of major surfaces of the insulating substrate and the delay medium so as to secure the two.
    Type: Grant
    Filed: February 11, 1991
    Date of Patent: July 14, 1992
    Assignee: Asahi Glass Company Ltd.
    Inventors: Haruto Hashimoto, Etsuji Kimura, Yutaka Igarashi
  • Patent number: 5107584
    Abstract: An electric unit with a plurality of electric circuit elements is manufactured to connect terminals of the electric circuit elements directly using flexible conductors and the entire electric unit is covered by a deformable and contractile tube. Entrance and exit of conductors for connecting the electric unit and an external electric circuit are sealed with waterproof synthetic resin in a watertight manner. At least a portion of the electric circuit unit is capable of being bent. The electric unit can be applied to electric appliances having various shapes and further be easily mounted in a space, for example, such as a corner of the electric appliance even if the available space is curved.
    Type: Grant
    Filed: October 9, 1990
    Date of Patent: April 28, 1992
    Assignee: Danfoss A/S
    Inventor: Hideaki Takeda
  • Patent number: 5081327
    Abstract: A sealable hermetic microchip package includes a vent therein that permits gas to escape during the sealing operation, but then itself is sealed at the completion of the sealing operation to render the package hermetic. The venting of gas from the interior of the package avoids the buildup of internal pressure during the sealing operation that can introduce bubbles and other faults into the sealing material. The vent may be a channel in the sealing surface of the lid of the package that is initially open, and then fills with the seal material as it flows to effect the seal. The vent may also be a hole in the lid that is sealed by the flow of a bead of the seal material. An equivalent approach to venting provided that the lid be mounted on standoffs that flow during sealing to permit the lid to settle onto the base of the package.
    Type: Grant
    Filed: March 28, 1990
    Date of Patent: January 14, 1992
    Assignee: Cabot Corporation
    Inventors: Dana R. Graham, Kenneth L. Jones, II
  • Patent number: 5077536
    Abstract: A device for the protection of electric power resistances assembled in a battery using rods, insulating guns and isolators all housed within a dust tight and water jet tight parallelepipedic metallic housing, containing only air for cooling the resistances; fixing screws are provided for assembling and holding the various panels together and seals with a cut-out are provided in all assembly areas between the panels so that electrical continuity between two adjacent parts of the panels is achieved through despite any possible loosening; a compression element is interleaved between two adjacent parts of the panels to be assembled, at right angles to passages for the fixing screws, and the compression element is interleaved between the two adjacent parts for producing on opposite faces of the parts a force greater than the rigidity of the parts and housed in the thickness of the cut-out in the seals providing for contact tightness of the parts of the panels without limiting efficiency.
    Type: Grant
    Filed: June 18, 1990
    Date of Patent: December 31, 1991
    Assignee: Le Metal Deploye
    Inventors: Bernard Fichot, Jean-Pierre Perrichon, Bernard Joubert
  • Patent number: 5064967
    Abstract: A strain relief device for an electrical cable disposed in a cable lead-through system for a housing containing an electrical component. The housing includes a cup-shaped housing portion and a closure portion. The strain relief includes two opposingly moving elements for clamping the cable. The two elements of the strain relief are braced against an inside wall of the cup-shaped housing portion. The closure portion is formed by one of the two elements of the strain relief.
    Type: Grant
    Filed: May 26, 1989
    Date of Patent: November 12, 1991
    Assignee: WABCO Westinghouse Fahrzeugbremsen GmbH
    Inventor: Gunther Singbartl
  • Patent number: 5053634
    Abstract: A waterproofing device for an outboard engine control circuit having a hydraulic pump for lifting and lowering a propeller from and into the water, a motor for driving the hydraulic pump, and a control circuit for controlling the motor, comprising waterproof relays in which terminal strips are provided by insert molding on the casing of a relay for controlling the motor, leads of the relay are inserted into the slots of the terminal strips to electrically connect the leads to the terminal strips, and a waterproof circuit breaker having a waterproof cover provided thereon; a snap-up cap provided on top of the waterproof cover, being normally recessed, and when the circuit breaker is opened, snapped up by the action of the actuator of the breaker.
    Type: Grant
    Filed: May 31, 1989
    Date of Patent: October 1, 1991
    Assignee: Sawafuji Electric Co., Ltd.
    Inventor: Seiichi Kakinuma
  • Patent number: 5051540
    Abstract: A component housing for an electromechanical component as an aeration opening provided with an insulating shaft formed by an insulating wall extending from the housing wall. The insulating shaft is open to the interior of the housing at an end lying opposite the aeration opening to form an insulating path between voltage carrying parts within the housing and neighboring metallic parts outside of the housing after the aeration opening is opened.
    Type: Grant
    Filed: April 11, 1990
    Date of Patent: September 24, 1991
    Assignee: Siemens Aktiengesellschaft
    Inventor: Harry Schroeder
  • Patent number: 5034568
    Abstract: A package for enclosing and mounting a multichip module in which separate mechanisms are provided for mechanically attaching the package to a circuit board and for electrically connecting the package to the circuit board to which it is attached. The package includes a ceramic base on which the multichip module is supported, a frame-like retaining ring which enables the attachment of the package to the circuit board and a lid for covering the top of the package and sealing it off from environmental influences. The package also includes a set of electrical leads extending from the interior to the exterior of the package for providing multiple separate connections between the multichip module and the circuit board on which it is mounted.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: July 23, 1991
    Assignee: Rockwell International Corporation
    Inventor: John C. Mather
  • Patent number: 5032692
    Abstract: This invention relates to a hermetically sealed electronic component package and method for making the package. In one embodiment of the invention, the electronic component is mechanically and electrically attached to the package by heating rings of brazing material. In another embodiment of the invention, an insulative, inorganic preform is heated to mechanically attach the electronic circuit within the package housing. The package is then hermetically sealed by mounting a preform within an electronic component package and heating the combination to a second predetermined high temperature to cause the preform to flow.
    Type: Grant
    Filed: May 9, 1989
    Date of Patent: July 16, 1991
    Assignee: AVX Corporation
    Inventor: Norman E. DeVolder
  • Patent number: 5019829
    Abstract: A TO-style plug-in package for MMICs and associated antenna structure is comprised of a microwave circuit component carrier having a generally cylindrically shaped conductive header upon which one or more MMICs are supported. An aperture through the header contains a conductor pin supported within a glass seal interface, so as to form a hermetically sealed matched impedance transmission line through the package. The conductor pin is connected to a bonding pad of a microwave circuit component on the header. A generally cylindrical conductive cover engages the header and encloses a cavity within which the microwave circuit components are supported. A microstrip antenna is supported on a dielectric layer overlying an outer surface of the conductive cover and is connected to a further conductor pin that extends through a glass-sealed aperture in the cover and forms a matched impedance transmission line from the antenna to the header.
    Type: Grant
    Filed: February 8, 1989
    Date of Patent: May 28, 1991
    Inventors: Douglas E. Heckman, Dawn A. Larson, Jeffrey A. Frisco, David A. Haskins
  • Patent number: 5020149
    Abstract: An integrated down converter and interdigital filter apparatus having a down converter and a number of interdigital filters mounted on the same printed circuit board and installed in the watertight housing. The housing of each interdigital filter is cut from sheet metal, with a conductive surface on the printed circuit board as one side. A method for construction of the interdigital filter is also set forth.
    Type: Grant
    Filed: October 24, 1988
    Date of Patent: May 28, 1991
    Assignee: Conifer Corporation
    Inventor: Dale L. Hemmie
  • Patent number: 5015979
    Abstract: An electromagnetic relay where a movable stand is retained by a pair of opposing leaf springs, the movable stand is operated in the opposing direction of the leaf spring in accordance with the energization, deenergization of the electromagnet, the movable terminal is disengageably brought into contact against the fixing terminal supported through the support stand, and the movable stand is provided with a through hole in the vertical direction to be press-fitted, mounted in it, a groove in the vertical direction in the contact portion of the movable stand and the leaf spring, and a passage for guiding into the groove portion the bonding agent to be put into the through hole.
    Type: Grant
    Filed: December 11, 1989
    Date of Patent: May 14, 1991
    Assignee: Omron Tateisi Electronics Co.
    Inventors: Yoichi Nakanishi, Junichi Kanetani, Muneo Nakata
  • Patent number: 5008956
    Abstract: An integrated local oscillator interdigital filter apparatus in a down converter is mounted on the same printed circuit board. The housing of the interdigital filter is cut from sheet metal, with a conductive surface on the printed circuit board as one side. A method for construction of the interdigital filter is also set forth.
    Type: Grant
    Filed: May 23, 1989
    Date of Patent: April 16, 1991
    Assignee: Conifer Corporation
    Inventor: Dale L. Hemmie
  • Patent number: 5001451
    Abstract: A sub-miniature fuse for electrical protection includes an assembly of an outer tube and an inner tube made of insulating material. The inner tube has electrodes and a fusible metal link sputtered onto its outer surface. The assembly of inner and outer tubes is terminated electrically at its ends with axial leads, or with surface mounting pads, or with radial leads.
    Type: Grant
    Filed: March 9, 1990
    Date of Patent: March 19, 1991
    Inventors: Vaughan Morrill, Jr., John H. Scandrett, David K. Hudson
  • Patent number: 4997392
    Abstract: A connector frame and a resilient pad positioned against the frame, both having an equal number of coaxial openings therethrough. A pin positioned in each opening of the pad and extending through the pad and frame with a collar abutting the pad. A back-up plate having the same number of coaxially positioned openings therethrough and abutting the opposite sides of the collars of the pins so that the pad is compressed to make the connector waterproof and reduce tolerance stack-ups.
    Type: Grant
    Filed: November 6, 1989
    Date of Patent: March 5, 1991
    Assignee: Motorola, Inc.
    Inventor: Chee A. Lee
  • Patent number: 4966559
    Abstract: A terminal block assembly for connection to the interior side of an electrical hermetic terminal of a hermetic compressor is disclosed. The hermetic terminal comprises a cup-shaped metallic body member having a plurality of conductor pins which extend through spaced apertures in the body member and are hermetically secured thereto by means of a glass insulating material. A cylindrical open end of the cup-shaped body member is exposed to the interior of the housing. The terminal block assembly comprises a main body member and a lid member. The main body member includes a cylindrical side wall portion that fits snugly within the open end of the terminal body member. The conductor pins extend through apertures in a round bottom wall of the main body member into partitioned channels in which the conductor pins are electrically connected to respective wire conductors. The lid member interlocks with the main body member to cover the partitioned channels.
    Type: Grant
    Filed: October 12, 1989
    Date of Patent: October 30, 1990
    Assignee: Tecumseh Products Company
    Inventor: Ronald R. Wisner
  • Patent number: 4953002
    Abstract: A housing for integrated circuit structures containing magnetic thin film which has permeable protective layers parallel thereto.
    Type: Grant
    Filed: September 5, 1989
    Date of Patent: August 28, 1990
    Assignee: Honeywell Inc.
    Inventors: Keith W. Nelson, James E. Lenz, Takeshi Kawai
  • Patent number: 4951011
    Abstract: A TO can-style plug-in package employs a pin/glass interface. In a first embodiment the pin/glass seal interface has a center pin of reduced diameter embedded in a smaller outer diameter, lower dielectric constant glass than a conventional TO-can. The glass is surrounded by a metal ferrule. The metallic header through which the pin/glass interfaces extend is provided with a ridge adjacent to the end of a respective pin. This increase in thickness of the header surrounding each glass-embedded center pin provides a prescribed capacitive reactance component for compensating the inductive reactance of the interiorly extending segment of the center pin and any connecting lead through which the microwave integrated component is coupled to the pin. In a second embodiment, the thickness of insulator glass that surrounds the center conductor is less than the thickness of the header.
    Type: Grant
    Filed: July 24, 1986
    Date of Patent: August 21, 1990
    Assignee: Harris Corporation
    Inventors: Douglas E. Heckaman, Dawn A. Larson, Jeffrey A. Frisco, David A. Haskins