Abstract: A method is disclosed for easy and inexpensive fabrication of fold-up frames having diverse geometric configurations for flat packs (metal packages) for housing discrete and integrated circuit chips. The method includes a first step of cutting a piece of flat metallic stock to predetermined length and width consistent with the number of fold-up frames and the perimeter required for the specific fold-up frame configuration to be fabricated, respectively. The flat stock is then milled to form a plurality of grooves of predetermined angle lengthwise in at least one major surface thereof to define the number of sidewall members in the final configuration of the fold-up frame. The milled flat stock may then be sliced to form a plurality of individual milled frames each having the predetermined height required by the specific configuration fold-up frame. Apertures are formed in the milled frame by punching or piercing all sidewall members simultaneously in a single operation.

Abstract: A TO can-style plug-in package employs a pin/glass interface. In a first embodiment the pin/glass seal interface has a center pin of reduced diameter embedded in a smaller outer diameter, lower dielectric constant glass than a conventional TO-can. The glass is surrounded by a metal ferrule. The metallic header through which the pin/glass interfaces extend is provided with a ridge adjacent to the end of a respective pin. This increase in thickness of the header surrounding each glass-embedded center pin provides a prescribed capacitive reactance component for compensating the inductive reactance of the interiorly extending segment of the center pin and any connecting lead through which the microwave integrated component is coupled to the pin. In a second embodiment, the thickness of insulator glass that surrounds the center conductor is less than the thickness of the header.

Abstract: A hermetically tight glass-metal housing for semiconductor components and a method for producing the housing includes a base support for a semiconductor component in the form of a conducting strip having an upper portion and being suitable for functioning as a lead frame. A mounting pedestal is disposed at the upper portion of the conducting strip. Electrical contacts are disposed at the upper portion of the conducting strip for electrical connections with the semiconductor component. A metal ring is hermetically tightly sealed to the upper portion of the conducting strip. A metal cap surrounds the semiconductor component and the metal ring forms a connecting element for a tight weld with the metal cap.

Abstract: A package is provided for a pair of microwave semiconductor devices, such package comprising upper and lower mating covers, each one of such covers having bonded thereto a corresponding one of the pair of microwave semiconductor devices. With such arrangement, after the devices are bonded to the cover to form a component of the package, the effective impedance of the thus formed component is electrically characterized, or measured. Having characterized a large quantity of such components, the components are then sorted into bins with components having substantially matched characteristics being placed in a common one of the bins. Pairs of such components in a common bin are used as the upper and lower cover for the package. Thus, assembly time is significantly reduced since additional matching compensation techniques are not required.

Abstract: A hermetically sealed housing for a solid state device or the like includes a metal header having a mounting surface and a metal cap mounted on the header and over the mounting surface. The cap includes a cup-shaped portion and a flange extending radially outwardly from the rim of the cup-shaped portion. A weld ring projects from a surface of the flange toward the header mounting surface and is welded to the mounting surface. A second ring projects from the surface of the flange and is spaced radially inwardly from the weld ring. The second ring is shorter than the weld ring so that it preferably just contacts the mounting surface of the header. The second ring captures any metal particles splashed from the weld ring during the welding of the cap to the header and thereby minimizes particle induced noise.

Abstract: A novel plastic molded chip carrier package for an integrated circuit chip has a carrier member molded of a plastic material to which are integrally embedded a plurality of I/O pins and a conductor member for interconnection between the terminals of the chip and the corresponding I/O pins to provide a unitary construction obtained at a single molding process. This plastic molded chip carrier package is preferred to have integral positioning studs which project in the same direction of the I/O pins for abutment against a printed circuit board for mounting the package in a spaced relation thereto with the I/O pins plugged into metallized through holes provided in the board.

Abstract: The invention is a semiconductor device assembly and method of making the same. A mounting plate has positioning means for positioning the plate relative to a header, a first mounting surface of the plate is attached to the header and a semiconductor device is attached to a second mounting surface of the mounting plate. The assembly is made by forming the mounting plate, positioning the mounting plate relative to the header by the positioning means, attaching the first mounting surface to the header and the semiconductor device to the second mounting surface. Another method of making the assembly is by defining and etching a mounting plate and attaching the first mounting surface to the header and the semiconductor device to the second mounting surface. This assembly and process provides an efficient means for mounting semiconductor devices and in particular electro-optic devices such as lasers.

Abstract: A lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area for the chip encircled by the segments.

Abstract: A process for making hermetic, low cost pin grid array (PGA) semiconductor die packages. The process involves die bonding a semiconductor die or integrated circuit chip to a substrate having an interconnect or metallization pattern thereon. The die is electrically connected to the pattern and then the die and the inner bonds are hermetically sealed inside a cap that is smaller than the substrate so that the ends of the metallization pattern are exposed. The leads are then electrically connected, such as by solder or other technique to the exposed ends of the pattern.

Abstract: A power semiconductor module includes a plastic housing having an interior. A substrate in the form of a ceramic plate with upper and lower surfaces is inserted in the housing as a housing bottom. Metallizations are disposed on the upper and lower surfaces of the ceramic plate. The metallization on the upper surface of the ceramic plate faces the interior of the housing and is structured to form conductor paths. Power semiconductor components, connecting elements and terminal elements for external termimals all are disposed on the upper surface of the ceramic plate. A frame is connected to the substrate in the interior of the housing for sealing against moisture.

Abstract: A rotary switch includes an open ended housing and a stator closing the open end of the housing. There is a seal member positioned between the stator and housing. The stator is formed of plastic and has a plurality of metallic terminals extending outwardly therefrom. There is an anerobic seal filling gaps between the stator and terminals caused by material shrinkage during setting of the plastic stator.

Abstract: A pressure contact semiconductor device has a semiconductor substrate disposed on a metal post electrode through metal electrode plate, an insulating ring engaged with the periphery of the metal post electrode extends to the periphery of the metal electrode plate and is brought into contact therewith at a certain height with a sufficient contact pressure. The semiconductor substrate is positioned precisely with respect to the metal post electrode so that a gate electrode ring is precisely positioned on a gate electrode film formed on the upper surface of the semiconductor substrate.

Abstract: This invention relates to an ultra high speed semiconductor integrated circuit device, and in particular to a layout and connecting structure between lead terminals of a package and signal pads on a chip. The device includes a wiring board, positioned above the chip, which comprises an internal transmission line having a predetermined characteristic impedance on a dielectric insulating plate. The internal transmission line forms a strip line or coplanar transmission line including a signal line an ground conductor film. The wiring board internconnects the outer lead and bonding pads on the chip. The wiring between the internal transmission lines can cross by using a multi-layered structure. As the result of the structure of the present invention, transmission loss is reduced, and it is possible to design the wiring board having an optimum performance for ultra high speed operation of the high density integrated circuit device.

Abstract: A relay is sealed with a sealing compound when the relay housing is in a closed state, thus causing an air cushion to be formed in the inside, with an afterflow of sealing compound into the interior being prevented. Following gelling or curing of the sealing compound, a vent hole is pierced into the relay housing which, if required, may be closed following degassing of the interior space of the relay.

Abstract: An improved telephone protector module construction for use with individual subscriber circuits in which the inner end wall having contact means thereon is recessed to accommodate a sealing gasket which surrounds the contact and ground pins, and provides a resilient seal against the corresponding surfaces of the engaged protector block to prevent accumulation of dirt, dust and vermin when installation is made in only partially shielded outdoor locations. The seal is formed from closed cell synthetic resinous sponge rubber so as to be non-absorbtive of ambient moisture while effectively closing the gap normally existing between the inner wall surface of the module and the corresponding surface of the block.

Abstract: A thermoswitch in which two fixed terminals are provided to a base disposed in a bottomed housing and a movable contact mechanism is provided between the two fixed terminals so that the movable contact is connected or disconnected by the displacement of a thermosensitive member such as bimetal, wherein the basal portions of the fixed terminals projecting from the base after solidifed with a first resin and a recess formed by the housing and base is filled and solidified with a second resin such that lead wires connected to the fixed terminals are embedded in the resin. According to this device, penetration of water coming down along the lead wires is positively prevented by the two resin layers.

Abstract: In a relay according to this invention the terminal elements (17) are injection-molded into wall members (2,3) which are so designed that they during assembly, and if so required, together with parts of the flange (35) of the coil (16) of the electromagnetic driving system, form a cup-shaped member having a bottom part (4). The rim portion (9) of the cover member (1) which is capable of being placed thereon, projects over the bottom part (4). The thus resulting space may be filled with a sealing compound (casting resin) (13). From this there results a tight relay consisting of a few individual parts only, which is easy to manufacture and which, moreover, is solder- and wash-tight.

Abstract: An rf module is provided with an integral coaxial connector lead-in and alignment structure about the lead-in. The rf module is readily coupled to mating rf modules or components in modular integrated rf circuit packages. The rf module includes structure for clamping the coupled modules to a flat surface which may be a printed wiring board substrate.

Abstract: A miniature sealed toggle switch having a housing (2,4) that is sealed by a gasket (16) sealed to the toggle lever by a groove (12b) and RTV (18) and to the housing by a ridge (16d) and a tapered edge (2e) on the base, and by two grooves (6d, 6e, FIG. 3) on the terminals that prevent leaks under different expansion of the metal terminals (6) and the molded base (2a, 2b, FIG. 3). Contactor erosion is reduced by a drop (26d) on the contactor causing arc movement on opening. Grooves (2g, 2h) and arc shields (2f) in the base prevent formation of conductive paths. A stepped taper (12d) on the toggle lever and a tapered hole (28a) reduce wear. Nickel plating of the brass lever (12) and aluminum bushing (4a) insure ground of the lever. The contactor configuration (32c, 32d, FIG. 5), clearance between the toggle lever and actuator, and energy storage in conical spring (30) provide non-stall, non-tease operation. The radius of the actuator tips (28c) are maintained by the radius (32a, 32b, FIG.

Abstract: A rolled metallized film capacitor is encased between a pair of box halves (13 and 13') each having a pair of dovetailed slots (36 and 37) formed in opposed walls so that when the box halves are assembled about a capacitor blank (10) the slots in the respective box halves are aligned with each other. The box halves are mounted in abutting relation about a pair of parallel wires (11 and 12), and then heat fusible metal (46 and 47) is deposited in the aligned slots to lock the box halves together while bonding the wires (11 and 12) to opposite ends of the capacitor blank (10). When assembled, the boxed capacitor with the laterally extending leads may be readily machine inserted or otherwise assembled in a circuit module, such as a printed circuit board.

Abstract: The apertures in one wall of an electrical component housing through which electrical terminals protrude are sealed with resin. The resin is applied to the housing wall at a remote area and caused to flow by capillary action along grooves to the required locations for sealing the apertures. In the case of a two part housing the parts of which join at the perimeter of the wall having the protruding terminals, the resin may also be caused to flow by capillary action into this join to seal it.

Abstract: A metal cover has a hole into which an insulating resilient T.F.E. bushing is force fitted. A metal terminal is pushed into the hole in the bushing. These three parts are essentially coaxial and form a cover-terminal assembly that is subsequently placed between and compressed by a pair of coining dies to deform the cover metal adjacent to the periphery of the cover hole. This coining step forces metal tightly against and into the resilient bushing subsequently compressing the bushing about the terminal. This terminal-cover assembly is particularly suitable for closing the housing of a hermetically sealed electrolytic capacitor. It is inert to chemically active electrolytes and withstands high internal pressures that are often associated with such capacitors.