Recess With Mating Projection Patents (Class 174/563)
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Publication number: 20150101862Abstract: An electrical connection box assembled by a lock structure has a first case, a second case, a plurality of lock pieces, an engagement protrusion, a plurality of lock recesses, and an engagement part. The plurality of lock pieces are provided to a peripheral wall of the first case and are elastically deformable toward an inner side of the first case. The engagement protrusion is provided to an outer surface of each lock piece. The plurality of lock recesses are provided to a peripheral wall of the second case. The engagement part is provided bridging each lock recess, the lock pieces being disposed between the lock recesses and the engagement parts, the engagement protrusions engaging the engagement parts to assemble the first and second cases, engagement between the engagement protrusions and the engagement parts being released by deformation of the lock pieces inside the lock recesses.Type: ApplicationFiled: October 2, 2014Publication date: April 16, 2015Inventor: Takashi SHIRAKI
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Patent number: 8981240Abstract: A case body portion accommodates an electronic circuit board. The case body portion has a rib projected from at least a part of a periphery of the opening. A lid has a flange, which is in contact with an outer periphery of the rib, when the lid is mounted on the case body portion to cover the opening. The rib has a raised portion raised outward from a part of an outer periphery of the rib.Type: GrantFiled: January 16, 2013Date of Patent: March 17, 2015Assignee: Denso CorporationInventors: Hiroki Chitaka, Mitsuteru Suzaki
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Patent number: 8975540Abstract: Electronic devices with support frames and mechanically-bonded plastic and methods for forming such electronic devices are provided. A representative electronic device includes: a housing that incorporates: a metal chassis having a base and a sidewall extending outwardly therefrom to define an interior, the chassis having an opening extending there through; a plastic part mechanically bonded to the metal of the chassis, the plastic part spanning the opening; and a support frame mounted at least partially within the housing such that the support frame increases rigidity of the housing.Type: GrantFiled: December 19, 2011Date of Patent: March 10, 2015Assignee: HTC CorporationInventors: Jason Donald Mareno, Bart Peter Reier
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Patent number: 8933349Abstract: An electrical apparatus includes a first half case and a second half case. An end surface at an edge of the first half case and an end surface of the second half case are welded to each other. The first half case has an engaged portion inside thereof. The second half case has, inside thereof, an engaging portion which engages with the engaged portion so as to restrain relative movement of the first half case and the second half case in a direction in which the first half case and the second half case are separated. With this structure, strength of combination of the two half cases can be improved.Type: GrantFiled: June 1, 2012Date of Patent: January 13, 2015Assignees: Sony Corporation, Sony Computer Entertainment Inc.Inventors: Kei Takahashi, Hirohisa Kubota, Tamotsu Tetsuchikawara
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Patent number: 8929084Abstract: A compact radio core engine (CE) module uniquely small in size and power consumption, in which only two circuit boards provide all the modem and transceiver functions needed for modern military radios. A modem circuit board has modem devices and a first connector mounted on the board, and a radio frequency (RF) circuit board has RF devices and a second connector mounted on the board. A module frame has an interior wall, and a side wall about the periphery of the interior wall. The modem and the RF circuit boards are positioned on opposite sides of the interior wall, and the connectors on the two boards mate with one another through an opening in the interior wall to exchange operating data and signals between the devices on the boards. The modem circuit board is seated entirely within a recess formed by the interior and the side walls of the frame.Type: GrantFiled: May 8, 2012Date of Patent: January 6, 2015Assignee: BAE Systems Information and Electronic Systems Integration Inc.Inventors: Michael S. Vogas, Boris Radovcic, Todd R. DeLuck, George M. Horihan, Minh Le, Kenneth E. Kolodziej
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Patent number: 8881923Abstract: A container and a lid are connected together in a sealing arrangement. Opposed sides of the lid and container are connected together by side catches. Opposed ends of the container are connected together by end catches different from the side catches. Use of either of the catches effects the seal around the periphery of the container.Type: GrantFiled: October 29, 2009Date of Patent: November 11, 2014Inventor: Mark Christopher Higginson
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Patent number: 8867222Abstract: An electric control device includes: an accommodation element (10) having an opening and a bottom; a cover element (20) for covering the opening of the accommodation element (10) so that accommodation space (15) is formed between the cover element (20) and the accommodation element (10); a hook (11) integrated with the accommodation element (10) for swaging the cover element (20); and a control element (30) formed in the accommodation space (15), wherein an electric element (32-35) is arranged on a substrate (31) so that the control element (30) is prepared. The substrate (31) includes a notch concavity (311) on a periphery of the substrate (31) so as to face the hook (11).Type: GrantFiled: September 27, 2010Date of Patent: October 21, 2014Assignee: Denso CorporationInventor: Shinsuke Oota
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Patent number: 8830687Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.Type: GrantFiled: May 24, 2012Date of Patent: September 9, 2014Assignee: Delphi Technologies, Inc.Inventors: Chris R. Snider, Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Jeffrey T. Bell, Robert L. Vadas, Allen E. Oberlin
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Patent number: 8749974Abstract: An electronic device enclosure includes a chassis and an operating member. The chassis includes a front plate and a top plate connected to the front plate. A clipping hole is defined in the front plate. The operating member includes a positioning portion and a securing piece. The positioning portion is received so it can be slid in the clipping hole, and the securing piece is attached to the front plate.Type: GrantFiled: June 2, 2011Date of Patent: June 10, 2014Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Xiao-Run Chen, Zhi-Ping Wu, Chih-Hang Chao
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Patent number: 8737045Abstract: An electronic device housing includes a bottom housing, a support frame, and a plastic side frame. The support frame is fixed on the bottom housing to form a receiving groove between the bottom housing and the plastic side frame. The plastic side frame is integrally formed by injecting a plastic material in the receiving groove. A manufacturing method for an electronic device housing is also provided.Type: GrantFiled: December 11, 2010Date of Patent: May 27, 2014Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Bin Dai, Fa-Guang Shi
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Patent number: 8692134Abstract: An electrical connection includes a first wire bonded to adjacent bond pads proximate to an edge of a die and a second wire having one end bonded to a die bond pad distal to the die edge and a second end bonded to a lead finger of a lead frame or a connection pad of a substrate. The second wire crosses and is supported by the first wire. The first wire acts as a brace that prevents the second wire from touching the edge of the die. The first wire also prevents the second wire from excessive lateral movement during encapsulation.Type: GrantFiled: August 16, 2011Date of Patent: April 8, 2014Assignee: Freescale Semiconductor, Inc.Inventors: Jie Yang, Qingchun He, Hanmin Zhang
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Patent number: 8680407Abstract: A modular enclosure assembly comprising: an upper and lower enclosure subassemblies, interconnected by a partial interpenetration, and a pair of hinged panel subassemblies for opening/closing the inner space of the enclosure subassemblies. Each of the enclosure subassemblies incorporates a back base plate having a first interpenetrating zone, located at an end of a lower left side of the back base plate, and a second interpenetrating zone, located at an end of a lower right side of the back base plate and juxtaposed with the first interpenetrating zone. The second interpenetrating zone incorporates a slat partially superposed on a rear surface of the back base plate where and with which this second interpenetrating zone forms a monoblock structure and from which the slat extends downwardly, beyond the rear surface of the back base plate.Type: GrantFiled: October 4, 2012Date of Patent: March 25, 2014Assignee: VPL Enterprises Ltd.Inventor: James Chun-Nam Chan
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Patent number: 8625293Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.Type: GrantFiled: August 12, 2011Date of Patent: January 7, 2014Assignee: Delphi Technologies, Inc.Inventors: Chris R. Snider, Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Jeffrey T. Bell, Robert L. Vadas, Donald G. Moeschberger, Allen E. Oberlin, John Michael Matly, Kip R. Piel, Jerry J. Wendling
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Patent number: 8592693Abstract: An electronic device housing includes a first housing, a second housing, a plurality of frames, and a plurality of fixing members. The first housing includes a bottom plate and a side plate extending from an edge of the bottom plate. The side plate is welded to the second housing. The frames are welded to the first housing. The fixing members fix the second housing to the frames.Type: GrantFiled: December 13, 2010Date of Patent: November 26, 2013Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Bin Dai
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Patent number: 8530760Abstract: An electronic device may include electronic circuitry and a housing carrying the electronic circuitry. The housing may include first and second metallic housing members having opposing first and second mating surfaces respectively defining a projection and a corresponding recess. The projection may be spaced inwardly from a perimeter of the first housing member, and the recess may be spaced inwardly from a perimeter of the second housing member. The electronic device may further include a gasket between the opposing first and second mating surfaces and extending outwardly to perimeters of the first and second mating surfaces. The gasket may include indium.Type: GrantFiled: January 9, 2012Date of Patent: September 10, 2013Assignees: SRI Hermetics, Inc., H-Tech, LLCInventor: Edward Allen Taylor
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Patent number: 8523396Abstract: A device housing includes first and second cases, a first magnetically sensitive positioning pin, and a first compressible member. The first case has a first protruding block having a first positioning hole. The second case has a first groove having a second positioning hole. When the first protruding block is disposed in the first groove, the first positioning hole is aligned with the second positioning hole. The first magnetically sensitive positioning pin runs through the first and second positioning holes to position the second case on the first case. The first compressible member is disposed in the first positioning hole and between an inner wall of the first positioning hole and the first magnetically sensitive positioning pin. When a first magnetic force acts on the first magnetically sensitive positioning pin, the first magnetically sensitive positioning pin compresses the first compressible member and moves away from the second positioning hole.Type: GrantFiled: August 18, 2011Date of Patent: September 3, 2013Assignee: Coretronic CorporationInventor: Chia-Chi Chung
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Patent number: 8487428Abstract: A semiconductor assembly is provided that includes a substrate. A first set of non-conductive hedges is disposed on and protrudes from a first surface of the substrate. A chip is coupled to and spaced apart from the substrate. The chip has a second surface facing the first surface of the substrate. A second set of non-conductive hedges is disposed on and protrudes from the second surface of the chip. The first set of hedges is configured and positioned to engage the second set of hedges to restrict movement of the substrate with respect to the chip. The second set of hedges is configured and positioned to engage the first set of hedges to restrict movement of the chip with respect to the substrate.Type: GrantFiled: November 20, 2007Date of Patent: July 16, 2013Assignee: Fujitsu LimitedInventor: Michael G. Lee
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Publication number: 20130175084Abstract: An electronic device may include electronic circuitry and a housing carrying the electronic circuitry. The housing may include first and second metallic housing members having opposing first and second mating surfaces respectively defining a projection and a corresponding recess. The projection may be spaced inwardly from a perimeter of the first housing member, and the recess may be spaced inwardly from a perimeter of the second housing member. The electronic device may further include a gasket between the opposing first and second mating surfaces and extending outwardly to perimeters of the first and second mating surfaces. The gasket may include indium.Type: ApplicationFiled: January 9, 2012Publication date: July 11, 2013Applicants: SRI Hermetics Inc., H-Tech, LLCInventor: Edward Allen Taylor
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Patent number: 8466377Abstract: An electronic device housing includes a first housing, a second housing, and a plurality of frames. The first housing comprises a bottom plate and a side plate extending from an edge of the bottom plate. The side plate of the first housing is welded to the second housing. The frames are fixed to the first housing. Each frame forms a restricting portion connecting the second housing.Type: GrantFiled: December 11, 2010Date of Patent: June 18, 2013Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Bin Dai
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Publication number: 20130140080Abstract: Electrical enclosure assemblies, electrical service enclosures, and methods of assembling an electrical enclosure assembly are presented herein. An electrical enclosure assembly for housing electrical components of an electrical distribution system is disclosed. The enclosure assembly includes a plurality of sidewalls interconnected to define therebetween a mounting space within which are mounted the electrical components, and define at one end thereof an open endface. An endwall guide extends from one or more of the sidewalls into the mounting space. The endwall guide includes a plurality of elongated slots, a plurality of projections, or both. The enclosure assembly also includes an endwall configured to at least partially close off the open endface. The endwall includes a plurality of elongated slots, a plurality of projections, or both. Each of the projections is configured to fit into and secure with a respective elongated slot to thereby removably mount the endwall to the sidewalls.Type: ApplicationFiled: December 6, 2011Publication date: June 6, 2013Applicant: Schneider Electric USA, Inc.Inventors: Luis Garcia Davila, Ivan Diaz Chavez
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Patent number: 8456817Abstract: A housing includes a bottom housing and a top housing. The bottom housing includes a connecting surface. The top housing includes a bottom surface. The connecting surface is fixed to the bottom surface by welding. A receiving groove is defined in the bottom surface, for receiving the molten slag generated and collected during a welding process.Type: GrantFiled: June 13, 2011Date of Patent: June 4, 2013Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Zi-Ming Tang, Jing-Hui You, Fa-Guang Shi
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Patent number: 8437119Abstract: To provide an electrical junction box that can maintain a stable assembly condition between a box main body and a cover member, even if locking mechanisms are not provided on a whole periphery of the electrical junction box. An electrical junction box includes a box main body and a cover member. One of the box main body and the cover member is provided on at least a single of side portions of the one peripheral wall with a locking mechanism. An elastic rib that protrudes from an inner peripheral surface of the one peripheral wall at one of the side portions is pressed onto a fitting projection piece. A side portion is provided with a support wall that is opposed to and spaced apart from the inner peripheral surface. The fitting projection piece is held in a space between the inner peripheral surface and the support wall.Type: GrantFiled: April 12, 2011Date of Patent: May 7, 2013Assignee: Sumitomo Wiring Systems, Ltd.Inventor: Masahiro Tagano
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Patent number: 8431835Abstract: A method for making a packaging device for an electronic element includes: preparing a ceramic frame body defined with a hollow space for receiving the electronic element therein; preparing a ceramic substrate having a copper layer formed thereon; etching the copper layer to form a predetermined copper pattern on an upper surface of the ceramic substrate; placing the ceramic frame body onto the upper surface of the ceramic substrate and in contact with the copper pattern; and heating the ceramic frame body and the ceramic substrate such that the copper pattern bonds the ceramic frame body to the ceramic substrate. A packaging device for an electronic element is also disclosed.Type: GrantFiled: March 9, 2010Date of Patent: April 30, 2013Assignee: High Conduction Scientific Co. Ltd.Inventors: Wen-Chung Chiang, Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu
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Patent number: 8431837Abstract: A waterproof jacket assembly applied in a communication device is disclosed. The communication device includes an enclosure defining a first through hole for a transmission wire passing through. The waterproof jacket assembly is mounted on the enclosure corresponding to the first through hole, and includes a sleeve, an elastic waterproof element and a cover board. The sleeve defines a receiving cavity in communication with the first through hole. The elastic waterproof element is received in the receiving cavity and helically wrapped around the transmission wire. The transmission wire passes through the cover board and the cover board engages with the sleeve to drive the elastic waterproof element to fill in the receiving cavity.Type: GrantFiled: November 29, 2010Date of Patent: April 30, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chung-Jun Chu
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Publication number: 20130098678Abstract: An operating room cable for electrically coupling a lead to a trial stimulator includes a trial stimulator connector electrically coupleable with the trial stimulator and a lead connector for receiving the lead. The lead connector includes a housing. A first lead aperture is defined in a second end of the housing in proximity to a first side of the housing. A first inner passage extends along an interior of the housing from the first lead aperture to the second end of the housing. A first stylet slit is defined along the first side of the housing and extends from a first end of the housing to the second end of the housing. The first stylet slit is formed between upper and lower casings of the housing. The first stylet slit is continuous with the first lead aperture and the first inner passage.Type: ApplicationFiled: October 19, 2012Publication date: April 25, 2013Applicant: BOSTON SCIENTIFIC NEUROMODULATION CORPORATIONInventor: BOSTON SCIENTIFIC NEUROMODULATION CO
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Patent number: 8404983Abstract: A removable electric controller for a garage door opener includes a base unit, a cover and a control box unit. A box lid of the control box unit is slidably connected to a connecting surface of the cover. A guide insertion end of a control circuit board of the control box unit is connected to a main connecting port module of a circuit terminal connecting plate on the base unit. The cover and the control box unit are detachable. A driving member, a light source member, an inductive circuit line and a power member of the base unit are connected to wiring port modules of the circuit terminal connecting plate, so that the wiring is in the way of modulization. The control circuit board of the control box unit can be replaced with ease, providing a convenient and simply assembly.Type: GrantFiled: May 16, 2011Date of Patent: March 26, 2013Assignee: Rhine Electronic Co., Ltd.Inventor: Kun Shi Tseng
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Patent number: 8357850Abstract: A housing includes a first base layer and a second base layer integrally combining with the first base layer. The first base layer is formed by a first injection mold, the first base layer has a first combining surface arranged with ribs. The second base layer combines with the first base layer to form the housing with a second injection mold. The second base layer has a second combining surface combining with the first combining surface. The second combining surface defines recesses to correspondingly receive the ribs.Type: GrantFiled: August 24, 2010Date of Patent: January 22, 2013Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) LimitedInventor: Huan-Bing Ye
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Patent number: 8323758Abstract: A design cover attachment structure is provided configured to facilitate an attachment/removal of a design cover composed of a plurality of decorative plates. At least a top surface and each of side surfaces of a casing of an electronic apparatus are covered with a design cover composed of a top surface decorative plate, and left and right side surface decorative plates. The left and right side surface decorative plates are provided with second engagement portions configured to be engaged with first engagement portions provided to a bottom surface decorative plate mounted on the casing or a bottom surface of the casing, so that the left and right side surface decorative plates are mounted on the casing. Third engagement portions configured to be engaged with fourth engagement portions provided to the top surface decorative plate, so that the top surface decorative plate is mounted on the left and right side surface decorative plates.Type: GrantFiled: December 4, 2008Date of Patent: December 4, 2012Assignee: Hitachi, Ltd.Inventors: Yuji Kishi, Ken Tsukamoto, Yoshinori Horikawa, Shinji Nishi, Kazuma Kishi, Akitoshi Morishima
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Patent number: 8294263Abstract: A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted.Type: GrantFiled: May 31, 2011Date of Patent: October 23, 2012Assignee: Everlight Electronics Co., Ltd.Inventors: Sheng-Jia Sheu, Chien-Chang Pei
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Patent number: 8273999Abstract: A chassis 2 as a first sheet-metal part has an L-shaped hooking section 27 formed at a cover mounting opening end of each side plate thereof, and an assembly guide section 28 dimpling inwardly the opening end of the chassis 2 by the thickness of a cover 8; the cover 8 as a second sheet-metal part has a hooking claw 81 extending from each side edge of the cover to the mounting side thereof and engaging with the L-shaped hooking section 27, and a guide lug 82 engaging with the assembly guide section 28, wherein an engaging claw 85 and an engaging hole 102, and a tapped hole 101 and a screw passing-through hole 84 are relatively provided on the abutment faces between the chassis 2 and the cover 8, respectively.Type: GrantFiled: December 11, 2009Date of Patent: September 25, 2012Assignee: Mitsubishi Electric CorporationInventor: Hideyuki Hirota
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Patent number: 8253041Abstract: An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.Type: GrantFiled: May 20, 2010Date of Patent: August 28, 2012Assignee: Cyntec Co., Ltd.Inventors: Da-Jung Chen, Chi-Feng Huang, Yi-Tsung Chen, Huei-Ren You, Jeng-Jen Li
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Patent number: 8173912Abstract: A housing for retaining an electronic component, including a lid and a lower part made of synthetic material, wherein the lid is joined in a force-fit manner to the lower part by clamping geometry, and in order to affix the electronic component in position, the lid applies a specified force (F) to the electronic component after being joined to the lower part due to its design. Here, the lid is designed in such a manner that the force (F) applied lies within a specified force range (B), and that the clamping geometry comprises a groove on the lower part and a ridge on the lid which grips into the groove, wherein a clamp web on the lower part or on the lid is arranged in such a manner that the lid is removably clamped to the lower part after being joined to the lower part with a force (F) which acts parallel to the clamping force (KF).Type: GrantFiled: March 19, 2008Date of Patent: May 8, 2012Assignee: Conti Temic Microelectronic GmbHInventors: Turhan Büyükbas, Jürgen Rietsch, Helmut Karrer, Jürgen Henniger, Matthias Gramann, Matthias Wieczorek, Klaus Scharrer, Peter Guth, Dirk Trodler
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Patent number: 7989697Abstract: A network communication device includes a top component and a bottom cover forming a receiving space there between when assembled. The top component further includes a top cover and a body. The body is configured attaches the top cover and the bottom cover. The assembly of the top cover and the bottom cover utilizes at least one locking tab assembly. Each locking tab assembly includes a locking tab and a reciprocal locking structure engaged with the locking tab. One of the locking tabs and the reciprocal locking structure of the one locking tab assembly are utilized to assemble the top cover and the body is disposed on a first planar surface of the top cover, and another one of the locking tab and the reciprocal locking structure of the locking tab assembly is disposed on the body.Type: GrantFiled: April 15, 2009Date of Patent: August 2, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Bin Huang, Chih-Yu Yeh, Shih-Chi Wong
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Patent number: 7858887Abstract: A broadband over power line housing which allows coupling between power lines and a broadband signal system. Cables enter and exit from a first housing portion. Connection circuitry is housed in a second housing unit selectively connectable to the first housing unit. A latch provides the selective connection, and includes three positions: a first latched position wherein the circuitry within the first and second housing units is electrically connected; a second latched position wherein the circuitry is disconnected; and a disconnected position where the first and second housing portions can be separated from one another. In one embodiment, the latch is operated with a hook stick between the first and second positions, allowing an operator to engage or disengage the circuitry from the ground. A visual indicator may be provided to indicate to the operator when the housing is in the latched and electrically disconnected state.Type: GrantFiled: August 28, 2008Date of Patent: December 28, 2010Assignee: ADC GmbHInventors: Brent David Allwood, Wayne William Dennes
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Patent number: 7842890Abstract: A one-piece housing for the enclosure and protection of an optical imager or other device and a method for locking a one-piece housing assembly in a folded configuration. The housing comprises three segments permanently joined by flexible hinges that allow the housing to quickly fold into a box to enclose an optical imager. To releasably maintain the housing in closed position, the assembly contains two locking tabs that snap-fit into depressions on a platform extending away from the main housing segment. One tab snap-fits directly into a depression on the top surface of the platform while the other tab snap-fits into a depression on the reverse surface of the platform. By locking into depressions on the top and reverse surfaces of the platform, the opposing tabs tightly grip the surfaces and releasably maintain the housing in the folded configuration.Type: GrantFiled: September 19, 2008Date of Patent: November 30, 2010Assignee: Jadak, LLCInventors: Richard Burnham Jost, Harold Francis Rose, Jr.
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Patent number: 7829809Abstract: The disclosure relates to a service switching device with an insulating housing, which has a front-panel side and an opposite fastening side as well as narrow and broad sides connecting the front-panel and the fastening sides, including at least one first housing shell and at least one covering part, which are connected by a first connector, which act on the broad sides of the housing shell and the covering part and hold them together whilst forming a peripheral joining line, the insulating housing including accommodating areas for connection terminals in the region of the narrow sides. A second connector is provided in the region of a terminal accommodating area and in the region of the narrow side associated therewith, which second connector holds the housing shell and the covering part together there at the joining line.Type: GrantFiled: July 2, 2008Date of Patent: November 9, 2010Assignee: ABB AGInventors: Matthias Bitz, Joachim Körner
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Publication number: 20100230156Abstract: A method for making a packaging device for an electronic element includes: preparing a ceramic frame body defined with a hollow space for receiving the electronic element therein; preparing a ceramic substrate having a copper layer formed thereon; etching the copper layer to form a predetermined copper pattern on an upper surface of the ceramic substrate; placing the ceramic frame body onto the upper surface of the ceramic substrate and in contact with the copper pattern ; and heating the ceramic frame body and the ceramic substrate such that the copper pattern bonds the ceramic frame body to the ceramic substrate. A packaging device for an electronic element is also disclosed.Type: ApplicationFiled: March 9, 2010Publication date: September 16, 2010Applicant: High Conduction Scientific Co., Ltd.Inventors: Wen-Chung Chiang, Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu
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Patent number: 7759584Abstract: An electronic part equipped unit includes a case body that includes a first recess portion for containing an electronic part and a second recess portion for containing a relay terminal which is connected to the electronic part, a wire side terminal to which a middle portion of a wire is attached, and a cover member to which the wire side terminal is attached. The wire side terminal is brought into contact with the relay terminal when the cover member to which the wire side terminal is attached is fitted to the second recess portion of the case body. A positioning rib for restricting the relay terminal is provided on a bottom portion of the second recess portion of the cover body. The wire side terminal has a rib contact portion.Type: GrantFiled: July 3, 2008Date of Patent: July 20, 2010Assignee: Yazaki CorporationInventor: Tomohiko Shimizu
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Patent number: 7754983Abstract: A method of manufacturing an electronic parts packaging structure, including the steps of preparing an electronic parts forming substrate in which an MEMS element is formed in a formation region and a concave portion is provided in a periphery part of the formation region, and a sealing cap in which a ring-shaped protruded bonding portion is provided in a part corresponding to the concave portion of the electronic parts forming substrate and a cavity is formed in a part corresponding to the formation region; and fitting the protruded bonding portion of the sealing cap into the concave portion of the electronic parts forming substrate. Thus, the MEMS element is hermetically sealed in the cavity of the sealing cap.Type: GrantFiled: April 21, 2006Date of Patent: July 13, 2010Assignee: Shinko Electric Industries Co., Ltd.Inventors: Masahiro Sunohara, Mitsutoshi Higashi
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Patent number: 7754982Abstract: A locking system for an electronic device housing comprises a top plate, a movable cover pivotal about a first edge of the top plate, and a lateral plate connected to a second edge of the top plate which is perpendicular to the first edge. The top plate defines an opening near the second edge thereof. The locking system comprises a flexible lock-receiving portion, an engaging portion, a groove, and a disengaging member. The flexible lock-receiving portion protrudes from the top plate within the opening and has a protrusion extending downwardly. The engaging portion is formed on a surface of the movable cover and faces the opening. The groove is defined on the lateral plate corresponding to the opening. The disengaging member is inside the groove and protrudes to engage the protrusion.Type: GrantFiled: August 13, 2008Date of Patent: July 13, 2010Assignees: Premier Image Technology(China) Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Jian-Chu Zhou, Hsieh-Tung Chung
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Patent number: 7714237Abstract: An electrical apparatus that can be fixed to a supporting frame having a mounting window to receive the electrical apparatus includes a main body having a substantially box-like shape and first fixing elements provided on first and second opposite sides of the body to engage with corresponding second fixing elements the frame and facing the mounting window. The first fixing elements include guiding fixing elements to permit axial and guided sliding of electrical apparatus with respect to the frame in inserting the apparatus into the mounting window. The first fixing elements further include snap-in fixing elements to block axial sliding of the electrical apparatus with respect to the frame once a predetermined snap-in position has been reached.Type: GrantFiled: May 4, 2006Date of Patent: May 11, 2010Assignee: BTICINO S.p.A.Inventors: Fabrizio Fabrizi, Ennio Calderara, Renato De Ambroggi
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Patent number: 7714236Abstract: An electric component includes a substrate, a function element provided on the substrate, a first sealing body provided on the substrate to cover the function element at a certain distance, the first sealing body including multiple apertures communicating with an internal space formed between the first sealing body and the substrate, and a second sealing body provided on the first sealing body and configured to occlude the multiple apertures. Here, a boundary between the first sealing body and the substrate is curved in a direction to narrow the internal space.Type: GrantFiled: July 22, 2008Date of Patent: May 11, 2010Assignee: Kabushiki Kaisha ToshibaInventors: Michinobu Inoue, Susumu Obata
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Patent number: 7642472Abstract: A mounting base for switch packages having a mounting flange is provided. The base includes a body having a first receptacle and a second receptacle, and each of the first and second receptacle is configured to accept a mounting flange of the switch package with snap-fit engagement. The first and the second receptacles are inverted relative to one another and allow mounting of the switch package with a fewer number of fasteners.Type: GrantFiled: April 11, 2005Date of Patent: January 5, 2010Assignee: Tyco Electronics CorporationInventors: Timothy Hasenour, Randy Hannah, Kurt T. Zarbock
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Publication number: 20090283321Abstract: A network communication device comprises a top component and a bottom cover forming a receiving space therebetween when assembled. The top component further comprises a top cover and a body. The body is configured attaches the top cover and the bottom cover. The assembly of the top cover and the bottom cover utilizes at least one locking tab assembly. Each locking tab assembly comprises a locking tab and a reciprocal locking structure engaged with the locking tab. One of the locking tabs and the reciprocal locking structure of the one locking tab assembly are utilized to assemble the top cover and the body is disposed on a first planar surface of the top cover, and another one of the locking tab and the reciprocal locking structure of the locking tab assembly is disposed on the body.Type: ApplicationFiled: April 15, 2009Publication date: November 19, 2009Applicants: HONG FU JIN ORECISION INDUSTRY(ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Bin Huang, Chih-Yu Yeh, Shih-Chi Wong
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Patent number: 7563992Abstract: An enclosure for electronic circuitry is provided which has a first housing member having at least one protrusion formed in a wall and a second housing member having at least one slot for receiving the at least one protrusion and securing the second housing member to the first housing member. The second housing member and the first housing member have one or more continuous electrical ground contact surfaces. The second housing member is secured to the first housing member so that there is an interference fit between the at least one protrusion and at least one slot and so that there are one or more continuous electrical ground contact surfaces between the first housing member and the second housing member. A method of assembling an enclosure for electronic circuitry is provided.Type: GrantFiled: September 20, 2006Date of Patent: July 21, 2009Assignee: Delphi Technologies, Inc.Inventors: Daniel A. Lawlyes, Joseph M. Ratell
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Publication number: 20080236887Abstract: A mounting assembly comprising: a first housing portion adapted to be mounted to an object, the first housing portion having a first opening and a plurality of pins located in the opening and a first portion of a closing mechanism located on the outside of the first housing portion; and a second housing portion having a member having a plurality of slots for mating with the plurality of pins and a second portion of a closing mechanism that mates with the first portion of a closing mechanism.Type: ApplicationFiled: March 26, 2008Publication date: October 2, 2008Applicant: PELCO, INC.Inventors: Lawrence E. Bakst, Bryan Grziwok, Bob Musetti
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Patent number: 7219420Abstract: A protective assembly for a printed-circuit electronics card having a metal substrate and a metal screening cover electrically connected to the substrate. The substrate includes a recessed gutter in which the edge of the cover is accommodated. The edge is crimped onto the substrate in the gutter.Type: GrantFiled: March 15, 2005Date of Patent: May 22, 2007Assignee: Valeo VisionInventors: Jean Marc Nicolaï, Marc Duarte, Dung Kong-A-Siou