Elements Patents (Class 204/279)
  • Publication number: 20080250722
    Abstract: The present invention provides for an assembly for positioning and holding abrasive particles to be electroplated with a metal. The assembly can include a substrate with a surface that is configured for receiving abrasive particles. The assembly can further include an intermediate layer configured to hold the particles and mask at least a portion of each abrasive particle. Additionally, a method for making an abrasive tool using such an assembly is provided, as well as abrasive tools made thereby. In one aspect of this invention, abrasive tools can have abrasive particle tips that are arranged in accordance with a predetermined vertical pattern and a predetermined horizontal pattern as well as a predetermined particle attitude.
    Type: Application
    Filed: April 10, 2007
    Publication date: October 16, 2008
    Inventor: Chien-Min Sung
  • Publication number: 20080233249
    Abstract: The invention relates to a process for wine evolution by electrochemical way, with reduced treatment times and controlled selectivity. The process may be carried out at the anodic compartment of an electrochemical reactor subdivided by a semipermeable membrane on a valve metal anode, for instance a titanium anode, provided with catalytic coating containing platinum or other noble metal.
    Type: Application
    Filed: March 23, 2007
    Publication date: September 25, 2008
    Inventors: Mario Bertuccioli, Gian Nicola Martelli, Luciano Iacopetti, Dario Oldani, Salvatore Peragine, Cleto Simoncelli
  • Patent number: 7427340
    Abstract: A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made of a conductive composite disposed on a conductive carrier. The raised features are adapted to polish the feature surface of a substrate and define channels therebetween. The conductive processing pad may have lower features made of a conductive composite that extend into the sub-pad from the conductive carrier. The conductive processing pad is adhered to a sub-pad bound to an opposing conductive layer and the opposing conductive layer bound to a platen assembly.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: September 23, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Rashid A. Mavliev, Ralph M. Wadensweiler
  • Patent number: 7425257
    Abstract: The disclosure relates to a method of obtaining a good current contact on the support bar of a cathode used in electrolysis. In this method a highly electroconductive layer is formed on the contact piece on the end of the support bar of the cathode, especially at the point that comes into contact with the electrolysis cell busbar. The electroconductive layer forms a metallic bond with the contact piece of the support bar. The disclosure also relates to the cathode support bar, wherein a highly electroconductive layer is formed to the contact piece on the end of said bar, in particular the area that touches the electrolysis cell busbar.
    Type: Grant
    Filed: November 6, 2003
    Date of Patent: September 16, 2008
    Assignee: Outotec Oyj
    Inventors: Karri Osara, Veikko Polvi
  • Patent number: 7396442
    Abstract: An ionically conductive ceramic element includes a central unit (703). The central unit (703) is composed of a plurality of integrated manifold and tube modules (IMAT) (22) joined end to end along a central axis (A). Each IMAT module (22) has a tube support portion (804) and a plurality of tubes (802) extending from the first surface (803). The tubes (802) each have a closed end (805) and an open end. The second surface (807) is at least partially open to the atmosphere. The open ends of the tubes (802) are open to the atmosphere through the second surface (807). An interior space (830) is formed in the interior of the IMAT (22) for collecting a desired product gas. A collection tube (710) is operable joined with a first end (714) of the central unit (703) for transporting the desired product gas collected in the interior space (730) of the connected IMAT modules (22).
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: July 8, 2008
    Assignee: Carleton Life Support Systems, Inc.
    Inventors: Brad M. Bagby, Scott H. Harvey
  • Patent number: 7387713
    Abstract: A sacrificial anode assembly operative to inhibit corrosion in the metal tank portion of a water heater includes a cylindrical metal anode member having an end retained within a tubular, electrically non-conductive plastic insulating sleeve which, in turn, is captives retained within a metal cap portion of the assembly. A resistor is received in an end surface groove of the sleeve and has a lead wire spot-welded or soldered to a core wire portion of the anode member. To prevent contact between the lead wire and the metal cap, and to protect the lead wire against vibration caused breakage at its spot weld or solder area, a U-shaped central portion of the lead wire is received in a through-opening in the resistor-supporting end of the sleeve which is covered by an annular insulating wafer formed from an electrically non-conductive material.
    Type: Grant
    Filed: December 7, 2005
    Date of Patent: June 17, 2008
    Assignee: Rheem Manufacturing Company
    Inventors: Ronald D. Marcelino, James S. Roden
  • Publication number: 20080128265
    Abstract: A sub-millimetre hydrogen collector generator ring disc electrode is disclosed which may be used in a collector generator system, for example for measurement of mass transport rates using hydrogen as a tracer. A calibrator and calibration method as well as a method of assaying tissue perfusion is also disclosed.
    Type: Application
    Filed: November 30, 2006
    Publication date: June 5, 2008
    Inventors: Danny O'Hare, Severin Luc Ramses Harvey, Kim Howard Parker
  • Patent number: 7378004
    Abstract: An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface of a predetermined shape and a bottom surface. The rigid member contains a plurality of channels, each forming a passage from the top surface to the bottom surface, and each allowing the electrolyte and electric field flow therethrough. A pad is attached to the rigid member via a fastener. The pad also allows for electrolyte and electric field flow therethrough to the substrate.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: May 27, 2008
    Assignee: Novellus Systems, Inc.
    Inventors: Cyprian Uzoh, Bulent Basol, Homayoun Talieh
  • Patent number: 7374645
    Abstract: A compression sealable electrolysis cell that is easily and reliably manufactured, maintained and repaired comprises two insulating end pieces which can position and seal two electrode tubes with electrical contacts separated by a ceramic membrane tube where fluid can be introduced at one end piece and removed at the other end piece in the spaces between the electrode tubes and the ceramic membrane tube. The design permits the compression of the entire assembly via the fixing of nuts on one or more threaded rods extending through both end pieces without the use of an adhesive or cement and without the imposition of torque or compressive stress on the ceramic membrane tube. The water or other fluid to be electrolyzed can be introduced tangentially to spaces between the electrode tubes and the ceramic membrane tube at a angle of 0 to 15 degrees to optimize flow and contact with the electrode tubes.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: May 20, 2008
    Assignee: Clenox, L.L.C.
    Inventors: James E. Davis, Michel van Schaik
  • Publication number: 20080105540
    Abstract: It is described a bipolar plate consisting of a single wall and a perimetrical sealing frame obtained by folding and provided with a planar abutment surface for the frame-to-wall welding. The wall is further provided with projections on one face thereof preferably obtained by moulding, and with supports on the other face consisting of sheet strips housed in the recesses formed by the concave part of the projections. The projections substantially extend along the entire length of the bipolar plate. The projections and supports are connected to electrodes or current distributors. The projections, the supports, the single wall and the perimetrical frame are made of the same metal or alloy. The electrode or current distributor supported by the projections, the same projections and the supports are welded together by a single pass of arc-welding or preferably laser-welding.
    Type: Application
    Filed: November 18, 2005
    Publication date: May 8, 2008
    Inventors: Fulvio Federico, Leonello Carrettin, Dario Oldani, Corrado Mojana
  • Publication number: 20080107869
    Abstract: Disclosed herein are mounting plates and methods for making an electroforms. In one embodiment, the master comprises an edge, a back, a master area, and a pattern having a pattern area. The mounting plate comprises a cutout having a cutout size that is smaller than the master area and larger than the pattern area, and an electrically conductive over-plate area extending around the cutout, between the cutout and an outer edge of the mounting plate. In one embodiment the method comprises: attaching a master to a mounting plate, masking the edge and the back of the master and portions of the mounting plate that will be exposed to plating material, other than the over-plate area, plating the pattern to form the electroform having an edge thickness, and removing the electroform from the master.
    Type: Application
    Filed: November 8, 2006
    Publication date: May 8, 2008
    Inventors: Paul William Buckley, Kenneth Paul Zarnoch, Brett Michael Dening
  • Patent number: 7363110
    Abstract: A gasket having the form of a frame is provided with a curved portion at an inner or outer periphery thereof. When used in combination with a similarly configured gasket, the two gaskets may together, upon compression, form a pinch seal. The curved portion may be provided with a chemically resistant material.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: April 22, 2008
    Assignee: Ineos Chlor Enterprises Limited
    Inventors: Brian K. Revill, Michael F. Dutton, Keith A. Stanley, Alan R. Naylor
  • Patent number: 7344625
    Abstract: The present invention relates to a handling device for an anode connector provided with at least two side trunnions and a tightening screw. The connector is generally capable of cooperating with attachment hooks of an aluminum production cell used in fused bath electrolysis production operations so as to enable connection of anodes onto the cell. The handling device has a tightening device capable of tightening the connector screw and affecting the tightness of the connector. The present invention also has a locking system that can lock the connector in a desired position in the handling device, by loosening the connector using the tightening device. The handling device also has at least one mobile member which typically has a support to support the connector in a closed position. The support can also displace the mobile member from its closed position to an open position, and vice versa.
    Type: Grant
    Filed: February 15, 2005
    Date of Patent: March 18, 2008
    Assignee: E.C.L.
    Inventor: Patrick Delescluse
  • Patent number: 7306706
    Abstract: A method and apparatus for stripping electro-deposited metal sheets from a cathode blank. The blank has opposite faces, upstream and downstream ends. At least one sheet is provided on at least one blank face to define upstream and downstream edges. The apparatus comprises a stripping assembly for stripping the electro-deposited metal sheets from the cathode blank, a discharge assembly and a metal sheet out-feed assembly. The discharge assembly is positioned downstream of the stripping assembly and includes opposite guide rollers adapted to engage the metal sheet exiting the stripping assembly. The metal sheet out-feed assembly is positioned downstream the discharge assembly for receiving the metal sheet. When the metal sheet has been stripped from the cathode blank, the guide rollers controllably feed the metal sheet to the out-feed assembly. The method comprises stripping the metal sheets from the cathode and controllably discharging the stripped sheets to an out-feed assembly.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: December 11, 2007
    Assignee: Falconbridge Limited
    Inventors: Victor Robinson, Philip Donaldson
  • Patent number: 7303662
    Abstract: Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: December 4, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Rashid Mavliev, Stan Tsai, Yongqi Hu, Paul Butterfield, Antoine Manens, Liang-Yuh Chen
  • Patent number: 7297239
    Abstract: An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: November 20, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Ismail Emesh, Periya Gopalan, Phillip M. Rayer, II, Bentley J. Palmer
  • Patent number: 7282125
    Abstract: A contact element holder, in particular a brush holder for commutator or wiper ring machines, has a carrier that can be secured to the machine housing and at least one quiver, held on the carrier and pointing toward the rotor, for displaceably receiving a contact element, and also has decoupling elements which are disposed between the carrier and the quiver. To achieve good noise decoupling of the contact element from the machine housing and, in use in a commutator machine, for assuring good commutation quality, the decoupling elements are embodied and disposed such that the at least one quiver is capable of executing only a limited rotational pivoting distance about the rotor.
    Type: Grant
    Filed: May 26, 2003
    Date of Patent: October 16, 2007
    Assignee: Robert Bosch GmbH
    Inventor: Bernhard Rupp
  • Patent number: 7282124
    Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: October 16, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Homayoun Talieh, Cyprian Uzoh, Bulent M. Basol
  • Patent number: 7252750
    Abstract: A dual contact ring for contacting a patterned surface of a wafer and electrochemical plating of a metal on the patterned central region of the wafer and removing the metal from the outer, edge region of the wafer. The dual contact ring has an outer voltage ring in contact with the outer, edge region of the wafer and an inner voltage ring in contact with the inner, central region of the wafer. The outer voltage ring is connected to a positive voltage source and the inner voltage ring is connected to a negative voltage source. The inner voltage ring applies a negative voltage to the wafer to facilitate the plating of metal onto the patterned region of the wafer. A positive voltage is applied to the wafer through the outer voltage ring to remove the plated metal from the outer, edge region of the substrate.
    Type: Grant
    Filed: September 16, 2003
    Date of Patent: August 7, 2007
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Wen Liu, Jung-Chih Tsao, Ke-Wei Chen, Ying-Lang Wang
  • Patent number: 7226670
    Abstract: A work piece or structural component is coated with a system of film layers at least one of which is composed of (AlyCr1-y) X, where X=N, C, B, CN, BN, CBN, NO, CO, BO, CNO, BNO or CBNO and 0.2?y<0.7, with the composition within said film being either essentially constant or varying over the thickness of the film continually or in steps, as well as a process for producing it.
    Type: Grant
    Filed: April 15, 2004
    Date of Patent: June 5, 2007
    Assignee: OC Oerlikon Balzers AG
    Inventors: Volker Derflinger, Andreas Reiter, Christoph Gey
  • Patent number: 7223324
    Abstract: Disclosed in a capping board for use to support hanging legs of anodes and cathodes within adjacent electrolytic cells. This capping board has a main body having a bottom surface shaped to fit onto upper edges of the adjacent cells, and a top surface. A first set of spaced part insulating blocks project from the top surface. This first set of blocks extends in line all over the length of the capping board on one side of the main body. A second set of spaced part insulating blocks also projects from the top surface. This second set of blocks also extends in line all over the length of the capping board at a given lateral distance from the first set of blocks. Thus, the two sets of blocks form two rows that together define a central path on the top surface. Each of the blocks has a recess forming an upwardly and laterally opening compartment to receive and support one of the hanging legs of the anodes and cathodes.
    Type: Grant
    Filed: November 26, 2004
    Date of Patent: May 29, 2007
    Assignee: Pultrusion Technique Inc.
    Inventor: Robert P. Dufresne
  • Patent number: 7217345
    Abstract: Production of pure metals through electro-winning and electro-deposition is accomplished by electrolytic deposition of metal over a reusable stainless-steel plate (cathode). Metal is deposited on both faces of the cathode, as well as on its edges, creating problems when removing the deposited metal. Breaking the deposited edges to remove the metal deposited on both faces produces irregular edges, folding and damages to the surface of the cathode, requiring re-processing, increasing costs of the deposited metal, as well as repairs or replacement of the cathodes. This invention includes a structure made of insulating material to which are fixed electrically energizable cathode guidance profiles with a cross-section similar to an omega and which house the edges of the cathodes, holding them in position during the process.
    Type: Grant
    Filed: May 12, 2005
    Date of Patent: May 15, 2007
    Assignee: New Tech Copper S.A.
    Inventor: Manuel Rafael Umana Casanova
  • Patent number: 7217472
    Abstract: A support member is useful for supporting membranes such as solid polymer electrolyte ion exchange membranes such as those used in electrochemical cell applications. The support member has a first lattice pattern on a first side of a single piece of material. A second lattice pattern on a second side of the single piece of material cooperates with the first lattice pattern to establish a plurality of flow passages across the material. Each lattice pattern has a corresponding plurality of recesses that extend partway through the material and overlapping portions of the recesses define the flow passages. In a disclosed example, the monolithic support member lattice patterns are established using chemical etching.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: May 15, 2007
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Andrei Leonida
  • Patent number: 7214297
    Abstract: A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conductive thief element attached to the substrate supporting member, and at least one source of electrical power in electrical communication with the contact pins and the conductive thief element.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: May 8, 2007
    Assignee: Applied Materials, Inc.
    Inventors: You Wang, Anzhong Chang, John O. Dukovic
  • Patent number: 7211175
    Abstract: Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features due to contact of the seed layer with an electrolyte solution. The potential can also be controlled to provide conformal plating over the seed layer and bottom-up filling of the recessed features. For each of these processes, a constant cathodic voltage, pulsed cathodic voltage, or ramped cathodic voltage can be used. An apparatus for controlled-potential electroplating includes a reference electrode placed near the surface to be plated and at least one cathode sense lead to measure the potential at points on the circumference of the integrated circuit structure.
    Type: Grant
    Filed: February 11, 2003
    Date of Patent: May 1, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, Jonathan Reid, Robert Contolini
  • Patent number: 7204920
    Abstract: A contact ring for use in electroplating of a substrate material is constructed such that fluid (e.g., electrolyte) is allowed to flow radially away from the axis of a toroidal support ring, thus preventing the trapping of fluids between the substrate and the toroidal support ring. The contact ring is constructed with a series of openings arranged about the circumference of the ring and wherein an electrical contact is placed in the path of each opening so any fluid passing through the opening also passes around the associated electrical contact. Further, the electrical contacts are also placed such that a substrate (e.g., a semiconductor wafer) can be placed inside the support ring so as to electrically contact the electrical contacts. The toroidal support ring has an aerodynamically streamlined cross-section at the openings, such that fluid flows through the openings with reduced aerodynamic drag.
    Type: Grant
    Filed: October 25, 2004
    Date of Patent: April 17, 2007
    Assignee: LSI Logic Corporation
    Inventors: Byung-Sung Leo Kwak, Gregory Frank Piatt, Hiroshi Mizuno
  • Patent number: 7204919
    Abstract: Disclosed is a capping board for use to support anodes and cathodes within adjacent electrolytic cells, which has a plurality of individual seats positioned in spaced apart relationship all along its length to receive and support hanging legs projecting from these anodes and cathodes. This capping board is improved in that it has at least one sheet or wire of electrically conductive material embedded therein. This sheet or wire extends over the length of the board and is shaped and positioned so that part of its extends externally within at least some of the seats so as to allow electrical contact of the legs of either the anodes or the cathodes and to allow fast dissipation of heat in the case of a short circuit.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: April 17, 2007
    Assignee: Pultrusion Technique Inc.
    Inventor: Robert P. Dufresne
  • Patent number: 7204917
    Abstract: The present invention is directed to a top surface of a workpiece surface influencing device and a method of using the same. The top surface of the workpiece surface influencing device is adapted for use in an electrochemical mechanical processing apparatus in which a solution becomes disposed onto a conductive surface of a workpiece and electrochemical mechanical processing of the conductive surface is performed while relative movement and physical contact exists between the top surface and the conductive surface. The top surface comprises a ceramic material that presents a substantially planar contact area to the conductive surface, the ceramic material having a hardness greater than that of the conductive surface. A plurality of channels are formed through the top surface.
    Type: Grant
    Filed: November 21, 2002
    Date of Patent: April 17, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Cyprian E. Uzoh, Bulent M. Basol
  • Patent number: 7204918
    Abstract: An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-oriented workpiece, with the tray having a top edge with a portion of the edge forming a dam over which the solution may flow and an opening in its lower portion where the solution can enter the tray, (2) a reservoir tank situated below the tray, (3) a feed line connecting the reservoir tank and tray opening, (4) a drain that returns the solution that overflows the tray top edge to the reservoir tank, and (5) a pump that circulates the solution from the tank to the tray and over the horizontally situated workpiece.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: April 17, 2007
    Assignee: Modular Components National, Inc.
    Inventor: Steven P. Glassman
  • Patent number: 7201828
    Abstract: An apparatus for performing an electrochemical process on a surface of a workpiece comprises a platen assembly comprising a support platen, an electrolyte distribution plate, and a first conductive layer intermediate the support platen and distribution plate and configured to be coupled to at least a first potential. A carrier is configured to carry the workpiece and position the workpiece proximate the electrolyte distribution plate. A reservoir delivers an electrolyte to the electrolyte distribution plate. At least one contact separate from the platen assembly engages a peripheral region of the workpiece for coupling the workpiece to a second potential.
    Type: Grant
    Filed: January 15, 2004
    Date of Patent: April 10, 2007
    Assignee: Novellus Systems, Inc.
    Inventor: Ismail Emesh
  • Patent number: 7195697
    Abstract: A membrane for a sensor, a method for the preparation thereof, a layered membrane structure and a sensor for analytical measurements which require controlled analyte permeability. The membrane, layered structure and sensor may be used for biological, physiological and chemical measurements, however, are especially applicable for electrochemical measurements of glucose, lactate, urea and creatinine. The membrane comprises at least one polymer material, at least one surfactant, and at least one hydrophilic compound in admixture to provide a membrane structure in which micelles of hydrophilic compound lined with thin layers of surfactant are randomly distributed in the bulk polymer of the membrane. Upon conditioning of the membrane a structure of a perculating network of pores lined with surfactant is formed which has excellent permeability properties. The membrane has the additional advantage of a proper adhesion to polymer encapsulant structures.
    Type: Grant
    Filed: November 21, 2002
    Date of Patent: March 27, 2007
    Assignee: Radiometer Medical A/S
    Inventor: Lydia Clausen
  • Patent number: 7192508
    Abstract: Device (1) to conduct current to or from the electrodes of an electrolysis cell, which device in the direction towards the electrolysis cell comprises three types of segments; at least one outer segment (2) joined with at least one intermediate segment (3) which again is joined with at least one inner segment (4); where the outer segment (2) has at least one end (5) which is to/shall extend out from an electrode body (6) towards an outer current circuit, and the outer segment is coupled to at least one intermediate segment (3) which again is coupled to at least one inner segment with at least one section (4) or end (7) in the electrode body; where the inner segment (4) is manufactured from steel, the intermediate segment is manufactured with a steel lining (8) over an inner core of a material (9) with better electrical and thermal conductivity than steel, and the outer segment is manufactured from a material (9) with better electrical and thermal conductivity than steel.
    Type: Grant
    Filed: November 23, 2001
    Date of Patent: March 20, 2007
    Assignee: Servico A.S.
    Inventor: Johnny Torvund
  • Patent number: 7186324
    Abstract: A hard film for cutting tools which is composed of (Ti1?a?b?c?d, Ala, Crb, Sic, Bd)(C1?eNe) 0.5?a?0.8, 0.06?b, 0?c?0.1, 0?d?0.1, 0?c+d?0.1, a+b+c+d<1, 0.5?e?1 (where a, b, c, and d denote respectively the atomic ratios of Al, Cr, Si, and B, and e denotes the atomic ratio of N).
    Type: Grant
    Filed: April 20, 2005
    Date of Patent: March 6, 2007
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Kenji Yamamoto, Toshiki Satou, Yasuomi Morikawa, Koji Hanaguri, Kazuki Takahara
  • Patent number: 7045043
    Abstract: The present invention relates to a method of reducing a band mark on an electroplating steel sheet, which can also reduce plating defects and damages to the materials caused by the differences in the physical characteristics of composition materials of a conductor roll used during electroplating Zn or Ni onto a steel sheet. In other words, the present invention comprises ceramic coating portions of circular bands, placed respectively in a thin strip at the both edge regions of the metal band position at the central portion of a conductor roll. In this manner, the present invention has the effects of reducing a band mark on a plating steel sheet, and also suppressing the generation of static electricity by eliminating the level difference between the conductive material (metal band portion) and the non-conductive material (rubber section). The present invention is also cabaple extending the life of a conductor roll by enhancing the wear and corrosion resistances thereof.
    Type: Grant
    Filed: July 24, 2000
    Date of Patent: May 16, 2006
    Assignee: Pohang Iron and Steel Co., Ltd.
    Inventors: Hyung-Jun Kim, Shi-Yeob Lee
  • Patent number: 7033468
    Abstract: For manufacturing printed circuit boards and films 7 with little variations in the layer thickness of the circuit structures without damaging the surfaces of the boards and films, a rotatory element 9, 10, more specifically a contact roll, is used for placing the printed circuit boards and films in electric contact, an elastic, electrically conductive material 2, 5, 6 being at least partially applied on the running tread unreeling on the printed circuit boards and films.
    Type: Grant
    Filed: April 11, 2001
    Date of Patent: April 25, 2006
    Assignee: Atotech Deutschland GmbH
    Inventor: Egon Hubel
  • Patent number: 6974530
    Abstract: The flow of electrolyte and/or of ions is controlled by a diffuser element provided in a plating reactor, wherein, in one embodiment, the diffuser element comprises a mechanical adjustment mechanism to adjust the effective size of passages of the diffuser element. In another embodiment, the diffuser element comprises at least two patterns of passages that are movable relatively to each other so as to adjust an overlap and thus an effective size of the corresponding passages. Moreover, the path of ions within the plating reactor may be controlled by an electromagnetically driven diffuser element so that a required thickness profile on the workpiece surface may be obtained.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: December 13, 2005
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Matthias Bonkass, Axel Preusse
  • Patent number: 6951600
    Abstract: A one-piece edge strip to be mounted on the bottom edge of a cathode used in electrolysis has a channel running longitudinally of the edge strip. The channel is designed to receive the bottom edge of the cathode. The edge strip is provided with a receptacle at either end of the channel, and each receptacle can accommodate an end portion of an edge strip mounted on a side edge of the cathode.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: October 4, 2005
    Inventor: Manuel G. Santoyo
  • Patent number: 6949171
    Abstract: This invention is a method of providing conductive tracks on a printed circuit including coating a substrate carrying printed tracks with an electro-plating solution with a tool which provides a first electrode of an electro-plating circuit and a second electrode provided by the tracks which are to be electroplated, and a tool suitable for use in electro-plating electrically conductive regions of a substrate, the tool including an absorptive member in which plating solution can be carried; a first electrode of an electro-plating circuit adapted to make electrical contact with plating solution carried by the absorptive member; and at least one tool second electrode electrically insulated from the first electrode and spaced from the absorptive member, the tool second electrode being so positioned that as the absorptive member is wiped across a surface of a substrate, the second electrode contactor can be wiped across the surface of the substrate to contact electrically conductive regions of the substrate to for
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: September 27, 2005
    Assignee: TDAO Limited
    Inventor: John Michael Lowe
  • Patent number: 6921468
    Abstract: A system for electroplating a semiconductor wafer is set forth. The system comprises a first electrode in electrical contact with the semiconductor wafer and a second electrode. The first electrode and the semiconductor wafer form a cathode during electroplating of the semiconductor wafer. The second electrode forms an anode during electroplating of the semiconductor wafer. A reaction container defining a reaction chamber is also employed. The reaction chamber comprises an electrically conductive plating solution. At least a portion of each of the first electrode, the second electrode, and the semiconductor wafer contact the plating solution during electroplating of the semiconductor wafer. An auxiliary electrode is disposed exterior to the reaction chamber and positioned for contact with plating solution exiting the reaction chamber during cleaning of the first electrode to thereby provide an electrically conductive path between the auxiliary electrode and the first electrode.
    Type: Grant
    Filed: July 19, 2001
    Date of Patent: July 26, 2005
    Assignee: Semitool, Inc.
    Inventors: Lyndon W. Graham, Kyle Hanson, Thomas L. Ritzdorf, Jeffrey I. Turner
  • Patent number: 6916409
    Abstract: An apparatus and process is disclosed for the electrolytic removal of metal from a device, such as a medical device. More particularly, the apparatus of the invention includes a mandrel having slots or openings therein to expose portions of a metallic device, such as a stent, to an electrolytic solution to remove metal from the exposed portion.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: July 12, 2005
    Assignee: Advanced Cardiovascular Systems, Inc.
    Inventors: Joseph R. Callol, Karim Said Osman, Napoleon L. Caliguiran, Rommel C. Lumauig
  • Patent number: 6913676
    Abstract: An apparatus for delivering at least two liquid media to consumers of a fuel cell system, with a feed pump is made less complicated than known apparatuses in that at least one pressure transmission unit between the at least two media is provided with at least one pressure transmission element, which has at least two pressure faces for pressure imposition that communicate with the liquid media.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: July 5, 2005
    Assignee: Robert Bosch GmbH
    Inventors: Michael Nau, Manfred Ruoff, Marc Bareis, Frank Ilgner, Horst Harndorf
  • Patent number: 6905581
    Abstract: An electrochemical device (18) for generating a desired gas of the type includes an ionically conductive electrolyte layer (20), a porous electrode layer (22), and a current collector layer (16) that has a high electrical conductivity and is porous to a desired gas (24) generated by the electrochemical device (18). The current collector layer (16) is substantially formed as a film comprised of a layer of spherical refractory material objects (26) having a conductive coating (12) of a precious metal. The coated spherical objects (26) have a desired diameter (28) making them suitable for forming into the film.
    Type: Grant
    Filed: December 2, 2002
    Date of Patent: June 14, 2005
    Assignee: Carleton Life Support Systems, Inc.
    Inventors: Scott R. Sehlin, Courtney J. Monzyk
  • Patent number: 6881309
    Abstract: In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate includes a plurality of openings which are arranged in a spiral pattern. The openings allow for an improved plating thickness distribution on the wafer surface. The openings can be elongated slots curved along the direction of the spiral path.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: April 19, 2005
    Assignee: Semitool, Inc.
    Inventors: Kyle M. Hanson, Robert A. Weaver, Jerry Simchuk, Raymon F. Thompson
  • Patent number: 6864589
    Abstract: A two dimensional vernier is provided along with a method of fabrication. The two dimensional vernier has a reference array patterned into a substrate, or a material overlying the substrate. An active array is patterned into photoresist overlying the substrate or the material. Both the reference array and the active array each comprise a two dimensional array of shapes. A difference between a combination of size or spacing of the shapes in each array determines vernier resolution. Vernier range is determined by a combination of vernier resolution and an integer related to a total number of shapes along a given axis. The two dimensional vernier allows an operator to readily measure the misalignment of a pattern to be processed relative to a previous pattern in two dimensions using a microscope. The two dimensional vernier reduces, or eliminates, repositioning of the microscope to determine both x-axis misalignment and y-axis misalignment.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: March 8, 2005
    Assignee: Sharp Laboratories of America, Inc.
    Inventor: Bruce D. Ulrich
  • Patent number: 6863788
    Abstract: An electrolytic cell for the reduction of aluminum having a layer of interlocking cathode tiles positioned on a cathode block. Each tile includes a main body and a vertical restraining member to prevent movement of the tiles away from the cathode block during operation of the cell. The anode of the electrolytic cell may be positioned about 1 inch from the interlocking cathode tiles.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: March 8, 2005
    Assignee: Alcoa Inc.
    Inventors: Alton T. Tabereaux, Jr., Guy L. Fredrickson, Eric Groat, Thomas Mroz, Alan Ulicny, Mark F. Walker
  • Patent number: 6852208
    Abstract: Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.
    Type: Grant
    Filed: October 3, 2002
    Date of Patent: February 8, 2005
    Assignee: NuTool, Inc.
    Inventors: Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Homayoun Talieh, Cyprian Uzoh
  • Patent number: 6849172
    Abstract: A method of operating a cell for electrowinning of copper, the cell including a plurality of anodes and cathodes therein, the method including the steps of introducing fresh electrolyte and sparging gas to a manifold system in the cell, controlling flow of fresh electrolyte and sparging gas in the manifold system and providing outlet openings in the manifold system such that streams of fresh electrolyte and sparging gas from the outlet openings are directed relatively uniformly across the cathodes in the cell.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: February 1, 2005
    Assignee: BHP Billiton Innovation Pty., Ltd.
    Inventors: Gregory David Rigby, Alan David Stuart, Philip Ernest Grazier
  • Patent number: 6846395
    Abstract: The present invention relates to an edge insulation member for an electrode plate used for electrolytic refinement of metal, and to a fixing method for it. On a tip portion 22A of a main body 22, a fitting groove 23 and a jaw portion 24 for tightly fitting an electrode plate 1 are formed to extend along the lengthwise direction of the main body 22. On a base end portion of the main body 22, an engagement notch 25 for fitting a support rod 26 is formed to extend along the lengthwise direction of the main body 22. A plurality of pin insertion holes 27 are formed on the side surface of the jaw portion 24. Fitting jigs made up from a pin 30 and a stopper 40 is removably fitted in this pin insertion hole 27. The support rod 26 is removably fitted in the engagement notch 25.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: January 25, 2005
    Assignee: Mitsubishi Materials Corporation
    Inventors: Hiroshi Tanaka, Fumihiko Shimizu
  • Patent number: 6802950
    Abstract: The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel—sulfamate bath. The shield is shown to improve the average current density at a plating surface.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: October 12, 2004
    Assignee: Sandia National Laboratories
    Inventors: John T. Hachman, Jr., James J. Kelly, Alan C. West
  • Patent number: RE40035
    Abstract: A ceramic oxygen generator is described which is capable of modular construction to permit the oxygen generation capacity to be expanded. An ionically conducted ceramic electrolyte is formed into a series of rows and columns of tubes on a tube support member and like electrolyte bodies can be connected together to form a manifold therebetween of oxygen produced in the interiors of the rubes. An electrical connection between tubes is formed such that the anodes and cathodes of tubes in a column are connected in parallel while the tubes in the row are, respectively, connected anode to cathode to form a series connection.
    Type: Grant
    Filed: February 16, 2001
    Date of Patent: January 29, 2008
    Assignee: Carleton Life Support Systems, Inc.
    Inventor: Victor P. Crome