Abstract: A retaining ring for electrochemical mechanical processing is described. The ring has a conductive portion having an upper surface and a lower surface and an insulating portion. The insulating portion has one or more openings extending therethrough, exposing the lower surface of the conductive portion. An upper surface of the insulating portion contacts the lower surface of the conductive portion. In an electrochemical mechanical polishing process, the retaining ring can be biased separately from a substrate being polished.

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Abstract: A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (“wafer”). The multi-layered wafer support apparatus includes a bottom film layer and a top film layer. The bottom film layer includes a wafer placement area and a sacrificial anode surrounding the wafer placement area. The top film layer is defined to be placed over the bottom film layer. The top film layer includes an open region to be positioned over a surface of the wafer to be processed, i.e., electroplated. The top film layer provides a liquid seal between the top film layer and the wafer, about a periphery of the open region. The top film layer further includes first and second electrical circuits that are each defined to electrically contact a peripheral top surface of the wafer at diametrically opposed locations about the wafer.

Abstract: A frame for holding sheet material taut comprises a support as well as two legs which extend essentially parallel to one another transversely from the support, on which legs fixing elements are provided for fixing, in each case, one of the opposing edges of a piece of sheet material thereto. At least one of the legs can be moved along the support towards and away from the other leg. Furthermore compensation elements are provided for compensating for stretch and/or shrinkage of the piece of sheet material fixed between the legs.

Abstract: An anode holder is used to hold an anode in a plating tank. The anode holder includes a bar having a conductive portion connected to a power source, a conductive anode shaft attached to the bar, and an anode connected to the conductive anode shaft. The conductive anode shaft includes an external thread portion provided at an end of the conductive anode shaft, an O-ring, and a step portion provided between the O-ring and the external thread portion. The step portion has a diameter larger than a diameter of the external thread portion but smaller than a diameter of the O-ring. The anode includes an internal thread hole to which the external thread portion of the conductive anode shaft is screwed. The anode also includes a receiving portion for receiving the step portion of the conductive anode shaft in a state such that the O-ring of the conductive anode shaft is brought into contact with an inner surface of the receiving portion.

Abstract: Apparatus for electroplating a workpiece includes an unassembled electroplating anode assembly having weldable first and second structural anode members. The first structural anode member includes a positioning slot. The second structural anode member includes a positioning tab disposable in the positioning slot. A method for making an electroplating anode assembly includes obtaining an electroplating-anode-assembly first structural anode member having a positioning slot and obtaining an electroplating-anode-assembly second structural anode member having a positioning tab. The method also includes locating the positioning tab in the positioning slot and welding together the first and second structural anode members.

Abstract: A process employing a rack having an article carrier that is movably supported on a frame and mechanically coupled for translating movement from a motor to the article carrier to effect movement of an article during processing to provide more uniform surface treatment, reducing or eliminating the need for shielding.

Abstract: A system for use in manufacturing semiconductor devices, is provided. The system includes an electrochemical processing tool and an image sensor. The electrochemical processing tool includes an electrode located at a central region of a platen. The electrode is adapted for contacting a wafer workpiece during certain processing of the wafer workpiece using the tool. At least part of the electrode is viewable from above the platen when the electrochemical processing tool is operably assembled. The image sensor is capable of capturing an image of the viewable part of the electrode. The image sensor is positioned above the platen. The image sensor is adapted to be aimed at the electrode when an image of the electrode is to be taken with the image sensor.

Abstract: A loading apparatus for use in electroplating processes includes a container designed to sealingly receive a plurality of airfoil blades fitted with gaskets. Each fitted airfoil blade is disposed in contact with a plurality of electrical contact assemblies having a spring-like design which ensures an adequate connection is made and complete plating of the airfoil blades occurs.

Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the workpiece and a plurality of contacts (420). The individual contacts (420) include a conductor (440) and a cover (430). The conductor (440) can comprise a proximal section (435) projecting inwardly into the opening (414) relative to the support member (410), a distal section (436) extending from the proximal section (435), and an inert exterior (444) at least at the distal section (436). The cover (430) comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.

Abstract: An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented. The holder comprises: a ceramic body which has an electrode and a heater circuit and which can holds a workpiece; a tubular member having an end portion connected to the ceramic body; a sealing member which is disposed inside the tubular member and which isolates a space inside the tubular member into two regions: a region on the first end portion (“sealed portion”) and a region on the opposite side (“opposite region”); and power supply conductive members which extend from the opposite region side, penetrating the sealing member to the sealed region side, and which are electrically connected to the electrode and the heater circuit.

Abstract: A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conductive thief element attached to the substrate supporting member, and at least one source of electrical power in electrical communication with the contact pins and the conductive thief element.

Abstract: On a fixture for electro-chemical machining for the production of long, curved cavities (11) in a component (12), the working electrode (3) of the electro-chemical machining tool (1) is connected to a guide body (1a) which moveably rests against the inner walls of the respective cavity by means of power-actuated guide elements (2), with the guide body being connected to a flexurally soft and torsionally stiff guide linkage (5) coupled to a feed and rotary drive. Control of the movement of the guide body is accomplished in dependence of at least one wall thickness measured with a measuring device (13, 14) during feed movement.

Abstract: The present invention provides improvements in methods for the manufacture of stents. Specifically, the invention provides methods wherein stents are placed on jigs of various designs which facilitate manufacture, stents carried by the jigs are immersed in liquid baths which contain an electrolyte, the stents are urged into contact with their associated electrodes while current is applied to those electrodes, and wherein the positions of contact between the stents and their respective electrodes are altered during processing without removing the stents from the jig. The method is applicable for electropolishing and electro-plating.

Abstract: A contact ring for use in electroplating of a substrate material is constructed such that fluid (e.g., electrolyte) is allowed to flow radially away from the axis of a toroidal support ring, thus preventing the trapping of fluids between the substrate and the toroidal support ring. The contact ring is constructed with a series of openings arranged about the circumference of the ring and wherein an electrical contact is placed in the path of each opening so any fluid passing through the opening also passes around the associated electrical contact. Further, the electrical contacts are also placed such that a substrate (e.g., a semiconductor wafer) can be placed inside the support ring so as to electrically contact the electrical contacts. The toroidal support ring has an aerodynamically streamlined cross-section at the openings, such that fluid flows through the openings with reduced aerodynamic drag.

Abstract: A carrier for use in processing of a plurality of wafers or other substrates includes a support frame on which the wafers are mounted and in one embodiment at least one auxiliary frame for holding the substrates on the support frame. A plurality of clips extend from the auxiliary frame and engage the substrates in pressure engagement, and fasteners retain the auxiliary frame in position with respect to the support frame. In one embodiment two auxiliary frames can be employed for holding wafers on opposing surfaces of the support frame. The support frame has electrically non-conducting surfaces whereby the processing does not affect the support frame, and the auxiliary frame is made of electrically non-conductive material. The clips are electrically conductive and bridge current from the support frame to the wafers during plating operations. In another embodiment, auxiliary frame are not used and the wafer retention clips are mounted on the support frame.

Abstract: Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending from the substrate support surface, a first seal positioned on the substrate support surface radially inward of the plurality of electrical contacts, and a second seal positioned radially outward of the plurality of electrical contacts. Additionally, the contact ring generally includes a fluid inlet configured to supply a fluid to a volume between the first seal and the second seal.

Abstract: A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an annular bump member positioned on the upper surface, and a plurality of flexible and conductive substrate contact fingers extending radially inward from the lower surface. The thrust plate includes an annular plate member sized to be received within the annular ring member, and a seal member extending radially outward from the plate member, the seal member being configured to engage the annular bump member for form a fluid seal therewith.

Abstract: A tool for electroplating a portion of the surface of each of a plurality of pieces includes a first plate having a plurality of holes, and a second plate having a plurality of retaining elements. Each of the holes is configured to receive a piece that is to be electroplated, and to mask a portion of the surface and expose another portion of the surface of the piece. The first and second plates are held together, and a mechanism is provided for shifting one of the plates with respect to the other between a first orientation in which the retaining elements are disengaged from pieces received in the holes and a second orientation in which the retaining elements are engaged with pieces received in the holes. This arrangement allows the pieces to be quickly and easily retained for an electroplating operation and released after the electroplating operation.

Abstract: An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust plate assembly adapted to exert a downward force on the substrate. For some embodiments, a first sealing member adapted to engage a plating surface of the substrate may be attached to the substrate support member. The apparatus may also include a second sealing member adapted to engage a non-plating surface of the substrate or a surface of the substrate support member to prevent the flow of plating fluid to a non-plating surface of the substrate. The apparatus may also include electrical contacts to electrically contact the plating or non-plating surface of the substrate.

Abstract: An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented. The holder comprises: a ceramic body which has an electrode and a heater circuit and which can holds a workpiece; a tubular member having an end portion connected to the ceramic body; a sealing member which is disposed inside the tubular member and which isolates a space inside the tubular member into two regions: a region on the first end portion (“sealed portion”) and a region on the opposite side (“opposite region”); and power supply conductive members which extend from the opposite region side, penetrating the sealing member to the sealed region side, and which are electrically connected to the electrode and the heater circuit.

Abstract: An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality of scallops formed on a surface opposing the substrate seating surface. A plurality of electrical contacts may be formed on the substrate seating surface opposite the plurality of scallops. The electrical contacts may be adapted to engage a plating surface of the substrate.

Abstract: A semiconductor wafer holder including first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.

Abstract: An electroplating panel having a strip of components to be electroplated. The components are spaced apart from one another along an edge of the strip. The panel includes a main buss and a plating thickness-compensation structure electrically connecting the main buss to the components at the edge of the strip. The plating thickness-compensation structure includes a first buss member and a second buss member. The first buss member extends along the edge of the strip and electrically connected to each component. The second buss member is electrically connected to main buss. The plating thickness-compensation structure further includes one or more links electrically connecting the first and second buss members.

Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured to receive the workpiece and a plurality of contacts. The individual contacts include a conductor and a cover. The conductor can comprise a proximal section projecting inwardly into the opening relative to the support member, a distal section extending from the proximal section, and an inert exterior at least at the distal section. The cover comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path.

Abstract: The invention relates to a device for the decontamination of water, particularly of heavy metals and/or arsenic and/or their compounds, by means of electrolysis, wherein the water to be purified is fed through a receptacle and passes by electrodes of different polarities. According to the invention, a combination of electrodes made from iron, aluminium, and graphite, or from aluminium and graphite, is used. Facing the direction of the receptacle bottom, the undersides of the electrodes are contained in groove-like, electrically insulated recesses that are spaced apart and separated from one another on their opposite side by single electrically insulating spacers, wherein the spacers are attached to the electrodes, and the electrodes, which can be unfolded, are arranged in the groove-like recesses (FIG. 5).

Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.

Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.

Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.

Abstract: A carrier for use in a coating process, the carrier being generally elongate and having a plurality of support members which, in use, support articles during the coating process, the support members each having an opening leading to a recess, the recess extending from the opening in a direction generally parallel to a longitudinal axis of the carrier.

Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.

Abstract: A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.

Abstract: A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip.

Abstract: An apparatus for performing an electrochemical process on a surface of a workpiece comprises a platen assembly comprising a support platen, an electrolyte distribution plate, and a first conductive layer intermediate the support platen and distribution plate and configured to be coupled to at least a first potential. A carrier is configured to carry the workpiece and position the workpiece proximate the electrolyte distribution plate. A reservoir delivers an electrolyte to the electrolyte distribution plate. At least one contact separate from the platen assembly engages a peripheral region of the workpiece for coupling the workpiece to a second potential.

Abstract: The invention relates to carriers serving to supply current to workpieces to be treated electrolytically or counter-electrodes and a method for the electrolytic treatment of workpieces. The carriers according to the invention comprise at least three elongate electric current conductors, disposed parallel to one another, a first current conductor being configured in such a way that the workpieces or counter-electrodes can, for supplying electric current or for mechanical attachment, be attached to the conductor directly or via holding devices, respectively a second to nth current conductor is provided, the second current conductor being connected to the first current conductor, the third current conductor to the second current conductor etc.

Abstract: A cathode cartridge (N) for an electroplating tester includes a cathode conductor (10) that conducts electricity to a surface (Wa) to be plated of a silicon wafer (W) as an object to be plated, a first insulator (20) that covers a front side of the silicon wafer (W) and holds the cathode conductor (10), and a second insulator (30) that covers a back side of the silicon wafer (W) and holds the silicon wafer (W). Negative portions other than the surface (Wa) to be plated of the silicon wafer (W) are insulated from plating solution with a first O-ring (22) fitted in the first insulator (20) and a second O-ring (32) fitted in the second insulator (30).

Abstract: The invention relates to a transverse conveyor for electrodes used in the production of metals. This transverse conveyor consists of a transfer device, located below the electrodes to be transferred and which device moves back and forth on a horizontal plane, as well as of lifters used for lifting the electrodes. The transfer device consists of a frame, on which there is a moving transfer bar, which is designed to cover the frame at all stages of its movement.

Abstract: Method and device for manufacturing of expandable cylindrical metal meshes for use in expandable stents and in particular for customized manufacturing. The method includes determining the type and size of the stent to be implanted, electrochemically forming the stent with desired pattern of meshes and implanting the stent into patient. The method comprises using a cathode with desired pattern of meshes and a tubular blank, from which the stent is formed. Between the cathode and the blank is delivered an electrolyte and the cathode and the blank are simultaneously rotated during electrochemical forming process.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path.

Abstract: The invention relates to a device for at least partly removing a deposit created in the electrolytic refining or electrowinning of metal from the surface of the mother plate used as an electrode in the refining or electrowinning process, said device comprising at least one member for removing the deposit and at least one member for controlling the removal member with respect to the deposit to be removed. According to the invention, the device comprises at least one gripping element that is used for creating a mechanical contact between the deposit and the removal member, said gripping element being connected to a control member, to which there are coupled both the shaft part of the gripping element and the deposit removal member.

Abstract: The invention relates to an intermediate component for protecting hangers associated with electrostatic coating processes. The component is an electrically conductive, pliable, tubular member, and inexpensive relative to the hanger which it serves to protect. The component lessens the cost associated with traditional hanger cleaning and preserves hanger life and integrity. The tubular member may have a longitudinal slit for installing the member over a cross bar of a hanger.

Abstract: A jig (10) is provided for holding an elongate member (56) to be surface treated. The jig (10) comprises a beam (12) and a plurality of hangers 14 spaced apart along the beam (12). The hangers (14) have supports (90) with retaining springs (96) thereon which are arranged to support and grip the elongate member (56). The beam (12) has hook-like members (18) for engagement with a lifting bar (30) of a crane (28). The crane (28) is used to transport the jig (10) to an anodising station (60) and subsequently to transport the jig (10) still with the anodised elongate member (56) thereon to a painting station. In that way, an elongate member to be surface treated can be manually placed on the respective supports (90) and held in place by the retaining springs (96) without having to use other forms of clamps.

Abstract: An electroplating apparatus for wheel disk comprises an electrolytic cell containing electrolytic bath, a cathode plate, an auxiliary anode, at least one anode plate and a driving mechanism. Part of the auxiliary anode is provided with an insulating shielding, one end of the insulating shielding passes through the center hole of the disk wheel. Part of the auxiliary anode is exposed on both sides of the wheel disk. Therefore, the auxiliary anode forms a dual anodes scheme with the anode plate to provide complete and smooth plating. The wheel disk is rotated by the driving mechanism to prevent tip-discharging.

Abstract: An electrode assembly for electroplating conducting portions of nonconductors comprises an insulating frame having a first projection opposite a second projection. Preferably the insulating frame comprises a resin selected from the group consisting of acrylic resins, polyvinyl chloride resins and polycarbonate resins. A metal filament, for connection to the negative pole of a source of electrical energy, extends from the first projection to the second projection. Adjacent to the metal filament a first conductive plate is attached to the insulating frame at a first distance from the metal filament. A second conductive plate attaches to the insulating frame at a second distance from the metal filament. The first plate and the second plate are adapted for connection to the positive pole of a source of electrical energy.

Abstract: The invention relates to a substrate carrier for holding substrates, especially semiconductor wafers. Good sealing of the wafer surface and electrical contact are made possible in that the substrate carrier has a first and a second part having a central opening matching the form of the substrate, wherein the substrate is received between the first and the second part and a peripheral seal having at least one undercut is provided in the inner periphery of the second part.

Abstract: A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it can be used in contact with the plating solution and still be part of the electrical contact system, eliminating the need for a protective plastic housing. This invention permits the dimensions of the cathode assembly to be minimized. A compact cathode assembly with minimum protrusion above the wafer plated surface enables modifications to the plating cell and agitation system providing more uniform copper deposits across the wafer surface and facilitating automation of the wafer plating process.

Abstract: A plating clamp assembly for use with a plating system including a plating bath and an article transport assembly to selectively engage an article to be plated as the article is moved through the plating bath by the article transport assembly to coat at least a selected portion of the surface of the article with material without creating faults on the selected portion of the surface of the article.

Abstract: A ceramic oxygen generator is described which is capable of modular construction to permit the oxygen generation capacity to be expanded. An ionically conducted ceramic electrolyte is formed into a series of rows and columns of tubes on a tube support member and like electrolyte bodies can be connected together to form a manifold therebetween of oxygen produced in the interiors of the rubes. An electrical connection between tubes is formed such that the anodes and cathodes of tubes in a column are connected in parallel while the tubes in the row are, respectively, connected anode to cathode to form a series connection.