Abstract: A method of manufacturing a dot pattern includes the steps of preparing a structured material composed of a plurality of columnar members containing a first component and a region containing a second component different from the first component surrounding the columnar members, with the structured material being formed by depositing the first component and the second component on a substrate, and removing the columnar members from the structured material to form a porous material having a columnar hole. In addition, a material is introduced into the columnar hole portions of the porous material to form a dot pattern, and the porous material is removed.

Abstract: A method for manufacturing a ferroelectric film includes the steps of causing, in a solution containing sol-gel raw materials, hydrolysis and polycondensation to the sol-gel raw materials to form a liquid containing particulate gels dispersed therein, and forming a ferroelectric film by a migration electrodeposition method, using the liquid containing particulate gels, through electrodepositing the particulate gels on an electrode.

Abstract: A metallic separator for a fuel cell has excellent corrosion resistance and contact resistance, even when a gold coating is applied directly without a surface treatment by a nickel coating. The metallic separator for a fuel cell, comprising stainless steel having a surface, can be obtained by coating at 2.3 to 94% of area rate on the surface without a surface treatment.

Abstract: Pathways to rapid and reliable fabrication of nanocylinder arrays are provided. Simple methods are described for the production of well-ordered arrays of nanopores, nanowires, and other materials. This is accomplished by orienting copolymer films and removing a component from the film to produce nanopores, that in turn, can be filled with materials to produce the arrays. The resulting arrays can be used to produce nanoscale media, devices, and systems.

Abstract: A system for maintaining a concentration range of an electroreducible metal species undergoing electrolysis within a predetermined concentration range comprises a first container containing a body of an electrolyte solution in which a metal is partially dissolved, a second container in fluid communication with the first container, the second container containing a second body of the solution, and a means for exchanging solution between the containers. The second container is configured with a means for electrolyzing, and a means for sensing the concentration of, the dissolved metal in the second body. During electrolysis, if the sensed concentration is within a predetermined range, the second body is circulated through the electrolyzing means; if the sensed concentration is outside or nearly outside the range, the solution is exchanged to maintain the concentration within the range.

Abstract: The side edge of the main magnetic pole layer is prevented from protruding in the track width direction even when a skew angle is generated by forming the main magnetic pole layer of the opposing face opposing the recording medium as an inverted trapezoid, thereby enabling the occurrence of side fringing to be prevented.

Abstract: The invention relates to a method for producing an electrolytically coated cold rolled strip, preferably for use in the production of battery sheaths. The cold rolled strip is provided with a cobalt or a cobalt alloy layer by an electrolytic method. The aim of the invention is to provide a battery sheath with low values for the electric contact resistance between the cathode substance of the battery and the inner surface of the battery sheath. To this end, organic substances m added to the electrolyte during coating that produce decomposition products, said decomposition produces and/or reaction products of said decomposition products with other components of the electrolytic bath being deposited on the strip material as a brittle layer along with the cobalt or the cobalt alloy.

Abstract: The present invention is directed to a process for forming a drug delivery device by electroplating onto a substrate a porous layer having pores of a controlled size and density and loading a drug into the pores. Preferably the drug delivery device is a gold stent plated with a gold porous layer.

Abstract: Embodiments of the present invention provide methods for enhancing void-free metallic filling of narrow openings by electrochemical deposition (ECD). The methods provide enhanced replenishment of plating inhibitor at the field, while depleting the inhibitor inside narrow openings. The resulting inhibitor gradients facilitate void-free ECD filling of narrow openings with large aspect ratios. The inventive methods utilize vigorous electrolyte agitation at the field and top corners of the openings, while maintaining a relatively stagnant electrolyte inside the openings. Vigorous agitation is produced, for example, by high pressure jets flow and/or by mechanical means, such as brush (or pad, or wiper blade) wiping, or by a combination of jets and wiping brushes.

Abstract: The invention relates to a method for producing a textured metal strip. In order to be able to implement a method of this type in a comparatively simple manner and thus cost-effectively, a metal layer (4) is galvanically produced on a textured substrate (1) having electrical conductivity, and the metal layer (4), while producing the textured strip (4a), is removed from the substrate (1).

Abstract: The present invention is directed to a method of creating porous anode foil for use in multiple anode stack configuration electrolytic capacitors, producing a pore structure that is microscopic in pore diameter and spacing, allowing for increased energy density with a minimal increase in ESR. Initially, an anode metal foil is etched, according to a conventional etch process, to produce an enlargement of surface area. The etched foil is then placed into the electrochemical drilling solution of the present invention. Alternatively, the etched foil may be masked, so that only small areas of the etched foil are exposed, prior to being placed in the electrochemical drilling solution. A DC power supply is used to electrochemically etch the masked or unmasked foil in the electrochemical drilling solution of the present invention such that pores on the order of a few microns diameter are produced through the foil.

Abstract: It is disclosed a method of depositing a MCrAlY-coating (6) on the surface (5) of a single crystal (SX) or directionally solidified (DS) article (1), wherein the article (1) is coated only at a local area by an electroplated method.

Abstract: An electrochemical method for generating both mesoporous metal and metal oxide films from dilute surfactant solutions by utilizing self assembly of surfactant-inorganic aggregates in the electric field of the solid-liquid interface at an electrode to specifically direct the morphology of the film. The surface of the working electrode serves as a solid-liquid interface in a plating solution containing surfactant and inorganic ions and salts.

Abstract: A PWB or multilayer board with circuit traces is treated by a process that serves to reduce the incident of failure of the board. The process includes the steps of applying a thin commoning layer of copper onto a catalyzed surface of the board substrate and the circuit lines. A photoresist is then applied over the commoning layer after which the photoresist is removed only from the commoning material over the circuit lines. A thin layer of a more noble metal, such as nickel, is electrodeposited over the exposed conductive layer. This is followed by a gold layer electrodeposited over the nickel in close registry therewith. The process provides the traces with a conforming nickel/gold layer that extends down the side of the traces. This reduces the tendency of a subsequent copper etch step from undercutting the nickel/gold, thereby causing slivers that could cause short circuiting between adjacent circuit patterns.

Abstract: The present invention relates to a method for producing surface-structured substrates, wherein a predetermined defined surface structuring is transferred to the surface of a substrate by activating the substrate surface using at least one fine probe that interacts with the substrate surface, and material of a liquid, solid, or molten salt electrolyte is electrochemically deposited in a selective manner on the regions of the substrate surface that are activated thereby. The invention also relates to a device for surface structuring of substrates.

Abstract: A sliding member having excellent seizure resistance comprising a metallic member provided with a sulfide-based solid lubricating layer on the sliding surface thereof is provided, characterized in that the interface of the metallic member in contact with said solid lubricating layer is provided with a surface roughness Rmax of 1 &mgr;m or higher. The sliding member above is obtained by preparing an aqueous solution dissolved therein one or two types or more of thiocyanates or thiosulfates of alkali metals or alkaline earth metals, and by performing electrolytic treatment in which a steel member the surface roughness thereof is controlled is used as the anode. In this manner, an iron sulfide based layer is formed on the surface of the steel member by using the Fe component derived from the steel and the S component from the solution as the reacting agents.

Abstract: A method of preparing a porous film comprises electrodepositing material from a mixture onto a substrate, the mixture comprising: (I) a source of metal, inorganic oxide, non-oxide semiconductor/conductor or organic polymer, (II) a solvent such as water; and (III) a structure-directing agent such as octaethylene glycol monododecyl ether in an amount sufficient to form an homogeneous lyotropic liquid crystalline phase in the mixture. Electrodepositing the film from a lyotropic liquid phase in this manner provides a porous film having a substantially regular structure and substantially uniform pore size. Following deposition, the porous film may be treated to remove the structure-directing agent.

Abstract: A substrate metal such as aluminum, usually in the form of a web, is anodized to form a porous oxide coating. A catalytic metal is then electrolytically deposited into the base of the pores preferably using an AC current. A portion of the oxide coating is then stripped away to expose the deposited catalytic metal at the surface of the remaining oxide layer. Alternately, a generally non-catalytic base metal may first be deposited followed by the deposition of the catalyst metal within the pores over the base metal. Further alternatives include stripping the oxide down to the base metal and then depositing the catalyst metal on the surface, further anodizing to form additional oxide between the deposited metal and the substrate, and enlarging the cross section of the base of the pores prior to the deposition of the metal.

Abstract: In order to simplify the sequence of creating a mask, in particular for producing a printing plate, and at the same time to improve the quality of the printing plate produced by means of a mask, the use of laser-induced thermal transfer is provided. The structure information is applied directly to the surface of a printing plate carrier during the creation of a mask, by means of a thermal transfer film and a laser image-setting unit, so that by means of the structure information applied, differentiation with regard to image points and non-image points can be carried out directly in order to produce a printing plate.

Abstract: Disclosed are electroplating baths for enhancing copper seed layers and for subsequent metallization on the seed layers. Methods of enhancing copper seed layers and depositing metal on such seed layers are also disclosed.

Abstract: The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion and causing greater plating of the cavity portion relative to the top portion.

Abstract: The present invention is applicable to composite particles for composite dispersion plating used for forming a self-lubricating composite dispersion coating and a method of plating using such composite particles as well as a plating (coating) using the same. The purpose of the invention is to obtain a composite particle for composite dispersion plating which is comprised of a particle with an excellent capability of reducing the friction and a low or very low specific gravity, and a method of plating using such composite particles. In this invention, each of the composite particles includes a friction-reducing mother or core particle (1) encapsulated with shell particles (2) comprised of the same components as a base metal of a composite dispersion plating bath (5). This provides a composite particle for composite dispersion plating which is comprised of a particle with an excellent capability of reducing the friction and a low or very low specific gravity.

Abstract: A process of producing an iron plating on a metal surface of a part is provided. The process includes the steps of forming and maintaining an electrolytic plating bath to comprise: 200-500 Gm/L ferrous sulfate; 20-70 Gm/L ferrous fluoborate; 10-35 Gm/L ammonium chloride; and an effective amount of wetting agent in an aqueous solution; maintaining the pH of the bath in the range of 1.5 to 4.2; maintaining the temperature of the bath in the range of 100° F. to 160° F.; and maintaining the current density in the bath in the range of 2 to 60 amps/sq.ft. At least the metal surface of the part to be plated is contacted with the electrolytic plating bath. According to a further aspect of the invention, during electroplating, the pH, the temperature, and/or the current density are changed within their specified ranges to control the microstructure of the electrodeposited iron.

Abstract: The invention concerns the manufacture of complex metallic or metallized porous structures, wherein the electroplating metal over the entire developed surface is preceded by a specific pre-metallization of the basic structure. The pre-metallization is obtained by depositing a conductive polymer, which is deposited on the entire developed surface of the structure by the steps of an oxidizing pre-treatment of the structure, depositing in the liquid phase, a monomer having a polymerized foam that is electrically conductive, and polymerizing oxidation-doping of the monomer. The structures according to the invention are particularly intended for use as electrodes for the electrolysis of liquid effluents, as electrode supports for electrochemical generators, as catalyst supports, filtration media, phonic insulation, electromagnetic and nuclear protection structures, or for other applications.

Abstract: A structured surface coating is electrochemically deposited on an (electrically conductive) surface of a component. The component to be coated forms the cathode in a galvanic bath. The process current is raised in discrete steps in a nucleation phase during which island formations are deposited on the surface, with brief pauses between each increase of between 0.1 and 30 sec. The process current is then maintained at a constant level, during which the islands grow. The process sequence may be repeated several times.

Abstract: An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in resistance against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in copper foil coated with an anti-corrosive layer formed of a zinc-copper-nickel ternary alloy. Another object is to impart excellent moisture resistance to the surface-treated copper foil.

Abstract: A one-step, integrated process and apparatus for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two “super anodes” on a rotating drum cathode to deposit the treatment.

Abstract: An air gap semiconductor structure and corresponding method of manufacture. The method includes forming a sacrificial polymer film over a substrate having metal lines thereon. A portion of the sacrificial polymer film is subsequently removed to form first spacers. A micro-porous structure layer is formed over the substrate and the metal lines and between the first spacers. A portion of the micro-porous structure layer is removed to form second spacers. The first spacers are removed by thermal dissociation to form air gaps. A dielectric layer is formed over the substrate and the metal lines and between the second spacers.

Abstract: This invention provides a composite foil comprising an aluminum carrier layer and an ultra-thin copper foil having a protective layer disposed between them comprising a porous copper layer and an interpenetrating zinc layer. A process for producing such composite foils comprises the steps of preparing the surface of the aluminum carrier, electrodepositing a porous copper layer on the aluminum carrier layer followed by electrodepositing a zinc layer, and then electrodepositing two layers of copper to form the ultra-thin copper foil. The composite foil provides a uniform bond strength between the aluminum carrier and the protective layer which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate.

Abstract: A structured surface coating is electrochemically deposited on an electrically conductive surface of a component. The component to be coated forms the cathode in a galvanic bath. The process current is raised in discrete steps in a nucleation phase during which island formations are deposited on the surface, with brief pauses between each increase of between 0.1 and 30 sec. The process current is then maintained at a constant level, during which the islands grow. The process sequence may be repeated several times.

Abstract: A method for rendering a surface of a contact rough includes submerging the surface of the contact in an electroplating bath having a dissolved metal salt, and pulsing an electric current through the contact and the bath to form a rough metallic structure on the surface of the contact.

Abstract: Process suitable for providing a substrate with a protective coating based on chromium, including a chromium matrix in which solid particles are distributed. The process includes a step of electrodeposition of the coating carried out by passing an electric current between a cathode or cathodes of the substrate to be coated and an anode or anodes. The cathode(s) and anode(s) are immersed in an electroplating solution, wherein the electroplating solution is based on an aqueous solution including trivalent chromium obtained from the reduction of chromic acid by a reducing agent, and contains solid particles.

Abstract: A method of making a composite structure including at least a plating film disposed on a substrate having at least a surface portion formed from a metallic base material. The method includes the steps of discharging a composite plating solution containing insoluble particles from a nozzle and impacting the composite plating solution on the surface portion of the substrate at a predetermined flow rate. During at least a portion of the discharging and impacting steps, the surface portion of the substrate is abraded with the insoluble particles in the plating solution discharged from the nozzle. A voltage can be applied between the base material and the nozzle, which are electrically connected by the plating solution, to thereby deposit a plating film on the surface portion of the substrate by electroplating.

Abstract: A method for manufacturing a zinciferous plated steel sheet, comprises: forming a zinciferous plating layer on a steel sheet; and forming an Fe--Ni--O film on the zinciferous plating layer. The Fe--Ni--O film is formed by carrying out electrolysis with the steel sheet as a cathode in an aqueous solution, dipping the steel sheet in an aqueous solution, or spraying a mist on a surface of the zinciferous plating layer.

Abstract: A porous nickel electrode substrate having a central high conductivity core sandwiched between two layers of porous conductive material such as nickel foam or nickel felt. The porous conductive material is plated with nickel and then sintered. By selectively controlling the plating of nickel on the porous material, variable conductivities may be designed into the substrate.

Abstract: A substrate metal such as aluminum or titanium, usually in the form of a web, is anodized to form a porous unsealed oxide coating. An inexpensive core metal such as copper or chromium is then electrodeposited in the pores of the oxide coating to form metal nodules extending above the oxide coating in a bulbous, undercut configuration. A second metal, usually an expensive catalytic metal, is deposited onto the surface of the core metal nodules by electro or chemical deposition. A large surface area of catalyst is formed with the use of a minimum amount of catalyst metal. The nodules may be liberated from the substrate metal surface by dissolving the oxide layer and releasing discrete particles to form a fine catalyst powder.

Abstract: A composite plating film is prepared from a composite plating solution containing a metal matrix and insoluble particles 4 dispersed therein or deposited therewith. The composite plating film has a non-uniform concentration of insoluble particles along a direction of the thickness of the composite film. The non-uniform concentration is achieved by changing the discharge rate of composite plating solution during deposition of the film on the base material.

Abstract: An electroformed tool that has a uniform air-releasing hole system with high strength and a simple and convenient method to manufacture it has been created. The method includes conducting electroforming by mixing a non-leveling agent with an electrolytic solution and forming an electroformed layer which has a continuous air-releasing hole structure.

Abstract: A magnetic recording medium having a substrate made of aluminum or aluminum alloy and an anodic-oxide film, e.g., alumite film, formed by effecting the anodic oxidation process, wherein the surface of the alumite film has protruding portions formed in addition to micro-irregularities which are formed in response to the cell-pore structure of the alumite film and height of the protruding portions is higher than that of the micro-irregularity, and density of the protruding portions is ranging from 10.sup.2 to 10.sup.7 per one square millimeter, these protruding portions are formed by processing the alumite film in the fluorine-contained solution (e.g., hydrofluoric acid) or in solution containing one of the acid (HCl), base (NaOH) and strong-acid salt ((NH.sub.4)SO.sub.4), Cr film and magnetic film are sequentially formed on the alumite film by the sputtering process.

Abstract: An integrated circuit chip having solder bumps thereon may be tested using a temporary substrate having substrate pads corresponding to locations of the input/output pads on the chip and having a sacrificial conductor layer on the temporary substrate pads. The solder bumps are placed adjacent the corresponding sacrificial metal layer and heated to form an electrical and mechanical connection between the chip and the temporary substrate. The chip is then tested and/or burned-in on the temporary substrate. After testing/burn-in, the sacrificial metal layer is dissolved into the solder bumps by heating. The integrated circuit chip, including a solder bump having the dissolved sacrificial metal layer therein, may be easily removed from the temporary substrate. Solder bumps may also be formed on the temporary substrate and transferred to unbumped chips.

Abstract: A method of manufacturing a screen printing plate which can be obtained without using a mother mesh sheet and a resist film including a step of providing a non-plating area on the roll and exposing the roll coated with high-sensitivity photosensitive film by a multiple number of laser beams. The multiple number of laser beams are controlled by preset electric data so that the desired halftone points of negative halftone image are exposed on the roll.

Abstract: A copolyester film was laminated onto a steel sheet, this sheet having double layers consisting of a lower layer of metallic chromium and an upper layer of hydrated chromium oxide on a tin plated steel sheet in which 5 to 40% of the surface of the steel sheet is covered with plated tin and the remainder of the steel surface is exposed and the space between plated tin particles is 0.5 to 50 .mu.m, and a method for production of this copolyester resin film laminated steel sheet which comprises: (a) electroplating with tin under restricted conditions, (b) formation of said double layer on the plated tin and exposed steel surface and (c) lamination of the copolyester resin film at a temperature above the melting temperature of tin.

Abstract: An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

Abstract: Process for producing color change devices incorporating areas of contrasting appearance, and the devices so produced. The process involves masking limited areas of a layer of a color generating metal (e.g. Ta or Nb, especially commercially sputtered Ta foil), with a mask made of a material which permits anodization of an underlying surface and permits penetration of fluoride as an adhesion-reducing agent at levels employed in the process. The masked metal layer is anodized to form an anodic film on the metal, the anodization being carried out in an electrolyte containing fluoride at a concentration high enough to (a) weaken the adhesion of the anodic film to the underlying metal over the entire area of the film, and (b) to introduce voids in the anodic film in areas not covered by the mask to reduce the density, and thus the refractive index, of the film in these areas compared to areas covered by the mask. Finally the mask is removed.

Abstract: In a method of making molds with microstructured recesses having a continuous base covered by a film of an electrically conductive material for forming in the recesses, by electrodeposition, microstructured plate-like bodies a microstructure master mold is pressed into a layer of thermoplastic material coated with a film of an electrically conductive material at a temperature which is above the softening temperature of the thermoplastic material such that the thermoplastic material with the electrically conductive film thereon first contacts the microstructure face and then enters the recesses in the microstructure. The master mold and thermoplastic material are then cooled and the master mold is removed whereby the thermoplastic material provides a negative mold of the microstructure having a continuous electrically conductive film disposed on the recess bases whereas the remainder of the electrically conductive film is broken apart and disposed in isolated spangles on the rest of the microstructured mold.