Abstract: A process is provided for producing an abrasive coating on a substrate surface by applying a bond coat by low pressure plasma spraying and anchoring to the bond coat abrasive particles by electroplating and embedding the particles into an oxidation resistant matrix by entrapment plating.

Abstract: A process and apparatus for selectively electroplating the tip portion of an airfoil. The airfoil includes a root portion and a blade portion having a tip. At least part of the blade including the tip is coated with an insulating material. Insulating material is removed from the tip and the airfoil is mounted in a fixture so that the tip is exposed. The fixture is immersed in a sealing bath, and the fixture and at least a portion of the airfoil is encased in sealing material while leaving the tip exposed. The fixture is then immersed in an electroplating bath, the exposed tip is electroplated, and the fixture is removed from the bath.

Abstract: An extremely small aperture is formed using a sharp conductive tip. The aperture may be in the form of a transparent window or an open aperture. In a first embodiment, the conductive tip is positioned adjacent a layer of titanium and a voltage is applied to the tip. The intense electric field near the tip anodizes the titanium and creates a small transparent window of titanium dioxide. In a second embodiment, a titanium layer is covered with a layer of silicon, a small region of the silicon is oxidized using a conductive tip, and the silicon and then the titanium are etched. In a third embodiment, an electric field from a conductive tip creates a pit in a surface titanium oxide layer. The titanium is then etched, using the oxide layer as a mask, to form an open aperture. The conductive tip is preferably the tip of an atomic force microscope.

Abstract: Electrical conductors (2) embedding filaments (4) of a fabric (3), and substantially filling interstices (5) that coextend with the imbedded filaments (4), are fabricated by plating conductive material onto a surface (14) of a passivated cathode against which the fabric (3) is held. Resist material (19) conforms the conductive material to form an array of electrical conductors (2).

Abstract: An apparatus and a method for its use for plating pin grid array packaging modules, with a fixture capable of simultaneously holding a plurality of said pin grid array modules such that three-dimensional bottom surface metallurgy (BSM) is sealingly protected during plating of top surface metallurgy (TSM).

Abstract: A new field of technology, near-field photolithography, is proposed. In near-field photolithography, an opaque pattern having a nanoscale resolution is made using a modified scanning tunneling microscope to deposit the opaque material on an electrically conductive material. A transparent sheet of indium tin oxide is patterned with a plurality of opaque copper deposits having a nanoscale resolution. The patterned indium tin oxide is then used as a photolithographic mask in the optical near-field. Near-field resolution is not diffraction limited, and near-field photolithography is able to pattern objects with sub-wavelength resolution. As a result, smaller semiconductor microchips can be manufactured and a new nanotechnology, e.g., nanomachines, can be developed. The scanning tunneling microscope (STM) is used as an "electrochemical paintbrush" to transfer the copper from a massive copper supply to the STM electrode tip and then to the ITO surface without degrading the STM tip.

Abstract: Conductive circuits are formed by first metallizing a surface of a molded synthetic resin substrate to form an electrically conductive metallic film coating thereon of a thickness (e.g., between 0.2 to 2 .mu.m) effective to exhibit sufficient electrical conductivity for subsequent electroplating thereon. Non-circuit portions of the metallic film coating are thereafter removed with laser light so as to expose an underlying surface portion of the substrate and thereby form a circuit pattern on the substrate surface which is established by a portion of the metallic film remaining on the substrate surface. An additional metal layer may then be electroplated directly onto the remaining portion of the metallic film to thereby form the conductive circuit.

Abstract: The present invention involves in situ laser patterning of thin-film layers during sequential deposition of the different layers. The layers may be applied using any known method of film deposition. The method of the present invention involves laser ablation to remove unwanted portions of the coating layers, including color filter materials, that have been sequentially deposited onto substantially the entire surface of a substrate. By controlling the depth of the laser ablation removal of the deposited films, it is possible to remove any portion of a film or layers of films or coatings that have been sequentially coated onto the surface of the substrate and to thereby control the depth and location of color filter materials coated upon the substrate. This patterning process can be employed in conjunction with any film deposition technique known in the art, including vacuum, wet chemical or dry processing deposition techniques, but is preferred with vacuum deposition.

Abstract: The present invention provides a method for producing an oxide film wherein a sharp-pointed processing electrode is positioned close to the material to be processed in an oxygen-containing gas, and a voltage in the single digit range is impressed across the material and the electrode so that the surface of the material is positive and the electrode is negative thereby causing an electric current to flow across the material and the electrode. The surface of the material reacts electrochemically with oxygen adsorbed on the surface of the material to anodize the surface immediately proximate the electrode. The method makes possible the formation of a patterned oxide film with a resolution of 0.1 .mu.m or less, thus surpassing the limit of conventional oxide film production methods.

Abstract: An apparatus for simultaneously anodizing the heads of several aluminum pistons includes a plating tank with an array of apertures extending through one side wall, one aperture for each piston; a fixture on the wall providing a cylindrical bore aligned with each aperture adapted to receive a piston; and a plurality of actuators which, when pivoted and locked into alignment with the fixture bores, operate to secure individual pistons in their respective apertures. A masking/sealing assembly within each fixture bore ensures that each aperture is sealed upon the securing of a piston therein, with only the piston's head and peripheral land being placed in fluid communication with the interior of the plating tank. A remote storage tank provides a supply of an electrolyte which is circulated by a fluid supply network between the storage tank and the thus-sealed plating tank during electrolysis. After the desired coating is achieved, the electrolyte is drained from the tank.

Abstract: A method and apparatus for depositing emitter material (3) on a wire cathode by means of electrodeposition. An amount (13) of a suspension comprising an alkaline-earth compound is transferred by a drop holder (11) which is positioned around the wire (2), by movement in a direction transverse to a longitudinal axis of the wire (2), whereafter an electric voltage is applied to the drop holder (11) and the wire (2) to deposit the emitter material (3) on the wire (2), after which the drop holder (11) is withdrawn from the wire (2) again. During the electrodeposition process the drop holder (11) and the wire (2) can be moved with respect to each other along sections of the wire (2) where the emitter material (3) has to be deposited.

Abstract: A method of and apparatus for producing abrasive tips on compressor or turbine rotor blades by electrolytic or electroless deposition in which the blades are mounted in a hollow jig with the tips of the blades extending through sealed openings in the jig and abrasive tips are formed on the tips. The parts of the blades within the hollow jig are isolated from the electrolyte without the need for wax masking. Preferably the jig is cylindrical with the blades extending radially through at least one circumferential row of apertures. The jig may comprise two end discs and at least one ring in which a circumferential row of apertures is formed. The ring is positioned between the end discs and means are provided for securing the discs and ring together.

Abstract: A porous nickel electrode substrate having a central high conductivity core sandwiched between two layers of porous conductive material such as nickel foam or nickel felt. The porous conductive material is plated with nickel and then sintered. By selectively controlling the plating of nickel on the porous material, variable conductivities may be designed into the substrate.

Abstract: A method for the electroplating of conductive metal onto a substrate containing at least one hole and an electroplateable surface which is conducive to subsequent metal deposition comprises placing the substrate in close proximity to an electrode but such that there is no substantial electrical continuity between the electroplateable surface and the electrode prior to electroplating. The electroplateable surface is preferably an electroplateable pattern which comprises either a conductive metal pattern or a catalytic pattern for subsequent plating. This process can be employed with any electroplateable pattern technique which is recognized in the art such as, for example, printing, stamping, plating, photographic or electrophotographic processes. In one embodiment, this process can be employed in the production of Plated Wire, i.e., a product which can be effectively employed as a replacement for drawn wires in power distribution applications.

Abstract: A method for forming solid electrolytic capacitors provides for anode lead and body surface with increased dielectric thickness as distinguished from a dielectric thickness formed within the inner anode body such that a capacitance value associated therewith is not substantially decreased. The method includes the steps of anodizing the anode to form a predetermined dielectric thickness on the anode and then soaking the anode in a solvent to impregnate an inner portion thereof with the solvent. The solvent is removed from surface areas desired to be coated by a further dielectric layer and thereafter again anodized whereby additional dielectric build-up is limited to the solvent free areas. The solvent is driven off resulting in a capacitor preform which is reinforced by thickened dielectric without capacitance loss which would result from depositing additional dielectric interiorly in the areas insulated from build-up by the solvent.

Abstract: An apparatus and method for simultaneously anodizing the heads of several aluminum pistons includes a plating tank having an array of apertures extending through one of its side walls, one aperture for each piston; and means for securing the head of each piston in its respective aperture. A seal disposed in each aperture ensures that the aperture is sealed upon the securing of the piston therein, with only the piston's head being placed in fluid communication with the interior of the plating tank. An acid electrolyte is directed into the plating tank through electrically-conductive sparging nozzles positioned therein opposite the heads of the pistons, thereby forming an electrolytic cell with the pistons as anodes and the sparging nozzles as cathodes. A power supply simultaneously applies a current to the cell, i.e., across the electrolyte via the pistons and sparger nozzles, to effect electrolytic coating of each piston's head.

Abstract: A process for forming an electrical circuit component includes forming an initial metal layer on a surface of a synthetic plastics substrate, and irradiating the initial metal layer with laser light along a closed path so as to remove the initial metal layer therealong. The closed path irradiated by the laser light thereby establishes an insulating region covered by a first portion of the initial metal layer which is bounded by the closed path, and a conducting region covered by a second portion of the initial metal layer which surrounds the closed path and the insulating region established thereby. A further metal layer is then formed over the second portion of the initial metal layer of the conducting region. The first portion of the initial metal layer of the insulating region may thus be removed to thereby expose a corresponding surface portion of the synthetic plastics substrate.

Abstract: The invention is a method for making a metal containing article, comprising the steps of: providing a layer of a porous ground in a selected area; exposing selected regions of the layer of porous ground to light, thereby metallizing the selected regions; repeating the foregoing steps a selected number of times to produce a selected number of layers; and selectively modifying the metallized regions of the layers. The initial metallization can be by electroless or semiconductor photo deposition plating. The subsequent modification of the metallized regions can be by electroless plating, electroplating or sintering. It is also possible, in some instances, to forego the second phase modification, the initial phase having provided the desired parameters. In a third preferred embodiment, the invention is a method using an initial metallization phase effected by exposure of a metal salt, such as a metal halide, to light, thereby inducing activation of the halide.

Abstract: The present invention relates to a method and apparatus for forming abrasive surfaces on the tips of a plurality of workpieces such as the tips of gas turbine airfoil blades. The method broadly comprises the steps of providing a mechanical masking device having a plurality of openings arranged around the circumference of the device, installing an array containing a plurality of workpieces to be coated within the mechanical masking device so that portions of the workpieces including the tips thereof extend through the openings, immersing the mechanical masking device with the installed array of workpieces in a tank containing a plating bath with a matrix material and an abrasive grit material in slurry form so that the workpieces lie in a substantially horizontal plane, and applying a current through the plating bath to form the abrasive surfaces on the tips of the workpieces. The mechanical masking device protects portions of the array from the coating operation.

Abstract: Apparatus and method for the electrolytic deposition of a metal on a weakly conductive, flexible substrate such as a textile or a paper sheet for the manufacture of flexible heating elements such as heated gloves, heated car seats, panels used in construction for the heating of rooms, etc. Metallic circuits of varying shapes can be formed on the weakly conductive, flexible substrate.

Abstract: A method is provided for partially plating, for example, strip-shaped metallic straps which are parts of a support grid for a nuclear fuel assembly, and further relates to a masking jig for use in the method. The masking jig has a plurality of tubular bodies and a support plate on which the tubular bodies are fixed. A pair of slits is formed in each of the tubular bodies. When carrying out partial plating, a strap is inserted into the slits so that each of the portions of the strap not to be plated are arranged within each of the tubular bodies. By subsequently carrying out plating, a plating layer can be formed on the portions of the strap to be plated, without forming a plating layer on the portions of the strap not to be plated. Moreover, it is possible to prevent any damage from being inflicted to the portions not to be plated due to external force.

Abstract: Encapsulated liquid crystal is deposited onto an electrode by providing a substrate having an electrode pattern thereon; placing the substrate and the electrode pattern in contact with an electrodeposition medium comprising a liquid crystal composition, a containment medium or precursor therefor, and optionally a carrier medium; and depositing encapsulated liquid crystal material comprising the liquid crystal composition dispersed in the containment medium onto the electrode pattern or selected portions thereof by applying a voltage to the electrode pattern or selected portions thereof. The coated substrate-electrode combination can then be made into displays, privacy screens, signs, architectural partitions, and the like.