Abstract: A structure and a method of preventing electrolytic corrosion for a magnesium alloy member (20), the structure wherein a first coated layer (11) formed by electro deposition and a second coated layer (12) formed by distributing PTFE particles on the first coated layer (11) are covered on the surface of a tightening member (1) at least on a surface coming into contact with the magnesium alloy member (20), whereby, the electrolytic corrosion of the magnesium alloy member can be prevented at a low cost by insulating a tightening member such as a steel bolt and a washer from the magnesium alloy member, and an adhesiveness therebetween can be sufficiently assured.

Abstract: An embodiment of the invention is a method of manufacturing copper interconnects 30 on a semiconductor wafer 10 where an electroplating process is used to deposit a first layer of copper grains 30d having an initial grain size and a second layer of copper grains 30e having a different initial grain size.

Abstract: The optical fiber manufacturing method according to the present invention is characterized by having the steps of forming, on the peripheral surface of a bare fiber having been exposed by removing a resin cover and on which a metallic coating has not been provided, a subbing layer consisting of an electroless Ni plating layer and an electrolytic Au plating layer; subjecting the bare fiber on which the subbing layer has been formed, to end face treatment by means of an optical-fiber cleaver to expose an end face portion of the bare fiber; and subjecting the bare fiber on which the end face treatment has been carried out, to electrolytic plating to form a metallic coating as a surface layer, consisting of an electrolytic Ni plating layer and an electrolytic Au plating layer.

Abstract: A turbine engine component comprising a substrate made of a nickel-base or cobalt-base superalloy and a protective coating overlying the substrate, the coating formed by electroplating at least two platinum group metals selected from the group consisting of platinum, palladium, rhodium, ruthenium and iridium. The protective coating is typically heat treated to increase homogeneity of the coating and adherence with the substrate. The component typically further comprises a ceramic thermal barrier coating overlying the protective coating. Also disclosed are methods for forming the protective coating on the turbine engine component by electroplating the platinum group metals.

Abstract: The present invention is directed to a method and apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conductor is stored in a reservoir and pump through an inlet channel to the liquid chamber. The liquid conductor is injected into a liquid chamber such that the liquid conductor makes contact with the outer surface of the workpiece. An inflatable tube is also provided to prevent the liquid conductor from reaching the back face of the workpiece. A plating solution can be applied to the front face of the workpiece where a retaining ring/seal further prevents the plating solution and the liquid conductor from making contact with each other. In an alternative embodiment, electrical contacts may be formed using an inflatable tube that has either been coated with a conductive material or contains a conductive object.

Abstract: Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling.

Abstract: A two-step method of filling copper into a high-aspect ratio via or dual-damascene structure. The first step sputters at a low temperature of no more than 100° C. and with at least portions of high wafer bias, thereby filling a lower half of the hole. The initial copper sputtering is preferably performed through multiple cycles of low-level and high-level pedestal bias to deposit copper on exposed corners and to sputter resulting overhangs from the corners while depositing deep in the hole. The second step may include either electrochemical plating or sputtering performed at a higher temperature, e.g., at least 200° C. and with lower wafer bias to complete the hole filling. In another aspect of the invention, diffusion promoting gas such as hydrogen is added to the copper sputter plasma.

Abstract: An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crystal particle in a direction perpendicular to the lead base material surface and in a direction parallel thereto, taken on a cut surface of the metal thin film defined by a given plane cutting the metal thin film in a direction perpendicular to the lead base material surface. Such constitution provides an electronic component having an external terminal coated with a metal thin film of a simple structure constituted of Sn or a Sn-based and substantially Pb-free alloy, formed by plating on a surface of a lead base material.

Abstract: A thermal barrier coating system having an improved life as a result of a preoxidation treatment applied to a single phase platinum aluminide bond coat. After coating the substrate to form a diffusion platinum aluminum bond coat, the surface finish of the bond coat was grit blasted with an inert grit of preselected size at a preselected pressure to achieve a predetermined surface finish. After the grit blasting, but before application of the ceramic top coat of yttria-stabilized zirconia (YSZ), the coating was preoxidized to form a thin alumina scale by heat treating the diffusion platinum aluminide bond coat at an elevated temperature at a preselected partial pressure of oxygen.

Abstract: The chemical composition of thin films is modulated during their growth. A computer code has been developed to design specific processes for producing a desired chemical composition for various deposition geometries. Good agreement between theoretical and experimental results was achieved.

Abstract: A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills at least one aperture so as to form a partially-filled aperture; and (3) a molecular layer comprising at least one molecule having a hydrophilic region and a hydrophobic region, wherein the hydrophilic region at least partially extends into the partially-filled aperture. Also, provided are coated metallic meshes having bilayers and a method of providing a molecular layer to a coated mesh.

Abstract: Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.

Abstract: Disclosed is a method of electroplating a Ni—Fe—P alloy using a sulfamate solution and, in particular, a method of electroplating a Ni—Fe—P alloy using a plating solution containing nickel sulfamate, iron sulfamate, phosphorous acid, and a buffer agent. The method is advantageous in that a residual stress of a deposited layer is very low and has stable mechanical properties, and excellent thermal and corrosion resistance because the deposited layer is obtained by electroplating the Ni—Fe—P alloy using the sulfamate solution useful in a high rate plating process. Furthermore, the method can be applied to various parent metals such as stainless steel, Inconel and iron alloys, and to various fields because the chemical compositions of the deposited layer are readily controlled by varying the concentration of the plating solution.

Abstract: Improved biosensors are provided having excellent selectivity and stability properties, together with methods of preparing the biosensors. A preferred biosensor includes an electrode (12) having enzyme (16) deposited thereon together with a layer of electropolymerized polymer (18) intermingled with the enzyme (16); a crosslinked silane film (20) is applied over the polymer layer (18), and a final coating (22) of polyurethane is formed over the film (20). In preparative procedures, the enzyme (16) is electrodeposited using an aqueous enzyme solution containing a nonionic surfactant at a concentration level preferably in excess of the critical micelle concentration of the surfactant. In the case of a glucose sensor, the polymer layer (18) is preferably polyphenol, while the silane film is crosslinked (3-aminopropyl) trimethoxysilane. The preferred biosensors have greatly enhanced selectivity stabilities.

Abstract: A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting the metal mesh to a relatively fast deposition of an electrodeposited material so as to substantially uniformly coat said mesh with electrodeposited material; and (3) subjecting the product of the relatively fast deposition step to a relatively slow deposition of an electrodeposited material so as to reduce at least one dimension greater than nanometer scale size to a size of nanometer scale. Also provided are metallic meshes so prepared and spectral filters.

Abstract: Electroplating methods using an electroplating bath containing metal ions and a suppressor additive, an accelerator additive, and a leveler additive, together with controlling the current density applied to a substrate, avoid defects in plated films on substrates having features with a range of aspect ratios, while providing good filling and thickness distribution. The methods include, in succession, applying DC cathodic current densities optimized to form a conformal thin film on a seed layer, to provide bottom-up filling, preferentially on features having the largest aspect ratios, and to provide conformal plating of all features and adjacent field regions. Including a leveling agent in the electroplating bath produces films with better quality after subsequent processing.

Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrodes which have a contact face which bears against the workpiece and conducts current therebetween. The contact face is provided with a contact face outer contacting surface which is made from a contact face material similar similar to the workpiece plating material which is to be plated onto the semiconductor workpiece. The contact face can be formed by pre-conditioned an electrode contact using a plating metal which is similar to the plating materials which is to be plated onto the semiconductor workpiece.

Abstract: A heat-resistant resin film having a metallic thin film accumulated thereon or an endless belt having a metallic thin film accumulated thereon having good mechanical characteristics is produced in a simple process. A metallic thin film is formed on an inner surface of a cylindrical substrate, and a layer of a heat-resistant resin is formed thereon. An accumulated body of the heat-resistant resin and the metallic thin film is peeled off from the substrate. The metallic thin film may be formed by electroplating, electroless plating or vapor deposition, or may also be formed by attaching a metallic foil having been prepared on an inner surface of the substrate. The heat-resistant resin layer is formed by injecting a polyamide acid solution in a rotational drum, and then formed by centrifugal forming by rotating the rotational drum on rollers under heating. After forming, imidization is conducted by heating and baking to form a film member of a thermosetting polyimide.

Abstract: A large surface area electrode well-suited to electrochemical applications is produced by winding many turns of a metallic fiber tow on to a sheet metal rectangle. In the preferred embodiment, an anode that can be used to purify water by electrochemical production of hydroxyl free radical is made by winding titanium fiber tow on to a rectangular substrate made of titanium sheet, and applying a suitable multilayered electrocatalytic coating. Made of other metals, an electrode of this description can also serve as the cathode of an electrochemical cell, or as a battery plaque.

Abstract: The invention relates to a method for producing an ultraphobic surface on aluminium as the supporting material and to the resulting surface and its use. According to said method, the surface of an aluminium support is anodized, especially by anodic oxidation, and/or electrochemically pickled in an acid solution with an alternating voltage, treated in hot water or water vapor at a temperature of 50 to 100° C., optionally coated with an adhesion promoter layer and then provided with a hydrophobic or especially oleophobic coating.

Abstract: MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator.

Abstract: Methods to at least partially reduce a niobium oxide are described wherein the process includes heat treating the niobium oxide in the presence of a getter material and in an atmosphere which permits the transfer of oxygen atoms from the niobium oxide to the getter material, and for a sufficient time and at a sufficient temperature to form an oxygen reduced niobium oxide. Niobium oxides and/or suboxides are also described as well as capacitors containing anodes made by fabricating a pellet of niobium oxide and heat treating the pellet in an atmosphere which permits the transfer of oxygen to a getter material, and for a sufficient time and temperature to form an electrode body, and anodizing the electrode body.

Abstract: A process for applying a metal layer to surfaces of light metals is proposed, in which iron is electrolytically deposited on the surfaces from a deposition bath containing Fe(II) compounds using dimensionally stable anodes insoluble in the deposition bath. The process is especially suitable for coating cylinder faces of internal combustion engines and of rotationally symmetrical parts with layers having very high wear resistance, especially of valves, nozzles and other parts of high-pressure injection systems for motor vehicle engines. In addition, the present invention pertains to nanocrystalline iron-phosphorus layers, which can be formed preferably by depositing iron in the presence of compounds containing orthophosphite and/or hypophosphite. These layers also have good corrosion resistance besides the good wear resistance.

Abstract: An anode is configured to be used within a metal film plating apparatus. The anode has a substantially planar electric field generating portion and an electrolyte solution chemical reaction portion. The planar electric field generating portion is coated with an inert material that is impervious to the electrolyte solution. In one embodiment, the anode is formed as a perforated anode. In one aspect, the electric field generating portion is formed contiguous with the electrolyte solution chemical reaction portion. In another aspects, the planar electric field generating portion is formed as a distinct member from the electrolyte solution chemical reaction portion.

Abstract: An apparatus for plating small-sized plating-pieces has a cathode and a plurality of grooves are formed on the surface of the cathode which is to come into contact with small-sized plating-pieces, so that an electric field can be concentrated onto the vicinities of the grooves. Thus, the electric field can be sufficiently dispersed on the whole cathode.

Abstract: A method for making conductive particles that efficiently permit a plated layer of uniform thickness to be formed over each of the particles without aggregating the particles in a plating liquid.

Abstract: The orientation of a wafer with respect to the surface of an electrolyte is controlled during an electroplating process. The wafer is delivered to an electrolyte bath along a trajectory normal to the surface of the electrolyte. Along this trajectory, the wafer is angled before entry into the electrolyte for angled immersion. A wafer can be plated in an angled orientation or not, depending on what is optimal for a given situation. Also, in some designs, the wafer's orientation can be adjusted actively during immersion or during electroplating, providing flexibility in various electroplating scenarios.

Abstract: For use in a fuel cell, constituted by plural cells, a separator that can reduce fluctuations in electromotive force across respective cells. A method for producing a separator in which a recessed gas path is formed. Depth fluctuations of the gas path can be reduced. It is formed easily even if the separator is formed of a hard material. The gas path having plural depths or gradation can be formed easily. An electrically conductive member 3, as a separator, and a processing electrode 16, having patterned electrode projections 20, are immersed in an electrolytic solution facing each other. Current is fed between member 3 and electrode 16 for electrolytic processing to dissolve the portion of the member 3 facing projections 20, thus forming a gas path 30 having a surface roughness Rz on this bottom surface 30e not larger than 1 &mgr;m.

Abstract: Methods to at least partially reduce a niobium oxide are described wherein the process includes heat treating the niobium oxide in the presence of a getter material and in an atmosphere which permits the transfer of oxygen atoms from the niobium oxide to the getter material, and for a sufficient time and at a sufficient temperature to form an oxygen reduced niobium oxide. Niobium oxides and/or suboxides are also described as well as capacitors containing anodes made from the niobium oxides and suboxides.

Abstract: A system for electroplating integrated circuit wafers includes an electroplating solution containment chamber having a first end that is capable of supporting an integrated circuit wafer so that a surface of the wafer faces an internal volume of the chamber, and a second end opposing the first end across the internal volume. The system further includes a liquid directing element at the second end. The liquid directing element includes a plurality of channels having divergent axes so as to direct a helical flow of electroplating solution toward the surface of the integrated circuit wafer when the wafer is present and the liquid directing element is attached to a source of pressurized electroplating solution.

Abstract: A plating method comprising using a plating solution containing an additive satisfying the following conditions: 0.005×h2/w<D/&kgr;<0.5×h2/w, and 0.01≦&THgr;≦0.

Abstract: This self-compensating spiral for a mechanical spiral balance-wheel oscillator in watchwork or other precision instrument, made of a paramagnetic alloy, contains at least one of the elements Nb, V, Ta, Ti, Zr, Hf and is covered with a substantially uniform oxide layer having a thickness greater than or equal to 20 nm, formed by subjecting the said spiral to an anodizing treatment.

Abstract: A method of plating which improves the uniformity of a plated coating thickness without changing the flow velocity of a feed plating solution. An aperture at a center of a mesh anode electrode of a plating apparatus produces an electric field density distribution between the mesh anode electrode and a wafer that is lower in the central portion of the wafer than at the edge portion of the wafer.

Abstract: A dendritic sponge which is directionally-grown on a substrate material has a high surface to volume ratio and is suitable for forming anodes for highly efficient capacitors. A dielectric film is formed on the sponge surface by oxidizing the surface. In a preferred embodiment, the dielectric is grown on titanium sponge and is doped with oxides of Ca, Mg, Sr, Be, or Ba to improve the film's dielectric constant or with higher valent cations, such as Cr6+, V5+, Ta5+, Mo6+, Nb5+, W6+, and P5+, to reduce the oxygen vacancy concentration and leakage current of the dielectric film. A capacitor formed from the sponge includes a cathode electrolyte which serves as an electrical conductor and to repair the dielectric film by re-oxidizing the anode surface at areas of local breakdown. Sponges of titanium, tantalum, and aluminum form efficient dielectric films.

Abstract: Deposition of conductive material on or removal of conductive material from a wafer frontal side of a semiconductor wafer is performed by providing an anode having an anode area which is to face the wafer frontal side, and electrically connecting the wafer frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the wafer frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the wafer is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the wafer frontal side surface, in its entirety, is thus permitted.

Abstract: A method for providing a tin-plated wire which is free from thermal oxidation yellowing. In a tin-plated wire which comprises a core wire 1 with its surface being formed with a tin-plating layer 2, the composition of the plating is comprised of 30 to 500 wppm gallium, and tin or tin alloy that makes up the remainder thereof. With the content of Ga more than 30 wppm, thermal yellowing is able to be prevented. As too much content of Ga causes surface roughness, the content of Ga must be 500 wppm or below.

Abstract: Light weight, low resistance electrode plates for lead-acid batteries are formed from a highly conductive non-lead substrate such as aluminum or copper, coated with a continuous layer of a corrosive resistant conductive materials, such as lead, applied from a fused salt bath.

Abstract: The present invention relates to a device and method for electrolytic deposition of metals on conducting particles. The conducting particles are completely immersed in a liquid and allowed to flow across a particle contacting surface of a cathode support. The particles flow across the surface and into a reservoir. Electrical contact is made between the negative pole of a DC power supply and the conducting particles. An anode mesh is placed above and parallel to the top face of the particle bed such that the mesh does not touch the particle bed but remains a controlled distance from it. The anode mesh is connected to the positive terminal of the DC power supply. A significant aspect of the present invention is that the device does not require a separator between the particle bed and the anode.

Abstract: The present invention relates to a device and method for electrolytic deposition of metals on conducting particles. The conducting particles are completely immersed in a liquid and allowed to flow across a particle contacting surface of a cathode support. The particles flow across the surface and into a reservoir. Fresh particles can be introduced onto a first portion of the particle contacting surface, or the particles can be recirculated from the reservoir. The pellet flow field is of uniform or near uniform thickness. Electrical contact is made between the negative pole of a DC power supply and the conducting particles via the support surface, via conducting inserts passing through the support surface, or via other means. An anode mesh is placed above and parallel to the top face of the particle bed such that the mesh does not touch the particle bed but remains a controlled distance from it. The anode mesh is connected to the positive terminal of the dc power supply.

Abstract: Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.

Abstract: A method for producing a multiplicity of miniature cavities extending from a mold surface for molding a plastic product having features integrally molded with and extending from a product base, and a mold so produced. The mold cavities are formed by depositing multiple layers of plating material on a workpiece in a predetermined pattern selected to produce a desired mold cavity shape. The mold may be in the form of a roll or belt for continuous processing, or in any form for discrete injection molding. The invention is particularly applicable to the production of touch fastener products, such as those with arrays of miniature hooks.

Abstract: The invention concerns a method for forming a coating on conductive particles by grafting a polymer and/or a copolymer of the particles from a bath containing at least a monomer from which the polymer and/or copolymer is formed. The method consists of producing the grafting by electrochemical reduction of the monomer in an electrolytic solution, where at least a cathode and an anode are provided, and containing an aprotic solvent, a support electrolyte and the monomer(s) required for polymerizing or copolymerizing the coating, by suspending the particles and moving the solution so as to produce an intermittent contact between the particles and the cathode, and to form, by polymerization or copolymerization, the coating on the particles by applying an electric potential.

Abstract: A method using an electrically nonconductive cathode chamber with at least part of its wall area rendered permeable to ions and electrolytic solutions; premixing a predetermined quantity of an electroconductive powder and a first electroplating solution; filling the cathode chamber with the solution/powder mixture and a plurality of electroconductive spheres; disposing an electroconductive cathode ball connection in contact with the spheres and powder particles; securing the cathode chamber to a cap which is part of a rotary assembly that allows the rotation of the cathode chamber about its axis without twisting the aforementioned cathode ball connection positioned within said chamber; placing the cathode chamber within an anode chamber containing a second electroplating solution and an anode; rotating the cathode chamber on its axis using the rotary assembly; biasing the anode with a positive voltage in reference to the cathode ball connection causing the electroplating of a metallic coating on the surface o

Abstract: A sliding bearing, which comprises a lining and a bismuth or bismuth-alloy overlay having improved compatibility and fatigue resistance is provided. The overlay is characterized by the following orientation. The relative ratio of the X-ray diffraction intensity I[hkl] of the bismuth or bismuth-alloy overlay defined below satisfies the following conditions (a) and (b): (a) the relative ratio of the X-ray diffraction intensity I[hkl] of planes other than the {012} planes is from 0.2 to 5 times as high as the ratio of the X-ray diffraction intensity I[012], namely, 0.2I[012]≦I[hkl]≦5I[012] (b) the relative ratio of the X-ray diffraction intensity I[hkl] of three or more planes other than {012} planes ranges from 0.5 to 2 times as high as the ratio of the X-ray diffraction intensity I[012], namely, 0.5I[012]≦2I[012].

Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.

Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.

Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.

Abstract: Embodiments include a method for depositing material onto a workpiece in a sputtering chamber. The method includes sputtering a target and a coil in said sputtering chamber. The coil may have a preformed multilayer structure formed outside of the sputtering chamber. The outer layer of the coil may act as a secondary source of deposition material. The multilayer structure may be formed with an inner region or a base metal and an outer layer of a sputtering metal. The outer layer may be formed using a process such as plasma spraying, arc spraying, flame spraying, ion plating, chemical vapor deposition and electroplating.

Abstract: The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seeded semiconductor substrates having sub-micron, high aspect ratio features. The invention provides an electrochemical deposition cell comprising a substrate holder, a cathode electrically contacting a substrate plating surface, an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface and an anode electrically connect to an electrolyte. Preferably, a vibrator is attached to the substrate holder to vibrate the substrate in at least one direction, and an auxiliary electrode is disposed adjacent the electrolyte outlet to provide uniform deposition across the substrate surface.

Abstract: A method for coating particulate substrate materials is provided which comprises (a) combining particles and an electrolyte in an imperforate container; (b) vibrating the container to generate a fluidized bed of particles in the electrolyte; and (c) electrochemically depositing a coating on the particles from reactants in the electrolyte. An apparatus for coating particles is also provided which comprises an imperforate container for receiving particles to be coated and an electrolyte and a device for generating a fluidized bed in the container, the device being operatively associated with the container.