Coating Predominantly Single Metal Or Alloy Substrate Of Specified Shape Patents (Class 205/149)
  • Patent number: 6254755
    Abstract: The object of the present invention is to provide an Oldham ring having uniform electroplating thickness and a scroll member type compressor comprising the same; in order to accomplish the above object, the electroplating process for plating an Oldham ring comprising a ring body and a plurality of key portions extending outwardly from the ring body of the present invention comprises the steps of: soaking the Oldham ring in a plating liquid; arranging at least two cathodes respectively on the inside wall of the ring body at positions corresponding to the areas between each adjacent pair of the key portions; and electroplating the Oldham ring by passing electric current between the cathodes and at least one anode contacting to the plating liquid.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: July 3, 2001
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Shigeki Miura, Kimiharu Takeda, Nobuo Hagi, Kazuhiko Inoguchi
  • Patent number: 6251252
    Abstract: The present invention provides a simple, reproducible electroless process for metalizing a non-hermetic optical fiber. The process of the present invention provides the optical fiber with a metalization layer suitable for solder bonding the optical fibers to other surfaces. The silica surface of the optical fiber is sensitized with a stannous fluoride solution, catalyzed with a catalyzing solution of stannous chloride and hydrochloric acid, and activated with an activator solution comprising palladium chloride. The sensitizing, catalyzing and activating steps are performed under ambient condition. Then nickel is plated on the silica surface through electroless plating and electrolytic plating. Finally, a gold layer is plated on the nickel layer. The process produces good adhesion properties and reliable optical fiber attachment for various applications.
    Type: Grant
    Filed: August 25, 1999
    Date of Patent: June 26, 2001
    Assignee: Lucent Technologies Inc.
    Inventor: Meijiao Sara Chen
  • Patent number: 6242105
    Abstract: Before the application of an external coating having a base of polyester or epoxy resin, or of a mixture of the two by spraying with an electrostatic spray gun, the parts to be coated are subjected to an initial zinc coating treatment by electrolytic process and a layer of an acrylic paint is applied to the zinc coating and polymerized to define a bonding sublayer between the metal and the external coating.
    Type: Grant
    Filed: February 23, 1994
    Date of Patent: June 5, 2001
    Assignee: Ateliers Reunis Caddie
    Inventors: Alice Joseph, Alain Le Marchand, Pierre-Noël Rollin
  • Patent number: 6235180
    Abstract: Method and appartus suitable for forming promptly a phosphate film of excellent performance for cold drawing on the steel wires are disclosed. The steel wires are descaled by cathodic electrolysis in acid solution, and thereafter, phosphate film are formed by cathodic electrolysis on the steel wires. Contacting with the solution containing colloidal titanium are preferable to be carried out between cathodic descaling process and phosphate film forming process. Descaling of cathodic electrolysis may preferably be performed in acid solution at a temperature of lower than 90° C. and in 1˜100 A/dm2. Phosphate film forming may preferably be performed by using electrolyte containing Zn ion, phosphoric acid ion and nitric acid ion, at a temperature of lower than 90° C., in 1˜100 A/dm2 and for 1˜30 seconds.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: May 22, 2001
    Assignees: Nihon Parkerizing Co., Ltd., Fujisyouji Kabushikigaisha
    Inventors: Naoyuki Kobayashi, Atsushi Moriyama, Shigemasa Takagi, Tomoaki Katsumata
  • Patent number: 6197182
    Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.
    Type: Grant
    Filed: July 7, 1999
    Date of Patent: March 6, 2001
    Assignee: Technic Inc.
    Inventors: Robert Kaufman, Gary C. Downes, Daniel J. Gramarossa
  • Patent number: 6096825
    Abstract: There are electrically conductive, electroactive functionalized conjugated polymers having formula (I): ##STR1## These electrically conducive, electroactive conjugated polymers may be covalently bonded to a first biological molecule or antiligand. Polymers bonded to a first biological molecule or antiligand may be used to form an electrode and may be used to assay for, detect and/or extract a second biological molecule or ligand.
    Type: Grant
    Filed: February 6, 1996
    Date of Patent: August 1, 2000
    Assignee: Bio Merieux
    Inventor: Francis Garnier
  • Patent number: 6059952
    Abstract: Methods for forming pastes of powder particles coated with an electrically conductive coating are described. The powder particles, with or without an optional first conductive coating layer applied to their surface, are placed in contact with a cathode surface and immersed in an electroplating solution. An anode covered with a nonconducting but ion-permeable membrane is immersed in the solution in close proximity to the cathode. Agitation to move and gently tumble the powder over the cathode surface is provided. The powder particles are plated with a metal or metal alloy coating by biasing the anode with a positive voltage relative to the cathode. The coated powder is removed, rinsed and dried. The powder is added to a polymer material to form a paste which is heated to fuse the powder coating surfaces to form a network of interconnected particles and is further heated to cure the polymer.
    Type: Grant
    Filed: July 7, 1998
    Date of Patent: May 9, 2000
    Assignee: International Business Machines Corporation
    Inventors: Sung Kwon Kang, Sampath Purushothaman, Rajinder Singh Rai
  • Patent number: 6013169
    Abstract: A method of reforming a tungsten probe tip includes forming a non-oxidizing metallic film on the surface of the tungsten probe tip, heating the film in a non-oxidizing atmosphere or vacuum, and diffusing the film into the tungsten probe tip. The non-oxidizing metallic film can be formed from a metal such as gold, platinum, rhodium, palladium, and iridium. The reformed tungsten probe tip can be used in low voltage and low current testing, and has excellent abrasion resistance, conductivity and oxidation resistance.
    Type: Grant
    Filed: March 9, 1998
    Date of Patent: January 11, 2000
    Assignee: Japan Electronic Materials Corp.
    Inventors: Masao Okubo, Kazumasa Okubo, Hiroshi Iwata
  • Patent number: 6010610
    Abstract: The electroplating process of the present invention is a cyclical operation having at least three essentially independent steps in each cycle of operation with the independent steps carried out in sequence and consisting of stirring, sedimentation and electroplating. The sedimentation step occurs over an essentially quiescent time interval with essentially no current flow through the electrolyte and essentially no stirring so as to form a sedimentation layer of loosely contacted particulates on said cathode plate. The electroplating step follows the sedimentation step at a current density of over at least 5 A/dm.sup.2. The stirring step immediately follows the step of electroplating with the stirring operation being sufficiently vigorous to disperse the particulates in the sedimentation layer and to break up particulates bridged by metallic coating formed during the previous step of electroplating.
    Type: Grant
    Filed: February 4, 1998
    Date of Patent: January 4, 2000
    Inventor: Pay Yih
  • Patent number: 5980720
    Abstract: Methods of treating wafers for analyzing defects present therein comprise providing wafers having front side surfaces comprising defective portions and a back side surfaces opposite thereto; and decorating the defective portion of the front side of the wafer with copper.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: November 9, 1999
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-min Park, Jae-gun Park, Gon-sub Lee, Gi-jung Kim
  • Patent number: 5976343
    Abstract: Process for multi-coat lacquering of a substrate with a stoved first electrodeposition layer by applying a second surface coating layer of 10 to 30 .mu.m dry layer thickness consisting of a base lacquering agent containing a first, water-based, polyurethane resin, and wet-on-wet application of a third coating agent with a thinner dry layer thickness of 7 to 15 .mu.m consisting of a second water-based base lacquering agent, further application without prior stoving of a clear lacquer layer and mutual stoving, wherein the first base lacquering agent has a higher concentration of polyurethane resin than the second base lacquering agent.
    Type: Grant
    Filed: December 10, 1998
    Date of Patent: November 2, 1999
    Assignee: Herberts Gesellschaft mit beschrankter Haftung
    Inventor: Detlef Schlaak
  • Patent number: 5935406
    Abstract: An improved process for the manufacture of uniformly and accurately sized metal spheres, particularly copper spheres, which comprises the steps of classifying a starting lot of spheres into closely sized fractions; separately electroplating each size fraction to a desired final mean diameter and size distribution; and then combining the plated fractions to give a metal sphere product having the requisite mean particles size and size distribution. The electroplating build-up step is characterized by a high level of precision. Additional benefits derive from the high hardness of copper electroplate on relatively soft copper starting particles which facilitates grinding or polishing irregularly shaped plated particles down to the desired sphericity and mean diameter, from the ability of metal such as copper electroplate to cover and envelop contaminated surfaces of starting particles, and from the ability to produce spheres having a unique combination of bulk and surface properties.
    Type: Grant
    Filed: October 17, 1997
    Date of Patent: August 10, 1999
    Assignee: ThermicEdge Corporation
    Inventors: Karel Hajmrle, Kenneth G. Reid
  • Patent number: 5935407
    Abstract: A process is provided for producing an abrasive coating on a substrate surface by applying a bond coat by low pressure plasma spraying and anchoring to the bond coat abrasive particles by electroplating and embedding the particles into an oxidation resistant matrix by entrapment plating.
    Type: Grant
    Filed: November 6, 1997
    Date of Patent: August 10, 1999
    Assignee: Chromalloy Gas Turbine Corporation
    Inventors: Krassimir P. Nenov, Richard Fenton, Joseph A. Fuggini, Peter Howard
  • Patent number: 5911865
    Abstract: A method of electroplating particulates in a metallic ion containing electrolyte within an electroplating device having an anode and cathode plate by repeating the steps of stirring the particulates, allowing sedimentation of the particulates to occur by gravity until a sedimentation layer of loosely contacted particles is formed on the cathode plate of a suitable thickness and applying an electromotive potential across said anode and cathode plate to create an electric current in said electrolyte for electroplating metallic ions on the surface of the particulates in said sedimentation layer wherein the steps of stirring, sedimentation and electroplating are performed in sequence over repeated cycles which are maintained essentially independent of one another with the step of electroplating being interrupted during the steps of stirring and sedimentation and with the step of stirring immediately following the step of electroplating.
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: June 15, 1999
    Inventor: Pay Yih
  • Patent number: 5865979
    Abstract: The entire outer surface of a ground rod, including its pointed end portion, has a continuous and uniform electroplated coating. The rod has a blunt end portion shaped to minimize mushrooming when it is hammered for driving the rod into the ground. Jets of plating solution directed against the rod produce swirling motion of plating solution around the rod while it moves longitudinally through a plating bath. Uniformity of the plated coating may be enhanced by rotating the rod during longitudinal movement through the plating bath.
    Type: Grant
    Filed: December 4, 1996
    Date of Patent: February 2, 1999
    Assignee: Thomas & Betts Corporation
    Inventors: Albert Lee Collins, Jr., Rick Alan Boyd, Herbert Lester Bradshaw II, Alvin Jerome Huber, Charles Thomas Wessner, Dennis Bowman Ruch
  • Patent number: 5800695
    Abstract: A process is provided for plating a coating onto a gas turbine engine component without detrimentally effecting air flow through cooling holes by injecting a maskant into the cooling passage to fill the cooling holes with the maskant, plating the external surface of the component with a coating, then removing the maskant from the component.
    Type: Grant
    Filed: October 16, 1996
    Date of Patent: September 1, 1998
    Assignee: Chromalloy Gas Turbine Corporation
    Inventors: David Kang, Kevin Updegrove, Frank Goodwater
  • Patent number: 5779872
    Abstract: Disclosed are a composite material having an anti-wear property and a process for producing the same. The composite material includes a matrix of a low melting point Sn alloy having a melting point of from 80.degree. to 280.degree. C., and metallic dispersing particles dispersed in the matrix in an amount of from 10 to 50% by volume. When the composite material is utilized to make a rough mold for preparing a prototype, it sharply improves the anti-wear property of the rough mold, and it can be re-used for a plurality of times without adversely affecting the sharply improved anti-wear property. The composite material provides the advantageous effect best when the metallic dispersing particles are Fe--C alloy dispersing particles and/or Fe--W--C alloy dispersing particles which were subjected to a surface treatment including an Sn or Ni electroplating followed by a ZnCl.sub.2 .multidot.NH.sub.4 Cl flux depositing.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: July 14, 1998
    Assignees: Toyota Jidosha Kabushiki Kaisha, Nisshin Steel Co., Ltd.
    Inventors: Satoru Kito, Masahito Ito, Fuminori Matuda, Eiki Takeshima, Yasuji Tanaka, Takahiro Fujii, Kenjiro Izutani
  • Patent number: 5775892
    Abstract: According to the present invention, an aluminum alloy containing silicon is anodized using an electrolyte including a compound containing an anion having complexing capability such as sodium hydrogenphosphate or tribasic sodium phosphate, a salt of an organic acid containing an oxyacid anion such as sodium citrate or sodium tartrate or an alcohol such as sorbitol, and a halide such as potassium fluoride or sodium fluoride. The use of such an electrolyte results in a reduced amount of silicon being incorporated in the anodic oxide film. When the resulting oxide film is subjected to an electrodeposition treatment such as electroplating or electrolytic coloring, wasteful consumption of electrodeposition current can be inhibited. An aluminum alloy decorative cover is produced by buffing the surface of an aluminum alloy containing silicon, forming the anodized film on the buffed surface, and subjecting the anodized film to sequential nickel and chromium plating.
    Type: Grant
    Filed: March 22, 1996
    Date of Patent: July 7, 1998
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Hajime Miyasaka, Hideaki Ikeda
  • Patent number: 5665219
    Abstract: Process for continuous manufacture of an electrical conductor consisting of an at least partially aluminium-based central core coated by continuous electrodeposition with at least one metal layer, including pretreatment of the surface of the core, characterized in that the following are subsequently performed successively on the core,a) an electrochemical deposition of copper in an aqueous bath maintained at a temperature of between 20.degree. C. and 60.degree. C., containing KCN, CuCN, K.sub.2 CO.sub.3 and KNaC.sub.4 H.sub.4 O.sub.6 with a current intensity of between 1 and 10 A/dm.sup.2 ;b) rinsing at ambient temperature;c) an electrochemical deposition of tin in an aqueous bath maintained at a temperature of between 20.degree. C. and 60.degree. C., containing essentially tin dissolved in methanesulphonic acid and, optionally, additives, with a current intensity of between 1 and 100 A/dm.sup.2 ;d) rinsing with water at 60.degree. C.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: September 9, 1997
    Assignee: Axon'Cable SA
    Inventor: Ning Yu
  • Patent number: 5571573
    Abstract: A process resulting in enhanced pole performance, relative to permalloy poles, in narrow track magnetic devices. A preferred process includes increasing the anisotropy field of the pole material while maintaining an acceptable coercivity level and near zero magnetostriction. One embodiment utilizes a NiCoFe alloy containing 22% cobalt by weight, heat treated in an easy axis magnetic field in a non-oxidizing atmosphere. This process achieves favorable domain structures at narrow pole tip widths.
    Type: Grant
    Filed: February 6, 1992
    Date of Patent: November 5, 1996
    Assignee: Quantum Corporation
    Inventors: Harold B. Shukovsky, Michelle Martin, Michael Mallary, Alan L. Sidman
  • Patent number: 5525203
    Abstract: In the described process of manufacturing a sliding surface bearing comprising a backing shell of steel, a bearing metal layer on the backing shell, and a copper-containing sliding surface layer, which has been electrodeposited over said bearing metal layer, the backing shell is provided throughout its rear surface, which constitutes the rear surface of the bearing, with a tin-containing corrosion-resisting layer after the sliding surface layer has been deposited. To prevent a separation of the corrosion-resisting layer, it is proposed that the rear surface of the bearing is covered with an electrodeposited nickel layer before the sliding surface layer is deposited on the bearing metal layer or on an intermediate layer of nickel provided on the bearing metal layer.
    Type: Grant
    Filed: December 19, 1994
    Date of Patent: June 11, 1996
    Assignee: Miba Gleitlager Aktiengesellschaft
    Inventors: Thomas Rumpf, Reinhold Weber
  • Patent number: 5514422
    Abstract: A composite metallizing wire useful in thermal flame spraying, having a conductive metallic solid core wire strand and a coating consisting of solid lubricant particles (i.e., graphite, BN, Teflon) and wear-resistant particles (i.e., SiC, TiC, Cr.sub.3 C.sub.2) homogeneously suspended in a conductive metal (i.e., Ni, Fe, Cr, Mo, Ti) complementary to said solid core wire strand. The wire is used to produce a metal matrix composite coating, comprising providing a thermalizing through-flow chamber with an exit nozzle, the chamber having a gas flow-through of at least 100 ms.sup.-1, establishing a flame in said chamber, and feeding a composite coated wire into said flame to be melted and projected by the gas flow to a target, the wire being constructed as above.
    Type: Grant
    Filed: March 1, 1994
    Date of Patent: May 7, 1996
    Assignee: Ford Motor Company
    Inventor: Robert C. McCune
  • Patent number: 5364523
    Abstract: An apparatus and a method of surface-treating a half sliding bearing, the method comprising the steps of: preparing a tank which accommodates a surface-treatment solution and an anode of an alloy to be applied to the bearings as a surface treatment; successively and one by one introducing the bearings into the surface-treatment solution; performing the surface treatment in such a manner that the surface layer of the alloy is applied to the surface of the bearings by feeding an electricity between a cathode served by the bearing and the anode via the surface-treatment solution while moving, in the surface-treatment solution, the bearings being introduced into the surface-treatment solution in a state in which the bearings is brought into contact with one another; and successively and one by one drawing out the bearings, which have been applied with the surface treatment, from the tank.
    Type: Grant
    Filed: June 11, 1993
    Date of Patent: November 15, 1994
    Assignee: Daido Metal Company, Ltd.
    Inventors: Tadashi Tanaka, Masaaki Sakamoto, Motomu Wada, Takayoshi Sasaki, Masaki Tanimoto
  • Patent number: 5259937
    Abstract: A colorless chromate coating film is formed on a bright aluminum wheel by subjecting the surface of an aluminum wheel to a cathodic electrolytic treatment in an acidic aqueous solution containing not less than 2 g/l of hexavalent chromium ions, 20 to 2,000 ppm of sulfate ions, 10 to 400 ppm of fluorine (F) as fluoride and not less than 20 ppm of zirconium ions at a pH of 0.6 to 1.7 at a current density of 0.5 to 15 A/dm.sup.2 for at least 30 seconds, thereby forming a coating film with a chromium coating amount of 50 to 250 mg/m.sup.2.
    Type: Grant
    Filed: December 16, 1992
    Date of Patent: November 9, 1993
    Assignees: Nihon Parkerizing Co. Ltd., Nissan Motor Co., Ltd.
    Inventors: Norifumi Hatano, Akihiko Hasebe, Kazuyuki Oyama, Katsuya Yamamoto
  • Patent number: 5182172
    Abstract: An improved method for inhibiting corrosion of precious metal plated objects is provided wherein a thin dichromate film coats the precious metal outer surface and fills the precious metal outer surface pores using either immersion or electrolytic methods employing passivation plating techniques.
    Type: Grant
    Filed: April 18, 1991
    Date of Patent: January 26, 1993
    Assignee: Bausch & Lomb Incorporated
    Inventor: John F. Tucker
  • Patent number: 5167794
    Abstract: The present invention relates to a lead frame material for a semiconductor, which comprises a copper or copper alloy matrix having a layer obtained by applying an Ag-plating of a thickness of from 0.005 to 0.5 .mu.m on the surface of the matrix and diffusing Ag into the matrix by heat treatment.
    Type: Grant
    Filed: April 5, 1991
    Date of Patent: December 1, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Hisatosi Ito
  • Patent number: 5167779
    Abstract: A process and apparatus for obtaining an intensive and continuous exchange of electrolyte on the surfaces of workpieces (11, 21) subjected to chemical or electrolytical treatments wherein the exchange is achieved by subjecting the workpieces (11, 21) to strong pulsating oscillations of a frequency of at least 1 Hz and of an amplitude of less than 10 mm, when immersed in the electrolyte. The vibrations are transmitted from an oscillation generator (3) mounted on a workpiece carrier, such as a rack (1, 4) or a rotating dipping drum 92). These high frequency low amplitude oscillations may be combined with low frequency, relatively long oscillations (7, 9, 10, 18), occurring simultaneously. The oscillation generator (3) is arranged on the individual transportable workpiece carriers (1, 2, 14). The workpieces may be boards (11) for printed circuits having through holes (12) or a pourable mass of parts (21).
    Type: Grant
    Filed: August 17, 1990
    Date of Patent: December 1, 1992
    Inventor: Hans J. Henig
  • Patent number: 5156729
    Abstract: A method of making a plain bearing sliding layer for use in internal combustion engines, comprising the immersion of a metal substrate in a chemical solution containing copper, tin and lead salts to which is added one of the compounds represented by the following three exemplary structures: ##STR1## where X is one of the chemical elements selected from sulphur and nitrogen, --C represents one carbon atom, and radicals R.sub.1 and R.sub.2 represent the allowed variations, from a single hydrogen atom up to the typical structures of inorganic compounds or aliphatic, aromatic or cyclic chain organic radicals. The chemical solution is subjected to an electric current with a density and potential controlled as a function of time, thereby effecting the selective electrodeposition of the solution elements on the substrate so as to form successive and alternate layers of softer material and harder material.
    Type: Grant
    Filed: November 1, 1989
    Date of Patent: October 20, 1992
    Assignee: Metal Leve, S.A.
    Inventors: Duraid Mahrus, Ademir Carubelli
  • Patent number: 5151167
    Abstract: This invention overcomes problems such as pinholes and blisters in making plated coin blanks and similar articles. A ferrous metal blank is electroplated with a strike of nickel, following which a coating of copper is applied at an initial low current density followed by full current density to minimize bridging. The low current density may be about 1/6 to 1/4 of the full current density. Preferably an outer layer of nickel is applied, also at an initial low current density, followed by full current density. Annealing before or after application of the final layer of nickel is advisable. This invention also relates to the resulting coin blank and coins.
    Type: Grant
    Filed: December 4, 1991
    Date of Patent: September 29, 1992
    Assignee: Royal Canadian Mint
    Inventors: Hieu C. Truong, Maria Dilay
  • Patent number: 5098528
    Abstract: A method for the making of an integrated type of LC component comprises the following steps;the coiling of an elongated element made of a metal with valve effect, the ends of which constitute two electrodes;the anodization of the element to form a dielectric layer;impregnation by an electrolyte, andthe positioning of a third electrode in a known way.Application to integrated passive components.
    Type: Grant
    Filed: June 26, 1991
    Date of Patent: March 24, 1992
    Assignee: Compagnie Europeene de Composants Electroniques LCC
    Inventors: Francois DeLalande, Dominique Poupard
  • Patent number: 5078844
    Abstract: An electrical insulating coating layer having excellent adhesion, toughness and heat resistance is formed on a surface of a copper material by anodizing the copper material under a low current in an acid bath of a hexacyanoiron complex. Copper materials such as coil wires can hence be provided with a thin, heat-resistant, electrical insulating layer, whereby the values of the copper materials can be heightened.
    Type: Grant
    Filed: February 8, 1991
    Date of Patent: January 7, 1992
    Inventor: Kunio Katsuma