Electrolytic Treatment Patents (Class 205/219)
  • Publication number: 20020020629
    Abstract: A method for manufacturing a lead frame including the steps of electrocleaning the surface of a thin plate material, electropolishing the electrocleaned thin plate material, removing inclusions on the surface of the electropolished thin plate material, rinsing the inclusion-removed thin plate material with an acidic solution, and forming multi-plated layers on the rinsed material. The lead frame manufactured by the method has 5 or less inclusions each having approximately 1 &mgr;m, on the surface area of 1600 &mgr;m2, which impede a wire bonding property or solder wettability of the lead frame.
    Type: Application
    Filed: December 8, 2000
    Publication date: February 21, 2002
    Applicant: Samsung Techwin Co., Ltd.
    Inventors: Se-Chul Park, Dong-Il Shin, Sung-Il Kang, Sang-Hoon Lee, Bae-Soon Jang
  • Publication number: 20020011418
    Abstract: Disclosed is a process of treating the surface of copper foil without using harmful elements such as arsenic, selenium and tellurium unlike in the prior art. It is possible to, in an easy way, obtain a uniform rough condition and low rougheness and produce a high adhesive strength to such resin base materials as polymide resin which is weak in adhesive strength. The process comprises a roughening treatment involving a cathodic electrolysis of at least one side of copper foil near or above the limiting current density in an electrolytic bath containing titanium ions and tungsten ions and prepared by adding sulfuric acid and copper sulfate so as to have copper protrusions deposited and then coating the depositions with copper or a copper alloy in a cathodic electrolysis, followed by giving to the surface of the above-mentioned copper or the copper alloy at least one of the following rust-proofing treatments—chromate treatment, organic rust-proofing treatment and silane coupling agent treatment.
    Type: Application
    Filed: April 12, 2001
    Publication date: January 31, 2002
    Applicant: FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Hisanori Manabe, Masasto Takami, Masaru Hirose
  • Patent number: 6342146
    Abstract: A continuous plating system which is horizontal, allows for submersion of the entire article to be plated, and is useful for alloy plating. The invention provides a link/hinge conveyor system, the conveyor acts as the conductor, numerous processes/baths are possible, and difficult to plate alloys, such as a tin/bismuth plate can be produced. Homogeneous alloys are possible with the present invention. Also disclosed are novel dryer, rinse and reflow systems for use with the continuous plating system.
    Type: Grant
    Filed: July 27, 1999
    Date of Patent: January 29, 2002
    Inventor: Geronimo Z. Velasquez
  • Patent number: 6328872
    Abstract: The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate and then polishes the same substrate. This is achieved by providing multiple chambers in a single apparatus, where one chamber can be used for plating/depositing the conductive material and another chamber can be used for polishing the semiconductor substrate. The plating/depositing process can be performed using brush plating or electro chemical mechanical deposition and the polishing process can be performed using electropolishing or chemical mechanical polishing. The present invention further provides a method and apparatus for intermittently applying the conductive material to the semiconductor substrate and also intermittently polishing the substrate when such conductive material is not being applied to the substrate.
    Type: Grant
    Filed: April 3, 1999
    Date of Patent: December 11, 2001
    Assignee: Nutool, Inc.
    Inventors: Homayoun Talieh, Cyprian Emeka Uzoh
  • Patent number: 6277510
    Abstract: The present invention provides a porous electrode used for a conductive material-filled polymer composite. At least one surface of the porous electrode is an open porous structure, which includes a plurality of macropores and micropores randomly distributed and interconnected with each other. The conductive material-filled polymer composite includes a polymer substrate and conductive particles filled therein. When the surface of the open porous structure of the porous electrode is bonded with the conductive material-filled polymer composite, the conductive particles in the conductive material-filled polymer composite can be trapped in the macropores of the porous structure, and the polymer substrate in the conductive material-filled polymer composite can be immersed into the micropores of the porous structure. This enables a better direct contact between the conductive particles and the porous electrode.
    Type: Grant
    Filed: January 10, 2000
    Date of Patent: August 21, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Kun-Huang Chang, Wei-Wen Yeh, Shu-Chin Chou, Chen-Ron Lin
  • Publication number: 20010013472
    Abstract: A method of plating for filling via holes, in which each via hole formed in an insulation layer covering a substrate so as to expose, at its bottom, part of a conductor layer located on the substrate, is plated with copper, to be filled with the plated metal, the method comprising the steps of forming a copper film on the top surface of the insulation layer covering the substrate, and the side walls and bottoms of the respective via holes, immersing the substrate having the copper film formed in an aqueous solution containing a plating promoter to thereby deposit the plating promoter on the surface of the copper film, removing the plating promoter from the surface of the copper film located on the insulation layer and leaving the plating promoter on the side walls and bottoms of the respective via holes, and subsequently electroplating the substrate having the copper film formed with copper to thereby fill the via holes with the plated copper and simultaneously form a continuous copper film which eventually c
    Type: Application
    Filed: January 30, 2001
    Publication date: August 16, 2001
    Inventors: Kenji Nakamura, Masao Nakazawa
  • Patent number: 6235180
    Abstract: Method and appartus suitable for forming promptly a phosphate film of excellent performance for cold drawing on the steel wires are disclosed. The steel wires are descaled by cathodic electrolysis in acid solution, and thereafter, phosphate film are formed by cathodic electrolysis on the steel wires. Contacting with the solution containing colloidal titanium are preferable to be carried out between cathodic descaling process and phosphate film forming process. Descaling of cathodic electrolysis may preferably be performed in acid solution at a temperature of lower than 90° C. and in 1˜100 A/dm2. Phosphate film forming may preferably be performed by using electrolyte containing Zn ion, phosphoric acid ion and nitric acid ion, at a temperature of lower than 90° C., in 1˜100 A/dm2 and for 1˜30 seconds.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: May 22, 2001
    Assignees: Nihon Parkerizing Co., Ltd., Fujisyouji Kabushikigaisha
    Inventors: Naoyuki Kobayashi, Atsushi Moriyama, Shigemasa Takagi, Tomoaki Katsumata
  • Patent number: 6203936
    Abstract: Thin, light weight bipolar plates for use in electrochemical cells are rapidly, and inexpensively manufactured in mass production by die casting, stamping or other well known methods for fabricating magnesium or aluminum parts. The use of a light metal, such as magnesium or aluminum minimizes weight and simultaneously improves both electrical and thermal conductivity compared to conventional carbon parts. For service in electrochemical cells these components must be protected from corrosion. This is accomplished by plating the surface of the light weight metal parts with a layer of denser, but more noble metal. The protective metal layer is deposited in one of several ways. One of these is deposition from an aqueous solution by either electroless means, electrolytic means, or a combination of the two. Another is deposition by electrolytic means from a non-aqueous solution, such as a molten salt.
    Type: Grant
    Filed: March 3, 1999
    Date of Patent: March 20, 2001
    Assignee: Lynntech Inc.
    Inventors: Alan J. Cisar, Oliver J. Murphy, King-Tsai Jeng, Carlos Salinas, Stan Simpson, Dacong Weng
  • Patent number: 6143158
    Abstract: A method for producing an aluminum support for a lithographic printing plate comprising the steps of (a) electrolytic polishing an aluminum plate in an alkaline aqueous solution; and (b) electrochemically surface roughening the aluminum plate using direct or alternating current in an acidic aqueous solution in this order, and also a method for producing an aluminum support for a lithographic printing plate comprising an electrolytic polishing step of treating an aluminum plate used as an anode in an alkaline aqueous solution at a current density of 5 A/dm.sup.2 to 200 A/dm.sup.2 while allowing the alkaline aqueous solution to flow between the aluminum plate and an electrode at an average flow rate of 10 cm/second to 400 cm/second.
    Type: Grant
    Filed: April 24, 1998
    Date of Patent: November 7, 2000
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsuo Nishino, Yoshitaka Masuda, Akio Uesugi
  • Patent number: 6132585
    Abstract: The present invention aims to provide a highly reliable semiconductor element with high performance, and a fabrication method for such highly reliable semiconductor with excellent mass producibility. The photovoltaic elements comprise an electric conductor, semiconductor regions and a transparent conductor layer, which are sequentially formed on a substrate. The shunt resistance in the semiconductor element is rendered in the range from 1.times.10.sup.3 .OMEGA.cm.sup.2 to 1.times.10.sup.6 .OMEGA.cm.sup.2 by performing a forming treatment and a short circuit passivation treatment after forming the transparent conductor layer, and then selectively covering with insulation the defective portions with a cationic or anionic electrodeposited resin, or performing a forming treatment, after forming the semiconductor layers, then selectively covering with insulation the defective portions with a cationic or anionic electrodeposited resin, and then forming the transparent conductor layer.
    Type: Grant
    Filed: November 15, 1996
    Date of Patent: October 17, 2000
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takafumi Midorikawa, Tsutomu Murakami, Takahiro Mori, Hirofumi Ichinose
  • Patent number: 6090254
    Abstract: A process for coating a metallic molding article comprising transporting said article by conveyer means continuously and serially through a degreasing stage (1), a first water rinsing stage (2), a surface conditioning stage (3), a chemical conversion treatment stage (4), a second water rinsing stage (5), and an electrodeposition coating stage (6), wherein at least one stage of said stage (1), (2), (3), (4), (5) comprises in dipping said article in a treating bath of dipping system, at least one unit of said treating bath is provided with a vibratory agitation means, and the angles of immersion and emergence of said article with respect to said bath are not less than 25 degrees. The invention contributes to a curtailment of pre-treatment before coating and an effective elimination of adherent metal particles from the matallic article to provide a very satisfactory coating film.
    Type: Grant
    Filed: March 21, 1997
    Date of Patent: July 18, 2000
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Tamotsu Sobata, Naohiko Sumie
  • Patent number: 6045677
    Abstract: A microchannel plate and method of manufacturing same is provided. The microchannel plate includes a plate consisting of an anodized material and a plurality of channels which are formed during the anodization of the material and extend between the two sides of the plate. Electrodes are also disposed on each side of the plate for generating an electrical field within the channels. Preferably, the material is alumina and the channels are activated such that the channel walls are conductive and highly secondary emissive.
    Type: Grant
    Filed: February 27, 1997
    Date of Patent: April 4, 2000
    Assignee: NanoSciences Corporation
    Inventors: Charles P. Beetz, Jr., Robert W. Boerstler, John Steinbeck, David R. Winn
  • Patent number: 5997713
    Abstract: An element with elongated, high aspect ratio channels such as microchannel plate is fabricated by electrochemical etching of a p-type silicon element in a electrolyte to form channels extending through the element. The electrolyte may be an aqueous electrolyte. For use as a microchannel plate, the; the silicon surfaces of the channels can be converted to insulating silicon dioxide, and a dynode material with a high electron emissivity can be deposited onto the insulating surfaces of the channels. New dynode materials are also disclosed.
    Type: Grant
    Filed: May 8, 1998
    Date of Patent: December 7, 1999
    Assignee: NanoSciences Corporation
    Inventors: Charles P. Beetz, Jr., Robert W. Boerstler, John Steinbeck, David R. Winn
  • Patent number: 5985124
    Abstract: Disclosed is a nickel electroplating bath or a nickel alloy electroplating bath used for electroplating a conductor partially masked with an organic high-molecular resist layer, wherein the nickel electroplating bath contains a water-soluble nickel salt, and the nickel alloy electroplating bath contains both a water-soluble nickel salt and a water-soluble salt of a metal capable of being alloyed with nickel. The above electroplating bath is incorporated with an electrical conductive salt containing at least one cation selected from the group consisting of an ammonium ion, magnesium ion, calcium ion, aluminum ion, and barium ion. Further, the electrical conductive salt substantially does not contain a sodium ion and a potassium ion as cations. Such an electroplating bath is capable of electroplating a conductor partially masked with an organic high-molecular resist layer without floating of the resist layer.
    Type: Grant
    Filed: October 21, 1997
    Date of Patent: November 16, 1999
    Assignees: Shinko Electric Industries Co., Ltd., C. Uyemura & Co., Ltd.
    Inventors: Toshihisa Yoda, Toru Negishi, Toru Murakami, Tomomi Yaji, Taichi Nakamura, Tsutomu Sekiya
  • Patent number: 5980722
    Abstract: A method of plating an aluminum alloy, of which the steps are small in number and the productivity is improved as compared with conventional zincate conversion or anodic oxidation methods and which attains a decrease in cost and obviates the use of mixed acids, and a plated aluminum alloy of which the coating has excellent adhesion, the method comprising the steps of carrying out anodic etching of a silicon-containing aluminum alloy to protrude silicon from the surface of the aluminum alloy, optionally carrying out anodic oxidation of the aluminum alloy on its surface from which the silicon is protruded, and plating the aluminum alloy, and the plated aluminum alloy containing silicon in a state where the silicon bridges the aluminum alloy and the plating layer.
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: November 9, 1999
    Assignee: Suzuki Motor Corporation
    Inventors: Tetsuya Kuroda, Hidezumi Katoh, Hitoshi Muramatsu
  • Patent number: 5958604
    Abstract: An electrolytic process for metal-coating the pre-cleaned surface of a workpiece of an electrically conducting material, which process comprises:i) providing an electrolytic cell with a cathode comprising the workpiece and an anode comprising the metal for metal-coating of the surface of the workpiece;ii) introducing an electrolyte into the zone created between the anode and the cathode by causing it to flow under pressure through at least one opening in the anode impinge on the cathode; andiii) applying a voltage between the anode and the cathode and operating in a regime in which the electrical current decreases or remains substantially constant with increase in the voltage applied between the anode and the cathode, and in a regime in which discrete gas bubbles are present on the surface of the workpiece during treatment.
    Type: Grant
    Filed: September 22, 1997
    Date of Patent: September 28, 1999
    Assignee: Metal Technology, Inc.
    Inventors: Vitalig M. Riabkov, Valerij L. Steblianko
  • Patent number: 5911864
    Abstract: The present invention provides for a wet etch and method for preparing a semiconductor device structure from a silicon carbide wafer. A first embodiment of the wet etch comprises a vessel, a tetrahydrofurfuryl alcohol and potassium nitrite etching solution within the vessel, an electrode, a wafer support for positioning at least a portion of the silicon carbide wafer within the etching solution, and a voltage source coupled with the electrode and the wafer support. A second embodiment of the wet etch comprises a wafer carrier for holding at least one wafer, a polishing plate adjacent the wafer carrier, a voltage source having a first terminal electrically coupled with the wafer and a second terminal electrically coupled with the polishing plate, and an applicator adjacent the polishing plate for depositing an etching solution on a surface of the polishing plate.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: June 15, 1999
    Assignee: Northrop Grumman Corporation
    Inventor: Graeme W. Eldridge
  • Patent number: 5876580
    Abstract: A method for rendering a surface of a contact rough includes submerging the surface of the contact in an electroplating bath having a dissolved metal salt, and pulsing an electric current through the contact and the bath to form a rough metallic structure on the surface of the contact.
    Type: Grant
    Filed: January 12, 1996
    Date of Patent: March 2, 1999
    Assignee: MicroModule Systems
    Inventor: James L. Lykins, II
  • Patent number: 5788824
    Abstract: The subject of the invention is a process for conditioning the copper or copper-alloy external surface of an element of a mold for the continuous casting of metals, of the type including a step of nickel plating of said surface and a step of nickel removal therefrom, wherein:a preparation of said surface, comprising in succession an operation of cleaning said bare surface, an operation of pickling said bare surface in an oxidizing acid medium and an operation of brightening said bare surface, is carried out;then, an operation of nickel plating of said bare surface is carried out by electroplating, by placing said element as the cathode in an electrolyte consisting of an aqueous nickel sulfamate solution containing from 60 to 100 g/l of nickel;then, after said element has been used, an operation of partially or completely removing the nickel from said surface electrolytically is carried out, by placing said element as the anode in an electrolyte consisting of an aqueous nickel sulfamate solution containing fro
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: August 4, 1998
    Assignees: Usinor Sacilor (Societe Anonyme), Thyssen Stahl Aktiengesellschaft
    Inventors: Jean-Claude Catonne, Christian Allely, Remy Nicolle, Gerard Raisson
  • Patent number: 5773087
    Abstract: A coated article comprising a stainless steel base having an etched surface and having on the etched surface a coated layer. The coating layer may comprise a fluororesin and can be provided: after sensitizing the stainless steel base through heating, treating with an acid, subjecting to etching, and subjecting to a solution treatment; after immersing in an aqueous acid solution or an aqueous ferric chloride solution to cause the base to be dissolved to such an extent that the gloss of the surface disappears; after uniformly abrading the surface of the base through buffing or blasting to the weight corresponding to a thickness of 1.0 .mu.m or more of the base, immersing in an aqueous acid solution or an aqueous ferric chloride solution to cause the base to be dissolved to such an extent that the gloss of the surface disappears, and subjecting to etching; or after subjecting to electrolytic etching at 15.degree. C. or less.
    Type: Grant
    Filed: July 29, 1996
    Date of Patent: June 30, 1998
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Hideki Kashihara, Katsuya Yamada
  • Patent number: 5747180
    Abstract: A method of fabricating two-dimensional regimented and quasi periodic arrays of metallic and semiconductor nanostructures (quantum dots) with diameters of .about.100 .ANG.(10 nm) includes the steps of polishing and anodizing a substrate to form a regimented quasi-periodic array of nanopits. The array forms a template for metallic or semiconductor material. The desired material is deposited in the nanopits by immersing the substrate in an appropriate solution and using the substrate as one cathode and inserting a second cathode in the solution.
    Type: Grant
    Filed: December 5, 1996
    Date of Patent: May 5, 1998
    Assignee: University of Notre Dame Du Lac
    Inventors: Albert E. Miller, Supriyo Bandyopadhyay
  • Patent number: 5725640
    Abstract: The disclosure relates to treating a self accelerating and replenishing immersion composition on a substrate with a neutralizing and reducing composition comprising an acid and a salt of an inorganic or organic amine, and then electrolytically coating the treated surface with a metal. The salts in one embodiment comprise salts of hydroxylamine or hydrazine and the acid comprises a mineral acid.
    Type: Grant
    Filed: May 14, 1996
    Date of Patent: March 10, 1998
    Assignee: Atotech USA, Inc.
    Inventors: Nayan E. Joshi, John E. McCaskie, Michael T. Boyle
  • Patent number: 5707503
    Abstract: According to the present invention, an oxygen sensor element includes a solid electrolyte having a side surface at one side thereof, the side surface being contactable with a gas to be measured, a skeletal electrode provided on the side surface and having a plurality of pore portions, each of the pore portions passing through the skeletal electrode up to the solid electrolyte, and a reactive electrode made of a porous film and provided in each of the pore portions, a thickness of the porous film being smaller than that of said skeletal electrode. An area percentage (SH/SZ) which is a ratio of a total area (SH) of the reactive electrode to a total area (SZ) of the skeletal electrode and the reactive electrode is in a range from 10 to 50%, an average area (SA) of the pore portions is 100 .mu.m.sup.2 or less, a film thickness of the skeletal electrode is in a range from 1.5 to 4 .mu.m, and the film thickness of the reactive electrode is in a range from 0.6 to 1.5 .mu.m.
    Type: Grant
    Filed: October 27, 1995
    Date of Patent: January 13, 1998
    Assignee: Nippondenso Co., Ltd.
    Inventors: Yasumichi Hotta, Hiromi Sano, Toshitaka Saito, Masatoshi Suzuki, Naoto Miwa
  • Patent number: 5700366
    Abstract: An electrolytic process for simultaneously cleaning and metal-coating the surface of a workpiece of an electrically conducting material, which process comprises: i) providing an electrolytic cell with a cathode comprising the surface of the workpiece and an anode comprising the metal for metal-coating of the surface of the workpiece; ii) introducing an electrolyte into the zone created between the anode and the cathode by causing it to flow under pressure through at least one opening in the anode and thereby impinge on the cathode; and iii) applying a voltage between the anode and the cathode and operating in a regime in which the electrical current decreases or remains substantially constant with increase in the voltage applied between the anode and the cathode, and in a regime in which discrete gas bubbles are present on the surface of the workpiece during treatment.
    Type: Grant
    Filed: September 3, 1996
    Date of Patent: December 23, 1997
    Assignee: Metal Technology, Inc.
    Inventors: Valerij Leontievich Steblianko, Vitalij Makrovich Riabkov
  • Patent number: 5681442
    Abstract: A process for producing an organic device includes forming a first electrode and a second electrode on a substrate having an insulating film formed on a surface thereof, etching out the insulating film with the first electrode and the second electrode being used as masks, forming a monomolecular or built-up monomolecular film containing electrolytically polymerizable unsaturated groups directly or indirectly on the surface of the substrate by a chemical absorption method or the Langmuir-Blodgett method.
    Type: Grant
    Filed: November 29, 1995
    Date of Patent: October 28, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazufumi Ogawa, Norihisa Mino
  • Patent number: 5672261
    Abstract: A method for preparing a Ni base superalloy inner wall surface of a body open end, such as an end of a turbomachinery blade, and an end plate, such as a blade tip cap, for brazing together at a rim of the end plate includes electrochemically removing oxides from the inner wall surface. The end plate is prepared, at least at its rim, by first removing surface and subsurface oxides, for example by mechanical abrading or a combination of such abrading and acid cleaning. Then at least the rim is electroplated with Ni which is heated to diffuse the Ni into the rim substrate. This provides an improved combination of surfaces for brazing for example with a Ni base brazing alloy. After brazing the rim to the inner wall, there is provided an article with an improved relatively low oxide brazed joint, including less than about 20 volume % oxides, and a plate rim of substantially Ni along with elements diffused from the brazing alloy and the rim.
    Type: Grant
    Filed: August 9, 1996
    Date of Patent: September 30, 1997
    Assignee: General Electric Company
    Inventors: Gary E. Wheat, Robert E. McCracken, Nicholas C. Palmer
  • Patent number: 5651871
    Abstract: Smooth planar metal surfaces, usually an aluminum web, intended for a lithographic printing plate, are roughened by brush graining with fine abrasive particles which are hard and dense and have a radial or disk-like configuration such that the abrasive particles are forged into the surface of the metal forming cavities in which the abrasive particles remain embedded. The embedded abrasive particles are dislodged and removed from the cavities by subjecting the web to an anodic treatment employing electrolyte materials and concentrations, temperatures and voltage which will dislodge and remove the particles while retaining the surface texture or morphology of the as-roughened surface. The web is then subjected to a second anodic treatment under conditions which favor oxide formation in order to provide a final anodized product.
    Type: Grant
    Filed: September 27, 1995
    Date of Patent: July 29, 1997
    Assignee: Howard A. Fromson
    Inventors: Howard A. Fromson, William J. Rozell, Robert F. Gracia
  • Patent number: 5643434
    Abstract: Process for the electrolytic deposition of composite nickel onto the face of a part of a motor vehicle, in particular the bore of a casing or engine block of an internal combustion engine comprising at least three successive stages, the first being an electrochemical activation stage where the part is brought to anodic polarity in a bath containing a halogenated acid salt of nickel, the second being a stage of superactivation of the surface and the third being a stage of electrolytic deposition of a nickel layer containing particles of solid substances where the part is brought to cathodic polarity in a nickel-plating bath containing a charge of solid particles of which the diameter is advantageously between 0.5 and 5 microns and which can be of silicon carbide or any other hardening element, optionally mixed with particles of graphite.
    Type: Grant
    Filed: January 31, 1996
    Date of Patent: July 1, 1997
    Assignee: Aluminum Pechiney
    Inventors: Mohamed Benmalek, Marc Santarini
  • Patent number: 5632880
    Abstract: A process for galvanic deposition of chromium coatings is provided in which the base material is subjected to a galvanic chromium plating bath to form a hard chromium coating with beaded or columnar type surface structure, and the beaded or columnar type surface structure is subsequently filled and smoothed with galvanically applied black chromium. The resulting combined coatings yield increased wear resistance, lower friction values, even without lubricants, and increased corrosion resistance.
    Type: Grant
    Filed: August 9, 1996
    Date of Patent: May 27, 1997
    Inventor: Marco Santini
  • Patent number: 5630933
    Abstract: Metal hydrides are activated by an electrochemical procedure. In this procedure, a bulk sample of the corresponding metal is immersed in an aqueous electrolyte and contacted by a cathode. Current passed through the aqueous electrolyte causes electrolysis of the water and a concomitant reaction with the formation of metal hydride. As a result, the metal hydride is fractured and smaller particles result. Additionally, the resulting metal hydride has a substantial amount of absorbed hydrogen. A novel plating method, taking advantage of the reducing power of hydrogen absorbed in a metal hydride, is useful to encapsulate such metal hydride with a variety of metals. Therefore, such hydrides are uniformly coated by using plating solutions without the standard reducing agent and stabilizer.
    Type: Grant
    Filed: July 14, 1995
    Date of Patent: May 20, 1997
    Assignee: Lucent Technologies Inc.
    Inventors: Henry H. Law, Brijesh Vyas
  • Patent number: 5595640
    Abstract: Nozzle body acting as an insoluble anode for the galvanic or chemical treent of rod-shaped or pipe-shaped objects continuously moved through the nozzle body and acting as cathode. The nozzle body is arranged in a hollow body serving as a pressure vessel, the electrolyte flowing through the hollow body. The hollow body has a plurality of radial bore holes acting as nozzles, these bore holes being arranged in a plurality of cross-sectional regions lying at a distance from one another and being inclined at angles (.alpha.) and (.beta.) relative to the longitudinal axis of the nozzle body and relative to the respective cross-sectional region. Diaphragms are associated with the nozzle body which is coated on all sides with a layer of metal from the platinum group. The diaphragms are arranged in the through-opening of the nozzle body, surround the body to be treated, and are situated in planes between the outlet openings of the bore holes.
    Type: Grant
    Filed: August 28, 1995
    Date of Patent: January 21, 1997
    Assignee: Metallglanz Gesellschaft fuer Entgratung und Oberflaechentechnik mbH
    Inventor: Timm von Hoffmann
  • Patent number: 5556530
    Abstract: An array of electrodes for use in a flat panel display includes a plurality of electron emitters formed of polycrystalline or single crystalline silicon which has been selectively etched to form pores in the emitters. The electrode array is then electroplated in a methane plasma to deposit a carbon compound such as silicon carbide on the surfaces of the emitters and in the pores of the emitters. Each emitter has a generally flat electron emitting surface which facilitates a longer life for the electrode array, the porous structure of the emitters increasing the electron emission efficiency of the emitters in relatively low electric fields. The electrode array can be integral with a support substrate by anisotropically etching the substrate to form the emitters. A layered interconnect structure can be formed on a surface of the silicon substrate for providing the interconnect structure for the electrode array.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: September 17, 1996
    Assignee: Walter J. Finklestein
    Inventors: Walter Finkelstein, John H. Hall
  • Patent number: 5556531
    Abstract: A process for the treatment of a material having an aluminum oxide layer comprising (a) treating the aluminum oxide layer with an aqueous solution of a pure and crystalline alkali metal silicate, and (b) rinsing the treated aluminum oxide layer with ion-containing water. A substrate so produced is useful in offset printing.
    Type: Grant
    Filed: May 5, 1995
    Date of Patent: September 17, 1996
    Assignee: Agfa-Gevaert AG
    Inventor: Wolfgang Wiedemann
  • Patent number: 5547559
    Abstract: The invention described provides a process for direct electroplating on activated surfaces substantially without the formation of a smut layer and thereby improving the adhesion of the plated deposit to the surface. The use of divalent or tetravalent sulfur compounds and/or cathodic electrocleaning is proposed between activation of the surface and electroplating of the surface.
    Type: Grant
    Filed: July 10, 1995
    Date of Patent: August 20, 1996
    Assignee: MacDermid, Incorporated
    Inventors: Peter Kukanskis, Ernest Yakobson, Lev Taytsas
  • Patent number: 5538600
    Abstract: A method of forming a highly-deflective surface on aluminum alloys. The, the composition comprising: cleaning a body formed from an aluminum alloy; electrobrightening the body; and desmutting the surface of the freshly-brightened body without etching. The bath comprises: 15-95 vol. % nitric acid and 1-85 vol. % acetic acid; 1-40 vol. % total water; and a source of fluoride ion supplying at least 35 grams per liter of fluoride. Ammonium bifluoride is the preferred source of fluoride.
    Type: Grant
    Filed: July 27, 1994
    Date of Patent: July 23, 1996
    Assignee: Aluminum Company of America
    Inventors: Paul B. Schultz, Albert L. Askin
  • Patent number: 5482614
    Abstract: An EL lamp having a higher luminescence efficiency and a process for manufacturing the same are provided. The EL element includes an aluminum foil having at least one specularly polished surface, an anodized oxide film formed on the specularly polished surface of the aluminum foil, a light emitting EL layer formed directly on the film, and a transparent electrode formed on the light emitting EL layer. The process for manufacturing an EL lamp includes the steps of polishing specularly at least one of the surfaces of an aluminum foil, forming an anodized oxide film on the specularly polished surface of the aluminum foil, and forming directly on the aluminum oxide film a light emitting EL layer and a transparent electrode.
    Type: Grant
    Filed: August 1, 1994
    Date of Patent: January 9, 1996
    Assignees: Stanley Electric Co., Ltd., Japan Metals & Chemicals Co., Ltd.
    Inventors: Kenichi Kondo, Takahiro Saida, Shuichi Taya, Toyoshi Iida, Takeshi Sotomura, Yuko Fujii, Keiji Sato, Mamoru Takahashi, Sadayasu Yamakawa, Shunichi Osawa
  • Patent number: 5476581
    Abstract: A method of producing a weapon barrel (1) having a wear-resistant inner coating (10) applied by an electrolytic method. To enable the application of a relatively thick protective layer to the inner wall or surface of a large-caliber weapon barrel (1), in particular, in the regions of thermally high stress and in a simple manner, a weapon barrel (1) prefabricated true to caliber is provided, a recess (7) is formed in the region of the chamber (2) and of the adjoining caliber region (3) to be coated with the protective layer (10) by electrochemical stripping (electrolytic polishing), and the recess (7) is subsequently refilled electrolytically with the protective layer (10). The same center electrode (4, 12) preferably is used for the electrolytic polishing process and for the electrolytic process for applying (plating) the protective coating or layer (10).
    Type: Grant
    Filed: October 17, 1994
    Date of Patent: December 19, 1995
    Assignee: Rheinmetall GmbH
    Inventors: Horst Reckeweg, Gert Schlenkert, Siegmar Kukulies
  • Patent number: 5464524
    Abstract: A plating method for a nickel-titanium alloy member is provided which comprises the steps of: subjecting a nickel-titanium alloy member to an anodic electrolyzing treatment and a cathodic electrolyzing treatment in succession by using an electrolyte containing hydrochloric acid as an essential component thereof, in particular, an electrolyte having a chloride ion concentration of 0.1 mol/l or more and a pH value of 2 or less, or an electrolyte having a chloride ion concentration of 0.4 mol/l or more, or still preferably, an electrolyte having a chlorine ion concentration of 0.3 mol/l or more and a pH value of 2 or less; strike plating the treated nickel-titanium alloy member with a desired metal; and electroplating the struck nickel-titanium alloy member with a desired metal. The adhesion between the nickel-titanium alloy member and a plating layer is very good.
    Type: Grant
    Filed: August 29, 1994
    Date of Patent: November 7, 1995
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Yoshiaki Ogiwara, Masaki Yasuhara, Akira Matsuda
  • Patent number: 5456819
    Abstract: This invention relates to an electrochemical treatment of metal substrates, including so-called "difficult to plate metals" such as tungsten and molybdenum, wherein deoxidation and plating are carried out in the same electrolyte bath by exploiting the electrochemical window in potential and pH of a reduction/deposition. This window may be illustrated using Pourbaix diagrams. In the first step of the treatment, a direct current at a reduction potential is applied to the substrate to reduce oxides present on the surface of the substrate without causing metal to be deposited from the electrolyte. In the second step, the reduction potential is changed to a more negative deposition potential, and a direct current at this deposition potential is applied for a time sufficient to deposit metal from the electrolyte.
    Type: Grant
    Filed: October 1, 1993
    Date of Patent: October 10, 1995
    Assignee: The United States of America as represented by the Secretary of Commerce
    Inventors: David S. Lashmore, David Kelley
  • Patent number: 5437779
    Abstract: A method of making a-magnetic record medium comprising the steps of: texturing a surface of a substrate by a first surface treatment; electrolyzing the surface of the textured substrate in an electrolyte of an acidic solution by applying an electric potential on the nonmagnetic substrate by a second surface treatment; and forming an undercoating layer and a magnetic layer on the surface of the electrolyzed substrate.
    Type: Grant
    Filed: December 9, 1993
    Date of Patent: August 1, 1995
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Tomoo Shige, Yasushi Makabe, Masataka Yokoyama
  • Patent number: 5395510
    Abstract: A blackened steel strip having improved blackness is produced in an efficient manner by anodizing a zinc alloy-plated steel strip in a solution containing 5 to 100 g/l of ClO.sub.3.sup.- and 10 to 300 g/l of SO.sub.4.sup.2- at pH 0.5 to 2.5 at a temperature of 30.degree. to 75.degree. C. and with a quantity of electricity of 10 to 300 C/dm.sup.2, and forming an acrylic resin chromate layer on the anodized steel strip to a thickness of 0.3 to 2.5 .mu.m. The solution may contain 5 to 100 g/l in total of at least one co-additive selected from Cl.sup.-, NO.sub.3.sup.-, H.sub.2 O.sub.2, Ni.sup.2+, Co.sup.2+, Fe.sup.2+, and Mn.sup.2+. The acrylic resin chromate layer contains 2 to 10 parts by weight of in the form of a chromate Cr per 100 parts by weight of acrylic resin.
    Type: Grant
    Filed: September 22, 1993
    Date of Patent: March 7, 1995
    Assignee: Kawasaki Steel Corporation
    Inventors: Katsuhei Kikuchi, Sachiko Suzuki, Nobuo Totsuka, Takao Kurisu, Keizo Okuno, Yoshihiro Naruse
  • Patent number: 5384026
    Abstract: A compact, hand portable, mobile electroplating unit provided with wheels, a seat for the user, and all of the chemical solutions and applicator equipment, including a D.C. power source, required to electroplate a metallic film on a metallic surface.
    Type: Grant
    Filed: May 10, 1994
    Date of Patent: January 24, 1995
    Assignee: Gold Effects, Inc.
    Inventor: Daniel A. McLaughlin
  • Patent number: 5368719
    Abstract: A process for plating aluminum and aluminum alloy substrates, such as 390 aluminum alloy pistons, with iron comprises (a) cathodically activating the aluminum-containing substrate in an acid bath and (b) plating iron from an iron sulfate-containing bath,
    Type: Grant
    Filed: May 12, 1993
    Date of Patent: November 29, 1994
    Assignee: Hughes Aircraft Company
    Inventor: Sue Troup-Packman
  • Patent number: 5277786
    Abstract: A process for producing a photoelectric conversion device comprising a substrate having a conductive surface, a semiconductor layer disposed on said conductive surface of said substrate, a transparent and conductive layer disposed on said semiconductor layer and a collecting electrode disposed on said transparent and conductive layer, wherein one or more defective portions formed at the semiconductor layer are repaired by means of electrolytic treatment using an electrolytic solution containing a material capable of providing an insulating material, wherein the conductive surface of the substrate is made an electrode, to thereby deposit an insulating material selectively at each of the defective portions.
    Type: Grant
    Filed: February 19, 1992
    Date of Patent: January 11, 1994
    Assignee: Canon Kabushiki Kaisha
    Inventor: Soichiro Kawakami
  • Patent number: 5269904
    Abstract: The invention is a single-bath electrolytic de-oxidation and anodization process in which a workpiece surface such as an aluminum surface is electrolytically de-oxidized and then anodized to form an adhesive oxide layer in the same electrolytic chemical bath without removing the workpiece from the bath. Upon completion of the anodization step, the piece is rinsed in a water bath. The invention further includes recirculating the electrolytic bath through a filter to suppress contaminant levels in the bath to prevent metal ion or organic contaminants from the de-oxidation step from compromising the integrity of the anodization step.
    Type: Grant
    Filed: June 5, 1992
    Date of Patent: December 14, 1993
    Assignee: Northrop Corporation
    Inventors: Calvin C. Fong, Rimas Viktora
  • Patent number: 5264113
    Abstract: A two-step process for the coating of magnesium and its alloys is disclosed. The first step comprises immersing the magnesium workpiece in a first electrochemical solution comprising about 3 to 10 wt-% of a hydroxide and about 5 to 30 wt-% of a fluoride having a pH of at least about 12. By controlling a current density to about 10 to 200 mA/cm.sup.2, an increasing voltage differential is established between an anode comprising the pretreated article and a cathode also in contact with the electrolytic solution. Next, the article is immersed in an aqueous electrolytic solution having a pH of at least about 11 and which solution is prepared from components comprising a water soluble hydroxide, a water soluble fluoride source and a water soluble silicate in amounts to result in an addition of about 2 to 15 g of a hydroxide per liter of solution, about 2 to 14 g of a fluoride per liter of solution and about 5 to 40 g of a silicate per liter of solution.
    Type: Grant
    Filed: July 15, 1991
    Date of Patent: November 23, 1993
    Assignee: Technology Applications Group, Inc.
    Inventors: Duane E. Bartak, Brian E. Lemieux, Earl R. Woolsey
  • Patent number: 5194139
    Abstract: An acidic pretreating solution for silver plating, which comprises as an agent for preventing the silver deposition by displacement, an inorganic acid and/or an organic acid, and a silver plating process which uses this pretreating solution. The pretreating solution provides long lasting preventive effect against silver deposition by displacement and the resulting silver plated layer firmly adheres to a metal substrate surface.
    Type: Grant
    Filed: March 8, 1991
    Date of Patent: March 16, 1993
    Assignee: Nippon Mining Company Limited
    Inventors: Takashi Kinase, Yoshiyuki Hisumi
  • Patent number: 5178745
    Abstract: This invention is an acid palladium strike bath which improves adhesion and porosity of subsequent platings of palladium or palladium alloys on metal substrates, especially those susceptible to passivation such as nickel, chromium, bronze and steel. The acid palladium strike bath which is useful for both low-speed and high speed plating operation includes a complexing agent selected from organic diamines and has a pH ranging from 2.0 to 6.0, preferably from 3.7 to 4.1. When used on easily corrodable substrates, such as copper, the palladium strike deposit protects the parts from chemical attack in the subsequent mainplating bath and prevents its contamination.
    Type: Grant
    Filed: May 3, 1991
    Date of Patent: January 12, 1993
    Assignee: AT&T Bell Laboratories
    Inventors: Joseph A. Abys, Heinrich K. Straschil
  • Patent number: 5149420
    Abstract: A method for plating palladium on Group IV-B and V-B metals, particularly niobium, vanadium, zirconium, titanium and tantalum as pure metals and as alloys is described. The method provides the metal to be plated with a roughened exposed surface to be plated which has been electrolytically hydrided and then the surface is plated using electroless or electrolytic plating. Hydride is removed from the plated surface, usually by heating. This also removes other surface impurities and aids the coat adhesion. The resulting palladium plated metal articles are usful for hydrogen extraction.
    Type: Grant
    Filed: July 16, 1990
    Date of Patent: September 22, 1992
    Assignee: Board of Trustees, operating Michigan State University
    Inventors: Robert E. Buxbaum, Peter C. Hsu
  • Patent number: 5145572
    Abstract: The process for manufacturing through-hole contacting plated printed circuit boards by direct metal electrodeposition on catalytically activated surfaces of the substrate material is improved by pre-treatment prior to electrodepositing the metal, preferably with a solution containing one or more nitrogen-containing organic compounds.
    Type: Grant
    Filed: December 9, 1991
    Date of Patent: September 8, 1992
    Assignee: Blasberg Oberflachentechnik GmbH
    Inventors: Jurgen Hupe, Herbert Iwan