Abstract: Continuous electrolytic tin plating is accomplished in a bath containing 90-160 g/L sulfuric acid, 4-70 g/L tin ion and a grain refiner, and 1-4% nonylphenol ethoxylated with 8-10 ethylene oxide groups, having a weight average molecular weight of 616.+-.18, at a speed of 900-1600 feet per minute and a current density as much as 1500 amperes per square foot or more.

Abstract: A coating for protecting metal components against corrosion in a saline atmosphere comprises at least one layer of a tin/zinc alloy containing between 8% and 35% by weight of zinc deposited on a sublayer of an alloy of zinc/nickel containing between 10% and 16% by weight of nickel, the thickness proportion of the two alloys forming the coating being two-thirds in the case of the zinc/nickel alloy and one-third in the case of the tin/zinc alloy. The coating may also include an external chromate film.

Abstract: In the present invention, the tin-silver-system alloy plating solution comprising following five fundamental ingredients (a)-(e): (a) a tin compound; (b) a silver compound; (c) at least one member selected from a group consisting of bismuth compounds and copper compounds; (d) a pyrophosphoric compound; and (e) an iodic compound. By the present invention, the tin-silver-system alloy layer, which can be employed instead of tin-lead solder alloy layer, can be formed without using harmful compounds: cyanide, lead compounds, etc..

Abstract: Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components. The invention relates to an electric component (surface mountable component) which can be mounted on the surface of a printed circuit board, and to a method of manufacturing said component. Such a component comprises a thin, electroconductive layer or stack of layers which is provided with end contacts and arranged on a support of an electrically insulating material.

Abstract: A metallic backing layer such as steel covered by a functional layer of AlSn, AlPb, CuPb, CuSn or CuZn, applied by spraying in air, and a softer covering layer applied to the functional layer by chemical or electrolytic deposition exhibits improved corrosion resistance, running-in behavior and conformability.

Abstract: A tin-silver alloy plating solution having a tin compound, a silver compound, and a complexing agent including a pyrophosphoric compound and an iodic compound. The tin-silver alloy layer composition can achieve a high electric current efficiency without using harmful compounds such as cyanides. The plating solution is very stable, possesses adhesivability, and the solder-wettability of the tin-silver alloy layer is satisfactory. Also, the alloy is an advantageous alloy for solder plating.

Abstract: A method for electroplating a silicon substrate in manufacturing a semiconductive device is provided. Electroplating process chamber contacts or fingers used in positioning a silicon substrate or wafer during an electroplating process are plated with a metal layer to prevent oxidation of the contacts. Oxidation of the contacts may result in increased and varying resistance of the contacts and thus nonuniform plating of the silicon wafer and possibly even deplating of a seed layer. A 20 mA/cm.sup.2 current is applied to the contacts which are immersed in an electrolyte solution before loading a silicon wafer. A silicon wafer is then loaded into the electroplating process chamber containing the electrolyte solution. The preplating of the contacts enables the formation of a uniform metal layer on the silicon substrate. Additionally, voltage then may be applied to the contacts after unloading the silicon wafer to reduce oxidation.

Abstract: A low hydrogen overvoltage cathode is provided which comprises an electroconductive base material coated with an alloy layer containing cobalt and tin at least at a content of tin ranging from 0.01 to 95% by weight. A process is also provided for producing the low hydrogen voltage cathode, wherein cobalt and tin at least are electrolytically co-deposited onto a surface of an electroconductive base material from a plating bath containing cobalt ions, tin ions, and a complexing agent.

Abstract: Continuous electrolytic tin plating is accomplished in a bath containing 90-160 g/L sulfuric acid, 40-70 g/L tin ion and a grain refiner, at a speed of 900-1600 feet per minute and a current density as much as 1500 amperes per square foot or more.

Abstract: An electrodeposition bath for depositing a Sn alloy onto a Cu substrate containing a Zn salt. This bath is particularly useful for Pb free alloy, such as a Sn--Bi alloy. The presence of Zn in the elctrodeposition bath greatly influence the bath behaviour and the characteristics of the deposited alloy, even if no Zn is codeposited on the Cu substrate.

Abstract: It now has been found that a smooth and level deposit of tin, lead or tin-lead alloy can be deposited on a substrate from an aqueous plating bath which comprises (A) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts, (B) an acid selected from the group consisting of sulfuric or fluoboric acid; and (C) an effective amount of at least one soluble bismuth salt of an alkane sulfonic acid or an alkanol sulfonic acid. Optionally, the aqueous plating bath may further comprise (D) at least one surfactant.

Abstract: A Sn--Bi alloy plating bath comprises at least one compound selected from the group consisting of polyoxy monocarboxylic acids, polyoxy lactones, polycarboxylic acids and salts thereof. A plating method comprises the step of applying a Sn--Bi alloy plating film to a substrate in the foregoing plating bath. The plating bath permits the formation of a Sn--Bi alloy plating film having a bismuth content ranging from 0.1 to 75% over a wide current density range. Moreover, the plating bath never forms precipitates, does not become turbid, does not cause any change of the bath composition and is, therefore, quite stable even when it is stored over a long period of time.

Abstract: A composition of matter for electrolytically depositing a tin layer on an iron containing-substrate is disclosed comprising an acidic aqueous mixture of:(a) a stannous tin halide; and(b) a salt having(1) an alkaline cation, and(2) an oxygen-containing inorganic acid anion reducible to a lower oxidation state.The salt is selected to minimize oxidation of Sn (II) to Sn (IV). An electrolytic cell for electrolytically depositing a tin layer on an iron-containing substrate is also disclosed, where the cell has an electrolyte comprising the foregoing composition. The overall cell potential of the cell is decreased, and the free energy increased, compared to an electrolytic cell without the salt. A process is disclosed for depositing a tin layer on an iron containing substrate comprising electrolytically coating the substrate with the composition, or coating the substrate employing the foregoing electrolytic cell. A product made by any of the foregoing processes is also described.

Abstract: A tin-zinc alloy electroplating bath comprises an amphoteric surfactant, a water-soluble stannous salt, a water-soluble zinc salt and a balance of water. When the tin-zinc alloy plating bath of the present invention is used, the formed coating film comprises a uniform alloy composition even in case where the current density varies over a wide range. Therefore, the coating film having the uniform alloy composition can be formed even on the substance having a complicated shape and the chromate treatment becomes satisfactory. As a result, the effect of the coating is improved, the resultant product is stable and the productivity is improved. Thus the tin-zinc alloy coating film having a high quality can be provided.

Abstract: A tin immersion composition of matter is disclosed comprising a compound comprising divalent tin ion, a compound comprising fluoride ion, and a compound comprising acid hydrogen ion. A process for treating an aluminum-copper or an aluminum-silicon alloy to improve the adhesion of metal layers to the alloy is also disclosed comprising contacting the alloy with an acidic tin immersion composition to produce a tin immersion coating on the alloy, and contacting the tin immersion coating with an etchant to substantially remove the tin immersion coating and produce an etched alloy surface.

Abstract: A particular anode comprising an electrochemically active material selected from the group consisting of the oxides of the elements tin, germanium and lead and mixtures comprising at least one of the respective oxides of such elements is useful in an electrochemical cell for the direct production of essentially dry halogen gas from essentially anhydrous halogen halide, or in a process for such production of essentially dry halogen gas. This cell or process may be used to produce halogen gas such as chlorine, bromine, fluorine and iodine from a respective anhydrous hydrogen halide, such as hydrogen chloride, hydrogen bromide, hydrogen fluoride and hydrogen iodide.

Abstract: A method for manufacturing a tin-coated surface of rolled copper strips or copper-alloy strips, wherein a strip surface is mechanically treated using a textured working roll to adjust a texture on said strip surface of an average peak-to-valley height within the range of 3 to 12 .mu.m and the textured strip surface is then continuously coated with tin or a tin-base alloy.

Abstract: A novel electroplating bath is described which comprises an alkane or alkanol sulfonic acid, tin, lead or tin-lead metal alloy and either an alkali carbonate or alkali bicarbonate salt. The addition of the alkali carbonate or bicarbonate salts reduces tin oxidation and thus decreases the amount of sludge formation in the bath.

Abstract: A solder bump 3a is formed on an electrode 2 provided on a printed circuit board 1. First, a core 3 is formed on the electrode 2. Then, solder paste 3' is coated on the core 3 so as to cover an entire surface of the core 3. Subsequently, the solder paste 3' is heated until the solder paste 3' fuses together with the core 3, thereby forming the bump 3a on the electrode 2.

Abstract: Silver-tin alloys can be deposited by the galvanic method from a cyanide-free bath which is prepared using silver as the nitrate or diammine complex, tin as the soluble tin(II) or tin(IV) compound and mercaptoalkane-carboxylic acids and -sulfonic acids, Uniform and adhering coatings of silver-tin alloys with a silver content of approximately 20 to 99 weight % can be deposited from said bath. Silver-tin alloys are electrodeposited from said bath at a pH of 0 to 14 and a current density of 0.1 to 10 A/dm.sup.2.

Abstract: Tin-zinc alloys can be electroplated from an aqueous alkaline solution containing an alkali metal zincate, an alkali metal stannate, and an alkali metal tartrate. The electroplating bath is alkaline with a pH of 11 to 14, preferably 12.0 to 13.5.

Abstract: Surfactants made by the successive ethoxylation and propoxylation of diamines are effective in providing a fine-grain tin coating in high-speed strip-steel plating operations under conditions of high current density. Surfactants prepared by successive propoxylation and ethoxylation are also effective.

Abstract: A system for electroplating a tin-bismuth alloy at near eutectic composition is disclosed. The system includes the plating bath and the process for initially preparing the bath as well as the process for plating an object with tin-bismuth alloy. The system further includes an apparatus for regulating the concentrations of tin and bismuth in the plating bath and the process by which the concentrations are controlled.

Abstract: A bath for electrodepositing tin, lead or an alloy thereof, containing a tin and/or lead ion and a sulfate ion becomes stable at pH 1 or higher when a condensed phosphate ion is added thereto. The bath is effective for depositing tin-lead alloy films on sealing glass-metal integrated articles.