Utilizing Organic Compound-containing Bath Patents (Class 205/296)
  • Publication number: 20120118750
    Abstract: A composition comprising at least one source of metal ions and at least one additive obtainable by reacting a poly-hydric alcohol comprising at least 5 hydroxyl functional groups with at least a first alkylene oxide and a second alkylene oxide from a mixture of the first alkylene oxide and the second alkylene oxide or a third alkylene oxide, a second alkylene oxide, and a first alkylene oxide in aforesaid sequence, the third alkylene oxide having a longer alkyl chain than the second alkylene oxide and the second alkylene oxide having a longer alkyl chain than the first alkylene oxide.
    Type: Application
    Filed: July 19, 2010
    Publication date: May 17, 2012
    Applicant: BASF SE
    Inventors: Cornelia Roeger-Goepfert, Roman Benedikt Raether, Dieter Mayer, Alexandra Haag, Charlotte Emnet
  • Publication number: 20120103820
    Abstract: An object of the present invention is to provide an electrolytic copper plating solution which can suppress, upon electrolytic copper plating on a copper seed layer during fabrication of ULSI copper microwiring (damascene copper wiring) having trends to further miniaturization, dissolution of the copper seed layer and accordingly can suppress occurrence of voids on the inner wall of vias/trenches. The present invention provides an electrolytic copper plating solution for filling for forming microwiring for ULSI, characterized in that it has a pH of 1.8 or higher and 3.0 or lower. The electrolytic copper plating solution preferably comprises a saturated carboxylic acid having 1 or more and 4 or less carbon atoms at 0.01 mol/L or more and 2.0 mol/L or less.
    Type: Application
    Filed: June 22, 2010
    Publication date: May 3, 2012
    Inventors: Junnosuke Sekiguchi, Hirofumi Takahashi, Akihiro Aiba
  • Patent number: 8152914
    Abstract: Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: April 10, 2012
    Assignee: Atotech Deutschland GmbH
    Inventors: Sigrid Schadow, Brigitte Dyrbusch, Carl Christian Fels
  • Patent number: 8123926
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: February 28, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Rajesh Baskaran, Robert W Batz, Jr., Bioh Kim, Tom L Ritzdorf, John L Klocke, Kyle M Hanson
  • Patent number: 8118988
    Abstract: A simple titration method involving a single copper ion titrant detected by a copper ion specific electrode provides the concentrations of both copper ions and bath complexing agent (ethylene diamine, for example) in alkaline copper electroplating baths of the type used to deposit or thicken copper seed layers on silicon wafers. Standard addition of an excess of a strong complexing agent (EDTA, for example) and back-titration with the copper ion titrant yields the bath copper ion concentration, and continued titration to a second endpoint, preferably after addition of hydroxide to adjust the pH of the analysis solution, yields the total concentration of bath complexing agent. Based on these analyzes, the concentration of free bath complexing agent may be calculated. The method also provides direct determination of the free bath complexing agent concentration via standard addition of excess bath complexing agent to a sample of the plating bath and titration with the copper ion titrant.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: February 21, 2012
    Assignee: ECI Technology, Inc.
    Inventors: Eugene Shalyt, Victor Ososkov, Michael Pavlov, Peter Bratin
  • Patent number: 8114263
    Abstract: The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said Polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolytically depositing a copper deposit using said aqueous acidic solution, said polyinylammonium compound corresponding to the general chemical formula (1): as well as to polyvinylammonium compounds of the general chemical formula (1), wherein one of the monomer units or both having indices I and m are present in the neutral form.
    Type: Grant
    Filed: March 1, 2006
    Date of Patent: February 14, 2012
    Assignee: Atotech Deutschland GmbH
    Inventors: Wolfgang Dahms, Udo Grieser, Olanda Grieser, legal representative, Christopher Grieser, legal representative, Philip Hartmann
  • Publication number: 20120018310
    Abstract: Composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising at least three active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides.
    Type: Application
    Filed: March 31, 2010
    Publication date: January 26, 2012
    Applicant: BASF SE
    Inventors: Cornelia Roeger-Goepfert, Roman Benedikt Raether, Charlotte Emnet, Alexandra Haag, Dieter Mayer
  • Patent number: 8048284
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: November 1, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Publication number: 20110259750
    Abstract: A method is disclosed for depositing a copper seed layer onto a substrate surface. In one embodiment, the method includes providing a substrate having a barrier layer disposed on a substrate surface, wherein the barrier layer has a barrier surface comprising a material selected from the group consisting of cobalt, ruthenium, tungsten, titanium, and a compound of two or more thereof, and exposing the substrate to a non-complexed, acid electrochemical plating solution with a plating bias applied across the substrate surface to deposit a copper-containing seed layer directly on the barrier surface without intervening layer disposed therebetween.
    Type: Application
    Filed: June 1, 2011
    Publication date: October 27, 2011
    Inventors: Hooman Hafezi, Aron Rosenfeld, Zhi-Wen Sun, Hua Chung, Lei Zhu
  • Patent number: 8012334
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: September 6, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 7993510
    Abstract: The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The electroplating solution of the present invention is characterized by containing 50 to 300 g/L of copper sulfate, 30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion, and 1 to 1000 mg/L of an additive comprising at least a levelling agent and a brightener.
    Type: Grant
    Filed: February 14, 2005
    Date of Patent: August 9, 2011
    Assignee: Ibiden Co., Ltd.
    Inventor: Honchin En
  • Publication number: 20110155581
    Abstract: A metal film-forming method is capable of forming a metal film on a surface of a base metal film, formed on a surface of a substrate, with sufficient adhesion to the base metal film even when a natural oxide film is formed on the surface of the base metal film. The metal film-forming method includes: preparing a substrate having a base metal film formed on a surface; and carrying out electroplating of the substrate using the base metal film as a cathode and another metal as an anode while immersing the substrate in a solution containing a metal complex and a reducing material, both dissolved in a solvent, to form a metal film, deriving from a metal contained in the metal complex, on the surface of the base metal film.
    Type: Application
    Filed: December 23, 2010
    Publication date: June 30, 2011
    Inventors: Akira SUSAKI, Tsutomu Nakada, Hideki Tateishi
  • Publication number: 20110065804
    Abstract: Articles having metallic finishes including antimicrobial agents dispersed throughout the finish and methods of electroplating said metallic finishes on a material. The metallic finishes include highly-decorative electroplated finishes for bathroom and kitchen hardware, door hardware, and other highly lustrous products where antimicrobial protection is preferred.
    Type: Application
    Filed: March 25, 2009
    Publication date: March 17, 2011
    Applicants: PAVCO INC., MICROBAN INTERNATIONAL LTD.
    Inventors: Leonard L. Diaddario, Matthew W. Stauffer
  • Publication number: 20110062029
    Abstract: For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ?-caprolactam, is contained in the bath as a leveler.
    Type: Application
    Filed: July 21, 2010
    Publication date: March 17, 2011
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Toshihisa Isono, Naoyuki Omura, Koji Shimizu, Shinji Tachibana
  • Publication number: 20110062030
    Abstract: The electrolyte composition is used in a method of depositing metals, in particular, onto substrates, especially solar cells. The electrolyte composition is particularly suitable for the deposition of metals, in particular silver, onto solar cells. The electrolyte composition is preferably free of cyanides and contains at least one metal, preferably silver, and an iminodisuccinate derivative, preferably a sodium or postassium iminodisuccinate.
    Type: Application
    Filed: September 9, 2010
    Publication date: March 17, 2011
    Inventors: Lothar Lippert, Stefan Dauwe
  • Publication number: 20110056840
    Abstract: An electrolytic plating equipment includes: a plating tank for holding plating solution; and a separate tank apart from the plating tank, for holding the plating solution circulating between the plating tank and the separate tank. The separate tank contains a first space and a second space located downstream from the first space. The plating solution in the first space in an amount exceeding a specific height flows from the first space into the second space, and the plating solution falls through air in the second space.
    Type: Application
    Filed: September 7, 2010
    Publication date: March 10, 2011
    Applicant: C. UYEMURA & CO., Ltd.
    Inventors: Toshihisa Isono, Shinji Tachibana, Naoyuki Omura, Shunsaku Hoshi, Kanako Matsuda, Koji Shimizu
  • Publication number: 20110045351
    Abstract: A method, including placing a substrate of a battery in a bath consisting of a metal M chosen from a metal group consisting of Fe, Ni, Co, Cu, W, V, and Mn, an oxidant selected from an oxidant group consisting of oxygen and sulfur, and a polymer. The method also includes applying an electrical current so as to form on the substrate a metal M compound cathode having a nanoscale grain structure.
    Type: Application
    Filed: August 19, 2010
    Publication date: February 24, 2011
    Applicant: RAMOT AT TEL-AVIV UNIVERSITY LTD.
    Inventors: Emanuel Peled, Diana Golodnitsky, Hadar Mazor-Shafir, Kathrin Freedman, Tania Ripenbein
  • Patent number: 7892411
    Abstract: Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive while using a soluble anode or insoluble anode as an anode and the workpieces as cathodes, including the steps of, setting a bath current density at not higher than 5 A/L, immersing metal copper in a region of the copper sulfate plating bath, the region being apart from a region between the anode and the cathode and also from regions adjacent the anode and cathode, respectively, such that a neighborhood of the thus-immersed metal copper can be used as an oxidative decomposition region, setting an immersed area of the metal copper at not smaller than 0.001 dm2/L based on the plating bath, and applying air bubbling to the oxidative decomposition region at not lower than 0.01 L/dm2·min based on the immersed area.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: February 22, 2011
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Shinji Tachibana, Tomohiro Kawase, Naoyuki Omura, Toshihisa Isono, Koji Shimizu
  • Patent number: 7879218
    Abstract: The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a solution containing accelerator molecules. Preferably, the bath into which the wafer is subsequently placed for electroplating has a reduced concentration of accelerator molecules. The pre-treatment causes a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: February 1, 2011
    Assignee: Novellus Systems, Inc.
    Inventors: Eric Webb, Jon Reid, Yuichi Takada, Timothy Archer
  • Publication number: 20110011746
    Abstract: To generate a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches, an aqueous, acid bath for the electrolytic deposition of copper is provided, said bath containing at least one copper ion source, at least one acid ion source, at least one brightener compound and at least one leveler compound, wherein at least one leveler compound is selected from the group comprising synthetically produced non-functionalized peptides and synthetically produced functionalized peptides and synthetically produced functionalized amino acids.
    Type: Application
    Filed: April 27, 2009
    Publication date: January 20, 2011
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Heiko Brunner, Bernd Roelfs, Dirk Rohde, Thomas Pliet
  • Patent number: 7857961
    Abstract: To provide a copper plating solution composition that precipitates copper plated membranes that are both uniform and smooth and which has good external appearance even if the copper plated membranes that are formed are relatively thin. The copper plating solution composition contains chlorine ions and bromide ions in specific volumes.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: December 28, 2010
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Shinjiro Hayashi, Hisanori Takiguchi
  • Patent number: 7824534
    Abstract: The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum and, particularly, to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution contains, as an additive, a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.
    Type: Grant
    Filed: December 9, 2005
    Date of Patent: November 2, 2010
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Katsuyuki Tsuchida, Hironori Kobayashi, Masashi Kumagai
  • Patent number: 7815786
    Abstract: An electrolytic plating method and composition for electrolytically plating Cu onto a semiconductor integrated circuit substrate having submicron-sized interconnect features. The composition comprises a source of Cu ions and a suppressor compound comprising polyether groups. The method involves superfilling by rapid bottom-up deposition at a superfill speed by which Cu deposition in a vertical direction from the bottoms of the features to the top openings of the features is substantially greater than Cu deposition on the side walls.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: October 19, 2010
    Assignee: Enthone Inc.
    Inventors: Vincent Paneccasio, Jr., Xuan Lin, Paul Figura, Richard Hurtubise
  • Publication number: 20100243467
    Abstract: Electrolytes for the electroplating of copper comprising, as inhibitor, a poly(alkylene-biguanide) salt. The inhibition developed by poly(alkylene-biguanide) salts is conditioned by the concentration of an accelerator on the surface of the copper. The surfactancy of poly(alkylene-biguanide) salts enables them to be instantly transferred from the electrolyte/air interface to the electrolyte/copper interface during contact between the cathode and the electrolyte. The electrolytes according to the invention are suitable for obtaining smooth and bright electroplated coatings and for depositing copper on surfaces having submicron-scale concavities useful in microelectronics.
    Type: Application
    Filed: April 2, 2007
    Publication date: September 30, 2010
    Inventor: Daniel Michelet
  • Patent number: 7781731
    Abstract: Disclosed herein is a method of qualitatively analyzing high-molecular additives in a metal plating solution, including: removing sulfate ions and metal ions from a metal plating solution; and qualitatively analyzing the metal plating solution, from which sulfate ions and metal ions are removed, using Matrix-Assisted Laser Desorption/Ionization Time-Of-Flight Mass Spectroscopy (MALDI-TOF MS). The method is advantageous in that the structure and molecular weight of high-molecular additives present in very small amounts in a plating solution can be accurately measured while maintaining the specific structure and molecular weight thereof without degrading the high-molecular additives.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: August 24, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yun Hee Kim, Bae Kyun Kim, Dong Hyun Cho
  • Patent number: 7771579
    Abstract: A chemical solution for an electro chemical plating process includes an electro chemical plating solution; and an additive, added in the electro chemical plating solution, substantially consisting of a polymer with one or more kinds of impurities, wherein each kind of the impurities has a density, with respect to the polymer, lower then 1019 atoms/cc.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: August 10, 2010
    Assignee: Taiwan Semiconductor Manufacturing Co.
    Inventors: Ting-Chu Ko, Chien-Hsueh Shih, Minghsing Tsai
  • Patent number: 7749610
    Abstract: The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 ?m to 3.0 ?m, 0.5×Rz(S)+0.5?C(S)??(1) where Rz(S) is a numerical value represented by ?m.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: July 6, 2010
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Kenichiro Iwakiri, Seiji Nagatani
  • Publication number: 20100089758
    Abstract: An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.
    Type: Application
    Filed: October 2, 2007
    Publication date: April 15, 2010
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Sakiko Tomonaga, Makoto Dobashi, Junshi Yoshioka, Ayumu Tateoka, Mitsuyoshi Matsuda, Hisao Sakai
  • Publication number: 20100084275
    Abstract: To provide a two-layer flexible substrate having excellent folding endurance, etching properties, and resist adhesiveness with no surface defects. A copper electrolytic solution containing chloride ions, a sulfur organic compound and polyethylene glycol as additives, and the copper electrolytic solution preferably contains 5 to 200 ppm of chloride ions, 2 to 1000 ppm of a sulfur organic compound and 5 to 1500 ppm of polyethylene glycol. A two-layer flexible substrate having a copper layer formed using the copper electrolytic solution, wherein the MIT folding endurance is 100 or more, and the surface roughness (Rz) of the copper layer is 1.4 to 3.0 ?m.
    Type: Application
    Filed: March 5, 2008
    Publication date: April 8, 2010
    Inventor: Mikio Hanafusa
  • Patent number: 7678257
    Abstract: There is obtained a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly an electrolytic copper foil which allows fine patterning, and is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. The present invention provides a copper electrolytic solution, containing as additives an organo-sulfur compound and a quaternary amine compound polymer obtained by homopolymerizing a compound in which the nitrogen of an acrylic type compound having a dialkylamino group is quaternized, or copolymerizing the compound with another compound having an unsaturated bond, and an electrolytic copper foil manufactured using this electrolytic solution.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: March 16, 2010
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Masashi Kumagai, Mikio Hanafusa
  • Publication number: 20100038256
    Abstract: The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the said surface to be coated is brought into contact with an electroplating bath while the said surface is not under electrical bias; a step of forming the coating during which the said surface is biased; a step during which the said surface is separated from the electroplating bath while it is under electrical bias; the aforementioned electroplating bath comprising, in solution in a solvent: a source of copper ions, with a concentration of between 0.4 and 40 mM; and at least one copper complexing agent.
    Type: Application
    Filed: September 20, 2006
    Publication date: February 18, 2010
    Applicant: ALCHIMER
    Inventors: Hervé Monchoix, Frédéric Raynal, Jérôme Daviot, José Gonzalez
  • Publication number: 20100006442
    Abstract: The present invention relates to processes for application of a metal layer on a substrate via deposition of a metal from a metal salt solution by a chemical and/or electroplating method, a significant factor in these processes being that carbon nanotubes are present in the substrate surface. The present invention moreover relates to the use of carbon nanotubes for application of a metal layer on a substrate.
    Type: Application
    Filed: July 27, 2007
    Publication date: January 14, 2010
    Applicant: BASF SE
    Inventors: Rene Lochtman, Jürgen Kaczun, Norbert Schneider, Jürgen Pfister, Norbert Wagner, Christoffer Kieburg, Ketan Joshi
  • Publication number: 20090166213
    Abstract: An object of the present invention is to provide a production method which enables efficient production of an electro-deposited copper foil with further lower profile when compared to the low-profile electro-deposited copper foils which have been supplied to the market and is excellent in mechanical strength. For the purpose of achieving the object, a production method adopted obtains the electro-deposited copper foil by electrolyzing a sulfuric acid based copper electrolytic solution which contains a quaternary ammonium salt polymer having cyclic structure and chlorine, wherein for the quaternary ammonium salt polymer contained in the sulfuric acid based copper electrolytic solution, a DDAC dimer or higher polymer is used. For the quaternary ammonium salt polymer, a diallyl dimethyl ammonium chloride polymer having a number average molecular weight of 300 to 10000 is preferably used.
    Type: Application
    Filed: October 31, 2006
    Publication date: July 2, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Makoto Dobashi, Mitsuyoshi Matsuda, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata, Ayumu Tateoka, Hiroshi Hata, Satoshi Mogi, Takeo Taguchi, Junshi Yoshioka
  • Patent number: 7517555
    Abstract: A copper plating solution according to the present invention is characterized by that it comprising 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic acid and 0.02 mol/L to 0.3 mol/L of sulfite, and has a pH adjusted to 5.0 to 8.5. A method for copper plating according to the present invention is characterized by that it comprises using the copper plating solution above. The copper plating solution and the method for copper plating according to the present invention stably provide a uniform copper plating film excellent in adhesion on the surface of an article to be plated, such as rare earth metal-based permanent magnet.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: April 14, 2009
    Assignee: Hitachi Metals, Ltd.
    Inventors: Fumiaki Kikui, Kaoru Kojima, Yoriyoshi Oooka, Kohshi Yoshimura
  • Patent number: 7510639
    Abstract: Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.
    Type: Grant
    Filed: July 16, 2005
    Date of Patent: March 31, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Deyan Wang, Robert D. Mikkola, Chunyi Wu, George G. Barclay
  • Publication number: 20090038952
    Abstract: Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive while using a soluble anode or insoluble anode as an anode and the workpieces as cathodes, including the steps of, setting a bath current density at not higher than 5 A/L, immersing metal copper in a region of the copper sulfate plating bath, the region being apart from a region between the anode and the cathode and also from regions adjacent the anode and cathode, respectively, such that a neighborhood of the thus-immersed metal copper can be used as an oxidative decomposition region, setting an immersed area of the metal copper at not smaller than 0.001 dm2/L based on the plating bath, and applying air bubbling to the oxidative decomposition region at not lower than 0.01 L/dm2·min based on the immersed area.
    Type: Application
    Filed: August 7, 2008
    Publication date: February 12, 2009
    Inventors: Shinji TACHIBANA, Tomohiro KAWASE, Naoyuki OMURA, Toshihisa ISONO, Koji SHIMIZU
  • Patent number: 7438794
    Abstract: A copper electroplating bath composition and a method of copper electroplating to improve gapfill are provided. The method of electroplating includes providing an aqueous electroplating composition, comprising copper, at least one acid, at least one halogen ion, an additive including an accelerating agent, a suppressing agent, and a suppressing-accelerating agent, and the solution and mixture products thereof; contacting a substrate with the plating composition; and impressing a multi-step waveform potential upon the substrate, wherein the multi-step waveform potential includes an entry step, wherein the entry step includes a first sub-step applying a first current and a second sub-step applying second current, the second current being greater than the first current. The accelerating agent is provided in concentration of greater than 1.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: October 21, 2008
    Assignee: Intel Corporation
    Inventors: David Jentz, Ramesh Viswanathan, Paul McGregor, Valery Dubin, Rajiv Rastogi
  • Patent number: 7427344
    Abstract: The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring the double layer capacitance of a measuring electrode in such sample solution. Specifically, the present invention utilizes the correlation between double layer capacitance and the organic additive concentration for concentration mapping, based on the double layer capacitance measured for the sample electrolytic solution.
    Type: Grant
    Filed: December 23, 2005
    Date of Patent: September 23, 2008
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Jianwen Han, MacKenzie E. King
  • Publication number: 20080210569
    Abstract: The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said Polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolytically depositing a copper deposit using said aqueous acidic solution, said polyinylammonium compound corresponding to the general chemical formula (1): as well as to polyvinylammonium compounds of the general chemical formula (1), wherein one of the monomer units or both having indices l and m are present in the neutral form.
    Type: Application
    Filed: March 1, 2006
    Publication date: September 4, 2008
    Inventors: Wolfgang Dahms, Udo Grieser, Olanda Grieser, Christopher Grieser, Philip Hartmann
  • Publication number: 20080187675
    Abstract: Disclosed herein arc novel liposome compositions generally including a foreign inclusion (e.g., diamond) component, and a liposome (e.g., i paucilamellar liposome) component. Also disclosed are methods of using these composition for plating and plate obtained thereby. Novel liposome compositions including components such as diamonds, are also disclosed, which can be used in a variety of applications, such as in abrasive, cosmetic or medical applications.
    Type: Application
    Filed: September 10, 2007
    Publication date: August 7, 2008
    Applicant: Frank C. Scarpa
    Inventors: Frank C. Scarpa, Dennis Johnson
  • Publication number: 20080142370
    Abstract: The aqueous acidic solution for electrolytically depositing high polish, decorative bright, smooth and level copper coatings on large area metal or plastic parts contains a) at least one oxygen-containing, high molecular additive and b) at least one water soluble sulfur compound, wherein the solution additionally contains c) at least one aromatic halogen derivative having the general formula (I), wherein R1, R2, R3, R4, R5 and R6 are each independently radicals selected from the group comprising hydrogen, aldehyde, acetyl, hydroxyls, hydroxyalkyl having 1-4 carbon atoms, alkyl having 1-4 carbon atoms and halogen, with the proviso that the number of residues R1, R2, R3, R4, R5 and R6 which are halogen ranges from 1 to 5.
    Type: Application
    Filed: July 28, 2004
    Publication date: June 19, 2008
    Inventors: Wolfgang Dahms, Carl Christian Fels, Gunther Bauer
  • Patent number: 7374652
    Abstract: Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the surface of an electronic device and in apertures on such substrate are provided. Such plating baths deposit a copper layer on the substrate surface that is substantially planar across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: May 20, 2008
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Shinjiro Hayashi, Hideki Tsuchida, Masaru Kusaka, Koichi Yomogida
  • Patent number: 7371311
    Abstract: An embodiment of the invention provides a method for reducing within die thickness variations by modifying the concentration of components of a low-acid electroplating solution. For one embodiment, the leveler concentration is increased sufficiently to reduce within die thickness variations to a specified value. For one embodiment of the invention, the leveler and suppressor are increased to reduce within die thickness variations and substantially reduce a plurality of electroplating defects. In such an embodiment the combined concentration of leveler and suppressor is determined to maintain adequate gap fill.
    Type: Grant
    Filed: October 8, 2003
    Date of Patent: May 13, 2008
    Assignee: Intel Corporation
    Inventors: Daniel J Zierath, Vinay Chikarmane, Valery M Dubin
  • Patent number: 7338585
    Abstract: A method comprising forming an interconnection opening through a dielectric material to a contact point; and electroplating a interconnection comprising copper in the contact opening using an electroplating bath comprising an alkoxylated sulfopropylated alkylamine. A method comprising forming an interconnection opening through a dielectric material to a contact point; lining the interconnection opening with a barrier layer and a seed layer; and electroplating an interconnection comprising copper in the contact opening using an electroplating bath comprising an alkoxylated sulfopropylated alkylamine.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: March 4, 2008
    Assignee: Intel Corporation
    Inventors: Rohan N. Akolkar, Valery M. Dubin
  • Patent number: 7335288
    Abstract: Methods for electrodeposition of copper on a noble metal layer of a work piece are provided. An exemplary method includes exposing the noble metal layer to an electrodeposition composition. The electrodeposition composition comprises a copper salt, a suppressor, an accelerator and an electrolyte. The electrodeposition of copper on a surface of the noble metal layer is initiated by application of a predetermined current density to the work piece. The electrodeposition of copper is terminated upon the occurrence of a predetermined event.
    Type: Grant
    Filed: September 18, 2003
    Date of Patent: February 26, 2008
    Assignee: Novellus Systems, Inc.
    Inventor: Vishwas V. Hardikar
  • Patent number: 7316772
    Abstract: A method for electroplating a copper deposit onto a semiconductor integrated circuit device substrate having submicron-sized features, and a concentrate for forming a corresponding electroplating bath. A substrate is immersed into an electroplating bath formed from the concentrate including ionic copper and an effective amount of a defect reducing agent, and electroplating the copper deposit from the bath onto the substrate to fill the submicron-sized reliefs. The occurrence of protrusion defects from superfilling, surface roughness, and voiding due to uneven growth are reduced, and macro-scale planarity across the wafer is improved.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: January 8, 2008
    Assignee: Enthone Inc.
    Inventors: John Commander, Richard Hurtubise, Vincent Paneccasio, Xuan Lin, Kshama Jirage
  • Patent number: 7232513
    Abstract: An electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid precipitation of wetting agent or other solute out of the plating solution. In some embodiments, the wetting agent decreases the air-liquid surface tension of the electroplating solution to 60 dyne/cm2 or less to increase the wetting ability of the solution with a substrate surface. In some embodiments of a method for plating metal onto substrate surface, the electroplating solution has a measured contact angle with the substrate surface less than 60 degrees.
    Type: Grant
    Filed: June 29, 2004
    Date of Patent: June 19, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Eric G. Webb, Jonathan D. Reid, John H. Sukamto, Yuichi Takada
  • Patent number: 7153408
    Abstract: The present invention is directed to an improved copper plating bath for depositing a copper layer onto a printing cylinder, the copper plating bath comprising: (a) a source of copper ions; (b) a source of methane sulphonate ions; (c) a source of chloride ions; (d) an organosulphur compound having the formula R—S—R?—SO3?X+ or X+—O3S—R?—S—R—S—R?—SO3—X+, wherein R is alkyl, hydroxyalkyl or alkyl ether, R? is a C2–C4 alkyl group, and X+ is a cation; and (e) a polyether compound and method of using the same. The copper plating bath produces a plating deposit that has a stable hardness and is free from self-annealing during high speed plating.
    Type: Grant
    Filed: April 13, 2006
    Date of Patent: December 26, 2006
    Inventors: Roderick D. Herdman, Trevor Pearson
  • Patent number: 7147767
    Abstract: The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions.
    Type: Grant
    Filed: December 16, 2002
    Date of Patent: December 12, 2006
    Assignee: 3M Innovative Properties Company
    Inventors: Steven D. Boyd, Susrut Kesari, William M. Lamanna, Michael J. Parent, Lawrence A. Zazzera, Haiyan Zhang
  • Patent number: 7144491
    Abstract: It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly to obtain an electrolytic copper foil which allows fine patterning, and which is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. Furthermore, it is an object of the present invention to obtain a copper electrolytic solution for this purpose. This copper electrolytic solution contains as additives an organo-sulfur compound and a quaternary amine compound with a specific skeleton.
    Type: Grant
    Filed: August 20, 2003
    Date of Patent: December 5, 2006
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Masashi Kumagai, Mikio Hanafusa