Utilizing Organic Compound-containing Bath Patents (Class 205/296)
  • Patent number: 5492615
    Abstract: A method for stabilizing organic metal finishing additives in aqueous metal treating baths by dissolving the organic metal finishing additive with a cyclodextrin and a common solvent therefor, so that an inclusion compound of the organic metal finishing additive in the cyclodextrin is formed, and then dissolving the inclusion compound in an aqueous metal treating bath. Aqueous metal treating baths having dissolved therein inclusion compounds of organic metal finishing additives in cyclodextrins are also described.
    Type: Grant
    Filed: November 22, 1994
    Date of Patent: February 20, 1996
    Assignee: LeaRonal Inc.
    Inventor: John Houman
  • Patent number: 5454930
    Abstract: An electrolytic copper plating method using a reducing agent is provided, wherein a catalyzed, electrically nonconductive substrate is dipped in a solution, which contains a copper salt, a copper-reducing agent for the acceleration of copper deposition and a copper-complexing agent and has a pH value of about 6 to 7.5, for electrolysis at a temperature of about 15.degree. C. to 50.degree. C., thereby forming an electrically conductive film of copper on said electrically nonconductive substrate. This method can be used in place of conventional electroless copper plating, dispense with any harmful substance such as formaldehyde, be easily analyzed and controlled, form an electrically conductive film of copper on an electrically nonconductive substrate with improved adhesion thereto, and is effectively applicable to making printed circuit boards in particular.
    Type: Grant
    Filed: July 28, 1994
    Date of Patent: October 3, 1995
    Assignee: Learonal Japan Inc.
    Inventors: Takeshi Miura, Masaru Seita
  • Patent number: 5433840
    Abstract: An aqueous acid bath for the galvanic deposition of bright, ductile and smooth copper coats which is suitable for decorative purposes as well as for strengthening the conductors of printed circuits. The bath is characterized by a content of polyalkylene glycol ether. When combined with thio compounds containing water-soluble groups, these additions produce an electrolyte with excellent stability. Polymeric phenazonium compounds, polymeric nitrogen compounds and/or thio compounds containing nitrogen may also be successfully combined, in addition, depending on the desired properties.
    Type: Grant
    Filed: April 6, 1994
    Date of Patent: July 18, 1995
    Assignee: Atotech Deutschland GmbH
    Inventors: Wolfgang Dahms, Horst Westphal, Michael Jonat
  • Patent number: 5421985
    Abstract: This invention relates to electrodeposited copper foil having an elongation measured at 180.degree. C. in excess of about 5.5%, an ultimate tensile strength measured at 23.degree. C. in excess of about 60,000 psi, and a matte-side R.sub.tm in the range of about 4.5 to about 18 .mu.m. This invention also relates to a process for making electrodeposited copper foil which comprises: preparing a copper deposition bath comprising water, copper ions and sulfate ions, said bath containing less than about 20 ppm chloride ions; and applying electric current to said bath to electrodeposit copper from said bath using a current density in the range of about 200 to about 3000 amps per square foot.
    Type: Grant
    Filed: April 7, 1992
    Date of Patent: June 6, 1995
    Assignee: Gould Inc.
    Inventors: Sidney J. Clouser, Dino F. DiFranco, Craig J. Hasegawa
  • Patent number: 5417841
    Abstract: The invention relates to a process for depositing copper on a gravure roll comprising the steps of: immersing a gravure roll in an electroplating bath comprising A) copper, B) sulfuric acid, C) at least one alkoxythio compound, D) at least one sulfonated, sulfurized hydrocarbyl compound and E) at least one grain refining thio compound, and passing electric current through the bath to deposit copper on the gravure roll.
    Type: Grant
    Filed: October 25, 1994
    Date of Patent: May 23, 1995
    Assignee: McGean-Rohco, Inc.
    Inventor: C. Richard Frisby
  • Patent number: 5328589
    Abstract: A process and composition for high acid/low metal copper electroplating baths with improved leveling, adhesion, ductility and throwing power. The bath includes effective amounts of a functional fluid having at least one ether group derived from an alcohol epoxy or a bisphenol A and containing ethoxy and propoxy functionalities.
    Type: Grant
    Filed: December 23, 1992
    Date of Patent: July 12, 1994
    Assignee: Enthone-OMI, Inc.
    Inventor: Sylvia Martin
  • Patent number: 5302278
    Abstract: A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO.sub.2 -X wherein R is an alkyl, heterocyclic or aryl moiety and X is a monovalent cation. The stabilizer is present in an amount sufficient to stabilize the thiosulfate ion when the solution is operated at an acidic pH of less than 7. Also, the solution is substantially free of cyanide.
    Type: Grant
    Filed: February 19, 1993
    Date of Patent: April 12, 1994
    Assignee: Learonal, Inc.
    Inventors: Fred I. Nobel, William R. Brasch, Anthony J. Drago
  • Patent number: 5277789
    Abstract: A novel method for making metals and homogeneous metal alloys comprises the steps of (a) providing a polymetallic complex of the general formula(.mu..sub.4 -0)L.sub.4 M'M"M'"M""X.sub.nwherein L is a ligand selected from the group consisting of organic and inorganic ligands, wherein M', M", M'", and M"" are metal atoms two or more of which may be the same, wherein X is a halogen atom, and wherein n is an integer ranging from 4 to 6; and (b) electrochemically depositing at least one of the metals from said polymetallic complex.
    Type: Grant
    Filed: June 29, 1992
    Date of Patent: January 11, 1994
    Assignees: Tufts University, Northeastern University
    Inventors: Samuel P. Kounaves, Albert Robbat, Jr., Geoffrey Davies
  • Patent number: 5252196
    Abstract: Compositions and processes for electrolytic plating. The compositions are characterized by critical amounts of one or more brightening and leveling agents. The compositions are particularly useful for plating through hole walls of printed circuit boards, including through holes having an aspect ratio equal or greater than about ten to one.
    Type: Grant
    Filed: December 5, 1991
    Date of Patent: October 12, 1993
    Assignee: Shipley Company Inc.
    Inventors: Wade Sonnenberg, Gordon Fisher, Roger F. Bernards, Patrick Houle
  • Patent number: 5232575
    Abstract: Acid, electroplating baths having consistent leveler activity contain levelers which are quaternized near-monodisperse polymers of acrylic or methacrylic trialkyl amine esters. The polymers may contain hydroxyalkyl acrylate or methacrylate ester components, unquaternized acrylic or methacrylic amine component as well as other polymeric components.
    Type: Grant
    Filed: May 31, 1991
    Date of Patent: August 3, 1993
    Assignee: McGean-Rohco, Inc.
    Inventor: John R. Dodd
  • Patent number: 5207996
    Abstract: Improved methods of heap leaching of copper ore with aqueous sulfuric acid solutions comprising a fluoroaliphatic surfactant are disclosed. The fluoroaliphatic surfactant increases the amount of copper values leached and recovered.
    Type: Grant
    Filed: October 10, 1991
    Date of Patent: May 4, 1993
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Michael J. Sierakowski, Frank A. Lee
  • Patent number: 5174886
    Abstract: Improved through-hole plating of printed circuit boards, wherein the ratio of the printed circuit board thickness to the diameter of at least one through hole is greater than 3 to 1, is achieved by a high-throw acid copper plating bath of this invention. The high-throw acid copper plating bath comprises an aqeuous solution of (A) copper sulfate, (B) sulfuric acid, (C) chloride ion, e.g., hydrochloric acid, (D) a carrier, (E) a brightener, and (F) an alkali metal salt; wherein the plating bath has a pH of not greater than about 1, the concentration of the hydrochloric acid is from about 6.0.times.10.sup.-4 to about 1.8.times.10.sup.-3 moles/liter, and the mole ratio of copper sulfate:sulfuric acid is not greater than about 1:25. Unlike previous high-throw acid copper plating baths, the bath of this invention contains an alkali metal salt. The use of the alkali metal salt makes it possible to maintain a lower acid concentration resulting in easier maintenance and more consistent plating.
    Type: Grant
    Filed: February 22, 1991
    Date of Patent: December 29, 1992
    Assignee: McGean-Rohco, Inc.
    Inventors: Randal D. King, Eda R. Montgomery
  • Patent number: 5151170
    Abstract: For acid copper plating baths containing a brightener used to produce smooth copper coatings of high brilliancy, it has been found that the "break-in" period normally needed after a brightener is added to the plating bath, has been virtually eliminated by use of the brightener of this invention. This brightener consists essentially of a peroxide oxidation product of a dialkylamino-thioxomethyl-thioalkanesulfonic acid wherein each alkyl and alkane group individually contains 1 to 6 carbon atoms and wherein the peroxide oxidation of the dialkylamino-thioxomethyl-thioalkane-sulfonic acid is carried out in an acid, aqueous medium having a pH of not more than about 1. In an added embodiment of this invention the acid copper plating bath also contains hydrolysis products of the peroxide oxidation product of a dialkylamino-thioxomethyl-thioalkanesulfonic acid.
    Type: Grant
    Filed: December 19, 1991
    Date of Patent: September 29, 1992
    Assignee: McGean-Rohco, Inc.
    Inventors: Eda R. Montgomery, Randal D. King