Abstract: A method for forming an aluminum sleeve comprises the following steps of: preparing material; wherein an aluminum alloy substrate is prepared; forging the aluminum material into a sleeve; trimming the sleeve in detail; thermally processing the sleeve for enhancing and hardening the forged sleeve; and anodizing-processing the sleeve to form a film on the sleeve. Between the forging and thermal processing; machining the trimmed sleeve through at least one process of rolling, grinding; polishing and vibration. Between thermal processing and anode-processing, surface-processing the sleeve so as to generate a blurred surface by a sanding step. In the anode-processing, dying the sleeve so that the color of the sleeve without fading or stripping.

Abstract: A method of manufacturing a nanochannel-array and a method of fabricating a nanodot using the nanochannel-array are provided. The nanochannel-array manufacturing method includes: performing first anodizing to form a first alumina layer having a channel array formed by a plurality of cavities on an aluminum substrate; etching the first alumina layer to a predetermined depth and forming a plurality of concave portions on the aluminum substrate, wherein each concave portion corresponds to the bottom of each channel of the first alumina layer; and performing second anodizing to form a second alumina layer having an array of a plurality of channels corresponding to the plurality of concave portions on the aluminum substrate. The array manufacturing method makes it possible to obtain finely ordered cavities and form nanoscale dots using the cavities.

Abstract: In devices such as flat panel displays, an aluminum oxide layer is provided between an aluminum layer and an ITO layer when such materials would otherwise be in contact to protect the ITO from optical and electrical defects sustained, for instance, during anodic bonding and other fabrication steps. This aluminum oxide barrier layer is preferably formed either by: (1) partially or completely anodizing an aluminum layer formed over the ITO layer, or (2) an in situ process forming aluminum oxide either over the ITO layer or over an aluminum layer formed on the ITO layer. After either of these processes, an aluminum layer is then formed over the aluminum oxide layer.

Abstract: A structure having a hole, including a substrate, a first layer including an alumina hole, and a second layer disposed between the substrate and the fist layer, wherein the second layer contains silicon, and has a smaller hole than the alumina hole.

Abstract: In an anodization apparatus and an anodization method for electrochemically treating a target substrate by irradiating the target substrate with light, treatment of a large target substrate can be made possible with smaller constituent elements. The electrical contact with the target substrate by a contact member is realized by a plurality of contact members or by the movement of a contact member to change the electrical contact position. The target substrate is manufactured in advance so as to have such a structure that portions thereof to be in contact with the plural contact members are connected to portions of a conductive layer on a treatment part thereof respectively.

Abstract: The present invention uses a two-step anodizing process to produce a colored anodized coating on the surface of an aluminum part. In accordance with this invention, a thin hard anodized coating layer is first formed on the surface of the aluminum part and then growing a softer a clear anodized coating layer on the surface of the aluminum part underneath the hard coat layer. The soft coat is essentially colorless and suitable for color finishing. This invention drastically improves the wear resistance of the aluminum part while maintaining a desired amount of clarity for effective electrolytic coloring.

Abstract: A capacitor comprising an aluminum anode and a dielectric layer comprising phosphate doped aluminum oxide and process for making the capacitor. The capacitor has a CV Product of at least 9 ?F-V/cm2 at 250 volts. Furthermore, the capacitor is formed by the process of: forming an aluminum plate; contacting the plate with an anodizing solution comprising glycerine, 0.1 to 1.0%, by weight, water and 0.01 to 0.5%, by weight, orthophosphate; applying a voltage to the aluminum plate and determining an initial current; maintaining the first voltage until a first measured current is no more than 50% of the initial current; increasing the voltage and redetermining the initial current; maintaining the increased voltage until a second measured current is no more than 50% of the redetermined initial current, and continuing the increasing of the voltage and maintaining the increased voltage until a final voltage is achieved.

Abstract: The metal oxide surface coating of an anodized valve metal may be made conductive under certain conditions so that conductive coatings can be electrolytically deposited on the surface of the oxide. When a dry polar aprotic electrolyte solution is used at a reduced temperature and a relatively high field is applied, the oxide ceases to be insulative. The process is reversible, meaning that there is no permanent change in the oxide.

Abstract: A method and apparatus of anodizing a component, preferably aluminum, is disclosed. The component is placed in an electrolyte solution. A number of pulses are applied to the solution and component. Each pulse is formed by a pattern including having three magnitudes. The third magnitude is less, preferably substantially less, than the first and second magnitudes, and all three magnitudes are of the same polarity. The pulse pattern may include alternations between the first and second magnitudes, and following the alternations, the third magnitude. Other patterns may be provided. The solution is in a reaction chamber, along with at least a portion of the component. The fluid enters the reaction chamber from a transport chamber through a plurality of inlets directed toward the component, preferably at an angle of between 60 and 70 degrees. The inlet is preferably the cathode, and the component is the anode, whereby current flows between the cathode and the anode in another embodiment.

Abstract: The present invention relates to an anodic oxidation method and a treatment apparatus thereof which is suitable, for example, for generation of an oxide film and electropolishing of aluminum, capable of generating an oxide film at a low cost and rapidly by eliminating the use of electrolytic solution having a strong acid property and using a carbonated water as the electrolytic solution, capable of improving the oxide film generating operation and rationalizing the water discharging treatment, capable of preventing increase in temperature of the electrolytic solution without a need of a special equipment, capable of generating an oxide film in a stable manner and obtaining a good oxide film by eliminating the generation of oxide in the vicinity of an object to be treated, and capable of rationalization of the oxide film generating treatment and enhancing the productivity by using supercritical carbon dioxide. An object (3) to be treated is electrolyzed as an anode in an electrolytic solution.

Abstract: A negative ion generating medium for generating negative ions from the surface of a mother material made of aluminum or aluminum alloy. The negative ion generating medium has the mother material of aluminum or aluminum alloy covered at the surface with an anodized layer on which a rare metal separated from a rare metal solution such as zirconium salt is deposited. As the rare metal is deposited in the pores provided in the anodized layer, its negative ion generating area can be increased thus releasing a large number of negative ions. The negative ion generating medium is manufactured by electrolytically processing the mother material in an electrolyte solution of sulfuric acid doped with a rare metal salt such as lithium salt to develop the anodized layer on the surface of the mother material and deposit the rare metal on the anodized layer.

Abstract: This invention is to reduce the influence of a gas generated by an anodizing reaction. A silicon substrate (101) to be processed is horizontally held. A negative electrode (129) is arranged on the upper side of the silicon substrate (101), and a positive electrode (114) is brought into contact with the lower surface of the silicon substrate (101). The space between the negative electrode (129) and the silicon substrate (101) is filled with an HF solution (132). The negative electrode (129) has a number of degassing holes (130) to prevent a gas generated by the anodizing reaction from staying on the lower side of the negative electrode (129).

Abstract: A method for inhibiting corrosion, e.g., pitting corrosion, of alloys is provided. Particularly, the method comprises contacting at least a portion of a surface of the alloy with an aqueous solution comprising a salt of one or more rare earth elements selected from the group consisting of yttrium, gadolinium, cerium, europium, terbium, samarium, neodymium, praseodymium, lanthanum, holmium, ytterbium, dysprosium and erbium; and establishing a voltage differential between an anode comprising the alloy and a cathode in the solution at an effective level and for a sufficient period of time wherein a rare earth element oxide-containing coating is formed on the surface of the alloy to inhibit corrosion thereof.

Abstract: A nanomachined and micromachined electrode (10) is disclosed that is produced by providing a layer of aluminum (11) positioned upon a conductive substrate (12), anodizing the layer of aluminum to produce a layer of aluminum oxide (13) having an array of pores (14), depositing a sacrificial metal (17) within the pores of the aluminum oxide layer, etching the aluminum oxide layer so as to leave an array of sacrificial metal rods (18), depositing a layer of electrode material (19) between the array of sacrificial metal rods, and etching the sacrificial metal rods so that a layer of copper remains having an array of pores (20) where the sacrificial metal rods had existed. The layer of copper is the electrode (10).

Abstract: A structure having a hole, including a substrate, a first layer including an alumina hole, and a second layer disposed between the substrate and the fist layer, wherein the second layer contains silicon, and has a smaller hole than the alumina hole.

Abstract: The invention provides a coated metal substrate comprising a metal substrate having an outer surface, a maskant film adhered to at least a portion of the outer surface of the metal substrate, the maskant film having a pattern of scribed lines therein, and a line sealant composition applied to the scribed lines in a maskant film. Both the maskant film and the line sealant composition are preferably radiation cured and substantially solvent-free. The invention also provides a method of protecting a metal substrate from chemical exposure by utilizing the radiation-cured maskant film and line sealant composition.

Abstract: Using pulsed current and relatively low average voltages, articles containing light metals such as magnesium may be rapidly anodized to form protective surface coatings. The anodizing solutions employed may contain phosphate, permanganate, silicate, zirconate, vanadate, titanate, hydroxide, alkali metal fluoride and/or complex fluoride, optionally with other components present.

Abstract: Metal articles having a durable visible marking on a smooth Type III hard anodized surface particularly useful for shock absorber tubes are produced by applying an alkaline solution to the anodized surface for not less than about 15 seconds at temperature of 100°-140° F.; applying a pattern of lacquer based solvent ink to said surface; and sealing the applied pattern by applying a liquid selected from the group consisting of nickel acetate, cobalt acetate and boiling water to said pattern.

Abstract: A process for the production of wear-resistant, coated surfaces includes the use of at least two electrodes connected to a voltages source which are mounted in, or border, a reaction space through which an electrolyte flows in which the surface to be coated is located. The process is distinguished by the fact that the direction of the flow of the electrolyte is selectively reversed at least once during the coating process to enable better control of the formation of the oxide layer.

Abstract: A method for the color finishing of aluminum frames and other components for motor vehicles comprises anodizing an aluminum surface and coloring the aluminum surface. The coloring of the aluminum surface may be effected by an adsorptive coloring process, an electrolytic coloring process, an interference coloring process, or any combination of the foregoing processes.

Abstract: A method, a composition and a method for making the composition for anodizing metal surfaces, especially magnesium surfaces is disclosed. The composition is a basic aqueous solution including hydroxylamine, phosphate anions and nonionic surfactants. A complementary method, composition and method for making the composition for rendering an anodized metal surface, especially a magnesium surface, conductive is disclosed. The composition is a basic aqueous solution including bivalent nickel, pyrophosphate anions, sodium hypophosphite and either ammonium thiocyanate or lead nitrate.

Abstract: A method of producing electrodes for electrolytic capacitors by etching metal foil in a low pH etching electrolyte is disclosed. The low pH electrolyte is an aqueous solution, which comprises hydrochloric acid, glycerol, sodium perchlorate or perchloric acid, sodium persulfate and titanium (111) chloride. Anode foils etched according to the method of the invention maintain high capacitance gains, electrical porosity and strength. The electrical porosity of the etched foils is sufficiently high such that the overall Equivalent Series Resistance (ESR) is not increased in multilayer anodes configurations. Also described is a low pH electrolyte bath composition. Anode foils etched according to the present invention and electrolytic capacitors incorporating the etched anode foils are also disclosed.

Abstract: A new and improved, anodized aluminum gas distribution plate for process chambers, particularly an etch chamber. The gas distribution plate includes an aluminum body having multiple gas flow openings extending therethrough and an alumina anodized coating or layer on the plate. The gas distribution plate is characterized by enhanced longevity and durability and resists particle-forming deterioration and damage throughout prolonged use.

Abstract: The invention provides a nanostructure including an anodized film including nanoholes. The anodized film is formed on a substrate having a surface including at least one material selected from the group consisting of semiconductors, noble metals, Mn, Fe, Co, Ni, Cu and carbon. The nanoholes are cut completely through the anodized film from the surface of the anodized film to the surface of the substrate. The nanoholes have a first diameter at the surface of the anodized film and a second diameter at the surface of the substrate. The nanoholes are characterized in that either a constriction exists at a location between the surface of the anodized film and the surface of the substrate, or the second diameter is greater than the first diameter.

Abstract: There is disclosed a process for producing an aluminium alloy sheet, which comprises subjecting a surface of the sheet to anodising conditions to form on the surface an aluminium oxide barrier layer of thickness 10 to 50 nm and treating the oxide layer with an aqueous solution of alkali to remove the layer, thereby leaving a roughened surface on the alloy sheet.

Abstract: A method and apparatus for anodizing a component. The component is placed in a container having first and second seal members that seal an annular surface of the component to be anodized. The first and second seal members, the annular surface of the component, and an inner surface of the container form a reaction chamber that holds a reaction medium therein. The reaction medium is supplied to the reaction chamber through a supply passage formed in the container. The reaction medium is drained from the reaction chamber through a drain passage formed in the container.

Abstract: A method for forming a coating on aluminum by contacting the aluminum with water, at least one multifunctional polymeric organic acid, a monomer of an intrinsically conductive polymer and polymerizing the ICP monomer and forming aluminum oxide by imposing an electrical potential between the aluminum surface as the anode and a cathode. The intrinsically conductive polymer salt and aluminum oxide coating that is formed resists corrosion and is resistant to de-doping during immersion in hot water.

Abstract: A method and apparatus for anodizing a component. The component is placed in a container having a supply port, a drain port and a supply passage. The supply passage faced on a surface of the component to be anodized. A reaction medium is supplied from the supply port to the drain port. An electric current is supplied from an electrode provided on the drain port side of the surface. The apparatus prevents any hydrogen gas created by the electrode from recirculating to the surface of the component.

Abstract: A new and improved, anodized aluminum gas distribution plate for process chambers, particularly an etch chamber. The gas distribution plate includes an aluminum body having multiple gas low openings extending therethrough and an alumina anodized coating or layer on the plate. The gas distribution plate is charcterized by enhanced longevity and durability and resists particle-forming deterioration and damage throughout prolonged use.

Abstract: Aluminum surface mount capacitors containing one or more anode foil coupons are initially anodized in an aqueous phosphate solution in order to produce an anodic oxide film having extreme resistance to hydration and attack by corrosive anions for the purpose of producing surface mount capacitors at high yield and of high stability.

Abstract: Process for obtaining a ceramic coating on the surface of a metal having semiconducting properties, such as aluminium, titanium, magnesium, hafnium, zirconium and their alloys, by a physico-chemical transformation reaction of the treated metal. This process consists in immersing the metal workpiece to be coated in an electrolytic bath composed of an aqueous solution of an alkali metal hydroxide, such as potassium hydroxide or sodium hydroxide, and of an oxyacid salt of an alkali metal, the metal workpiece forming one of the electrodes, and in applying a signal voltage of overall triangular waveform to the electrodes, that is to say a signal having at least a rising slope and a falling slope, with a form factor that can vary during the process, generating a current which is controlled in its intensity, its waveform and its ratio of positive current to negative current.

Abstract: The present invention is directed to a method of creating porous anode foil for use in multiple anode stack configuration electrolytic capacitors, producing a pore structure that is microscopic in pore diameter and spacing, allowing for increased energy density with a minimal increase in ESR. Initially, an anode metal foil is etched, according to a conventional etch process, to produce an enlargement of surface area. The etched foil is then placed into the electrochemical drilling solution of the present invention. Alternatively, the etched foil may be masked, so that only small areas of the etched foil are exposed, prior to being placed in the electrochemical drilling solution. A DC power supply is used to electrochemically etch the masked or unmasked foil in the electrochemical drilling solution of the present invention such that pores on the order of a few microns diameter are produced through the foil.

Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.

Abstract: In a method of providing a surface with a protection layer having at least a first surface area (2) and a second surface area (1), which surface areas (1, 2) are distinguishable in that the surface areas (1, 2) differ from each other in at least one visual property, parts of the surface situated outside the first surface area (2) are masked with a mask layer which partially covers the surface, and the surface is subjected to an electrochemical treatment (14, 20), whereby non-masked parts of the surface are treated. As the mask layer provided on the surface is a sol-gel layer forming the protection layer in the second surface area (1), a wear-resistant surface-protection layer having visually distinguishable surface areas is provided in an efficient manner. An object which can be obtained by means of the proposed method is also described.

Abstract: Using aqueous electrolytes containing complex fluorides or oxyfluorides such as fluorozirconates, fluorotitanates, and fluorosilicates, articles containing light metals such as magnesium and aluminum may be rapidly anodized to form protective surface coatings. White coatings may be formed on aluminum articles using pulsed direct current or alternating current. When the article to be anodized is comprised of magnesium, pulsed direct current having a relatively low average voltage is preferably used.

Abstract: A method for removing gas bubbles from a surface of a wafer is provided. Removal process is performed as the wafer surface is placed into a process solution for an electrochemical process. As the wafer surface is placed into the solution and moved towards a pressure barrier placed into the solution, a process solution flow between the wafer surface and the pressure barrier is induced to remove gas bubbles from the wafer surface.

Abstract: A method of manufacturing a decorative plate (1) includes the steps of: preparing a metal substrate and covering selected areas (11, 16) of the substrate with a protective film; anodizing the substrate; and removing the protective film to expose metallic surfaces in the selected areas of the substrate.

Abstract: An electrostatic chuck comprising an insulating base 6, a plurality of conductive aluminum thin films 4a, 4b deposited on the surface of the base, and alumite films 2a, 2b formed by anodizing the surfaces of the conductive thin films 4a, 4b, wherein the conductive thin films 4a, 4b are each provided with a DC voltage of a different polarity so that a surface chucking a wafer 7 is electrostatically bipolar.

Abstract: In an anodized electrode which comprises a substrate, a vacuum deposited porous coating thereon comprising at least one substance selected from valve metals, valve metal oxides and mixtures thereof, and at least one ectrolytically produced anodized layer selected from valve metal oxides and mixtures thereof, the effective surface area is increased prior to deposition of the at least one anodized layer, e.g. by oxidizing the surface of the porous layer and removing thus formed oxide, and/or by roughening the surface of substrate mechanically, chemically and/or electrochemically, prior to vapor deposition.

Abstract: A method, a composition and a method for making the composition for increasing the corrosion resistance of a magnesium or magnesium alloy surface is disclosed. The composition is a water/organic solution of one or more hydrolyzed silanes. By binding silane moieties to the magnesium surface, an anti-corrosion coating on a magnesium workpiece is produced. A complementary method, composition and method for preparing the composition for treating a metal surface to increase corrosion resistance is disclosed. The composition is an aqueous hydrogen fluoride solution with a non-ionic surfactant.

Abstract: A process for producing an aluminum support for a planographic printing plate, the process comprising the steps of: (a) preparing an aluminum plate; (b) disposing said aluminum plate in an aqueous acidic solution; and (c) electrochemically surface-roughening said aluminum plate using an alternating current, wherein a ratio QC/QA of a cathode-time quantity of electricity of said aluminum plate QC to an anode-time quantity of electricity of said aluminum plate QA is from 0.95 to 2.5. An aluminum support for a planographic printing plate formed by the process. A planographic printing master plate comprising at least a positive-type or negative-type light-sensitive layer on the aluminum support.

Abstract: A method is provided for forming an inorganic layer on a surface of a copper material, made of copper or of a copper-based alloy: a browning anodic oxidation process is performed on the copper material in an electrolytic bath containing only an alkali (for example NaOH) at a specified concentration in aqueous solution, under controlled condition of temperature and anodic current density and for a period of time suitable to form a continuous layer basically formed of copper (I) oxide (Cu2O): layers highly adherent to the copper substrate and having good mechanical behavior are produced: different colors and optical properties may be obtained by controlling the process conditions so as to influence the crystalline form of the Cu2O layers.

Abstract: A bearing manufacturing method for a compressor is disclosed. Since an oxide-coated layer is formed at the surface of the bearing and electrolized in a tiomolybedenic acid ammonium aqueous solution so that the molybedene emulsion can be infiltrated in the fine pores of the oxide-coated layer. Accordingly, the abrasion resistance of the bearing can be increased while the friction coefficient is remarkably reduced, and thus, a reliability of the compressor and an energy efficiency can be increased.

Abstract: The present invention is directed to a method of etching anode foil in a non-uniform manner which increases the overall capacitance gain of the foil while retaining foil strength. In particular, by using a mask to protect a mesh grid of the foil from further etching, a previously etched foil can be further etched, prior to the widening step. Alternatively, the mask may be used in the initial etch, eliminating the need for the second process. In effect the foil may be etched to a higher degree in select regions, leaving a web of more lightly etched foil defined by the mask to retain strength. According to the present invention, the foil is placed between two masks with a grid of openings which expose the foil in these areas to the etching solution. The exposed area can be as little as 10% of the total foil to as much as 95% of the total foil, preferably 30% to 70% of the total foil area.

Abstract: A method of manufacturing a positive electrode foil of an aluminum electrolytic capacitor is provided in which anodizing conditions are optimally determined and automatically set to minimize the loss of production and to produce a constant quality of the positive electrode foil. The method comprises an etching process and an anodizing process. An etched foil produced in the etching process is subjected to a constant current inspection, and then, the anodizing conditions are determined from the result of the constant current inspection. The anodizing conditions are transferred to a control panel in the anodizing process where they are automatically registered as its settings. Also, an apparatus for manufacturing the positive electrode foil is provided which has a voltage sensor connected between an output running roller and cathode electrodes in an anodizing tank. A voltage measured by the voltage sensor is fed back to a direct-current source for controlling its output voltage.

Abstract: A hard, wear-resistant ceramic surface is applied to spinning rotor cups in an electrolytic bath on which is imposed a shaped-wave electric current. A special electrode has been designed to facilitate application of the coating to the unique shape of a spinning rotor cup under the shaped wave conditions.

Abstract: We have discovered that the formation of particulate inclusions at the surface and the interior of an aluminum alloy article interferes with the performance of the article when a surface of the article is protected by an anodized coating. We have also discovered that the formation of such particulate inclusions can be controlled to a large extent by controlling the concentration of particular impurities present in the alloy used to fabricate the aluminum alloy article.

Abstract: Methods of forming a nano-scale electronic and optoelectronic devices include forming a substrate having a semiconductor layer therein and a substrate insulating layer on the semiconductor layer. An etching template having a first array of non-photolithographically defined nano-channels extending therethrough, is formed on the substrate insulating layer. This etching template may comprise an anodized metal oxide, such as an anodized aluminum oxide (AAO) thin film. The substrate insulating layer is then selectively etched to define a second array of nano-channels therein. This selective etching step preferably uses the etching template as an etching mask to transfer the first array of nano-channels to the underlying substrate insulating layer, which may be thinner than the etching template. An array of semiconductor nano-pillars is then formed in the second array of nano-channels. The semiconductor nano-pillars in the array may have an average diameter in a range between about 8 nm and about 50 nm.

Abstract: In a process for producing an aluminum support of a lithographic printing plate, the desired aluminum support is produced by imparting fine asperities to an aluminum plate and then roughening it electrochemically in an acidic aqueous solution. The roughened aluminum plate may be electropolished or chemically etched.

Abstract: A method of high-k gate dielectrics prepared by liquid phase anodic oxidation, which first produces a metallic film on the surface of a clean silicon substrate, next to oxidize said metallic film to form a metallic oxide as a gate oxidizing layer by liquid phase anodic oxidation, then to promote quality of said gate oxidizing layer by processing a step of thermal annealing. With this oxidation, a gate dielectric layer of high quality, high-k and ultrathin equivalent oxide thickness (EOT) can be produced, which can be integrated to complementary metal oxide semiconductor (CMOS) process directly.