Abstract: Leaching aids, for example, when present in a leaching solution, and methods of using the leaching aids. The leaching aids can include one or a combination of compounds. The method of using the leaching aids can include a process of recovering metal from ore, for example, a process involving heap leaching, solvent extraction and electrowinning.

Abstract: A solution for selectively etching copper or a copper alloy from a microelectronic device, wherein the device simultaneously includes copper or a copper alloy and nickel-containing material, the solution being an etching solution for copper or a copper alloy comprising a chelating agent having an acid group in a molecule, hydrogen peroxide, and a surfactant having an oxyethylene chain in a molecule.

Abstract: An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.

Abstract: Present invention provides an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. The electro-deposited copper foil is formed by depositing fine copper crystal grains having a small deviation of grain-diameter. The electro-deposited copper foil has a low-profile and glossy surface and has extremely large mechanical strength expressed by a tensile strength as received of 70 kgf/mm2 to 100 kgf/mm2 and has a tensile strength after heating (180° C. for 60 minutes) corresponding to 85% or more of the tensile strength as received. The electro-deposited copper foil is manufactured by electrolysis using a sulfuric acid base copper electrolytic solution containing a compound composed of a benzene ring having a sulfo group bonded thereto, a sulfonate of an active sulfur compound and a polymer of a quaternary ammonium salt having a cyclic structure.

Abstract: The method of the present invention includes a step (i) in which a voltage is applied between first and second electrodes 21 and 22 so that the first electrode serves as a cathode, with the first and second electrodes 21 and 22 being placed in contact with a material that allows ions to move therethrough. The material includes an adsorbent (gel 11) containing a macromolecule that has adsorbed a metal ion. The macromolecule contains the same constitutional units as those contained in a macromolecule extracted from Aphanothece sacrum. The first electrode 21 is placed in contact with the adsorbent in step (i). The metal is deposited on a surface of the first electrode 21 by applying the voltage in step (i).

Abstract: A method of electrowinning or electrorefining copper from a copper electrolyte solution which contains chloride ions, the method comprising the steps of: (a) forming a polyacrylamide solution by dissolving polyacrylamide, having a molecular weight range of 5,000 to 20,000,000 Daltons, in an acidic medium and under conditions to form a polyacrylamide block copolymer having blocks of carboxyl groups dispersed along the polymer backbone; (b) introducing the polyacrylamide solution into an electrolytic cell containing the copper electrolyte solution at a polyacrylamide concentration of 0.01-10 mg/L; and (c) electroplating copper from the copper electrolyte solution to form a copper cathode.

Abstract: A system and process for recovering copper from a copper-containing ore, concentrate, or other copper-bearing material to produce high quality cathode copper from a leach solution without the use of copper solvent/solution extraction techniques or apparatus. A process for recovering copper from a copper-containing ore generally includes the steps of providing a feed stream containing comminuted copper-containing ore, concentrate, or other copper-bearing material, leaching the feed stream to yield a copper-containing solution, conditioning the copper-containing solution through one or more physical or chemical conditioning steps, and electrowinning copper directly from the copper-containing solution in multiple electrowinning stages, without subjecting the copper-containing solution to solvent/solution extraction prior to electrowinning.

Abstract: A system and process for recovering copper from a copper-containing ore, concentrate, or other copper-bearing material to produce high quality cathode copper from a leach solution without the use of copper solvent/solution extraction techniques or apparatus. A process for recovering copper from a copper-containing ore generally includes the steps of providing a feed stream containing comminuted copper-containing ore, concentrate, or other copper-bearing material, leaching the feed stream to yield a copper-containing solution, conditioning the copper-containing solution through one or more physical or chemical conditioning steps, and electrowinning copper directly from the copper-containing solution in multiple electrowinning stages, without subjecting the copper-containing solution to solvent/solution extraction prior to electrowinning.

Abstract: A system and process for recovering copper from a copper-containing ore, concentrate, or other copper-bearing material to produce high quality cathode copper from a leach solution without the use of copper solvent/solution extraction techniques or apparatus. A process for recovering copper from a copper-containing ore generally includes the steps of providing a feed stream containing comminuted copper-containing ore, concentrate, or other copper-bearing material, leaching the feed stream to yield a copper-containing solution, conditioning the copper-containing solution through one or more physical or chemical conditioning steps, and electrowinning copper directly from the copper-containing solution in multiple electrowinning stages, without subjecting the copper-containing solution to solvent/solution extraction prior to electrowinning.

Abstract: Electrolytic solutions containing organic additive(s) selected from a described class of additives (e.g., 4,6-dihydroxypyrimidine) reduce overall applied electrical potential of electrolytic cells and/or reduce gas formation at the anode(s) or increase copper production rate. Benefits include reducing overall power consumption and reducing acid mist during electrolytic processes.

Abstract: An electrolytic process for the production of metallic copper in an electrolytic cell including anode and cathode chambers separated from each other by a porous member, an anode disposed in the anode chamber, and a cathode disposed in the cathode chamber. The process comprises providing an ammoniacal alkaline electrolyte solution containing diammine cuprous ions in each of the anode and cathode chambers, and applying direct current to the anode and cathode to produce metallic copper on the cathode and to produce tetrammine cupric ions on the anode. An electrolytic cell apparatus including anode and cathode chambers separated from each other by a porous member, an anode disposed in the anode chamber, a cathode disposed in the cathode chamber, and a DC current source connected to the anode and cathode, wherein each of the anode and cathode chambers contains an ammoniacal alkaline electrolyte solution containing diammine cuprous ions.

Abstract: Alkoxylated compounds of formula I R((AO)nH)mHp  (I) wherein each AO group is independently an alkyleneoxy group selected from ethyleneoxy, 1,2-propyleneoxy, 1,2-butyleneoxy, and styryleneoxy groups; n is an integer of from 2 to 100; m is an integer of from 1 to the total number of —OH plus —NH hydrogens in the R group prior to alkoxylation; the sum of m plus p equals the number of —OH plus —NH hydrogens in the R group prior to alkoxylation; and the R group is a group selected from the following: N(CH2CH2O)3  (II); R1N(CH2CH2O)2 where R1 is a C1-C24 alkyl, aryl, or aralkyl group  (III); R1N+(CH2CH2O)3Y− where R1 has the above meaning and  (IV) Y− is an anion, preferably an inorganic anion such as a halogen anion, a hydrogen sulfate anion, one-half of a sulfate anion, or one-third of a phosphate ion; NCH2CH2N  (V); NCH2CH2NCH2CH2N  (VI); CH3C(CH2O)3  (VII); CH3CH2C(CH2O)3  (VIII);

Abstract: An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method. The present invention further provides an electrodeposition apparatus including a path for circulating a copper sulfate solution, whereby in said path is provided a filtration means for removal of thiourea-decomposed products remaining in copper electrolyte.

Abstract: An improvement in the solvent extraction process for recovering metal values, i.e. copper, from acidic aqueous solutions containing copper and iron which may also include chloride, and more particularly to an improvement which provides for increased copper to iron ratios in the loaded organic extractant phase. The improvement comprises washing the loaded organic extractant phase prior to stripping of the copper values therefrom with an aqueous acidic wash solution containing at least a portion of electrolyte solution, wherein the wash solution or the electrolyte solution has been previously contacted with copper metal.

Abstract: The present invention concerns a method for the prevention of anode passivation in the electrolytic refining of copper, when periodic reversal current technology is used in electrolysis. The method is particularly suitable for the electrolytic refining of copper at high current densities. Irregular periodic reversal current technology is used in the present method, whereby current reversal is adjusted on the basis of an increase in electrolysis cell voltage.

Abstract: A copper electroplating composition for integrated circuit interconnection is proposed, including a copper salt, an inorganic acid containing same anion as the copper salt, a suppressing agent and a polishing agent. This electroplating composition helps deposit copper into fine trenches with a high aspect ratio on a substrate, so as to form a surface-flat and void-free plated copper layer over the substrate by electroplating. It can therefore reduce the usage of polishing slurry and polishing time in a subsequent chemical mechanical polishing process, and also improve surface planarity of the copper later after being polished.

Abstract: Methods of dissolving copper into electrolytic solutions, such as solutions comprising nitrogen compounds, by supplying an anodic current to a copper or copper-containing metal that is in contact with an electrolytic solution comprising a nitrogen compound (such as 2-hydroxyethylamine) and carbon dioxide. Anodic current may be provided by, for example, galvanic coupling with a material having a more positive reduction potential in the electrolytic solution (or given the system of electrolytic solutions) than copper, and/or by applying an impressed anodic current to the copper or copper-containing metal. Separate reaction vessels may be employed to house a first copper metal and a second cathode metal, as well as the electrolytic solutions associated with each.

Abstract: A high tensile strength copper foil having a matte side roughness Rz of 2.5 &mgr;m or less and a tensile strength of 40,000 Kgf/mm2 after heating one hour at 180° C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominently (111) orientation.

Abstract: A method of electrowinning, electrorefining or electroforming of ductile copper deposits. The method uses an adduct of a tertiary alkyl amine with polyepichlorohydrin in amounts effective for ductilizing a copper deposit form a copper electrolyte.

Abstract: A high tensile strength copper foil having a matte side roughness Rz of 2.5 .mu.m or less and a tensile strength of 40,000 Kgf/mm.sup.2 after heating one hour at 180.degree. C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominantly (111) orientation.

Abstract: Using the electrolytic process to make manganese metal, a source of manganomanganic oxide (Mn.sub.3 O.sub.4) is used in the sulfuric acid leach solution in conjunction with a reducing agent to convert the manganomanganic oxide into manganese sulfate for treatment in the electrolytic cell. Sources of manganomanganic oxide include sintered manganese ore, manganese ore having less than 7% available oxygen such as Assoman Ore, and MOR fume. Reducing agents include sulfur dioxide, activated carbon, reducing sugars and molasses.

Abstract: An electrolytic process for producing copper foil having a low profile surface exhibiting a high peel strength when bonded to a polymeric substrate, which process comprises: (a) preparing an electrolyte comprising a copper sulfate-sulfuric acid solution, containing as addition agents, a low molecular weight water-soluble cellulose ether, a low molecular weight water-soluble polyalkylene glycol ether, a low molecular weight water-soluble polyethylene imine and a water-soluble sulfonated organic sulfur compound; (b) passing an electric current through the electrolyte from a primary anode to a cathode spaced from the primary anode in a first electrodeposition zone under first mass transfer conditions including a first current density to electrodeposit on the cathode a base copper foil having a fine-grained microstructure and a matte surface having micropeaks with a height not greater than about 150 microinches; (c) passing the base foil and electrolyte from the first electrodeposition zone to a second electrodep

Abstract: A method to prevent corrosion of a stainless steel cathode in a copper electrowinning system uses compounds added to the electrowinning solution which reduce the level of free chlorine. Examples of such compounds are thiourea, alkyl sulphonate surfactants and protein glues.

Abstract: Polyacrylic acids are used in electrowinning and electrorefining baths as additives for grain refinement, dendrite reduction, and for reducing impurities in the electroplate.

Abstract: A sulfur dioxide free process for the production of high purity metallic copper from copper-matte wherein copper-matte is leached under oxidizing conditions in a ferric-containing acid copper sulfate electrolyte leach assembly including one or more leach reactors to yield a copper-rich electrolyte, and copper cathode is produced in an electrowinning assembly which is physically decoupled from the leaching assembly and may include one or more electrowinning cells. The process operates at ambient pressure and temperatures less than the boiling point.

Abstract: This invention is directed to a process for making copper metal powder from copper-bearing material, comprising: (A) contacting said copper-beating material with an effective amount of at least one aqueous leaching solution to dissolve copper ions in said leaching solution and form a copper-rich aqueous leaching solution; (B) contacting said copper-rich aqueous leaching solution with an effective amount of at least one water-insoluble extractant to transfer copper ions from said copper-rich aqueous leaching solution to said extractant to form a copper-rich extractant and a copper-depleted aqueous leaching solution, said extractant comprising (i) at least one oxime characterized by a hydrocarbon linkage with at least one --OH group and at least one .dbd.