More Than 20 Weight Percent Of One Or More Phosphoric Acids Patents (Class 205/680)
  • Patent number: 11020515
    Abstract: A method for passivating a biomaterial surface includes modifying proteinaceous material disposed at the biomaterial surface. The passivation may be effectuated by exposing the biomaterial surface to therapeutic electrical energy in the presence of blood or plasma.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: June 1, 2021
    Assignee: Medtronic ATS Medical, Inc.
    Inventor: Brian Pederson
  • Patent number: 9504554
    Abstract: The production of microstructured surfaces in magnesium alloys, containing zinc as the major alloying element, in particular in absorbable implants such as stents, wherein microstructures in sizes of up to 5 ?m (micrometers) are generated on a magnesium alloy base body of the absorbable implant, for example of the absorbable stent, by way of optionally combined, pickling and electrochemical micropolishing processes, and allow better adhesion of a polymer coating (including higher break resistance) and higher corrosion resistance. The microstructured surface is produced out of the bulk material and exhibits no delamination from the base material during the mechanical deformation of the implant.
    Type: Grant
    Filed: January 2, 2014
    Date of Patent: November 29, 2016
    Assignee: BIOTRONIK AG
    Inventors: Ullrich Bayer, Monika Badendieck, Susanne Peters, Thomas Drobek, Okechukwu Anopuo
  • Patent number: 8313635
    Abstract: Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: November 20, 2012
    Assignee: Lam Research Corporation
    Inventors: Fred D. Egley, Michael S. Kang, Anthony L. Chen, Jack Kuo, Hong Shih, Duane Outka, Bruno Morel
  • Patent number: 7584539
    Abstract: A method of manufacturing an inkjet printer component and an inkjet printer component electropolishing device are provided. The method includes positioning an electrode in a fluid passageway of an inkjet printer component, the electrode including a conductive face and a nonconductive face; polishing a side of the fluid passageway by: biasing the nonconductive face of the electrode toward a side of the fluid passageway such that the conductive face of the electrode does not contact any portion of the fluid passageway; providing an electrolytic fluid to the fluid passageway of the inkjet printer component; and applying a voltage between the electrode and the inkjet printer component.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: September 8, 2009
    Assignee: Eastman Kodak Company
    Inventors: James E. Harrison, Francis T. Galbraith, Kevin P. Egan, Bruce A. Bowling, Richard W. Sexton
  • Publication number: 20090200178
    Abstract: The present invention describes a cost-saving and environmentally conserving process for the electrochemical polishing of steel, in particular of low-alloy steels. The workpieces are rinsed after electropolishing in an arid phosphoric acid-sulfuric acid-bath in a first rinsing step with a phosphoric acid-containing solution, whereby a chemical attack on the freshly polished surfaces is avoided without the use of environmentally harmful and unhealthy inhibitors such as chromates. By recycling of the acids and the rinsing solution, these acids and solutions can be regenerated, whereby the process can be designed effluent-free.
    Type: Application
    Filed: July 31, 2006
    Publication date: August 13, 2009
    Applicant: POLIGRAT GMBH
    Inventors: Siegfried Piesslinger-Schweiger, Olaf Böhme
  • Patent number: 7501051
    Abstract: The present electropolishing electrolyte comprises an acid solution and an alcohol additive having at least one hydroxy group, wherein the contact angle of the alcohol additive is smaller than the contact angle of the acid solution on a metal layer under electropolishing. The alcohol additive is selected methanol, ethanol and glycerol, and the acid solution comprises phosphoric acid. The volumetric ratio of glycerol to phosphoric acid is between 1:50 and 1:200, and is preferably 1:100. The volumetric ratio is between 1:100 and 1:150 for methanol to phosphoric acid, and between 1:100 and 1:150 for ethanol to phosphoric acid. In addition, the acid solution further comprises an organic acid selected from the group consisting of acetic acid and citric acid. The concentration is between 10000 and 12000 ppm for the acetic acid, and between 500 and 1000 ppm for citric acid.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: March 10, 2009
    Assignee: BASF Aktiengesellschaft
    Inventors: Jia Min Shieh, Sue Hong Liu, Bau Tong Dai
  • Patent number: 6837984
    Abstract: An apparatus for electropolishing a wafer includes a wafer chuck and a stationary jet. The wafer chuck is configured to rotate and translate the wafer. The stationary jet is configured to apply an electrolyte to the wafer when the wafer is translated and rotated by the wafer chuck.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: January 4, 2005
    Assignee: ACM Research, Inc.
    Inventor: Hui Wang
  • Publication number: 20040256245
    Abstract: A metal layer formed on a surface of a wafer is electropolished using a wafer chuck and a moveable nozzle. The surface on which the metal layer is formed is the same surface on which features of devices are formed. The wafer chuck is configured to rotate the wafer when the wafer is placed on top of the wafer chuck. The moveable nozzle is disposed vertically above the wafer when the wafer is placed on top of the wafer chuck. The moveable nozzle is configured to move from a first position to apply a stream of electrolyte to a first portion of the metal layer to a second position to apply the stream of electrolyte to a second portion of the metal layer when the wafer is rotated by the wafer chuck, where the first and second portions of the metal layer are located at different radial positions on the wafer.
    Type: Application
    Filed: July 21, 2004
    Publication date: December 23, 2004
    Applicant: ACM Research, Inc.
    Inventor: Hui Wang
  • Patent number: 6764590
    Abstract: In one aspect of the invention, an apparatus for ECM grooving of a workpiece is provided. A portion of a conical workpiece is supported on a frame, with the cone opening facing a Z-axis. A slide electrode assembly is provided, including an electrode movable along the Z-axis and having, on a face aligned across a machining gap from the workpiece, a pattern of grooves to be defined on the workpiece; As an electrolyte is pumped into or through the machining gap at a constant static pressure, the electrode reacts to the pressure by moving toward or away from the workpiece to establish a certain gap width to create the necessary groove depth and definition. The force acting on the slide electrode assembly is the primary controlling factor for establishing the machining gap as the electrode and support move in response to the constant static pressure of pumped electrolyte.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: July 20, 2004
    Assignee: Seagate Technology LLC
    Inventor: Dustin Alan Cochran
  • Publication number: 20030234184
    Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.
    Type: Application
    Filed: June 6, 2003
    Publication date: December 25, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Feng Q. Liu, Stan D. Tsai, Yongqi Hu, Siew S. Neo, Yan Wang, Alain Duboust, Liang-Yuh Chen
  • Patent number: 6582585
    Abstract: The method according to the invention comprises a macrographic etching step followed by a “bleaching” step by electrolytic etching by means of a bath containing at least phosphoric acid and a weak acid. This method allows components made of superalloys to be easily and effectively inspected, including when they contain elements such as rhenium or ruthenium.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: June 24, 2003
    Assignee: SNECMA Moteurs
    Inventors: Michel Ruimi, Sylvie Poutonnet, Philippe Poubanne
  • Patent number: 6579439
    Abstract: This invention, in one aspect, relates to processes for electropolishing aluminum, in particular, aluminum alloy metal surfaces, by immersing the metal surface in a polishing solution and making the aluminum alloy material anodic. The polishing solution can comprise a phosphoric acid solution and a hypophosphite-containing compound. The polishing solution can also comprise a polyol, a polyol ether and an organic acid.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: June 17, 2003
    Assignee: Southern Industrial Chemicals, Inc.
    Inventor: Wayne D. Chandler
  • Patent number: 6277264
    Abstract: An electropolishing system for uniformly polishing the inner surface of a pipe includes an electrode for placement within the pipe, a plurality of electrical leads for coupling the pipe to a common voltage source, and a power supply. The power supply includes a first voltage supply terminal, for coupling to the electrode, and second voltage supply terminal, for coupling to the common voltage source. A disclosed method for electropolishing the inner surface of a pipe includes the steps of placing an electrode within the pipe, electrically coupling the pipe to a common voltage source with a plurality of electrical leads, coupling the electrode to a first voltage supply terminal of a power supply, coupling the common voltage source to a second voltage supply terminal of the power supply, and drawing the electrode through the pipe.
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: August 21, 2001
    Assignee: Therma Corporation, Inc.
    Inventor: Thomas A. Lorincz
  • Patent number: 5997721
    Abstract: A method of cleaning an Al workpiece comprises a.c. anodising the workpiece in an acidic electrolyte capable of dissolving aluminium oxide and maintained at a temperature of at least 70.degree. C. under conditions such that the surface of the workpiece is cleaned with any oxide film thereon being non-porous and no more than about 20 nm thick.
    Type: Grant
    Filed: October 16, 1997
    Date of Patent: December 7, 1999
    Assignee: ALCAN International Limited
    Inventors: Peter Karl Ferdinand Limbach, Armin Kumpart, Nigel Cleaton Davies, Jonathan Ball
  • Patent number: 5616231
    Abstract: Aluminum alloy articles are electrobrightened in an acidic solution containing phosphoric acid, water, and suspended mineral particles. The solution preferably also contains sulfuric acid. Aluminum alloy sheet electrobrightened in the solution has a less directional appearance when the suspended mineral particles are present.
    Type: Grant
    Filed: May 8, 1996
    Date of Patent: April 1, 1997
    Assignee: Aluminum Company of America
    Inventors: Albert L. Askin, Paul B. Schultz, Daniel L. Serafin
  • Patent number: 5507923
    Abstract: An apparatus is provided for electrolytically polishing the inside surface of tubular products such as rifled stock, or fiream or artillery barrels. The apparatus comprises a first and second reservoir in fluid communication through the tubular product with an electrolyte flow system. A cathode head is provided that is displaced from one reservoir to the other in the presence of flowing electrolyte and at a current density of between 1 and 5 amp-min/sq. in. A method of electrolytically polishing tubular products is also provided.
    Type: Grant
    Filed: November 9, 1993
    Date of Patent: April 16, 1996
    Inventors: Henry J. Stouse, Mark D. Stouse, R. Keith Raney