Abstract: Nanopatterned substrates can be prepared by a method that includes forming a block copolymer film on a substrate, annealing the block copolymer film, surface reconstructing the annealed block copolymer film, coating an etch-resistant layer on the surface reconstructed block copolymer film, etching the resist-coated block copolymer film to create an etched article comprising a nanopatterned substrate, and separating the etch-resistant layer and the block copolymer film from the nanopatterned substrate. The method is applicable to a wide variety of substrate materials, avoids any requirement for complicated procedures to produce long-range order in the block copolymer film, and avoids any requirement for metal functionalization of the block copolymer.

Abstract: To prevent a plate-like work in a plating tank from swinging to improve quality of plating and prevent dropout or damages of a printed circuit board during transportation. A plating tank 2a includes an upper guide rail 11 that is provided above the plating tank 2a and transports a transport hanger 15a in a moving direction and a lower guide rail 14 that is provided inside the plating tank 2a and generates an attractive force against a lower clamp 49 of the transport hanger 15a. In the plating tank 2a, an attractive force is generated while performing plate processing to pull the lower clamp 49 of the transport hanger 15a downward, thereby giving tension to a plate-like work W.

Abstract: The present invention relates generally to methods for producing metallic products comprising a substrate and a metallic, external coating. In preferred embodiments, the metallic products are jewelry articles.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.

Abstract: Disclosed is an anode for a lithium secondary battery. The anode includes a current collector in the form of a wire and a porous anode active material layer coated to surround the surface of the current collector. The three-dimensional porous structure of the active material layer increases the surface area of the anode. Accordingly, the mobility of lithium ions through the anode is improved, achieving superior battery performance. In addition, the porous structure allows the anode to relieve internal stress and pressure, such as swelling, occurring during charge and discharge of a battery, ensuring high stability of the battery while preventing deformation of the battery. These advantages make the anode suitable for use in a cable-type secondary battery. Further disclosed is a lithium secondary battery including the anode.

Abstract: A method of electrowinning or electrorefining copper from a copper electrolyte solution which contains chloride ions, the method comprising the steps of: (a) forming a polyacrylamide solution by dissolving polyacrylamide, having a molecular weight range of 5,000 to 20,000,000 Daltons, in an acidic medium and under conditions to form a polyacrylamide block copolymer having blocks of carboxyl groups dispersed along the polymer backbone; (b) introducing the polyacrylamide solution into an electrolytic cell containing the copper electrolyte solution at a polyacrylamide concentration of 0.01-10 mg/L; and (c) electroplating copper from the copper electrolyte solution to form a copper cathode.

Abstract: Disclosed is a method of altering the surface behavior of a liquid by adding to the liquid a compound of a Formula (1): Rf—O—(CF2)x(CH2)y—O-(QO)z—H ??(1) Wherein Rf is a linear or branched perfluoroalkyl having 1 to 6 carbon atoms, optionally interrupted by one to three ether oxygen atoms, x is an integer of 1 to 6; y is an integer of 1 to 6; Q is a linear 1,2-alkylene group of the formula CmH2m where m is an integer of 2 to 10; and z is an integer of 1 to 30.

Abstract: The subject matter is directed to electrical contacting of band- or plate-shaped materials (1), which are conveyed by transport track through an electroplating system. The cathodically polarized contact means (6) may be located on the underside of the material (1) in the electrolyte (12) circulated in the electroplating system. The material is electrically contacted to transfer current to the material (1). Each tubular contact means (6) is cooled by means of a cooling unit or a cooling medium. No metal is deposited on the cooled surface of the contact means (6) if the temperature difference between the working temperature of the electrolyte (12) and the surface temperature of the contact means (6) is sufficiently large. This property can be supplemented with a surface of the contact means (6) that cannot be cathodically metal-coated in the electrolyte (12) used.

Abstract: An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.

Abstract: An easily handleable composition for metal surface treatment is provided which achieves foundation surface concealment, coating adhesion and corrosion resistance equal to or higher than those obtained by the conventional metal surface treatment compositions. This composition for metal surface treatment places no burden on the environment. A method for treating the surface of a metal material in which such a composition for metal surface treatment is used, and a metal material treated by such a metal surface treatment method, are also provided. Specifically disclosed is a metal surface treatment composition used for a treatment of a metal surface, which composition contains a zirconium compound and/or titanium compound substantially not containing fluorine, and an inorganic acid and/or a salt thereof. This metal surface treatment composition has a pH of not less than 1.5 but not more than 6.5.

Abstract: Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.

Abstract: An electrolytic copper plating method characterized in employing a phosphorous copper anode having a crystal grain size of 1,500 ?m (or more) to 20,000 ?m in an electrolytic copper plating method employing a phosphorous copper anode. Upon performing electrolytic copper plating, an object is to provide an electrolytic copper plating method of a semiconductor wafer for preventing the adhesion of particles, which arise at the anode side in the plating bath, to the plating object such as a semiconductor wafer, a phosphorous copper anode for electrolytic copper plating, and a semiconductor wafer having low particle adhesion plated with such method and anode.

Abstract: A graphene sheet including an intercalation compound and 2 to about 300 unit graphene layers, wherein each of the unit graphene layers includes a polycyclic aromatic molecule in which a plurality of carbon atoms in the polycyclic aromatic molecule are covalently bonded to each other; and wherein the intercalation compound is interposed between the unit graphene layers.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.

Abstract: Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.

Abstract: Particulated structures and their method of manufacture for use in an electrical generator employing gas-mediated charge transfer are disclosed. The structures comprise a multiplicity of particles which contain voids between first and second opposing surfaces of said particles. At least a portion of said opposing surfaces are modified such that the charge transferability of said first opposing surfaces differs from the charge transferability of said second opposing surfaces.

Abstract: The present invention discloses a solar cell having a multi-layered structure that is used to generate, transport, and collect electric charges. The multi-layered nanostructure comprises a cathode, a conducting metal layer, a photo-active layer, a hole-transport layer, and an anode. The photo-active layer comprises a tree-like nanostructure array and a conjugate polymer filler. The tree-like nanostructure array is used as an electron acceptor while the conjugate polymer filler is as an electron donor. The tree-like nanostructure array comprises a trunk part and a branch part. The trunk part is formed in-situ on the surface of the conducting metal layer and is used to provide a long straight transport pathway to transport electrons. The large contact area between the branch part and the conjugate polymer filler provides electron-hole separation.

Abstract: The present invention comprises a compound of a compound of Formula 1 wherein Rf is a C2 to C12 perfluoroalkyl optionally interrupted by one to four moieties each independently selected from the group consisting of —CH2—, —O—, —S—, —S(O)—, and —S(O)2—; n is 1 to 6; m is 0 to 2, provided that m is less than or equal to n. X and Y are each independently O or NR, R is hydrogen or C1 to C6 alkyl; R1, and R2 are each independently C1 to C6 alkyl, optionally containing one or more oxygen atoms and may form a ring selected from the group of piperidine, pyrrolidine, and morpholine; and R3 is O?, (CH2)pC(O)O?, (CH2)pCH(OH)(CH2)SO3?, and (CH2)qSO3?; p is 1 to 4; and q is 2 to 4 which is useful as a surfactant.

Abstract: A method of dissociating an organoborane-amine complex in a coating composition is provided. The method includes the step of introducing the organoborane-amine complex, the radical polymerizable compound, and optionally an amine, onto a substrate to form the coating composition. The method also includes the step of introducing carbon dioxide into the coating composition in a molar ratio of at least 1:1 of the carbon dioxide to free amine groups present in the coating composition. More specifically, a carbamic zwitterion is formed in-situ from reaction of the carbon dioxide and the free amine groups. The formation of the carbamic zwitterion leads to dissociation of the organoborane-amine complex and formation of a radical. The radical is then used to polymerize the radical polymerizable compound.

Abstract: A charge transfer mechanism is used to locally deposit or remove material for a small structure. A local electrochemical cell is created without having to immerse the entire work piece in a bath. The charge transfer mechanism can be used together with a charged particle beam or laser system to modify small structures, such as integrated circuits or micro-electromechanical system. The charge transfer process can be performed in air or, in some embodiments, in a vacuum chamber.

Abstract: A thin film of a medical implant includes a surface, a plurality of walls and a plurality of paths. The walls are disposed on the surface, and formed to shapes of arc. The paths are disposed on the surface, wherein each of the paths is located among the walls. The walls and paths have a plurality of holes. According to the thin film of the present disclosure, the walls are formed to shapes of arc, and have no acute anger, whereby the biological cells can helpfully grow and attach on the thin film quickly. Furthermore, the thin film has the holes, which provide cell tissue, such as pseudopod, tentacle, etc. of the biological cells to grow and attach therein, whereby the biological cyto-affinity of the thin film can be increased so as to increase the biological cyto-compatibility of the medical implant.

Abstract: In an insoluble anode for use in an electrolysis step accompanied by oxygen generation, by making the anode exert sufficient durability even in electrolysis accompanied by cathodic polarization besides anodic polarization, a service life of an electrode is prolonged and works of electrode repair, replacement, and the like are reduced. In order to realize this, an active material supporting member made of a porous metal sheet such as an expanded metal, a punching metal, or a bamboo blind-like or net-shaped metal is bonded to a conductive metal as an electrode structure, to configure an electrode substrate. The electrode substrate is coated, on the side to which the supporting member is bonded, with an electrode active material consisting mainly of iridium oxide. Thus, the anode for oxygen generation, which is highly resistant to a cathodization phenomenon, is obtained.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.

Abstract: A plating apparatus includes a plating bath configured to perform plating processing of a substrate with a plating solution including an inorganic constituent and an organic constituent introduced into the plating bath, a chemical supplying unit configured to supply each chemical of the inorganic constituent and the organic constituent, an electrode configured to dispose in the plating solution and the electrode configured to selectively adsorb a by-product produced from the organic constituent, and an electric current applying unit configured to apply a predetermined electric current to the electrode.

Abstract: An electric contact in the outer edge thereof, is used for electroplating substrates, e.g. as a wafer in a cup plater. In order to obtain an even electroplating result, at least two electrolytic partial cells are formed which are supplied with current by respective electroplating current sources (9?) and (9?) that can be individually adjusted. The partial cathode (12?) and the associated partial anode (7?) are supplied in the region of the diametrically remote partial cathode (12?). Conversely, the partial cathode (12?) is supplied via the base layer of the partial cathode (12?). The required levelling of the layer thickness distribution is inter alia carried out by alternate different adjustments of the quantity of the electroplating current of the two partial cells and by the electrodes (7,12) that rotate relative to each other.

Abstract: The present invention comprises fluorinated ethoxylated polyurethanes of formula [Rf—(X)n—(CH2CHR1—O)m—CH2CH2—O—C(O)—NH]p-A, wherein Rf is a C1 to C6 perfluoroalkyl; X is a divalent radical; n is 0 or 1; R1 is H or C1 to C4 alkyl; m is 1 to 20; p is a positive integer of at least 2; and A is the residue of a polyisocyanate, and methods for altering surface behavior of liquids using such compounds.

Abstract: An electrolytic recycling method recovers two or more component elements of one or more compounds simultaneously. A compound, such as a compound semiconductor, to be recycled is dissolved in a liquid electrolyte. Electrolysis of the dissolved compound recovers component elements simultaneously at respective negative and positive electrodes by reduction and oxidation respectively. The component elements produced may be in respective condensed phases or include a gaseous phase.

Abstract: A method for providing a semiconductor chip package with side wettable plating includes singulating a semiconductor chip package from an array of packages formed in a block format, immersing the semiconductor chip package in a bath of plating solution, contacting a lead land of the semiconductor chip package with conductive contact material within the bath of plating solution, connecting the conductive contact material to a cathode electrical potential, connecting an anode within the bath of plating solution to an anode electrical potential, and plating the lead land of the semiconductor chip package.

Abstract: The invention is relative to an electrode for gas evolution in electrolytic and electrometallurgical industrial applications, made of a metal substrate having a surface morphology characterized by a combination of micro-roughness and macro-roughness which favors high adherence of a superficial catalytic layer in order to prevent detachment of the same and passivation of the substrate even under critical operating conditions.

Abstract: Micro-fluid ejection heads have anti-reflective coatings. The coatings destructively interfere with light at wavelengths of interest during subsequent photo imaging processing, such as during nozzle plate imaging. Methods include determining wavelengths of photoresists. Layers are applied to the substrate and anodized. They form an oxidized layer of a predetermined thickness and reflectivity that essentially eliminates stray and scattered light during production of nozzle plates. Process conditions include voltages, biasing, lengths of time, and bathing solutions, to name a few. Tantalum and titanium oxides define further embodiments as do layer thicknesses and light wavelengths.

Abstract: An electrochemical cell includes a fuel electrode configured to operate as an anode to consume a fuel when the fuel electrode and an associated cathode are connected to a load. An ionically conductive medium either present or flowing through the electrochemical cell is configured to conduct ions and participate in electrochemical reactions between the anode and the cathode. The cell further includes a catch tray containing catalyst material to induce the ionization of precipitates of fuel and/or fuel additives that may separate in solid form from the fuel electrode. The catch tray may be positioned to prevent a congestion of the precipitates in the ionically conductive medium, or the waste of electrically disconnected fuel and/or additives.

Abstract: Process for the preparation of a catalytic specie consisting essentially of a metallic support, which is coated with a ceramic active phase layer, mainly compound of the general formula (I): [RhxNiyMglAlm(OH)2]z+(An?z/n)kH2O,??(I) wherein An? is mainly a silicate or a polysilicate anion; 0?x?0.3; 0?y?0.9; 0?l?0.9; 0?m?0.5; 0?k?10; x+y>0; 0.5?y+l?0.9; x+y+l+m=1; and z is the total electrical charge of the cationic element or a compound of the general formula (II): [AzA?1-z][B1-x-yNixRhy]O3-???(II) wherein A and A? are different and are selected from the Lanthanide or the Actinide families or from the group IIa of the Mendeleev's periodical table of elements; B is selected from the transition metal groups of columns IIIb, IVb, Vb, VIb, VIIb, Ib and IIb and group VIIIb of the Mendeleev's periodical table of elements; 0?x?0.7, 0?y?0.5, 0?x+y?0.

Abstract: Techniques for forming metal catalyst particles on a metal tip, and nanostructures on a metal tip are provided.

Abstract: The invention relates generally to electrodeposition apparatus and methods. When depositing films via electrodeposition, where the substrate has an inherent resistivity, for example, sheet resistance in a thin film, methods and apparatus of the invention are used to electrodeposit materials onto the substrate by forming a plurality of ohmic contacts to the substrate surface and thereby overcome the inherent resistance and electrodeposit uniform films. Methods and apparatus of the invention find particular use in solar cell fabrication.

Abstract: A method and apparatus for electrolytically treating a surface of a component includes a reaction chamber, a transport chamber and a fluid return path. The reaction chamber is adapted for placing at least a portion of the component therein, and holds a reaction fluid. Fluid enters the reaction chamber through a plurality of inlets. Each inlet directs the fluid toward the component at one or more non-zero vertical angles, and at one or more non-zero horizontal angles. The reaction chamber is a fixture having a cover with an underside shaped to direct the fluid to the surface of the component, such as by having a plurality of slopes. The inlets are through a material that is electrically non-conductive, such as ceramic, plastic, PVC, and fiber reinforced plastic, and/or the fixture further includes a titanium cathode ring that can be vertically adjacent the non-conductive material.

Abstract: Articles containing fine-grained and/or amorphous metallic coatings/layers on at least part of their exposed surfaces are imprinted with surface structures to raise the contact angle for water in the imprinted areas at room temperature by equal to or greater than 10°, when compared to the flat and smooth metallic material surface of the same composition.

Abstract: The invention relates to an apparatus (1, 101, 201) for electrochemically coating a workpiece (22), including a coating reservoir (2, 102, 202) with a charge opening (5) and a supply reservoir (3, 103, 203), wherein the two reservoirs are in communication through a passage opening (4, 104, 204). The apparatus has at least one electrode (11) and one counter electrode (14). In order to prevent contamination of a coating liquid (20, 120, 220) during an electrochemical deposition process, the apparatus can be switched between a coating position and a rest position by rotating the supply and the coating reservoirs about at least one common axis (A, A?, A?) so that the center of gravity of the volume of the coating reservoir (2, 102, 202) in the coating position is lower in relation to the center of gravity of the volume of the supply reservoir (3, 103, 203) than in the rest position. The invention further relates to a method for coating workpieces.

Abstract: A bipolar plate assembly for a fuel cell is provided. The bipolar plate assembly includes a first electroformed unipolar plate disposed adjacent a second electroformed unipolar plate. The first and second unipolar plates are bonded by a plurality of localized electrically and thermally conductive plugs by electroplated material deposited within apertures formed in the substrates onto which the unipolar plates are electroformed. A method for forming the bipolar plate assembly is also described.

Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas.

Abstract: A method for manufacturing a nano-particulate electrode for Dye Solar Cells including the steps of providing an electrically conductive substrate, formation of a nanoparticulate layer on the substrate, application of dye to the nanoparticulate layer and an additional step of electrolytic treatment of the nanoparticulate layer in an electrolyte.

Abstract: This invention relates to compounds and compositions used to prepare semiconductor and optoelectronic materials and devices. This invention provides a range of compounds, compositions, materials and methods directed ultimately toward photovoltaic applications, as well as devices and systems for energy conversion, including solar cells. In particular, this invention relates to molecular precursor compounds, precursor materials and methods for preparing photovoltaic layers.

Abstract: A fuel cell includes a first electrically conductive plate and a first gas diffusion layer. The first gas diffusion layer is disposed over the first electrically conductive plate. Characteristically, the first gas diffusion layer comprises a first fibrous sheet having fibers coated with an electrically conductive layer. A first catalyst layer is disposed over the first gas diffusion layer and an ion conducting membrane is disposed over the first catalyst layer. The fuel cell also includes a second catalyst layer disposed over the ion conducting membrane with a second gas diffusion layer disposed over the second catalyst layer. A second electrically conductive plate is disposed over the second gas diffusion layer. Methods for forming the gas diffusion layers and the fuel cell are also provided.

Abstract: A compound comprising one or more polyfunctionalized pyrrolyl anions coordinated to a metal selected from the group consisting of barium, strontium, magnesium, radium or calcium or mixtures thereof. Alternatively, one anion can be substituted with and a second non-pyrrolyl anion. Synthesis of the novel compounds and their use to form BST films is also contemplated.

Abstract: In various embodiments, composite materials containing a ceramic matrix and a carbon nanotube-infused fiber material are described herein. Illustrative ceramic matrices include, for example, binary, ternary and quaternary metal or non-metal borides, oxides, nitrides and carbides. The ceramic matrix can also be a cement. The fiber materials can be continuous or chopped fibers and include, for example, glass fibers, carbon fibers, metal fibers, ceramic fibers, organic fibers, silicon carbide fibers, boron carbide fibers, silicon nitride fibers and aluminum oxide fibers. The composite materials can further include a passivation layer overcoating at least the carbon nanotube-infused fiber material and, optionally, the plurality of carbon nanotubes. The fiber material can be distributed uniformly, non-uniformly or in a gradient manner in the ceramic matrix. Non-uniform distributions may be used to form impart different mechanical, electrical or thermal properties to different regions of the ceramic matrix.

Abstract: A method of treating surfaces of a steel plate by forming an inorganic film on the surfaces of the steel plate by cathodic electrolytic treatment in an aqueous solution containing Zr and F and not containing phosphoric acid ions. Also disclosed is a method of treating surfaces of a steel plate by cathodic electrolytic treatment in aqueous solution containing Zr, F and P, and having a phosphoric acid ion concentration in a range of larger than 0 to smaller than 0.003 mols/liter calculated as PO4.

Abstract: Embodiments of the present invention generally relate to lithium-ion batteries, and more specifically, to a system and method for fabricating such batteries using thin-film processes that form three-dimensional structures. In one embodiment, an anodic structure used to form an energy storage device is provided. The anodic structure comprises a flexible conductive substrate, a plurality of conductive microstructures formed on the conductive substrate, comprising a plurality of columnar projections and dendritic structures formed over the plurality of columnar projections and a plurality of tin particles formed on the plurality of conductive microstructures. In another embodiment, the anodic structure further comprises a tin nucleation layer comprising tin particles formed on the flexible conductive substrate between the flexible conductive substrate and the plurality of conductive microstructures.