Abstract: The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel—sulfamate bath. The shield is shown to improve the average current density at a plating surface.

Abstract: A finite element model of the environment of electrodeposit coating is prepared by a simulation method, change of an electric field in an electrolytic cell for the case of electrodeposit coating is simulated, the distribution of currents then flowing through individual parts of a finite element model of a to-be-coated object is obtained, the electric variables of currents flowing through the respective surfaces of the finite elements of the to-be-coated object are obtained and accumulated according to the current distribution, the thickness of an electrodeposition coating film is calculated as h=&Sgr;KFICC.E.&Dgr;t/&rgr; if the cumulative electric variable is higher than a deposition starting electric variable such that a fixed concentration is attained by OH− or H+.

Abstract: A cyclic voltammetric method for measuring the concentration of additives in a plating solution. The method generally includes providing the plating solution, having an unknown concentration of an additive to be measured therein and cycling the potential of an inert working electrode through a series of measurement steps. The series of measurement steps includes a metal stripping step including pulsing from an open circuit potential to a metal stripping potential between about 0.2 V and about 0.8 V, and holding the metal stripping potential until a corresponding current nears 0 mA/cm. The series of measurement steps further includes a cleaning step including pulsing from the metal stripping potential to a cleaning potential between about 1.2 V and about 1.6 V, and holding the cleaning potential for about 2 seconds to about 10 seconds. The series of measurement steps then includes a pre-plating step including pulsing from the cleaning potential to a pre-plating potential between about −0.

Abstract: A method for determining an end point of a planarization process for removing metal from a surface of a substrate submerged in an electrolytic solution or slurry. A first electrode is provided which is operable to contact the surface of the substrate, such as a working electrode of a potentiostat system. A second electrode is provided which is operable to contact the electrolytic solution, such as a reference electrode of the potentiostat system. The first electrode is contacted to the surface of the substrate and an electrochemical property is measured, such as the electrochemical potential between the first and second electrodes, where the electrochemical property is indicative of an electrochemical characteristic of the substrate-slurry system. The planarization process is preferably stopped when a substantial change in the electrochemical potential of the system is measured.

Abstract: An object of the present invention is to provide a method of monitoring deterioration of an electrolytic gold plating solution which can always stably performing gold plating by continuously detecting a deterioration state of the gold sulfite complex plating solution, and to provide an apparatus for monitoring the deterioration of the electrolytic gold plating solution. The present invention is characterized by an electrolytic gold plating method for performing electrolytic gold plating on a surface of a substrate body using a gold sulfite plating solution, wherein the gold plating is performed while deterioration of the plating solution is being always or intermittently detected during plating.

Abstract: A method of forming a copper layer with increased electromigration resistance. A doped copper layer is formed by controlling the incorporation of a non-metallic dopant during copper electroplating.

Abstract: It is an object to provide a plating apparatus capable of forming a plated film having a uniform thickness in a substrate to be treated. In a plating apparatus using a face down method in which a voltage is applied between a cathode electrode (5) provided in contact with a peripheral edge portion of a substrate (1) to be treated and an anode electrode (6) provided in a plating solution vessel (3), thereby carrying out plating, there is provided an anode electrode moving device (13) for vertically moving the anode electrode (6) corresponding to a plating situation of the substrate (1).

Abstract: The present invention provides methods and apparatus for analysis and monitoring of electrolyte bath composition. Based on the results of the analysis, the invention controls electrolyte bath composition and plating hardware. Thus, the invention provides control of electroplating processes based on plating bath composition data. The invention accomplishes this by incorporating mass spectral analysis into a feedback control mechanism for electroplating. Mass spectrometry is used to identify plating bath conditions and based on the results, the plating bath formulation and plating process are controlled.

Abstract: A plating system is composed of a transfer device for performing transfer of a wafer, a plating unit and a washing/drying unit provided around the transfer device. Each unit is structured to be detachable from the plating system. The plating unit is divided into a wafer transfer section and a plating section by a separator, and atmosphere of each section is independently set.

Abstract: A method is provided that comprises forming a copper seed layer on a workpiece and measuring the uniformity of the copper seed layer on the workpiece. The method further comprises applying the uniformity measurement to modify processing to form a copper layer having a desired uniformity profile for increased planarization in subsequent planarizing.

Abstract: The object of the present invention is to provide a plating method capable of planarization process of high quality in comparison with the conventional plating method and also provide a plating device and a plating system adopting the plating method of the invention. In the plating method and device, an object 10 to be processed and an electrode plate 20 are dipped in a solution including objective metal ions and a forward current is supplied between the object and the electrode plate to educe a metal on the surface of the object. After forming a plating film on the object excessively, a backward current is supplied between the object 10 and the electrode 20 to uniformly remove at least part of superfluous plating film.

Abstract: The plating method comprises the steps of dividing a region, to be plated, into a group of mesh-like zones, measuring a plating area of each of the zones, comparing the measurement values of the plating areas and judging whether or not the plating area has any variance, and conducting a design change, on patterns contained in this zone, to eliminate the variance.

Abstract: MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator.

Abstract: An electrochemical processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. An electrochemical deposition unit provides a space to receive said microelectronic workpiece to deposit a subsequent film layer onto a prior layer, wherein a condition signal from the metrology unit influences the process control of the electrochemical deposition unit. The signal can also be used to transfer the microelectronic workpiece to a layer stripping unit, or a layer enhancement unit, or to a non-compliance station. The apparatus is particularly useful in measuring seed layer thickness and adjusting the operating control of a computational fluid dynamic reactor, which electroplates a process layer onto the seed layer.

Abstract: A plating analysis method is disclosed for electroplating in a system in which resistance of an anode and/or a cathode cannot be neglected. This method comprises giving a three-dimensional Laplace's equation, as a dominant equation, to a region containing a plating solution; discretizing the Laplace's equation by the boundary element method; giving a two-dimensional or three-dimensional Poisson's equation dealing with a flat surface or a curved surface, as a dominant equation, to a region within the anode and/or the cathode; discretizing the Poisson's equation by the boundary element method or the finite element method; and formulating a simultaneous equation of the discretized equations to calculate a current density distribution i and a potential distribution &phgr; in the system. The method can obtain the current density and potential distributions efficiently for a plating problem requiring consideration for the resistance of an electrode.

Abstract: A method for defining the characteristics of metal electrodes of ceramic sensor elements, where the metal electrodes are deposited as layers and subjected to a subsequent annealing process. The aim is to provide a non-destructive, simple and economical method, capable of being automated, for performing an acceptance test in a specimen-specific manner on the sensor element. In the case of the test procedure proposed here, the quantity and distribution of gold deposited so as to be inaccessible in the protective layer, are indirectly determined. This is done by measuring the layer thickness during manufacturing of an electrode, in a before/after comparison, with the aid of an eddy-current measuring process where the electrode is placed in the magnetic circuit of a coil that is traversed by the flow of a high-frequency a.c. current, and the resulting ostensible inductance of the coil is measured using an LCR measuring unit. The coil can be wired as a resonant circuit with the aid of a capacitor.

Abstract: An electrochemical processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. An electrochemical deposition unit provides a space to receive said microelectronic workpiece to deposit a subsequent film layer onto a prior layer, wherein a condition signal from the metrology unit influences the process control of the electrochemical deposition unit. The signal can also be used to transfer the microelectronic workpiece to a layer stripping unit, or a layer enhancement unit, or to a non-compliance station. The apparatus is particularly useful in measuring seed layer thickness and adjusting the operating control of a computational fluid dynamic reactor, which electroplates a process layer onto the seed layer.

Abstract: Precise control of deposition or etching of thin films on a transparent substrate is particularly useful for electroformation of nozzles and formation control. A computer based measuring system is used to measure, in real time, a test feature such as one such nozzle. The rate of material deposition and removal is controlled based on the measured value of the test feature. In particular, a video camera and microscope are used to produce images of the test feature. During the electroplating process, metal is plated onto a conductive layer, and as the plated metal layer grows up from the conductive layer of the mandrel, the plated layer can also encroach on transparent openings produced by the absence of the mandrel conductive layer. The amount of encroachment on the transparent openings is directly related to the thickness of the plated layer.

Abstract: In a process for manufacturing an electrode for a PEM fuel cell or an electrochemical energy converter, an ion-exchange polymer is applied to one face of an electrode substrate. An electrocatalyst is then applied to the substrate by electrochemical deposition, preferably from a solution containing one or more complexes or salts of the electrocatalyst. The electrochemical deposition occurs by application of a voltage between a pair of electrodes, one of which is the electrode under preparation. The voltage between the two electrodes is controlled by controlling the potential of the working electrode. A pulsed voltage profile is applied across the two electrodes during the electrodeposition process.

Abstract: The dominant physical parameter that affects the internal stress of electroplated metals on substrates have been identified and their effects have been systematically studied. Thin electroplated metals have very high internal stresses, even though the substrate displacements are small. Increasing the electroplated metal's thickness greatly reduces the magnitude of the stress, which can be either tensile or compressive depending on the plating conditions, but it may not necessarily reduce the displacement of the substrate. Based on the research done in connection to this application, the relationship between the plating temperatures and the current density needed to obtain near-zero-stress state for electroplated nickel on silicon substrate can be deduced.

Abstract: A method for coating a metal strip using a coating metal, in particular for coating a steel strip using zinc or a zinc/nickel compound, by means of at least one electroplating cell through which current flows and which contains an electrolyte through which the metal strip is passed, the current effecting the deposition of a layer of coating metal on the metal strip, and the current being controlled by a so-called monitor controller that has a process model and a controller part. The current is controlled in such a way that a layer of a desired thickness is deposited on the metal strip, the controller part being adjusted to the altered state of the coating plant in the event of changes in the state of the coating plant, in particular when a new metal strip enters or the coating falls below a minimum intended layer thickness.

Abstract: A substrate (155) is placed into a plating bath (19, 59), a current in the bath is measured, and a film (110) is plated onto the substrate (155). In one embodiment the current is measured using a sensing array (57) positioned within the bath, and the measurement is used to control a plating deposition parameter. In an alternative embodiment the current is measured using the sensing array (57) and a characteristic of the plated film is controlled using a corresponding control array (53) also positioned within the plating bath (59).

Abstract: A method is described for electrodepositing an alloy of Ni-Fe-W-P. The alloy has good corrosion and wear resistance and hence is a possible replacement for hard chromium. The electrodeposition solution contains nickel ions, iron ions, tungsten ions and phosphorous ions, and a reducing agent. The solution yields high iron content, bright level alloy deposits containing up to 40 percent iron. In another aspect of the invention, electrodeposition is carried out on a surface containing a geometric error. A sensor determines the surface topography of the surface. This is compared in a microprocessor to the desired topography. A corrective signal is sent to an electric current source to cause electrodeposition of a quantity of leveling agent sufficient to at least partially correct the geometric error.

Abstract: The invention provides a process for producing solid electrolyte capacitors by forming a dielectric oxide film and a first cathode layer of solid conductive substance over the surface of an anode body of valve metal, and forming a second cathode layer of conductive high polymer on the first cathode layer by electrolytic oxidative polymerization. In forming the second cathode layer, the pH of the electrolyte to be used for electrolytic oxidative polymerization is maintained within a predetermined range by adding an acid or alkali to the electrolyte. Since the pH of the electrolyte remains substantially unaltered by the polymerization according to the invention, the electrolyte is repeatedly usable while permitting the resulting second cathode layers to retain the desired electric conductivity.

Abstract: A method and a system are provided for plating workpieces as part of an "on-track" in-line or a radially arranged manufacturing system, including "on-site" measurement of at least one plating characteristic for computer controlled process regulation and quality control. Movement of workpieces between various stations is controlled in response to a comparison of the measured value(s) of the plating characteristic(s) and (a) target value(s) or target range(s) of values.

Abstract: A plating system and method is provided for electroplating silicon wafers with copper using an insoluble anode wherein the electrolyte is agitated or preferably circulated through an electroplating tank of the system and a portion of the electrolyte is removed from the system when a predetermined operating parameter is met. A copper containing solution having a copper concentration greater than the copper concentration of the removed portion is added to the copper plating system simultaneously or after electrolyte removal, in a substantially equal amount to the electrolyte removed from the system and balances the amount of copper plated and removed in the removal stream. In a preferred method and system, an electrolyte holding tank is provided which serves as a reservoir for circulating electrolyte. The addition of the copper containing solution and removal of working electrolyte is also preferably made from the holding tank.

Abstract: A method and circuit (14) for monitoring an electroplating operation of an electroplating machine (10) of the type having a first electroplating cell (18) for depositing nickel onto an integrated circuit leadframe (12) and a second electroplating cell (19) for subsequently depositing palladium onto the leadframe (12). A first current (30) is applied in the first electroplating cell (18) to form a nickel deposit on the leadframe (12) and a second current (31) is applied in the second electroplating cell (19) to from a palladium deposit on the nickel deposit. The second current (31) is greater than the first current (30) if the electroplating machine (10) is operating normally. The first current (30) and second current (31) are compared in a comparator (44) during the electroplating operation, and if the second current (31) is less than the first current (30), an error signal is generated on an output line (50). If desired, the electroplating machine (10) may be stopped in response to the error signal.

Abstract: A method for preventing the deposition of material in an opening near a surface of an article, and a masking insert therefore. The method and insert are particularly suited for preventing the plating of a metal, such as platinum, on turbine airfoils or turbine blades and vanes having a complex geometry, as is the case when cast trailing edge cooling slots are present in the airfoil surface. The method entails the use of the masking insert, which is precisely configured to mask the cooling slots during plating by preventing circulation of the plating bath through the slots. For this purpose, the insert is equipped with appendages that are sized, shaped, spaced and oriented on a base member to register with, and preferably be received within, the cooling slots of an airfoil having a particular cooling slot design.

Abstract: An improved electrodepositable composition is provided comprising: (a) an active hydrogen-containing cationic resin electrodepositable on a cathode; (b) a capped polyisocyanate curing agent; and (c) an organotin-containing catalyst. The improvement comprises the addition to the electrodepositable composition of a water immiscible acid functional compound having a hydrocarbon chain of at least 5 carbon atoms like abietic acid and natural sources thereof. A preferred acid functional compound is abietic acid. The composition provides improved cure response and appearance properties when electrodeposited over conductive substrates.

Abstract: A real-time measurement is made of the proportions of solid matter and pigment contained in an electrodeposition coating material in an electrodeposition coating material tank. The attenuation of an ultrasonic wave through the electrodeposition coating material and the density and temperature of the electrodeposition coating material are measured, and a real-time measurement is made of the proportions of the solid matter and pigment by means of calculating these proportions on the basis of the measured ultrasonic-wave attenuation, density and temperature. Furthermore, the composition of the electrodeposition coating material is controlled on the basis of the results of said measurement.

Abstract: In a method of producing an electrolytic copper foil by passing an electrolyte between a rotating cathode drum and anode located opposite to the cathode drum, the thickness of the resulting copper foil is made uniform throughout. The anode has a structure including a main portion and an end portion, the end portion being divided widthwise into n foil thickness-uniformizing sub-anodes. Electricity is supplied to the main anode and the sub-anodes at a preset current density D (A/dm.sup.2) to attain a target foil thickness T (g/m.sup.2). Variations of thickness in the direction of the width of the resulting copper foil are measured as the thicknesses Tm (g/m.sup.2) where m=1-n in the direction of the width of the copper foil corresponding to the n sub-anodes, and the quantities of electricity being supplied to the n sub-anodes are individually controlled at current densities Dm (A/dm.sup.2) where m=1-n so that Tm values are made equal to the target foil thickness T (g/m.sup.2).