Abstract: A stepped elastic positioning structure for a semiconductor carrier includes a plurality of transversely and longitudinally arranged walls and a plurality of recesses defined by the walls. On the walls of the semiconductor carrier is formed a plurality of L-shaped stop blocks, each of the stop blocks has an elastically deformable free end which is capable of elastically restricting the semiconductor in the recess, and improving the easiness for putting in or taking out the semiconductor. The end of each of the stop blocks is a stepped structure, plus the elastic deformability of the stop blocks, which makes the recess capable of holding different sized semiconductors.

Abstract: A reticle pod with drain structure comprises an outer container and an inner container, wherein an upper cover of inner container is disposed with a plurality of retainers, and a plurality of supporters disposed on the outer container are used to press the retainers for fastening and stabilizing the reticle in the inner container and thus ensuring safety and stability of the reticle in the reticle pod. Collision risks of the reticle in the reticle pod due to vacillation of reticle pod during transportation can be reduced. Cost of reticles also can be greatly decreased. Further, a plurality of drain holes is disposed on a lower cover of the outer container for draining the remained water in the outer container. It will be done without disassembling the lower cover of outer container for reducing the contamination opportunity in the pod and preventing from wasting of labor and time for disassembling.

Abstract: An elastic positioning structure for a semiconductor carrier is provided with a plurality of stop blocks formed on and extending along the walls of the semiconductor carrier, the fixed end and the elastic free end of the respective stop blocks are located at the same level, so that the fixed end can still serve as a restricting structure to restrict the semiconductor, even when the free end of the stop blocks lose elasticity. The positioning structure has a narrow top and wide bottom, and the recess of the semiconductor carrier is narrow at the top and wide at the bottom, so that the semiconductor can be easily taken out and put into the recess, and can be well restricted in recess without disengaging therefrom.

Abstract: One or more pods for adjusting at least one of an oxygen content or a water content therein and methods of their use are provided, where one or more semiconductor wafer are selectively stored within a storage chamber of the pod. The pod comprises a storage chamber having a side wall surface defining an opening at one side thereof and a pod door fitted to the storage chamber at the opening so as to provide ingress and egress to the storage chamber. The pod door comprises a door body, a first door locking mechanism on the door body and a seal band configured to engage the sidewall surface. The first door locking mechanism comprises a first pressure applicator, a first key assembly and a first connector-rod.

Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.

Abstract: A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.

Abstract: A transfer system includes a substrate positioning device, robots having a first robot and a second robot; and robot control devices, the robot control devices including a first robot control device to which the first robot and the substrate positioning device are connected and a second robot control device to which the second robot is connected. The first robot control device includes an acquiring unit configured to acquire, from the substrate positioning device, at least an absolute deviation amount between the rotation center of the mounting table and a center position of the substrate positioned, and a transmitting unit configured to transmit correction information relying on the absolute deviation amount acquired by the acquiring unit, to the second robot control device to which the second robot is connected.

Abstract: To generate a gas-curtain for a load-port-apparatus and to supply a purge-gas into a pod by a single gas source, provided is a gas purge device including: purge nozzles extending along an outer side of side edges of the opening portion; a curtain nozzle arranged above an upper edge of the opening portion; a gas supply pipe arranged in parallel to each purge nozzle, for supplying an inert gas to the purge nozzle and the curtain nozzle, the gas being supplied from the gas supply pipe to the purge nozzle in a direction orthogonal to an extending direction of the gas supply pipe; and a conductance adjusting unit arranged at an end portion of the gas supply pipe, for generating a pressure loss in a gas flow in a configuration in which the gas is supplied to the curtain nozzle at the end portion of the gas supply pipe.

Abstract: A loadport has a port door and a frame with an opening through which the port door interfaces with a container door of a container for holding semiconductor workpieces. In one embodiment, a movable closure mechanism is connected to the port door and is defined to be movable in a controlled manner relative to both the port door and the frame. In this embodiment, a stationary closure mechanism is disposed on the frame proximate to the opening. In another embodiment, a stationary closure mechanism is connected to the port door, and a movable closure mechanism is disposed on the frame proximate to the opening. In both embodiments, the movable closure mechanism is defined to engage with the stationary closure mechanism such that movement of the movable closure mechanism to engage with the stationary closure mechanism applies a closing force between the port door and the container door.

Abstract: To provide a substrate storage container capable of keeping low a relative humidity in an internal closed space for a long period of time even after purging, a substrate storage container including a constitutive material, which includes a shell body, a door and an on-off valve, defining the internal closed space, the constitutive material being formed of a specific constitutive material having a water absorption of 0.1 wt. % or less when immersed in water at 23 degree C. for 24 hours, and thereby, an actual requirement is objectively satisfied in terms of water release suppression ability under JIS K 7209 or ISO 62 to significantly suppress releasing of water into the internal closed space 3 through the shell body, the door and the on-off valve.

Abstract: A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion can accommodate large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.

Abstract: A system and method for controlling transportation of a substrate of a liquid crystal panel is disclosed. Said method comprises: putting the substrate of the liquid crystal panel into a transport apparatus; humidifying the transport apparatus having the substrate of the liquid crystal panel placed thereinto by utilizing a humidifying apparatus to form a mist in the transport apparatus; and transporting the substrate of the liquid crystal panel by utilizing the humidified transport apparatus. The present invention prevents the substrate of the liquid crystal panel from being damaged by electrostatic charges and ensures product percent of pass.

Abstract: A liquid crystal display (LCD) glass substrate storage tray includes a frame. Each surface of the frame is configured with a plate, the frame and the plates enclose to form a closed box, and the plate on surface of the frame where an opening for the LCD glass substrate to be selected and placed is located forms a box door that is installable or removable from the frame.

Abstract: The position of a substrate temporal placement piece (4) is set so that the substrate temporal placement piece (4) does not overlap a disc-shaped substrate (W) from a viewing direction perpendicular to the surface of the disc-shaped substrate (W), when a lid (20) is attached to a substrate transfer opening (2) of a container main body (1) and the disc-shaped substrate (W) is pressed to a location where the substrate is positioned and held by a back side holding portion (3). Thereby, even if the disc-shaped substrate (W) stored in the container main body (1) is bent due to vibration, impact, etc., there is no danger that the substrate (W) is in contact with the substrate temporal placement piece (4), and the disc-shaped substrate (W) having a larger diameter can be safely stored.

Abstract: Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The latching mechanism is located in a protective latch well that minimizes accidental opening of the latch(s). The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation.

Abstract: The substrate storage pod includes a pod case for housing a substrate, and an opening, a lid member which closes and seals the opening, a buffer space which is defined in the lid member, an air-supply port for supplying a replacement gas into the buffer space; and multiple holes which are arranged so as to establish communication between the buffer space and an inner plate of the lid member in a state of being fit-inserted to the opening of the pod case, for sending out the replacement gas into the hollow inner space, the replacement gas having been supplied into the buffer space, the inner plate facing the hollow inner space of the pod case. With this, pressure variation of the replacement gas in supply pipes is blocked, and hence replacement-gas flow in a stable laminar state free from disturbance can be obtained.

Abstract: An apparatus is provided for protecting a surface of interest from particle contamination, and particularly, during transitioning of the surface between atmospheric pressure and vacuum. The apparatus includes a chamber configured to receive the surface, and a protector plate configured to reside within the chamber with the surface, and inhibit particle contamination of the surface. A support mechanism is also provided suspending the protector plate away from an inner surface of the chamber. The support mechanism holds the protector plate within the chamber in spaced, opposing relation to the surface to provide a gap between the protector plate and the surface which presents a diffusion barrier to particle migration into the gap and onto the surface, thereby inhibiting particle contamination of the surface.

Abstract: The present invention discloses a pod which includes a lower cover member, an upper cover member and a guiding locking piece. The guiding locking piece deployed on one side of the upper cover member of pod, the overall structure of which is formed by a flat base linking to a first slope that links to a second slope, two openings deployed on two side areas of the overall structure, and an upper locking piece and a lower locking piece deployed in each of two openings. When the mask is placed into the lower cover member of pod and is covered by the upper cover member, the mask is pushed to certain position and supported and locked by the upper locking piece and the lower locking piece.

Abstract: The substrate storage pod includes an engagement portion in an outer side surface of a lid of the pod, and an insertion slot through which the engagement portion can be accessed from an external space; the insertion slot is formed in a flange portion arranged around the periphery of an opening in the pod and into which the lid can be fitted, and a latch mechanism supported so as to be slidable in a direction parallel to a flange side wall in a pod main body-surface of the flange portion. An engaging portion of the latch mechanism reaches the engagement portion via the insertion slot. The engagement portion is switched between an engaged state and a non-engaged state in response to movement of the latch mechanism.

Abstract: A wafer container with a latch mechanism that provides sealing for large wafer containers, such as for 450 mm wafers, accomplishes secure door closing and latching with reduced torque requirements for rotating the central rotatable cam plate. In various embodiments, a camming slot formed in the rotatable cammed plate is arcuate and defined by opposing cam surfaces which are selectively engaged by a cam follower, such as a roller, attached to a proximal end of a latch arm. The roller can include unitary axle portions that snap into the proximal end of the latch arm and is supported at both axial ends of the roller. The proximal end of the latch arm can include parallel extensions separated by a gap, and have guide in surfaces to deflect the extensions as the axle portions of the roller are forced into position thereby seating the roller at both axial ends.

Abstract: A mask box having a buckling structure includes a base, a cover and a plurality of buckling elements. The base is configured to support a mask and has a plurality of troughs. The cover covers the base and has a plurality of pivotal portions. The buckling elements are positioned to correspond to the troughs. Each buckling element includes an engaging block and an elastic arm connected to the pivotal portion. The engaging block moves away from the periphery of the cover when the engaging block is subjected to an external force. The engaging block is buckled into the trough via an elastic restoring force of the at least one elastic arm when the external force is removed. By this arrangement, the assembly of the buckling elements is simplified and its product cost is reduced. Further, the present invention conforms to the requirements for environmental protection.

Abstract: The packaging system includes an enclosure having an interior volume. A wafer stack, comprising plural wafers and separators in contact with the wafers, is located in the interior volume. The separators have raised bumps extending from each side. The bumps create spaces that allow air to flow therethrough. The separator film intercepts and captures airborne molecular contaminants belonging to organic and inorganic chemical families. In addition, the film is dissipative to static discharge. Furthermore, the bumps provided by the separators protect the fragile wafers from damage due to mechanical shock. The separators are also provided with a peripheral ring or embossment, which contacts the wafer edges and further protects the wafers from damage to mechanical shock. Air cushions can be provided in the wafer stack, which cushions are provided with bands to regulate the compression.

Abstract: Embodiments of mechanisms of a wafer pod including a pod door are provided. The pod lock includes a rotating element pivoted on the pod housing and having an anchor element disposed on the rotating body. The pod lock further includes a locking element including a locking body slidably disposed on the pod housing. The pod lock also includes an elastic element disposed on the locking body, and adjacent to the anchor element. When the rotating element is rotated, the rotating element pushes the locking element to move, and the elastic element applies an elastic force on the anchor element.

Abstract: A disk holding device according to an exemplary aspect of the present disclosure includes, among other things, a cassette that includes an interior and an end wall and a cover that is received against the cassette to at least partially cover the interior, the cover having a latch arm that includes a channel established by a first edge wall and a second edge wall, the channel receiving a complementary portion formed in the end wall of the cassette. The first edge wall is received against an interior surface of the end wall that faces toward the interior and the second edge wall is received against an exterior surface of the end wall that faces away from the interior.

Abstract: The present invention relates to a reticle pod having gas guiding apparatus. The gas guiding apparatus communicates with at least an inlet of the reticle pod and comprises a first outlet corresponding to a first gas flowing space of the reticle pod and a second outlet corresponding to a second gas flowing space. When the inlet supplies a high-purity gas to the gas guiding apparatus, the high-purity gas will flows through the gas guiding apparatus, and flow to the first and second gas flowing spaces via the first and second outlets, respectively to distribute uniformly in the first and second gas flowing spaces. In addition, the cleaning efficiency on the reticle is improved; the contact between the reticle and air can be avoided for protecting the reticle. Thereby, the usage of the high-purity gas is reduced, and the filling efficiency of the high-purity gas is enhanced.

Abstract: Disclosed are a wafer carrier that keeps wafers under a constant pressure, at any preset value below or above the atmospheric pressure, to prevent wafer contaminations arising from atmospheric exposure in conventional wafer carriers, and also, a wafer transport system and method utilizing the same wafer carrier. The wafer carrier charged with a preset carrier pressure is transported and docked with an airlock of a wafer processing tool comprising the airlock, a vacuum transfer module, and a process chamber. The airlock adjusts, by a gas pump, inner pressure to equate successively with, first, the carrier pressure before opening the carrier door, and next, the vacuum transfer module pressure before opening the latter's door. The wafers are then transferred into the process chamber. After processing, the wafers are transferred back into the wafer carrier and charged with the preset carrier pressure before undocked and transported to the next wafer processing tool.

Abstract: Improvements in a semiconductor wafer container including improvements in side protection to the wafers, improved cover design to minimize rotation, a simplified top cover orientation mechanism and an improved bottom holding mechanism for automation. The side protection to the wafers is with multiple staggered inner and outer walls. The improved cover design improves alignment of the top and bottom housings and minimizes rotation of the housings in transit or motion. The housings have a recessed tab ramp feature with bi-directional locking that also increases the rigidity of the containment device when the two housings are assembled. The latching mechanism is located in a protective latch well that minimizes accidental opening of the latch(s). The improved bottom holding mechanism for automation is an integrated feature that is molded into the bottom housing and not assembled in a secondary operation.

Abstract: Provided is a reticle storage container including an inner container 10 which can store a plurality of reticles 16 and an outer container 1 which covers the inner container 10. The outer container 1 is configured to include a gas nozzle 5 which can inject a predetermined gas. The same gas as the gas supplied into an exposure apparatus 20 is supplied to the gas nozzle 5. The gas injected into the reticle storage container is vented through a vent hole 14 installed to the inner container 10.

Abstract: The present invention comprises a workpiece container for storing at least one workpiece having a bottom surface and a peripheral edge. In one embodiment, a workpiece support structure is located within the container enclosure, which forms multiple vertically stacked storage shelves within the enclosure. Each storage shelf includes, in one embodiment, a first tine and a second tine for supporting the workpiece in a substantially horizontal orientation. The bottom surface and peripheral edge of a workpiece seated on a storage shelf extends beyond the outer edge of both the first tine and the second tine. An end effector according to the present invention may engage these extended portions or “grip zones” of the workpiece.

Abstract: A FOUP (front opening unified pod) is disposed with a plurality of supporting pieces, the positions of which are calibrated to be symmetrical for the supporting pieces to horizontally support wafers in the pod, and with an OHT pad (overhead hoist transport pad), a major function of which is to evenly distribute the weight of the FOUP and the wafers so that the transportation of the FOUP and the wafers by the OHT head can be further stabilized and more weight can be loaded to meet the demands of the process.

Abstract: A substrate transport system includes a carrier having a housing forming an interior environment having an opening for holding at least one substrate and a door for sealing the opening from an outside atmosphere where when sealed the interior environment is configured to maintain an interior atmosphere therein, the housing including a fluid reservoir exterior to the interior environment and configured to contain a fluid, forming a different atmosphere in the fluid reservoir than the interior atmosphere, to form a fluidic barrier seal that seals the interior environment from an environment exterior to the carrier.

Abstract: A wafer container utilizes a rigid polymer tubular tower with slots and a “getter” therein for absorbing and filtering moisture and vapors within the wafer container. The tower preferably utilizes a purge grommet at the base of the container and may have a check valve therein to control the flow direction of gas (including air) into and out of the container and with respect to the tower. The tower is sealingly connected with the grommet. The tower may have a getter media piece rolled in an elongate circular fashion forming or shaped as a tube and disposed within the tower and may have axially extending. The media can provide active and/or passive filtration as well as having capabilities to be recharged. Front opening wafer containers for 300 mm sized wafers generally have a pair of recesses on each of the left and right side in the inside rear of the container portions.

Abstract: A substrate storage container includes an attachment structure in a container body for storing substrates so that a transport component is removably attached to the attachment structure. The attachment structure includes a supporting rail portion provided on an outer wall of the container body, a guide piece provided on the outer wall of the container body, and an engagement part formed with the guide piece. A forked portion formed of a combination of the guide piece and the engagement part. The transport component includes a hollowed frame-shape main part member supported by the supporting rail portion of the attachment structure.

Abstract: Packaging for substrates, particularly for metal/ceramic substrates, having a tray-like packaging portion, produced from a flat material, for example from a plastic flat material, by deep-drawing, having at least one receptacle, formed by a depression in an upper base section of the packaging portion, for a plurality of substrates that are combined to form at least one substrate stack (5).

Abstract: A media carrier, adapted to hold a plurality of pieces of magnetic media, is disclosed. This media carrier can be placed on the workpiece support, or platen, allowing the magnetic media to be processed. In some embodiments, the media carrier is designed such that only one side of the magnetic media is exposed, requiring a robot or other equipment to invert each piece of media in the carrier to process the second side. In other embodiments, the media carrier is designed such that both sides of the magnetic media are exposed. In this scenario, the media carrier is inverted on the platen to allow processing of the second side.

Abstract: A reticle pod includes an outer pod shell and an outer pod door disposed under the outer pod shell. The outer pod door has at least one gas control hole. A seal ring is disposed between the outer pod shell and the outer pod door. A valve is disposed in each gas control hole. The outer pod shell and the outer pod door are configured to form an enclosure space in order to store a reticle. The seal ring seals the gap between the outer pod shell and the outer pod door. The at least one valve is configured to control gas flow in and out of the enclosure space.

Abstract: The present invention provides a package cushioning structure for module, which includes a cushioning bottom board and a cushioning band extending through and interlaced with the cushioning bottom board. The cushioning bottom board forms a plurality of spaced hollow sections. A bar is arranged between every two of the hollow sections. The cushioning band includes a plurality of cushioning air columns mounted thereto at interval. The cushioning air columns are arranged alternately on the bars. To package, modules are each positioned on and born by each of the bars between two of the cushioning air columns. An alternate package cushioning structure includes a cushioning bottom board having a surface forming slots and a cushioning band arranged in the cushioning bottom board through a mounting channel extending through the bottom board from a side surface thereof. Air columns of the cushioning band are located in the slots to support modules.

Abstract: In a first aspect, a substrate carrier is provided that includes an enclosure adapted to be sealable and to house at least one substrate. The substrate carrier includes a first port leading into the enclosure and adapted to allow a flow of gas into the enclosure while the substrate carrier is closed. Numerous other aspects are provided.

Abstract: The invention provides a tray for packaging LCD assemblies, which includes a bottom plate. The bottom plate is provided with a plurality of rhombic grooves which are arranged side by side, and a plurality of discharge grooves for buffering stress concentration are arranged around the rhombic grooves. Because the bottom plate of the tray of the invention is designed with various types of stress concentration factors which are mutually associated, and the rhombic grooves of the stress concentration factors form a plurality of stress concentration zones on the bottom plate of the tray, the stress concentration in the center of the bottom plate can be effectively decreased. In addition, the discharge grooves are arranged around the rhombic grooves in the invention, and the stress concentration of the rhombic grooves is decreased by the discharge grooves.

Abstract: A package structure used to load substrate storage containers for convenience of transportation is revealed. The package structure includes a package box and at least one buffer pad. The buffer pad is disposed in the package box and used for loading a substrate storage container. The density of the buffer pad is smaller than 70 kg/m3. The buffer pad not only separates the package box from the substrate storage container but also absorbs vibration from outside of the package box so as to prevent the vibration from being transmitted to the substrate storage container completely. The amount of vibration that has an impact on the substrate storage container is reduced.

Abstract: The present invention relates to a front opening unified pod (FOUP) having three inlets and one outlet. Thereby, the mixing region for the moisture, oxygen, and the filled gas can be increased and the removing efficiency of the moisture and oxygen in the FOUP is enhanced, improving the purging efficiency of the FOUP and shortening the time required for filling gas. In addition, the humidity in the FOUP can be reduced effectively so that the internal environment of the FOUP can reach rapidly the condition suitable for semiconductor fabrication. Hence, the subsequent semiconductor processes can be performed and the preparation time for the processes can be shortened.

Abstract: An improved wafer container is provided for use with automated equipment. The container includes a top lid that engages with a bottom base to form a housing having an inner cavity for storing semiconductor wafers. The lid includes a handling member that interfaces with automated equipment for engaging the lid with the base and removing the lid from the base. The container includes latches that can be actuated between a locked position and an unlocked position by automated equipment. The container can hold multiple stacked wafer separator rings, each of which has automation tabs extending outwardly from the ring outer rim. The automation tabs allow for automated equipment to transfer the wafer separators rings between the container and a staging area.

Abstract: A substrate storage tray that can be decreased in size for transportation. A substrate storage tray (1) for storing a large size substrate (20) includes a frame member (2) that includes a pair of first frame portions (5) opposed to each other and a pair of second frame portions (6) opposed to each other and has a frame shape, a substrate supporting member (3, 4) that has a plate shape, is disposed inside a region enclosed by the frame member (2), and is arranged to support one surface of the substrate (20), and extending portions (7) that are provided to middle portions in a long direction of the pair of first frame portions (5) and are arranged to widen a space between the pair of second frame portions (6).

Abstract: The FIMS system is for use with a pod composed of a lid having an engaged portion provided on the outer surface thereof and a pod body having a latch mechanism including an engagement portion that engages the engaged portion as it moves along a predetermined axis to fix the lid to the pod. The FIMS system has a latch mechanism drive means for driving the latch mechanism along a certain axis and an engagement portion position sensor that can generate a signal indicating whether the engagement portion is at an engagement position or non-engagement position when the latch mechanism drive means drives the latch mechanism. The latch mechanism drive means and the engagement portion position sensor are provided in the vicinity of a first opening portion of the FIMS system.

Abstract: Improvements in a semiconductor wafer container for reducing movement of semiconductor wafers within a wafer carrier using flexible wall segments, panels or flexible inserts in the base member's main inner containment diameter. These walls allow a vertical containment surface to move and capture the entire stack of wafers rather than a few wafers. The surface that contacts the wafers moves uniformly inward. The wafer stack is secured by reducing or eliminating the gap between the wafer container and the wafer stack. Further improvements include the addition of a ramped engagement surfaces in the top and/or bottom cover that provides mechanical advantage for easier assembly of the top and bottom cover. This design also allows for automated loading and unloading of the wafer stack because once the top cover is removed, the flexible walls spring back outward. Thus providing a small gap in which to freely remove the wafers.

Abstract: A separate supporting body for supporting semiconductor wafers of ?450 mm is attached to the inner surface of either side wall of a container body. Each supporting body is formed of a front supporting piece that is projected laterally from a frame and horizontally retains the wafer on, at least, the side part in the front peripheral edge; and a rear supporting piece that is projected laterally from frame and horizontally retains the wafer on, at least, the side part in the rear peripheral edge. Front supporting piece is formed of a projected part that extends from the front of frame toward the front peripheral edge of the semiconductor wafer and a curved part that extends rearwards from projected part along the peripheral edge of the semiconductor wafer.

Abstract: A dual containment pod having an outer pod and an inner pod that provides support structure and environmental control means. The inner pod includes a base having a flat, polished surface with protrusions upon which the reticle seats and providing a gap between the reticle and the polished surface. The gap separates the reticle from the flat, polished surface of the base and is dimensioned to inhibit migration of particles into the gap, thereby preventing contamination of sensitive surfaces of the wafer or reticle. The top cover of the inner pod seats on the polished surface proximate a periphery of the base. Moveable reticle engaging pins on the top cover of the inner pod are engaged by the top cover of the outer container when the inner pod is assembled inside the outer pod providing reticle restraint.

Abstract: In a first aspect, a loadport is provided. The loadport has a plate adapted to couple to a door of a substrate carrier to open the substrate carrier wherein the plate includes a first opening adapted to couple to a first port in the door of the substrate carrier on a first side of the plate and to couple to a gas source on a second side of the plate, and wherein the loadport is adapted to allow a flow of gas into the substrate carrier via the first opening in the plate. Methods of purging substrate carriers are provided, as are numerous other aspects.

Abstract: A wafer transfer system includes a bidirectional wafer carrying pod, an over-head transport (OHT) rail, an OHT, two platforms, and two loading ports respectively connected to the two platforms. The bidirectional wafer carrying pod has a loading housing and two doors respectively and detachably installed on the two opposite sides of the loading housing. The OHT rail has a single rail section and a double rail section. The two ends of the double rail section are connected to the single rail section. The platforms are respectively disposed beside the double rail section. The loading ports are disposed under the double rail section. Through the OHT, The bidirectional wafer carrying pod can selectively be transferred to one rail of the double rail section and disposed on the loading port of the tool corresponding to the one rail of the double rail section.

Abstract: A front opening wafer container suitable for 450 mm diameter wafers. The front door has a pair of latch mechanism externally operable on the sides of the door, each latching mechanism having a pair of latch tips extendible from top and bottom peripheries of the door into receivers in the door frame of the front opening of the container portion. The door contains wafer cushions that support horizontally stacked wafers. The cushions have vertically extending support strip regions with arcuate wafer engagement portions therebetween. The arcuate wafer engagement portion is positioned in a vertically extending central recess on the inside surface of the door. The wafer cushion is secured to the inside of the door at the pair of vertically extending support strip portions at a pair of vertically extending loading junctures. The latching tips of each latching mechanism is in a vertical alignment with the vertically extending loading junctures.