Abstract: A substrate-supporting rod (4) includes a resin body (41) and a metal rod (43). The resin body (41) includes a body portion (411) being cylinder-shaped and having a first through hole (413) in a direction of the axis thereof, and a number of shelves (415, 415?) arising from said body portion and extending in parallel away from said body portion at a predetermined pitch. The body portion and the number of shelves are unitary portions of the resin body. The metal rod is received in the first through hole. A projection (4151) is defined on the end of each of shelf to support a substrate (45). The projection is cylindrical in shape of which the diameter is larger than the thickness of the corresponding shelf, and a central axis thereof is substantially perpendicular to a central axis of the body portion.

Abstract: An air-purifying device for a front-opening unified pod to purify the air in it is provided. The air in the front-opening unified pod 51 is sucked through one of its breathing holes 58a and directed into an air-purifying device (M) that includes a fan-driving means 1, a dust-filtering means 2, and a chemical-filtering means 3. The moisture, chemical gases, and dust in the air are removed by the air-purifying device (M), and then the purified air is forced into the front-opening unified pod 51 through the other breathing hole 58b. Thus the air in the front-opening unified pod 51 is purified, and its purity is maintained by circulating the air.

Abstract: A glass substrate cassette includes a bottom structure, a top structure, and a pair of side supports affixed to space the bottom structure and the top structure for forming an accommodation space in between. A plurality of support plates are horizontally affixed between the side supports. Each of the support plates is shaped as a corrugated plate structure for supporting thereon a glass substrate. The corrugated support plate has recess portions for allowing a delivering device to load and/or unload the glass substrates.

Abstract: A wafer holding device for a wafer pod is disclosed. The disclosed wafer holding device includes a support frame mounted on one side of the housing of the wafer pod, an actuating frame, two rotating arms and two wafer retainers. When the housing and the base of a wafer pod are assembled, the actuating frame moves and forces the wafer retainers to rotate in a direction perpendicular to the edge surface of the wafers.

Abstract: A substrate container having an enclosure with an access opening for inserting and removing substrates into an interior of the enclosure and a door chassis that is configured to selectively enclose the opening, the door chassis comprising a first wall having a peripheral wall extending therefrom. The substrate container includes a latch mechanism that is operably coupled with the chassis, the latch mechanism configured to operably secure the chassis to the opening. The door of the substrate container includes a textured particle capture region wherein particles generated by the latch mechanism and elsewhere are captured by the particle capture region.

Abstract: Various methods and apparatus for simultaneously processing two single-sided hard memory disks is provided. Disks are positioned in pairs, with one surface of one disk positioned adjacent one surface of the second disk, with the disk surfaces touching or with a slight separation between them. In this back-to-back orientation, the disk pairs may be processed using conventional double-sided disk processing equipment and techniques. However, each disk will not have two active surfaces. Because of the positioning of the disks during processing, only one surface of each disk will be subjected to full processing. Therefore, each disk will only have one active side.

Abstract: A wafer storage container has a container body and a lid. The container body has lid support inserts in a lid receptacle, and the lid has corner inserts for contact with the lid support inserts to support the lid. A supporting member is attached to the container body. The supporting member includes a base plate portion, side plates extending from the base plate portion, and a handle on each side plate for lifting the container body. The thin plate supporting member has contacting portions to support the thin plates, supporting members which elastically support the contacting portions, and a base support bar to support the supporting portions. The tip end of each supporting portion contacts a support stage, and elastically supports the contacting portions from both sides.

Abstract: A waver transportable container (1) includes a container body (2), which is capable of storing a plurality of wafers (33) and has one end an opening portion (2a), and a door body (3) capable of fitting to the opening portion (2a) of the container body (2) in a detachable manner; a guide rib (17) for positioning is provided in an outside portion of the door body (2), and a positioning rib (22), which engages with the guide rib (17) to position the door body (3), is provided in an outside portion of the container body (2).

Abstract: A package for the transportation of contamination vulnerable articles is provided, comprising a closeable plastic container which is loaded with the respective articles, a first bag made from plastic surrounding said container, and a second bag made from plastic wrapping said first bag, wherein said first bag is provided with a valve-filter arrangement in order to allow a controlled air stream into said first bag when opening said valve-filter arrangement.

Abstract: A method for carrying a semiconductor device includes: (a) providing semiconductor devices each having a main surface, a back surface, and a plurality of external terminals; (b) providing a tray having a front surface, a rear surface, an electronic tag imbedded in the tray, first concaved portions formed on the front surface, second concaved portions formed on the rear surface, the electronic tag constituted by a non-contact recognition type chip having a memory circuit in which recognizable information is stored, a depth of the first concaved portion is deeper than a depth of the second concaved portion; (c) housing the semiconductor devices into the first concaved portions respectively in such a manner that the back surface of the semiconductor device being oppose to a bottom of the first concaved portion; and (d) carrying the tray with the semiconductor devices.

Abstract: A substrate container and a bottom plate are connected with a mechanism for adjusting the distance between the container and bottom plate, by, e.g., a threaded connection between two members of the connector mechanism. Also provided are a duck-billed valve for venting the container and a dampener for minimizing damage due to shocks.

Abstract: A container for disks has an improved latching mechanism. The container comprises a cassette with sidewalls with slots for holding disks in an axial arrangement, two opposite end walls each have a U-shaped recess extending downwardly from the open top, a top cover with a rectangular top portion and two end portions extend downwardly to cover the U-shaped recess. The top cover latches to the cassette by way of a latching mechanism which includes a living hinge, an extension portion, and a hook portion all on each end portion. The hook portion cooperates and engages with a cooperative catch member on the cassette. The extension member is under tension to secure the top cover in place. In an alternate embodiment, recesses on the extension portion connect to nubs on the cassettes or on the bottom cover to secure the top cover in place.

Abstract: Various apparatus and methods are provided for positioning and handling single-sided hard memory disks. A disk carrier is provided with ribs formed on the inside surface of opposing side walls. The ribs form disk receiving grooves or channels. The ribs further comprise an alternating pattern of large and small ribs. The large ribs separate pairs of disks from other pairs, the small ribs separate and maintain spacing of the two disks comprising each pair of disks.

Abstract: A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

Abstract: A cassette for holding substrate in a load-lock comprising an outer casing having a front surface with multiple slots and two sidewalls having holes at the bottom section thereof. Braces are set at the corner edges inside the outer casing and side plates are attached to the braces. Each slot has a set of side plates attached to the braces for holding a substrate. Obstruction pieces are also set inside the outer casing near the corresponding holes. Each obstruction pieces comprise a fixed part and an obstructing part. The fixed part attaches firmly to a bottom plate of the outer casing, and the obstructing part blocks the corresponding hole on the outer casing.

Abstract: Tubular silicon members advantageously formed by extrusion from a silicon melt or by fixing together silicon staves in a barrel shape. A silicon-based wafer support tower is particularly useful for batch-mode thermal chemical vapor deposition and other high-temperature processes, especially reflow of silicate glass at above 1200° C. The surfaces of the silicon tower are bead blasted to introduce sub-surface damage, which produces pits and cracks in the surface, which anchor subsequently deposited layer of, for example, silicon nitride, thereby inhibiting peeling of the nitride film. Wafer support portions of the tower are preferably composed of virgin polysilicon. The invention can be applied to other silicon parts in a deposition or other substrate processing reactor, such as tubular sleeves and reactor walls. The tower parts are preferably pre-coated with silicon nitride or polysilicon prior to chemical vapor deposition of these materials, or with silicon nitride prior to reflow of silica.

Abstract: A semiconductor cassette reducer has a first substantially U-shaped plate and a second substantially U-shaped plate. A number of wafer supports connect the first substantially U-shaped plate to the second substantially U-shaped plate. Several retention springs are attached to the first substantially U-shaped plate. The retention springs hold the semiconductor cassette reducer in a FOUP (front opening unified pod).

Abstract: A workpiece container assembly includes a container, and a cover having a locking section that facilitates manipulation and gripping by an apparatus for opening and closing the workpiece container assembly. The container is configured to accommodate workpiece(s) therein. A body of the cover covers an open side of the container. The locking section of the cover includes a bar protruding towards the exterior of the body of the cover, a jaw extending from the bar, and a resilient member connected to the bar such that the bar is biased in its longitudinal direction. The container also includes a frame defining an insertion hole into which the bar of the locking section of the cover is inserted. The opening/closing apparatus includes a clamp that can latch onto the jaw and move the bar against the biasing force of the resilient member to withdraw the bar from the insertion hole in the frame of the container.

Abstract: A panel carrier comprising a box and a plurality of attaching elements is provided. The interior lateral surfaces of the box have a plurality of cannelures. The ends of each attaching element are inserted into the corresponding cannelures on the lateral surfaces of the box so that the interior of the box is partitioned into variable size compartments.

Abstract: A container for holding a wafer includes an enclosure portion having a top, a bottom, a pair of opposing sides, a back and an opposing open front defined by a door frame. A door is sealingly engagable in the door frame to close the open front. The container further includes wafer restraint means in the enclosure including fixed wafer restraint means and operable wafer restraint means. The operable wafer restraint means is selectively positionable by engaging and disengaging the door from the door frame, and is positioned so to enable insertion or removal of a wafer from the container when the door is disengaged from the door frame and positioned so as to cooperate with the fixed wafer restraint means to restrain the wafer in the container when the door is engaged in the door frame.

Abstract: A double-seal mechanism is provided on a cover member for sealing closed a container main body. The double-seal mechanism includes an inner seal piece that seals an interior of the container main body and is positioned between an inner seal reception section of a flange of the container main body and a seal pressing section of the cover. An outer seal piece forms a second seal between the container main body and the periphery of the cover member. The inner seal piece has a rounded distal end fitted into a fitting groove in the flange. A cover member fixing unit of the cover member includes a latch shaft that is linearly projected from and retracted, a latch roller attached to a tip end of the latch shaft, and a crank mechanism that linearly projects and retracts the latch shaft as the crank mechanism rotates. The latch roller travels along an inclined retracting surface on the container main body which forces the cover member inward into sealing engagement with the container main body.

Abstract: The present invention includes: a box case having a size capable of containing an open type of cassette that can hold a plurality of first objects to be processed and capable of containing a plurality of second objects to be processed, the second objects to be processed being larger than the first objects to be processed; a supporting part provided at an inside wall surface of the box case, the supporting part being capable of supporting the second objects to be processed in a tier-like manner; an open-close lid provided at an opening part of the box case in a removable and attachable manner; and a positioning-engaging part provided at a bottom part of the box case in a removable and attachable manner. The open-close lid is capable of sealing the box case. The positioning-engaging part is capable of engaging with a positioning part provided at a lower surface of a bottom part of the cassette to position the cassette.

Abstract: A storage/buffering system for the stocking and/or buffering of substrate and/or substrate carriers in a process environment includes a 6-axis robot. An end-effector is connected with the robot providing an additional one degree of freedom and a mechanism for grabbing and moving of substrate and/or substrate carriers. The robot is mounted in an inverted orientation to a removable service cart for easy removal of the robot to a service area in the event of breakdown. The robot receives commands from a programmable controller connected to control the robot and configured to direct the arm of the robot through a set of movements. Product is loaded in and out of the system through I/O load ports. Product is stored inside the storage/buffering system on a plurality of storage locations, each with product presence/absence detect sensor. The robot can alternatively be mounted directly to the storage system enclosure structure.

Abstract: A wafer storage container has a container body and a lid. The container body has lid support inserts in a lid receptacle, and the lid has corner inserts for contact with the lid support inserts to support the lid. A supporting member is attached to the container body. The supporting member includes a base plate portion, side plates extending from the base plate portion, and a handle on each side plate for lifting the container body. The thin plate supporting member has contacting portions to support the thin plates, supporting members which elastically support the contacting portions, and a base support bar to support the supporting portions. The tip end of each supporting portion contacts a support stage, and elastically supports the contacting portions from both sides.

Abstract: A presser member (1) of the present invention is formed of different materials for the contacting part (5) to press-hold the precision substrates (15) and for the parts other than the contacting part (5). The presser member (1) is shaped from a thermoplastic elastomer for a rectangular frame part, and the contacting part (5) has a pair of structuring parts (4) provided in such a fashion as to inwardly extend from each of a pair of oppositely facing sides. A second contacting part (11) is formed in the extension peripheral part extending via a supporting part (10). The other parts are shaped from a thermoplastic resin. The aforementioned contacting part (5) is provided with grooves of a V-shaped cross section with inclinations changed in the middle for receiving the peripheries of precision substrates (15), and V-grooves for press-holding the peripheries of precision substrates are provided in resilient pieces (12) separated and protruding in a comb teeth-like fashion to form the second contacting part (11).

Abstract: A shipper for memory disks comprises a cassette having an open top and an open bottom, a top cover to cover the open top, and a bottom cover to cover the bottom. The body portion has opposing side walls and opposing end walls. The two side walls each have with a vertical upper portions and an inwardly converging bottom portion. Said sidewalls have inwardly facing elongate teeth or spacers defining slots to hold the substrates in a vertically positioned and spaced array. Each tooth is continuous from the open top to the open bottom and each tooth has a upper vertical portion at the vertical upper portion of the side wall and a converging lower portion at the bottom portion of the side walls. The converging lower portion of each tooth follows the convergence of the bottom portions of the sidewalls.

Abstract: A carrier with ultraphobic surfaces for promoting more effective cleaning and drying of the carrier. In the invention, entire surfaces or portions of surfaces of a carrier are made ultraphobic. The ultraphobic surfaces of the carrier cause liquids that may come in contact with the surface, such as may be used in cleaning, to quickly and easily “roll off” without leaving a liquid film or substantial number of liquid droplets. As a result, less time and energy is expended in drying the surfaces, and redeposited residue is minimized, thereby improving overall process quality. In addition, the ultraphobic surfaces may be resistant to initial deposition of contaminants, where the contaminants may be in liquid or vapor form.

Abstract: A wafer container, and methods of constructing a wafer container. The wafer container has an enclosure portion with at least a top, a bottom, a pair of opposing sides, a back, an open front, and a door to close the open front. The door includes a door chassis with at least a first latching mechanism. The latching mechanism has a rotatable cam member and at least one latching arm. The latching arm has a bifurcate cam follower portion that engages with the periphery of the cam member.

Abstract: In a preferred embodiment of the invention, a wafer retaining arrangement is incorporated into a transport module suitable for 300 mm wafers. The wafer retaining arrangement attaches to an interior of a door of the transport module and includes a framework, and a first and a second plurality of wafer engaging members that secure semiconductor wafers within the transport module and that extend laterally from respective first and second sidewall portions and are preferably parallel to one another. Each of the wafer engaging members includes an arm portion and a wafer engagement head spaced laterally from the respective sidewall portion, wherein the wafer engagement heads of the first plurality of wafer engaging members are in close proximity to the wafer engagement heads of the second plurality of wafer engaging members.

Abstract: A wafer container has an open front defined by a frame for receiving a door. The frame has slots on opposite sides. The door utilizes two latching linkages that extend, lift, lower and retract two latching portions from the edge portion of each opposite side of the door and into and out of latch receptacles on the frame. Each latching mechanism utilizes a sliding plate with a handle connected thereto and exposed on the front of the door. The sliding plate has a pair of lifting linkages cooperating with a pair of latching linkages. Moving the handles outwardly extends the latching portions into the latching receptacles, then pulls the door inwardly to seal the door to the container portion. The sliding plate includes a rack portion engaged with a pinion accessible from the front of the door by a latch key whereby the mechanism can be operated robotically.

Abstract: Various embodiments of an apparatus for holding and processing semiconductor workpieces are provided. In one aspect, an apparatus is provided that includes a first base, a second base and three elongated members coupled to and between the first base and the second base. The three elongated members are spatially arranged so that a semiconductor workpiece may be positioned therebetween. Each of the elongated members has a first lateral edge, a second lateral edge and at least one radially inwardly projecting member. The at least one radially inwardly projecting member has a third lateral edge, a fourth lateral edge and an upper surface for receiving a portion of the semiconductor workpiece and a lower surface. The third lateral edge is displaced laterally inward from the first lateral edge and the fourth lateral edge is displaced laterally inward from the second lateral edge.

Abstract: A tray carrier with ultraphobic surfaces for promoting more effective cleaning and drying of the tray carrier. In the invention, entire surfaces or portions of surfaces of a tray carrier are made ultraphobic. The ultraphobic surfaces of the tray carrier cause liquids that may come in contact with the surface, such as may be used in cleaning, to quickly and easily “roll off” without leaving a liquid film or substantial quantity of liquid droplets. As a result, less time and energy is expended in drying the surfaces, and redeposited residue is minimized, thereby improving overall process quality and facilitating economical reuse of the tray carrier. In addition, the ultraphobic surfaces may be resistant to initial deposition of contaminants, where the contaminants may be in liquid or vapor form.

Abstract: A cassette, particularly suitable for storing film frames, in a preferred embodiment utilizes an integral shell portion with a plurality of shelves to support a plurality of axially aligned horizontally stacked film frames. A door, preferably vacuum-formed, covers the open front of the shell to enclose the film frames therein. The cassette may have a robotic top and collapsible handles. In a preferred embodiment the handles are U-shaped and slideably engaged with a pair of brackets integral with the sidewall. In another embodiment the handles pivot about an axis parallel to the top of the cassette and attach by a pair of split prongs insertable into a pair of receiving holes. A pair of film frame retention members are pivotally and rotatably attached at the sides of the shell inside the front opening.

Abstract: There are provided a dust generation preventing structure of a wafer storage case and a process for preventing dust generation thereof, wherein dust generation is effectively prevented by blocking or suppressing free movement of particles constantly generated from a surface of a wafer storage case of a synthetic resin with a coating layer of a surfactant, and a wafer storing method using the wafer storage case. The wafer storage case of synthetic resin is used for housing wafers, and a surface of the wafer storage case is coated with a coating layer of a coating agent to prevent dust generation from the surface.

Abstract: The disk carrier is used to house and secure a plurality of disks and comprises a disk cassette having an open top, an open bottom, and end wall ingresses; a top cover; and a bottom cover. The top cover has flaps to cover the end wall ingresses. To reduce particulation from opening and closing the disk carrier, one embodiment of the disk carrier implements an articulation in the flaps. Another embodiment implements a living hinge on the bottom cover. The disk carrier also has a path to ground for dissipating static and other electrical charge away from the disks.

Abstract: A wafer container having a latching mechanism utilized to lock the door of the wafer container in an airtight status. The latching mechanism comprises a cam rotated to move a link and a locking plate pivoted to one end of the link, and a guide block adapted to guide the locking plate sliding into an insertion hole in the container body of the wafer container by using a straight guide means and a curved guide means of the guide block and then to turn the locking plate about pivot rods at the link, causing the locking plate to withstand against part of the container body and to hold down the door toward the inside of the container body and to lock the door in an airtight status.

Abstract: A wafer cassette comprises a case body and an adapter that supports substrates. There are adapters of various types corresponding to the size of the substrates to be supported. The case body and the adapter of any type are united in a manner such that fitting portions of the case body are fitted individually in fitting holes of the adapter.

Abstract: A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

Abstract: A microelectronic substrate handling device comprising first and second support structures spaced from each other, the first support structure having a series of upper teeth defining a series of upper notches extending along a length of the first support structure and a series of lower teeth defining a series of lower notches extending along a length of the first support structure, each of the upper and lower notches opening toward the second support structure, wherein the upper and lower notches are offset from each other by a predetermined offset distance so that an edge of a microelectronic device will fit differently within the upper and lower notches of the first support structure when supported between the first and second support structures.

Abstract: A boat (4) has a recess (5) for supporting a laminated wafer (50). The recess (5) has a first side surface (5a), a first bottom surface (5b), a second side surface (5c), a second bottom surface (5d) and a third side surface (5e). Viewing from an upper surface of the boat (4), the second bottom surface (5d) is located in a position lower than the first bottom surface (5b). The laminated wafer (50) is mounted on the boat (4) in the state that a side surface of a first silicon wafer (1) is not in contact with the second bottom surface (5d) of the recess (5) and a side surface of a second silicon wafer (2) is in contact with the first bottom surface (5b) of the recess (5). A second main surface (2a) of the second silicon wafer (2) is in contact with the first side surface (5a) of the recess (5) and a second main surface (1a) of the first silicon wafer (1) is in contact with the third side surface (5e) of the recess (5).

Abstract: A wafer carrier opener is provided. The wafer carrier opener may eliminate the use of two separate actuators by using a four-bar linkage mechanism. The wafer carrier opener includes a wafer carrier door receiver, a horizontally stationary member, and a link coupled between the wafer carrier door receiver and the horizontally stationary member so as to allow horizontal movement of the wafer carrier door receiver.

Abstract: A container for enclosing a mask for a lithographic device is disclosed. The container is at least partially translucent for radiation of at least a predetermined wavelength and is formed in such a way that an image can be obtained from outside the container using light of that wavelength.

Abstract: A modular carrier system uses a shell portion to house semiconductor wafer disks or similar inventory. The modular carrier system uses an external frame with accessories attached to the frame so that multiple configurations of accessories are possible with each shell portion and the accessories can be recycled when the shell portion is disposed.

Abstract: An enclosure for transporting semiconductor wafers includes a pair of sensors that are responsive to electrostatic fields mounted on conductive grounded plates in facing orientations on opposite sides of a position within the enclosure at which a semiconductor wafer is to be located. Electronic circuitry within the enclosure in communication with the sensors supplies monitoring signals to remote circuitry external to the enclosure that isolates sources of contaminants and provides remote balance and gain adjustments. Calibration of the balance and gain adjustments uses a grounded plate for zero balance reference, and uses a plate of insulating material that is charged to a known potential for referencing gain adjustments to produce related outputs.

Abstract: A wafer cassette pod that is equipped with at least one position sensing device to avoid the accidental falling of a cassette pod door resulting in wafer breakage. The wafer cassette pod is provided with at least one position sensing device mounted in the sidewall of the cassette pod with a finger member protruding from the end surface of the sidewall forming the cassette pod opening. When the wafer cassette pod is not properly positioned, or docked on the loadport, the spring force of the position sensing device pushes the cassette pod away from the entrance of the loadport and thus, preventing the accidental falling of a cassette pod poor resulting in possible wafer breakage problems.

Abstract: A wafer carrier for transporting or holding wafers in a horizontal axially aligned arrangement has minimal four point regions of wafer support at the edge portion of the wafers. A preferred embodiment is an H-bar carrier with a plurality of slots defined by elongate wafer guides on the carrier sidewalls. Upwardly extended protrusions support the wafers with minimal contact with the carrier. The protrusions are sufficient in number and configuration to preclude contact with the top surface of the guides.

Abstract: A substrate transport container having a carrier box including a container body and a door hermetically sealably covering an opening provided in the front of the container body. Partitions form a circulating flow path in the carrier box. The circulating flow path has a flow path in which air flows toward substrates and a flow path in which air flows toward a fan. A substrate carrying section is disposed in the flow path in which air flows toward the substrates to carry the substrates in such a way that the principal surfaces of the substrates are approximately parallel to the flow path in which air flows toward the substrates. A particle removing filter and a gaseous impurity trapping filter are placed on the upstream side of the substrate carrying section in the flow path in which air flows toward the substrates. A fan motor for driving the fan is incorporated in the carrier box to form an air current for circulating through the circulating flow path.

Abstract: An adjustable cassette (1) for accommodating substrates includes a frame (10), a pair of supporting plate (20) with a plurality of retaining members (208) facing each other, and an adjusting means for joining of the supporting plates to the frames and thereby forming the cassette. At least one supporting plate can slide away from or close to another supporting plate and be fixed by means of the adjusting means.

Abstract: A wafer shipping container has a first housing subcontainer. A second housing subcontainer mates with the first housing subcontainer to form a housing. The first housing subcontainer is substantially the same as the second housing subcontainer. A process carrier fits inside the housing.

Abstract: A wafer carrier for carrying a plurality of axially aligned thin circular wafers. The wafer carrier has a framework portion formed from a pair of end members connected by a plurality of side support members. A pair of opposing sidewall assemblies is positioned between the pair of end members, and is attached to at least one side support member. Each sidewall assembly has a plurality of shelves defining a plurality of slots for receiving a wafer. The sidewall assemblies are formed from a plurality of stacked together individual shelf members. Each shelf member has a body portion with an upper surface and a lower surface. The lower surface has a plurality of pegs which are positioned to be received by a plurality of apertures formed in the upper surface of an immediately adjacent individual shelf member.