Abstract: The invention relates to a cover (200,300,400,500,600) for an electronic device (100), which electronic device comprises a substrate (110) and at least two electronic components (120,130), one of which generates an electromagnetic field around itself, where the cover has a first main surface (210) that faces towards the electronic device, comprises a material that conducts current, and is designed and arranged in such a way in relation to the electronic components that a cooling medium can pass from the first (120) to the second (130) electronic component. The invention is characterized in that, by virtue of its shape and its material content, the cover has been given an increased ability to absorb at least part of the electromagnetic field that is generated by at least one of the electronic components.

Abstract: A ESD-free container is provided. A compound material is used for the creation of the container, the compound material comprising a metallic material that is wedged between layer of polymide material. The compound material is surrounded by layers of PMMA, resulting in a container having a cavity that is surrounded by a first layer of PMMA, a second layer of the compound material and a third layer of PPMA.

Abstract: A packaging container for electronic components, particularly integrated circuits, which includes a tray into which the integrated circuits can be secured, a tray cover which is secured onto the tray, wherein the tray cover is composed of a plastic material, a desiccating material and an electrostatic dissipating product. The tray cover may further include a humidity indicating system incorporated into the tray cover. The packaging container may also be placed within a water and moisture-proof barrier bag for shipment purposes.

Abstract: A shield (100) having an outer surface (104) and a plurality of sidewalls (106) is disclosed. The plurality of sidewalls (106) extends from the outer surface (104). At least a portion of the plurality of sidewalls (106) are designed to retain the shield to at least a portion of a substrate (102). Further, at least a portion of the plurality of sidewalls (106) are designed to deflect away from the substrate (102) when pressure is applied to the outer surface (104) in such a manner that the outer surface (104) assumes a concave position (202).

Abstract: A wafer shipping container has a first housing subcontainer. A second housing subcontainer mates with the first housing subcontainer to form a housing. The first housing subcontainer is substantially the same as the second housing subcontainer. A process carrier fits inside the housing.

Abstract: A multi-layer structure comprises at least one electrostatic dissipative outer layer and a conductive core layer. The outer layer comprises a material selected from the group consisting of an inherently dissipative polymer, an inherently dissipative polymer blended with a non-conductive matrix polymer, an inherently conductive polymer blended with a non-conductive matrix polymer in an amount sufficient to impart a surface resistivity of greater than 105 and less than 1012 ohms/square, and mixtures thereof. The core layer comprises a material selected from the group consisting of an inherently conductive polymer, an inherently conductive polymer blended with a non-conductive matrix polymer, a conductive filler blended with a non-conductive matrix polymer, and mixtures thereof.

Abstract: The present invention includes a packaged coated workpiece. The packaged coated workpiece has: (1) a workpiece coated with a resist film sensitive to optical radiation, particulates or chemical contaminants; (2) an inner barrier sealed to enclose the coated workpiece and optionally a first getter agent, to produce a sealed first enclosure; and (3) an outer barrier sealed to enclose the sealed first enclosure and optionally a second getter agent, provided that the packaged coated workpiece has at least one getter agent, to produce a packaged coated workpiece suitable for storage for a period of at least one week without substantial loss of sensitivity, resolution or performance. The present invention also includes a process for preparing a packaged coated workpiece and a method of increasing the storage time of a coated workpiece to at least one week without substantial loss of sensitivity, resolution or performance.

Abstract: In order to prevent impairment due to static electricity in a container for an electronic component, generation of static electricity itself has to be inhibited. The peeling static electrification amount of a cover tape should be from −9 to +9 nC when the cover tape has a surface resistivity of at least 1011 &OHgr;, or it should be from −3 to +3 nC when the cover tape has a surface resistivity of less than 1011 &OHgr;. In a carrier tape body, a side of a cover tape which faces an electronic component should have a composition containing a resin on the positive polarity side and a resin on the negative polarity side relative to a side of the electronic component which faces the cover tape in the series of frictional electrification. For the surface of a container to be in contact with an electronic component, a material which is less likely to generate static electricity should be employed.

Abstract: A holding structure of an electronic component includes a first resin mold formed by resin insert molding with a terminal. The first resin mold possesses a positioning portion for positioning the electronic component to be electrically connected to the terminal. The holding structure includes a second resin mold formed by resin insert molding with the terminal and surrounding the first resin mold and the electronic component. The electronic component has been positioned by the first resin mold and has been electrically connected to the terminal.

Abstract: A ring-shaped device is provided for protecting an electrostatic discharge sensitive electronic component. The protective device has a thin film support structure, adhesive material for securing the support structure to the leads of the electronic component, and conductive material for electrically connecting the leads together. The adhesive material may be a pressure sensitive adhesive. The conductive material may be an annular layer of metal deposited on the support structure. In addition, a central opening is provided in the support structure to accommodate a top portion of the electronic component. The electronic component may be protected while it is stored, handled and assembled into a larger system or device, such as a circuit board. The protective device may be used with a variety of electronic components, including components with different leads configurations and also taped components.

Abstract: A device for inhibiting the functioning of electronic receiver, transmitter and/or receiver-transmitter apparatus, of the portable type and functioning with electromagnetic waves, comprises a container suitable for containing said electronic apparatus. The container comprises at least one sheet or layer of material having good electrical conductivity properties, arranged so as to surround totally said electronic apparatus to act as a shield against the propagation of electromagnetic waves to/from the antenna of the electronic apparatus, inhibiting functioning thereof.

Abstract: An EMI protective spring plate having an oblique supporting portion diagonally connected between a flat top contact portion and a flat bottom soldering portion, a front sliding portion obliquely downwardly extended from one end of the flat top contact portion toward the flat bottom soldering portion and inserted through a lower slot in the oblique supporting portion, and a rear sliding portion obliquely upwardly extended from one end of the flat bottom soldering portion toward the flat top contact portion and inserted through an upper slot in the oblique supporting portion.

Abstract: A lithography system including a reticle carrier and reticle library cassette designed for electro-static discharge (ESD) protection. A reticle carrier, such as a SMIF (Standard Mechanical Interface) pod, and reticle library cassette are fabricated largely of electrically conductive materials. Such materials may include polycarbonate plastic impregnated with carbon fibers or an electrically conductive stainless steel. The electrically conductive materials used to fabricate the reticle carrier and reticle library cassette may allow static electrical charges to be drained to ground, thereby preventing ESD damage to the reticles. Furthermore, the reticle carrier may incorporate rounded edges and corners, which may aid in the prevention of static charge buildup near the pod.

Abstract: An EMI shielded enclosure for shielding an electrical component from electromagnetic radiation includes a first cover, a second cover, a top member having a first end, a second end, a first side face and a second side face, a bottom member having a first end, a second end, a first side face and a second side face, a front member connected to the first ends of the top member and the bottom member and having a first side face and second side face, and a back member connected to the second ends of the top member and the bottom member and having a first side face and a second side face. The first cover is attached to the first side faces of the front, back, bottom and top members, wherein at least one of the front, back, bottom and top members has a tapered first side face. The second cover is attached to the second side faces of the front, back, bottom and top members.

Abstract: A system (e.g., a power supply) is presented which allows a user to electrically couple a common ground electrical potential of a circuit (e.g., a power supply circuit return) to, or electrically isolate the common ground electrical potential from, an earth grounded chassis, without having to open the chassis. The system may include a metal bolt and nut, wherein the nut is coupled to an electrically conductive bracket. The bracket is mounted upon a printed circuit board and electrically coupled to the common ground electrical potential. When an insulating bushing is installed in a hole in the chassis adjacent to the bracket, and a threaded shaft of the bolt extends through aligned holes in the insulating bushing, an insulating member positioned between the bracket and the chassis, and the bracket, and the threaded shaft engages the nut, the bolt holds the insulating bushing in place, and the bracket is electrically isolated from the chassis.

Abstract: A device for fastening a shielding cover to a printed circuit board. A tension pin having end regions and a leaf spring in engagement with the tension pin act to press the shielding cover onto the printed circuit board wherein the end regions of the tension pin engage both the shielding cover and the printed circuit board.

Abstract: An enclosure having two walls an attenuation distance apart from each other perpendicular to the plate of the enclosure. At least one of the walls is orbitally riveted or soldered to the plate of the enclosure. Having two walls an attenuation distance from each other is particularly advantageous for RF components. The two walls can be placed to surround the RF component to reduce the RF energy generated by the component that escapes in to the atmosphere, or the two walls can be placed to separate the RF component from other component in the same enclosure to reduce the interference of the RF component with the other components. Alternatively, the enclosure can have a single wall orbitally riveted to the plate of the enclosure with an RF gasket attached to the entire length of the wall to reduce the amount of RF energy that is able to pass around the wall.

Abstract: An RF screened housing (1;13) according to the invention contains a screening plate (2;15) and having at least two mutually opposite side walls (3;16), which project from said screening plate (2;15) and are designed to engage behind rims of a printed circuit board (5;14), which is fitted with the RF screened housing (1;13), as well as elastic means (7;18) which can be pressed against at least one of the main surfaces of the printed circuit board (5;14) in order to clamp them at the rims to the side walls (3;16).

Abstract: A detector assembly which includes an electrically conductive, two-piece, molded plastic housing including a relatively rigid bulkhead portion having a groove and a second dome portion having a sidewall extending over an adjacent bulkhead portion. The dome portion has a plurality of relatively flexible tabs, a part of each tab extending into the groove and making mechanical contact with the bulkhead portion via the groove to provide a press fit therebetween. An electrically conductive barrel is disposed within the housing and is electrically connected via an electrically conductive o-ring to the bulkhead to form an electrically shielded chamber within the housing in conjunction with the bulkhead and the dome portions. Equipment to be shielded is disposed within the chamber and is secured to the barrel.

Abstract: A mains interface module is disclosed for a screened enclosure containing electronic equipment. A mains interface module for a screened enclosure containing electronic equipment has a screened casing having a weather proof mains inlet connector, one or more mains outlets and contains EMI filters operative to protect the outlet(s) from interference from a mains supply when connected to the inlet connector. The screening prevents radiation of interference within the enclosure. The weatherproof mains inlet allows the equipment to be used and installed outside. The EMI filters prevent interference from being conducted through the outlets.

Abstract: A package includes a substrate mechanically supporting circuitry. A conductive cover (e.g., a metal sheet) is over the circuitry so that the circuitry is exposed below an opening in the conductive cover. A bent down corner of the conductive cover is inserted into a hole in the substrate. A solder ball is placed on the other end of the hole. During a subsequent heating, the solder ball is drawn up through the hole. When cooled, the conductive material grasps onto the tip of the bent down corner, thereby establishing a good connection between the conductive cover and the newly formed conductive via. As a finger approaches the circuitry (e.g., a fingerprint detection circuit), the finger first discharges electrostatic charge into the cover, not into the circuit, thereby protecting the circuit. In another package, the cover is composed of a highly resistive material, to slowly dissipate the electrostatic charge.

Abstract: A sub printed circuit board fixing device in an electronic product, the device includes: an electrical connection unit which is installed on a main printed circuit board, and where a sub circuit board is inserted; a connection unit which is formed in the lower part of the sub printed circuit board and is inserted into the electrical connection unit fixed to the main printed circuit board; a shield bracket for shielding the sub printed circuit board; and a fixing bracket which is installed on the main printed circuit board, for removably fixing the sub printed circuit board to which the shield bracket is fastened.

Abstract: A computer system housing for providing an attenuating barrier for electromagnetic interference (EMI) noise. The computer system housing includes a backplane wall having a plurality of connectors for receiving PCB's, and a bulkhead wall coupled to the backplane wall. The bulkhead wall defines a plurality of bulkhead slots through which connector receptacles of printed circuit boards (PCB's) can extend. An EMI bulkhead gasket is positioned on the bulkhead wall. A conductive metal impregnated, elastomer EMI gasket is positioned on a mounting flange of the bulkhead wall. The computer system housing also includes a plurality of bulkhead plates. The bulkhead plates contact the EMI bulkhead gasket and the elastomer EMI gasket along their entire peripheral edges so that EMI noise is conducted through these gaskets to the bulkhead wall. The computer system housing further includes a bulkhead plate alignment and mounting system that does not employ separable fasteners.

Abstract: An electrostatic discharge-free container for storing electrically insulating articles is provided. The container consists of a container body formed of a top lid, a bottom lid and four sidewall panels defining a cavity therein, the lids and the sidewall panels are formed of an electrically insulating material, such as a polymeric material. Inside the container, at least four support means are mounted on the bottom lid in a spaced-apart relationship. Each of the at least four support means has a base portion for engaging the bottom lid and a roller portion for rollingly engaging and supporting an electrically insulating article thereon. The base portion and the roller portion of the at least four support means are formed of an electrically conductive material such as a metal particle loaded plastic for electrical communication between the two portions and with a grounding wire.

Abstract: An insert for use within integrated circuit (IC) chip carriers to provide universality across device types and applications at a low design and fabrication cost. The present invention functions as a generic carrier floor and/or adaptor insert which enables reception of both quad-flat-pack (QFP) and thin-quad-flat-pack (TQFP) ICs within frames of a variety of existing carriers, or alternatively, may allow both QFP and TQFP ICs to utilize a single IC carrier frame, a feature which currently prevailing embodiments would require two unique IC carriers.

Abstract: A two-part electromagnetic radiation shielding device (10) for mounting on a Printed Circuit Board (PCB). The device (10) comprises a substantially open frame member (6) for receiving an electric or electronic component requiring shielding, and a closing can or cover member (1). The frame and cover members (6; 1) are constructed from electrically conductive material and have peripheral sides (7; 3) adapted to grip each other such that, in use, the frame and cover member (6; 1) surround the component in a closing arrangement. The peripheral sides (7; 3) of the frame and cover member (6; 1) have a shape such that a continuous gripping force is exerted (14) to establish and maintain circumferential electrical contact (13) between the frame and cover member (6; 1) at facing edges (5; 11) of the peripheral sides (3; 7) of the members (1; 6). Separate mechanical (14) and electrical (13) engagements are provided for optimum Electro Magnetic Compatibility (EMC) shielding.

Abstract: An RF shield having a removable cover is disclosed. An RF shield for shielding an electronic component comprises a plurality of sidewalls and an interconnecting top wall, with the sidewalls and the top wall enclosing a cavity adapted to receive therein the electrical component to be shielded. The top wall is constructed of a first thickness and includes a frangible connection defined by at least one score line circumscribing a removable central portion. The score line has a second thickness less than the first thickness. The frangible connection may be severed in response to the application of a force on the central portion, thereby permitting removal of the central portion to form an access opening.

Abstract: A shielding cover for a GBIC module (30) including a pair of cover parts (38, 40) formed with complementary features to surround a printed circuit board (32) of the module. A pair of latch members (42, 44) hold the two cover parts together and also provide a latching function when a module is inserted into a guide structure (12) mounted to a host board.

Abstract: A shielding arrangement for electrical circuits, particularly on printed circuit boards, has a shielding frame with circumferentially arranged cupola-like pegs for engagement with catches in a shield cover. The spacing between the pegs is determined by the required HF-tightness.

Abstract: A shielding screen for a printed circuit board that supports an electronic circuit has a frame and at least one cover for covering the frame. The frame and the at least one cover, when adhesively fastened to each other, form a subassembly that, when attached to the printed circuit board, electromagnetically shields the electronic circuit. For adhesively fastening the at least one cover to the frame, a conductive adhesive substance is applied to opposite surfaces of the frame and the at least one cover.

Abstract: The present invention relates to a protective shield (1) of EMC-type, for e.g. electrical components (40) on a circuit board (30). The protective shield (1) comprises a frame (10) with associated lid (20), where said frame (10) at the end facing towards the circuit board (30) comprises a flange (12). The frame is arranged to be fastened to the circuit board (30) by means of gluing, welding or soldering. The frame (10) is intended to surround at least one component (40) so that electrical contact is formed between said circuit board (30) and said frame (10) and between said frame (10) and said lid (20).

Abstract: A computer has a chassis with a variety of electronic components mounted to it. The chassis is generally rectangular and slidably mounted within a sheet metal enclosure. The enclosure closely receives the chassis to eliminate excessive movement therebetween. The enclosure is essentially a four-sided box with an opening at either end. A front panel is attached to one of the openings. The front panel and the enclosure each contain half of a labyrinth seal which seals one end of the enclosure when the front panel is assembled to the enclosure. A similar seal is formed at the other end of the enclosure when the chassis is mounted in the enclosure. The labyrinth seals have a folded configuration which forms an interleaving arrangement.

Abstract: There is provided an electro-magnetic relay including (a) a coil assembly including a core, a coil wound around the core, and a magnet located at the center of the coil assembly, (b) an armature block assembly including an armature swingable relative to the core, a spring swingable together with the armature and having a contact at a distal end thereof, and an insulating block formed integral with the armature and the spring, (c) a base assembly including a fixed contact facing to the spring, a fixed contact terminal on which the fixed contact is formed, a neutral terminal to be electrically connected to the spring, a coil terminal to be electrically connected to the coil, and an insulating block formed integral with the fixed contact, the fixed contact terminal, the neutral terminal, and the coil terminal, and (d) a cover housing therein the coil assembly, the armature block assembly, and the base assembly, the cover including (d-1) an enclosure having both a bottom edge defining an open bottom, and an insul

Abstract: A shield for an electronic device having a pair of cooperating printed circuit boards includes an integrated connector for connecting the printed circuit boards. The shield is provided with a frame attachable between the circuit boards and structure attached to the frame for supporting a connector that electrically connects the circuit boards. In one embodiment, the contacts of the connector are embedded in a sub-frame attached to the frame. In another embodiment, a connector holder is formed with the frame for supporting a connector that connects the printed circuit boards. By virtue of the unitary structure, problems associated with tolerance stack-up can be eliminated, and usable printed circuit board area can be maximized.

Abstract: As to a packing container, when a corrugated cardboard sheet where metallic foil is stuck on one of its sides is assembled so as to have a box-shape, an edge left for applying paste and a side on which the edge left for applying paste is stuck are connected by metallic foil tape so that metallic foil on the sides inside the box joins along an internal circumferential surface of the box. As a result, since a closed path is formed along the internal circumference of the packing container, partial charging of a packing container is prevented by short-circuiting or shielding charged static electricity, and an electrostatic breakdown of contents, such as a semiconductor device, is prevented.

Abstract: A plastic tube and a method and apparatus for forming it in which a strip of relatively thin plastic sheet material is cut from a roll of the material and wound around a mandrel. Overlapping ends of the strip are sealed to form the tube. The edge of the strip is inwardly bent to form an inwardly extending lip. When used in the manufacture of a capacitor, the tube is placed in a can on top of the disc of insulating material and a capacitor roll is placed in the tube. The edge of the sheet material can be pre-creased so that when folded inwardly, darts of the material form the lip.

Abstract: The packaging container according to the invention for receiving filled product can be used as a self-supporting container or as an in-liner or insert container in supporting outer containers such as corrugated paperboard boxes, wooden cases, box pallets with mesh panels, or drums. The packaging container comprises a multilayered composite film combination which is made up of a polymer film with barrier layer properties, acting as the outer layer of the container, an intermediate layer made of an electrically conductive material and also a further polymer film, forming the inner layer of the packaging container. According to the invention, the further polymer film, forming the inner layer of the packaging container, bears a perforation pattern and the electrically conductive intermediate layer is in connection with a grounding system via electric contact points. The polymer film forming the inner layer of the packaging container is preferably a heat-sealable monofilm or a coextruded film.

Abstract: A case for housing a substrate which limits the accumulation of dust, due to static electricity, while allowing visual access to the substrate. A box-like case portion has an open front end and a front lid pivotally provided on the case portion to close the front end and in which a predetermined substrate is housed in the case portion. A predetermined portion of the box-like case portion and the front lid are made of synthetic resin formed with electrically conductive copolymer. A predetermined position of the box-like case is formed of transparent electrically conductive material.

Abstract: An electrostatic discharge protection device is disclosed for use with a semiconductor chip package where the electrostatic discharge protection device establishes an electrical connection between connector pins on the semiconductor chip package and ground thereby creating a short circuit to protect the semiconductor chip package from electrostatic discharge. The electrostatic discharge protection device is manually operable to engage or disengage and also automatically withdraws the shorting connection upon insertion of the semiconductor chip package onto a printed circuit board or into a mating receptacle.

Abstract: A packaging system includes a bottom having a flat surface for accepting an object, a top having a flat surface and projecting fingers extending from the surface of the top. When the top is assembled to the bottom, the fingers deform, forcing the object against the bottom surface. The object is maintained in position by friction against the bottom surface and the presence of undeformed fingers surrounding the object. The packaging system may be made of static dissipative material and include connection claws and rods for connecting a number of packages in series.

Abstract: Airtight ESD-protected containers (42) are used to transport semiconductor components (12). A reclosable lid (44) snaps onto the rectangular container (42) to provide the airtight environment. The shape of the container allows stacking of multiple containers inside a larger outer box for shipping to the customer site. Both the lid and the container are reusable which provides cost savings spread over their useful life. Transporting semiconductor components in this manner does not use small cardboard boxes or dry-pack bags.

Abstract: A molded synthetic-resin container having a wall with an outer surface has a layer of conductive particles imbedded in at least a portion of the wall at the outer surface thereof. This layer is made according to the invention, after blow-molding of the container, by heating and thereby disrupting a surface region of the container, then applying a conductive powder to the disrupted surface region, and finally heating the powder on the disrupted surface region and sintering it into the disrupted surface region.

Abstract: A glass substrate transport box which is easy to handle and transported and adapted to protect glass substrates is provided at drastically reduced production cost. At least the body of the box is a molded piece of resin foam with a foaming ratio of 3-30, e.g. polyolefin foam, which has grooves for supporting glass substrates on at least a pair of its opposed inside walls. Preferably the inside wall of the body has a relatively dense skin layer. The resin foam may contain an electrically conductive polymer or an antistatic agent.

Abstract: Proposed is a novel casing for frame-supported pellicle used for dustproof protection of a photomask in the photolithographic patterning process for the manufacture of fine electronic devices. Different from conventional casings made from a plastic resin, the casing of the invention is characterized by the use of a unique permanently antistatic resin composition which is a resin blend consisting of 80-95% by weight of an ABS or acrylic resin and 20-5% by weight of a specific hydrophilic polymer. By virtue of the excellent antistatic behavior of the resin composition, the frame-supported pellicle encased in the casing is safe from the troubles due to deposition of dust particles during transportation and from contamination by the vaporized matter from the casing.

Abstract: An anti-static package for containing and manipulating an electronic component susceptible to damage from electrostatic charges. The anti-static package is comprised of a container body and a lid, wherein the lid is adapted to allow indirect manipulation of the electronic component through the use of an adhesive surface on a compressible member attached to the lid to form an adhesive bond between the lid and the electronic component, and two camming surfaces, controlled by a user's fingers or an analogous tool The adhesive is specially selected for both its anti-static properties and the lack of residue left on the electronic component as a result of forming an adhesive bond.

Abstract: An electrostatic dissipating packaging tape is disclosed that comprises a transparent substrate, a substantially transparent adhesive layer on one surface of the substrate, and a clay coating on the opposite surface of the substrate from the adhesive. The clay is characterized by being able to provide a surface resistivity of 10.sup.14 ohms per square or less when present on a surface in amounts that are low enough to remain transparent, and the clay is present on the substrate surface in an amount sufficient to provide the coating with a surface resistivity of 10.sup.14 ohms per square or less, but less than an amount that would substantially reduce the transparent optical properties of the packaging tape.

Abstract: A transparent static dissipative adhesive tape is disclosed. The tape comprises a transparent polymer substrate having opposed first and second surfaces, a transparent static dissipative coating on the first surface of the substrate, and a transparent static dissipative adhesive coating on the second surface of the substrate. The adhesive coating comprises a transparent conductive layer on the second surface formed of conductive particles in a polymer matrix, and a transparent adhesive layer without any conductive particles over the conductive layer. The exposed surface of the adhesive layer exhibits conductivity substantially the same as the conductivity of the underlying conductive layer.