Including Component Positioning Means Patents (Class 206/722)
  • Patent number: 6568535
    Abstract: Apparatus and methods are presented herein for uniformly sealing and peeling a cover tape to/from a carrier tape. The carrier tapes of the present invention include surface transitions that minimizes/eliminates surface irregularities and distortions such that the cover tapes can be uniformly sealed and peeled from the carrier tapes. The surface transitions act as physical barriers to prevent propagation of surface irregularities and distortions from the thermoformed pocket area into the heat bonding zones. The surface transitions also act as stiffening members to keep the heat bonding zones as flat as possible during subsequent handling of the carrier tape. The surface transitions may be in the form of continuous ribs and/or step portions.
    Type: Grant
    Filed: January 14, 2000
    Date of Patent: May 27, 2003
    Assignee: Peak International Ltd.
    Inventor: John D. Pylant
  • Patent number: 6564946
    Abstract: A containment device for retaining semiconductor wafers having a first housing member having a frame with inner and outer walls normal to the frame having a gapped relation. The inner wall receives the semiconductor wafers. A second housing member securably attachable to the first housing member by plural latches has a frame forming the top of the device. Each latch has a hook secured to the first housing member passing through a hole in the second housing member and releasably secured within the hole by the hook. In a second embodiment, the latches and holes are replaced with a plurality of rotatable latch members each having a hook at the distal end for engagement with a hole in the second housing member, secured to the first housing member and rotatable about a hinge. One wall of the first embodiment is replaced with a soft liner which absorbs shock.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: May 20, 2003
    Assignee: Texas Instruments Incorporated
    Inventors: Lee Lewis, Kurodearimasu Takeshi Hirose, Jeffrey Wilson, James Dove, Michael Hayden
  • Patent number: 6505741
    Abstract: A tray for receiving semiconductor devices is formed of a main portion having supporting surfaces, and a plurality of columnar bosses formed on the top and bottom supporting surfaces of the main portion to surround and couple with outer perimeters of semiconductor devices. The columnar bosses are formed to be situated adjacent to each other when two trays are piled. The tray can be formed economically without deformation.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: January 14, 2003
    Inventor: Hirokazu Ono
  • Patent number: 6502701
    Abstract: A package has a holder for holding an ink cartridge, a container for accommodating the holder, and a mount for sealing an opening of the container. The holder is made from recycled materials and the internal shape of the holder conforms to the external shape of the cartridge. The container has a transparent portion and substantially conforms to the holder. The mount is made from recycled materials. The mount is attached to the container in a depressurized environment. The cartridge is visible through the transparent portion of the container. Since the holder and the mount are made from recycled materials, the package is environmentally sound. The holder may hold a used cartridge.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: January 7, 2003
    Assignee: Seiko Epson Corporation
    Inventor: Satoshi Shinada
  • Patent number: 6484881
    Abstract: An electronic component package for containing a plurality of electronic components. The package including structure that provides at least two configurations. In the first configuration, the package functions as a sufficiently rigid tray for supporting and protecting the plurality of components during storage, shipping and handling of the package. In the second configuration, the package functions as a flexible carrier tape for feeding the components into and through automated component handling and placement equipment. The structure includes package edges interconnected to and extending along a plurality of tray sections in which the components are housed. In one embodiment, the package edges connect to a cover to provide the first rigid tray configuration. In another embodiment, the package edges include flexible edge wings that rotate into position and are secured to provide the first rigid tray configuration.
    Type: Grant
    Filed: February 3, 2000
    Date of Patent: November 26, 2002
    Inventor: Joseph G. Alvité
  • Publication number: 20020153268
    Abstract: A carrier for coiled filaments comprises a longitudinal base having a first end including a reinforced edge, a second end, and a first ledge opposite a second ledge. There is a raised platform between the first ledge and the second ledge. The raised platform has a first row of projections extending above the raised platform adjacent to the first ledge of the base. A second row of projections extends above the platform adjacent to the second ledge of the base, in parallel relationship to the first row of projections. The raised platform accommodates a plurality of rectangular envelopes each sized to mount in overlapping relationship between the first row of projections and the second row of projections. Each envelope contains a filament so that the ends of the filament extend out of the envelope from openings in the corners of the envelope. A first rail of resilient material mounted on the first ledge includes a plurality of slits each to receive one end of a filament.
    Type: Application
    Filed: April 24, 2001
    Publication date: October 24, 2002
    Applicant: 3M Innovative Properties Company
    Inventors: Thomas A. Higbee, Martin G. Afflerbaugh
  • Patent number: 6446818
    Abstract: A boat for cleaning semiconductor packages, including cleaning ball grid array packages in centrifugal cleaners. The boat includes a bottom plate with receptacles for receiving semiconductor packages and a top plate having through holes, where each through hole is smaller than the receptacle with which it corresponds in the bottom plate. An alignment mechanism ensures that the top plate is aligned with the bottom plate in a manner that results in each through hole being positioned directly over a respective one of the receptacles. An attachment mechanism releasably attaches the top plate to the bottom plate in a co-planar relationship that results in the presence of a vertical space between the two plates.
    Type: Grant
    Filed: August 10, 2000
    Date of Patent: September 10, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Ajit M. Dubey, Raj N. Master, Ot Ong, C S Chan
  • Publication number: 20020066693
    Abstract: A tray for holding packaged semiconductor devices includes a structure on at least one edge of the tray adapted to receive a tab containing a unique identifier, such as a color or combination of colors or alphanumeric indicia, to identify the type of packaged device to be contained in said tray.
    Type: Application
    Filed: December 1, 2000
    Publication date: June 6, 2002
    Inventors: Jones Zhu, Wilder Wang, Quifang Yang
  • Patent number: 6398034
    Abstract: The present invention provides a low cost carrier tape designed to store chips during transportation. The invention comprises a carrier tape which contains receptacle holes designed to secure chips onto the carrier tape by clasping onto the chip's electrical contacts. The receptacle holes prevent the chip from rotating and physically moving. The receptacle holes are formed in patterns to match the standardized electrical contact patterns of flip chip families. The diameters of the receptacle holes may be sized slightly smaller than the diameter of electrical contacts such that a chip is secured by “snap-fitting” each electrical contact into a receptacle hole. Relief slits may be formed on the edges of the receptacle holes to facilitate the “snap-fitting” of electrical contacts into receptacle holes.
    Type: Grant
    Filed: February 29, 2000
    Date of Patent: June 4, 2002
    Assignee: National Semiconductor Corporation
    Inventors: Hem P. Takiar, Nikhil Vishwanath Kelkar
  • Patent number: 6365244
    Abstract: The present invention provides methods for heat absorption and thermally protected enclosures for containing heat sensitive devices, which include a heat absorption composition including polyoxymethylene polymer.
    Type: Grant
    Filed: November 4, 1997
    Date of Patent: April 2, 2002
    Assignee: Honeywell International, Inc.
    Inventors: Jane Ren, Christopher E. Osuch, Richard A. Olzak
  • Publication number: 20020014465
    Abstract: A carrier structure comprises a carrier base which is not thermally deformable and a portion of which is also transparent to electromagnetic radiation. An adhesive layer is disposed on a surface of the carrier base. Semiconductor chips or other items adhere to the adhesive layer, which is cross-linked when it is desired to remove the chips. Once the chips have been removed, the adhesive layer may be removed from the carrier base. The carrier base can be re-used to transport and hold semiconductor chips after application of a new adhesive layer. A carrier frame may releasably support the carrier base.
    Type: Application
    Filed: July 25, 2001
    Publication date: February 7, 2002
    Inventor: Kevin Kwong-Tai Chung
  • Patent number: 6341695
    Abstract: A containment device for retaining semiconductor wafers (54) which includes a first housing member (10) having a frame (12), an inner wall (14) and an outer wall (16), the inner wall (14) and outer wall (16) having a spaced apart relationship forming a gap (18) therebetween. The inner wall (14) closely receives the semiconductor wafers (54). The containment device also includes a second housing member (36) that is securably attachable to the first housing member (10) and which has a frame (38) that forms the top of the containment device when the first and second housing members (10, 36) are securably attached together. The first and second housing members are secured by a plurality of latches (20), each with a hook (22) secured to the first housing member which passes through a hole (40) in the second housing member and is releasably secured within the hole by the hook.
    Type: Grant
    Filed: May 15, 2000
    Date of Patent: January 29, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Lee Lewis, Kurodearimasu Takeshi Hirose, Jeffrey Wilson, James Dove, Michael Hayden
  • Patent number: 6340088
    Abstract: Electronic components can be reliably supplied from a storage container for electronic components, which is easy to manufacture and highly economical, to a mounting device. The storage container for electronic components includes a storage region, in which electronic components are stored, a discharge hole, a lead portion for leading the electronic components to the discharge hole, the end of the lead portion becoming the discharge hole, a discharge hole side lead portion, provided with a taper (guide angle) so that its width becomes narrower toward the discharge hole, and a storage region side lead portion, positioned between the storage region and the discharge hole side lead portion, and provided with a taper (guide angle) so that its width becomes narrower toward the discharge hole side lead portion. In addition, the taper (guide angle) of the storage region side lead portion may be larger than the taper (guide angle) of the discharge hole side lead portion.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: January 22, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akira Mouri, Kiyoyuki Nakagawa, Kenichi Fukuda
  • Publication number: 20010027933
    Abstract: An accommodation container including: at least one first container body and at least one second container body which can be stacked onto the at least one first container body, respectively, and at least one accommodation part provided between the at least one first container body and the at least one second container body, the accommodation part being capable of accommodating a semiconductor device having a plurality of external connection terminals. The accommodation part is made of a soft material at least at a portion to be in contact with the external connection terminals of the semiconductor device.
    Type: Application
    Filed: May 26, 1999
    Publication date: October 11, 2001
    Inventors: KEIICHI SASAMURA, HIDEYASU HASHIBA, YUKIO ANDO, SHIGEO SUZUKI, YUUKI KANAZAWA
  • Patent number: 6287068
    Abstract: A self-aligning tray carrier for supporting a tray carrying a large group of ICs therein. The invention includes self-aligning, cooperative tray carrier and tray transport configurations to ensure precise, repeatable alignment of a tray carrier with an underlying tray transport through gravity alone when a tray carrier which has been raised off the transport is again lowered into supporting contact therewith. Another, optional, feature of the mutually cooperative configurations of the tray carrier and tray transport permits the tilting of the tray carrier while still supported on the transport so as to effect precise alignment of IC packages carried in rectangular recesses on a tray on the tray carrier with respect to common alignment points (i.e., the same corner of each tray recess) to facilitate repeatability of the IC package surface location being marked on each IC package borne by the tray. Such alignment may be further enhanced by vibration or tapping of the tray carrier while in a tilted orientation.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: September 11, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Robert L. Canella, Tony T. Ibarra
  • Publication number: 20010013483
    Abstract: In a storage case 10 for enclosing a memory card, for example, there is provided a storage case which can reliably be prevented from being smudged by dusts and can reliably be prevented from being dropped unintentionally and which is also easy to handle.
    Type: Application
    Filed: December 14, 2000
    Publication date: August 16, 2001
    Inventors: Toshikazu Konno, Chika Nakata, Masahiro Kinoshita, Makoto Yamaguchi
  • Patent number: 6271584
    Abstract: A bearer strip having components arranged in several parallel rows with variable spacing between the rows so as to increase packing density while providing sufficient empty space for introducing free flowing plastic on the bearer strip.
    Type: Grant
    Filed: August 27, 1997
    Date of Patent: August 7, 2001
    Assignee: Siemens Aktiengesellschaft
    Inventors: Stefan Schmausser, Otto Gruber, Siegfried Fischer, Walter Juri, Bernd Barchmann, Jürgen Winterer, Martin Petz, Jürgen Steinbichler, Xaver Schlögel, Otto Voggenreiter
  • Patent number: 6230896
    Abstract: A JEDEC-compatible universal shipping tray is provided for transporting packaged semiconductor devices. Embodiments include a tray having an array of hollow short pedestals that are commonly connected to a manifold, such as a sealed chamber. A flexible membrane, such as a polymer sheet, is placed over the top ends of the pedestals, then holes are punched in the membrane, as with a needle, to expose the top ends of selected pedestals. Packages to be shipped in the tray are placed over the exposed top ends of the pedestals, and a vacuum is drawn through a manifold vacuum valve to hold the packages to the pedestals against the membrane. Since the internal configuration of the tray of the present invention is not customized to fit a particular package, packages of different sizes and shapes can be shipped using a tray of the same design. Furthermore, partially filled trays can be shipped simply by leaving the membrane unpierced at the ends of pedestals that are not needed to support packages.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: May 15, 2001
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Donald L. Lambert
  • Patent number: 6193069
    Abstract: The present invention provides integrated packaging for storing or transporting a circuit assembly. In an embodiment of the invention, a housing comprises a first side portion attached to the circuit assembly, a second side portion and means for coupling the first side portion to the second side portion wherein the second side portion is moveable to a first position when the circuit assembly is operating and the second side portion is moveable to a second position when the circuit assembly is to be transported, so that the housing encloses the circuit assembly.
    Type: Grant
    Filed: April 22, 1999
    Date of Patent: February 27, 2001
    Assignee: Compaq Computer Corporation
    Inventors: John L. Guenther, Donald D. Campbell, Brian D. Perry
  • Patent number: 6193068
    Abstract: A containment device for retaining semiconductor wafers (54) is disclosed. The containment device comprises a first housing member (10) having a frame (12), an inner wall (14) and an outer wall (16). The inner wall (14) and outer wall (16) each extend generally perpendicularly from the frame (12). The inner wall (14) and outer wall (16) have a spaced apart relationship forming a gap (18) therebetween. The inner wall (14) closely receives the semiconductor wafers (54). The containment device also comprises a second housing member (36) that is securably attachable to the first housing member (10). The second housing member (36) has a frame (38) that forms the top of the containment device when the first and second housing members (10, 36) are securably attached together.
    Type: Grant
    Filed: April 22, 1999
    Date of Patent: February 27, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Lee Lewis, Kurodearimasu Takeshi Hirose, Jeffrey Wilson, James Dove, Michael Hayden
  • Patent number: 6176374
    Abstract: A container system for storing and transporting sensitive components such as semiconductor chips is disclosed. The container system includes in combination, a housing and a plurality of component carriers for receiving components to be stored and transported in stacked banks. The plurality of component carriers are stacked one on top of the other in a top-to-bottom stacked arrangement within the housing. An underside bottom surface of a first component carrier provides a top cover to a second component carrier positioned immediately below the first component carrier, wherein a component carrier includes a compartmental core for storing components on a top surface thereof in segmented row compartments, each segmented row compartment having sidewall surfaces and a bottom surface.
    Type: Grant
    Filed: January 2, 1997
    Date of Patent: January 23, 2001
    Assignee: International Business Machines Corporation
    Inventors: John Michael Blondin, Jeffrey Jay Jones, David J. Rich, Woody Ray Smith
  • Patent number: 6146199
    Abstract: Disclosed is a plastic strip for use in the manufacture of unshrouded insulative housings for electrical connectors. The strip is comprised of an elongated body having a first and a second end and adjacent the first end there is a cavity for receiving a polymeric molding compound. This cavity allows the strip to be attached end to end a second subsequently formed axially aligned plastic strip to allow for the continuous manufacture of such strips. The strip also includes a plurality of axially spaced apertures for receiving pins or other conductive elements.
    Type: Grant
    Filed: November 2, 1998
    Date of Patent: November 14, 2000
    Assignee: Berg Technology, Inc.
    Inventors: Jose L. Ortega, Carmen A. LaRosa, Taj F. Hanna, Ricky Lee Fackler, Melissa Klein Gardner, Anthony M. Jugovich
  • Patent number: 6116427
    Abstract: A tray is adapted to receive a plurality of ball grid array devices therein, and includes a base plate having a device-receiving portion and a peripheral portion around the device-receiving portion. The device-receiving portion has a top side formed with a device-receiving recess. The top side of the device-receiving portion is further formed with a partition unit in the device-receiving recess for dividing the device-receiving recess into a plurality of cavities adapted for receiving the ball grid array devices respectively therein. The device-receiving portion further has a bottom side formed with a plurality of openings. Each of the openings is aligned with a corresponding one of the cavities and is adapted to receive an array of ball contacts formed on a bottom side of the ball grid array device that is disposed in the corresponding one of the cavities therein.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: September 12, 2000
    Assignee: Silicon Integrated Systems Corp.
    Inventors: Chung-Ju Wu, Wei-Feng Lin, Chen-Wen Tsai
  • Patent number: 6116413
    Abstract: A packaging system for a bioelectrical stimulating and recording electrode is provided. The system includes a semi-porous protective container in which the electrode is housed. A conductive biocompatible and bioresorbable liquid partially fills the container in order for the electrode housed therein to be coated by the liquid. While the preferred conductive liquid is glycerol, other liquids may be chosen for practicing the invention.
    Type: Grant
    Filed: January 23, 1998
    Date of Patent: September 12, 2000
    Assignee: Cochlear Limited
    Inventors: Bruce Tabor, Paul Michael Carter, David Kerry Money
  • Patent number: 6109445
    Abstract: A modular tray system for holding component carriers includes a rectangular frame having retaining elements in the form of slots or pegs along opposite sides. Rails or partitions are arranged in parallel and selectively spaced apart along the opposite sides, and spaced apart along the opposite sides, and spanning between the opposite sides. Component carriers such as strips of thermoformed component-holding carrier tape are supported on the spaced apart rails. The modules can be stacked to allow for the holding of component carriers having relatively deep component-holding pockets.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: August 29, 2000
    Assignee: Tek Pak, Inc.
    Inventor: Anthony W. Beyer
  • Patent number: 6070731
    Abstract: An IC receiving tray storage device is provided which is capable of securedly identifying the category of the tested ICs sorted for each category and received in the corresponding tray in the unloader section after end of test. Mounted to the tray storage is a casing comprising a generally rectangular base plate and a plurality of outer walls standing substantially upright and separately from each other on the base plate. A category identifying indicator is attached to at least one outer wall of the casing. This category identifying indicator indicates the category of ICs received in the tray. Also, in the base plate of the casing is formed an opening 71 through which a vertically movable unit is free to move. By the category identifying indicator, the category of the tested ICs received in the tray can be easily confirmed after the tray storage device has been taken out from the IC handler.
    Type: Grant
    Filed: August 1, 1997
    Date of Patent: June 6, 2000
    Assignee: Advantest Corporation
    Inventors: Yoshito Kobayashi, Hiroto Makamura
  • Patent number: 5988619
    Abstract: This invention relates to a circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.
    Type: Grant
    Filed: April 2, 1998
    Date of Patent: November 23, 1999
    Assignee: Micron Technology, Inc.
    Inventors: James M. Wark, Michael J. Bettinger
  • Patent number: 5984103
    Abstract: A protective package for pagers and similar products has a protector on which the pager is mounted. The pager protector has a formed plastic mounting panel having raised lands which are spaced from each other by a center section which forms a cradle for the pager with the raised lands. The pager is mounted on the panel by inserting the spring loaded clip of the pager through a notch in the center section of the panel to slip the center section of the panel between the head of the clip and the pager body until the clip head seats into an indentation in the panel. The notch may have sections of different widths and the indentation may have portions of different depth and periphery so that the insert can be used with pagers of several different standard sizes. The protector with the pager mounted may be enclosed within an outer container that conforms to the general dimensions of the protector to provide a secure, protective packaging structure around the pager and insert.
    Type: Grant
    Filed: November 3, 1998
    Date of Patent: November 16, 1999
    Assignee: Panoramic, Inc.
    Inventors: Timothy M. Stirmel, Richard J. Dyble
  • Patent number: 5964352
    Abstract: The invention provides a carrier band of electronic parts, comprising: a band-type tape band 12, which has sprocket holes 13 and holes 14 at regular intervals; a one-side sticking tape 15, which is affixed to a back side of the tape band 12, wherein a sticking face of the tape is exposed from the holes 14 such that electronic parts A can be stuck at the sticking face of the tape and rolled up to a reel; and projecting portions 16, 16, which are formed in both side edges of a tape width direction of the holes 13 of the tape band 12 such that a distance between opposing pointed ends can be narrower than a width of the sticking tape 15, wherein both sides of the sticking tape 15 pushed up to an upper side of the holes 14 are supported by the projecting portions 16, 16.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: October 12, 1999
    Assignee: Nissho Corporation
    Inventor: Ritsue Shoji
  • Patent number: 5950837
    Abstract: A shipping kit assembly is disclosed for use in transporting circuit packs installed in electronic bays. The assembly kit includes a pair of spaced, upper and lower channel members which, together with a vertical band strap received in and retained thereby, are adapted to secure and support a plurality of circuit packs which are installed in shelf units or sub-racks for shipping or transporting therein. The bottom channel member incorporates a supporting bracket at each end therefor for securing and locating an attached circuit pack in a predetermined location in the shelf unit or sub-rack. One or more horizontal band straps may be used to secure the packs against movement in the shelf unit.
    Type: Grant
    Filed: July 7, 1998
    Date of Patent: September 14, 1999
    Assignee: Northern Telecom Limited
    Inventor: Robert John Barber
  • Patent number: 5947298
    Abstract: An electric apparatus packing bag which holds an electric apparatus, allowing the electric apparatus to be electrically tested when maintained intact with the packing bag. The packing bag has a through hole at one side panel thereof through which the electric wire of the electric apparatus extends to the outside of the packing bag, and a pocket-like cover panel, which shields the through hole and, has a retaining portion, which holds the test terminal of the electric wire of the electric apparatus in place.
    Type: Grant
    Filed: December 2, 1998
    Date of Patent: September 7, 1999
    Assignee: Shining Blick Enterprise Co., Ltd.
    Inventor: Peter K. H. Huang
  • Patent number: 5934475
    Abstract: A container for receiving an ink jet head cartridge is provided with a plate-shaped member and a container main body which forms a space to accommodate an ink jet head cartridge by being coupled with the plate-shaped member. The container main body has a wall section which does not contact the ink jet head cartridge and a recess portion which projects from the wall section toward the accommodating space to contact and support the ink jet head cartridge.
    Type: Grant
    Filed: August 29, 1994
    Date of Patent: August 10, 1999
    Assignee: Canon Kabushiki Kaisha
    Inventors: Norio Hikake, Toshiaki Nagashima
  • Patent number: 5927503
    Abstract: An apparatus for processing an integrated circuit device comprises at least one insert having at least one beveled hole therein, the insert adapted to receive at least one semiconductor device. The apparatus further includes a tray having a pocket for receiving the insert and a slot, a deformable segment on the insert, and at least three posts on the insert. Further included is at least one tab on the deformable segment with one of the slots receiving the tab. The slot in the tray and the tab on the insert movably attaches the insert to the tray, the insert being self-aligning to a processing apparatus thereby in conjunction with the posts and allowing for removal of the insert from the pocket.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: July 27, 1999
    Assignee: Micron Technology, Inc.
    Inventors: Leland R. Nevill, William C. Layer, Steven L. Hamren, Gregory A. Barnett
  • Patent number: 5909812
    Abstract: A container for storing and transporting articles, such as leadframes. The container includes a base with a planar wall having an upwardly facing surface defined by a peripheral edge, and at least two upwardly extending, opposite posts secured to the upper surface of the planar wall. The posts are spaced interiorly from the peripheral edge of the upwardly facing surface wherein each post has an outwardly facing surface and an inwardly facing surface that is tapered outwardly from the top of the post to the bottom of the post. The articles are positioned between the inwardly facing surfaces of the posts. A cover is releasably securable to the planar wall of the base. The cover includes a top wall and a peripheral, downwardly extending wall formed to the outer periphery of the top wall. The peripheral wall is positioned adjacent the peripheral edge of the upwardly facing surface of the base and outwardly with respect to the posts of the base when securing the cover to the base.
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: June 8, 1999
    Assignee: Plastic Development, Inc.
    Inventor: Normand Thibaudeau
  • Patent number: 5904251
    Abstract: A container 2 for flat panels comprising: a lower end holding shock absorber member 30 resiliently holding a lower end of said flat panel 34 contained in the container 2; an upper end holding shock absorber member 50 resiliently holding an upper end of the flat panel; a side shock absorber member 42 comprised of a resilient member and provided with parallel guide grooves 44 for slidably guiding a side end of the flat panel 34; and a side spacer 40 for attaching said side shock absorber member 42 on an inner wall surface of said container 2 so that a distance between said side shock absorber member 42 and said inner wall is adjustable. The lower end holding shock absorber member 30 is designed to be adjustable in height with a bottom spacer 35.
    Type: Grant
    Filed: May 11, 1998
    Date of Patent: May 18, 1999
    Assignee: Zeon Kasei Co. , Ltd.
    Inventors: Masamiki Ogata, Kenji Iwamoto, Kazuo Fujimoto
  • Patent number: 5896729
    Abstract: A container for shipping and handling devices is described. The container is particularly well suited to store sliders used in magnetic storage systems. The container includes a bottom piece and a detachable top piece. The bottom piece includes a base with a channel (also referred to as a device chamber) and two side walls. At least one device is stored in a channel in the base. The detachable top piece is secured to the bottom piece with a locking device. The locking device may include two substantially straight edges and two curved outer ridges. When the top piece is attached to the bottom piece, each of the curved outer ridges of the locking device extends into a groove in the inner surface of the side walls. The devices are contained within the container by a pair of slider stop devices.
    Type: Grant
    Filed: February 18, 1998
    Date of Patent: April 27, 1999
    Assignee: International Business Machine Corporation
    Inventors: Sonny Bell, Buddy Chang, Xavier Charles Lelong, Edward Joseph Pacheco, Bruno Alejandro Valdes, Michael Zung
  • Patent number: 5885676
    Abstract: A plastic tube and a method and apparatus for forming it in which a strip of relatively thin plastic sheet material is cut from a roll of the material and wound around a mandrel. Overlapping ends of the strip are sealed to form the tube. The edge of the strip is inwardly bent to form an inwardly extending lip. When used in the manufacture of a capacitor, the tube is placed in a can on top of the disc of insulating material and a capacitor roll is placed in the tube. The edge of the sheet material can be pre-creased so that when folded inwardly, darts of the material form the lip.
    Type: Grant
    Filed: July 6, 1995
    Date of Patent: March 23, 1999
    Assignee: Magnetek, Inc.
    Inventors: Edward M. Lobo, Raymond H. Vanwagener
  • Patent number: 5830012
    Abstract: Disclosed is a plastic strip for use in the manufacture of unshrouded insulative housings for electrical connectors. The strip is comprised of an elongated body having a first and a second end and adjacent the first end there is a cavity for receiving a polymeric molding compound. This cavity allows the strip to be attached end to end a second subsequently formed axially aligned plastic strip to allow for the continuous manufacture of such strips. The strip also includes a plurality of axially spaced apertures for receiving pins or other conductive elements.
    Type: Grant
    Filed: August 30, 1996
    Date of Patent: November 3, 1998
    Assignee: Berg Technology, Inc.
    Inventors: Jose L. Ortega, Carmen A. LaRosa, Taj F. Hanna, Ricky Lee Fackler, Melissa Klein Gardner, Anthony M. Jugovich
  • Patent number: 5779057
    Abstract: Disclosed is a rigid removable carrier tray for transporting and storing pin sockets. The tray includes one or more arrays of holes of consistent or varying diameter disposed in an upper surface and formed to receive pin sockets. Pin sockets are recessed below the upper surface of the carrier tray when placed in the holes. A flexible adhesive film is disposed over the upper surface of the carrier tray to prevent the pin sockets from falling out of the carrier tray during transport. The pin sockets are installed by removing the adhesive film and press fitting the leads of an integrated circuit ("IC") chip into the pin sockets in the holes. The holes in the array may be arranged in a customized pattern in order to accommodate a particular IC chip, or may be arranged in a generic pattern to accept a variety of IC chips. The carrier tray also includes standoffs with alignment guides and troughs that facilitate stacking and storage.
    Type: Grant
    Filed: November 4, 1996
    Date of Patent: July 14, 1998
    Assignee: Augat Inc
    Inventors: Michael LePage, Keith Morrison, Ronald Schmitt, Paul Chauvin
  • Patent number: 5775509
    Abstract: A carrier system for electrical components, in particular dipole wired electrical components, includes a carrier strip for receiving supply line wires of components and fasteners for fixing the supply line wires to the carrier strip. The fasteners are fastening elements disposed on the carrier strip having guide grooves formed therein for retaining the supply line wires threaded into the guide grooves by force-locking.
    Type: Grant
    Filed: June 24, 1996
    Date of Patent: July 7, 1998
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventor: Ewald Lampl
  • Patent number: 5765692
    Abstract: A flexible carrier tape used for protecting components while they are being transported, wherein the carrier tape comprises a strip portion having a component-receiving surface and first and second longitudinal edge surfaces. A plurality of walls extend from the component-receiving surface between the first and second longitudinal edge surfaces, and the walls extend longitudinally along the carrier tape. The carrier tape further comprises an adhesive on at least a portion of the component-receiving surface between at least one of the plurality of walls and one of the first and second longitudinal edge surfaces.
    Type: Grant
    Filed: November 13, 1995
    Date of Patent: June 16, 1998
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: James L. Schenz
  • Patent number: 5762185
    Abstract: An electrode transport and storage system has an electrode with a sensor portion and an enclosure into which at least the sensor portion of the electrode projects and which together with the electrode encloses a storage chamber designed to contain a liquid for providing improved storage and transport for the electrode. The enclosure is formed as a rigid casing which is connected at the open end of the casing with the electrode. A sealing element is provided in-between the casing and the electrode. The storage chamber is filled with an electrolyte solution which immerses at least the sensor portion of the electrode while the sealing element retains the solution during transport and storage of the electrode. If desired, the electrode may be calibrated within the casing which is filled with a calibration solution.
    Type: Grant
    Filed: May 31, 1995
    Date of Patent: June 9, 1998
    Assignee: ProMinent Dosiertechnik GmbH
    Inventor: Rainer Dulger
  • Patent number: 5752605
    Abstract: A tray and sleeve carton adapted to protect delicate packaged articles, such as computer chips. The tray includes spaced integral tubular supports which contain recesses for receiving the end portions of packaged articles. Each recess has a bottom support shelf spaced from the bottom panel and a back wall spaced from the side panels, thus creating false walls which support and isolate the article from the outer structure of the carton.
    Type: Grant
    Filed: May 2, 1996
    Date of Patent: May 19, 1998
    Assignee: Riverwood International Corporation
    Inventor: Leonard Cooper
  • Patent number: 5727688
    Abstract: A component holder body is provided with a component arrangement section where an installation space for a component is defined, and holding parts for holding the component arranged in the installation space. The component arrangement section is constructed so as to be shiftable between a holding position in which the component arrangement section projects and a position projecting upward from the holding position. Meanwhile, the holding parts are designed so as to shift, in association with the shift of the component arrangement section between the holding and projecting positions, between a holding posture for holding the component and a retreat posture for opening the installation space.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: March 17, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshimichi Ishii, Ryoichi Kamatani, Hiroyuki Mochizuki
  • Patent number: 5717162
    Abstract: An IC career includes a movable corner ruler for regulating one of the two diagonally opposed corner portions which are situated on opposite corners of an IC, and a reference ruler for regulating the other corner portion. The movable ruler is resiliently retained by a first and a second plate spring extending along the two sides forming the first-mentioned corner portion of the IC such that the first-mentioned one corner portion is resiliently urged towards the reference corner ruler. The first and second plate springs are connected with each other through a connection piece integrally blanked together with the first and second plate springs, and internal ends of the first and second plate springs extend from connection portions with respect to the connection piece so as to define free ends.
    Type: Grant
    Filed: April 5, 1996
    Date of Patent: February 10, 1998
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5673795
    Abstract: A packaging system includes a bottom having a flat surface for accepting an object, a top having a flat surface and projecting fingers extending from the surface of the top. When the top is assembled to the bottom, the fingers deform, forcing the object against the bottom surface. The object is maintained in position by friction against the bottom surface and the presence of undeformed fingers surrounding the object. The packaging system may be made of static dissipative material and include connection claws and rods for connecting a number of packages in series.
    Type: Grant
    Filed: June 26, 1995
    Date of Patent: October 7, 1997
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: William J. Clatanoff, Warren Allen Fink
  • Patent number: 5664681
    Abstract: A multiple device carrier is designed to hold ZIP or SIP packages tightly in its cells. The cells are spaced to provide air flow for cooling the packages and allowing heat generated within the packages to dissipate. The carrier is provided with a locking strip member to prevent loosening of the packages in the cells and allow leads of the packages to be aligned. The package assembly held by the carrier can be inserted into a socket to connect the circuit packages with external circuitry.
    Type: Grant
    Filed: August 24, 1995
    Date of Patent: September 9, 1997
    Assignee: Mitsubishi Semiconductor America, Inc.
    Inventor: Nour Eddine Derouiche
  • Patent number: 5617627
    Abstract: Method for completing personal computer cards of prescribed accurate dimensions includes nesting side walls with side channels and end walls with end channels to close an enclosure of a personal computer card and then qualifying, or conforming, the dimensions of the closed enclosure to the prescribed dimensions of the personal computer card by forming the nested walls and channels, preferably by impacting the nested walls and channels within forming dies, to attain the critical length, width and thickness prescribed for the personal computer card.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: April 8, 1997
    Assignee: A.K. Stamping Co. Inc.
    Inventors: Harry K. Semple, Carmine Bartiromo
  • Patent number: 5613611
    Abstract: A carrier for carrying IC packages having a bevelled flange and bevelled dog combination which firmly engages a flange of the package in order to hold the package extremely securely to the carrier such that any force applied to the carrier is transmitted wholly and accurately to the package and so that the package does not dislodge easily from the carrier when subjected to acceleration or vibration.
    Type: Grant
    Filed: May 28, 1996
    Date of Patent: March 25, 1997
    Assignee: Analog Devices, Inc.
    Inventors: Brian A. Johnson, Robert E. Malone, M. William Miller, Jeffrey Moeller
  • Patent number: 5597074
    Abstract: A packing tray for protecting all kinds of semiconductor packages or chips in the form of a tray-type packing tray, a tube-type packing tray, a reel tape-type packing tray, and a waffle-type packing tray wherein the packing tray is made of paper, paper pulp, and wood, which does not cause pollution when recycling, burning, and disposal in the soil.
    Type: Grant
    Filed: December 28, 1994
    Date of Patent: January 28, 1997
    Inventor: Seung S. Ko