Abstract: The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E).

Abstract: A mounting apparatus includes a chassis, a mounting tray, and a securing device. The chassis includes a positioning hole. The securing device includes a securing member attached to the mounting tray, a rotating shaft received in the securing member, a driving member attached to the rotating shaft, and a resilient member located between the driving member and the securing member. The rotating shaft includes an engaging portion. The driving member rotates the rotating shaft relative to the securing member between the unlocked and locked positions; when the rotating shaft is in the unlocked position, the engaging portion is aligned with the positioning hole and arranged in a first direction, and when the rotating shaft is in the locked position, the resilient member is deformed, and the engaging portion is engaged in the positioning hole and arranged in a second direction substantially perpendicular to the first direction.

Abstract: Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.

Abstract: A cantilever-type standoff includes a column body, a plurality of cantilevers, a plurality of blocking plates, and a plurality of bumps. The cantilevers are respectively disposed on opposite end surfaces of the column body. The blocking plates are respectively parallel to the cantilevers. A plurality of clamping grooves are respectively defined by the blocking plates and the cantilevers. The bumps are respectively disposed on surfaces of the cantilevers facing the blocking plates.

Abstract: A method for processing solar cells comprising: providing a vertical furnace to receive an array of mutually spaced circular semiconductor wafers for integrated circuit processing; composing a process chamber loading configuration for solar cell substrates, wherein a size of the solar cell substrates that extends along a first surface to be processed is smaller than a corresponding size of the circular semiconductor wafers, such that multiple arrays of mutually spaced solar cell substrates can be accommodated in the process chamber, loading the solar cell substrates into the process chamber; subjecting the solar cell substrates to a process in the process chamber.

Abstract: A method for processing solar cells comprising: providing a vertical furnace to receive an array of mutually spaced circular semiconductor wafers for integrated circuit processing; composing a process chamber loading configuration for solar cell substrates, wherein a size of the solar cell substrates that extends along a first surface to be processed is smaller than a corresponding size of the circular semiconductor wafers, such that multiple arrays of mutually spaced solar cell substrates can be accommodated in the process chamber, loading the solar cell substrates into the process chamber; subjecting the solar cell substrates to a process in the process chamber.

Abstract: A locking apparatus for locking a magazine configured to receive a printed circuit board (PCB) may include an actuator, a rotating block, and a locking member. The actuator may be installed on the magazine. The rotating block may be connected to the actuator. The rotating block may be rotated about a vertical axis. The locking member may be rotatably connected to the magazine about the vertical axis. The locking member may be selectively combined with the rotating block to block a front face of the magazine, thereby preventing breakaway of the PCB from the magazine.

Abstract: A removable daughter card assembly including a circuit board having a leading edge. The daughter card assembly also includes connector modules that are configured to be mounted to the circuit board proximate to the leading edge. The connector modules face in an insertion direction for engaging corresponding mating connectors when advanced in the insertion direction. The card assembly also includes an elongated stiffener that is configured to be mounted to the circuit board. The stiffener includes a plurality of support walls and a bridge member that couples to each one of the support walls. The support walls are secured to the circuit board. The bridge member extends substantially parallel to and proximate to the leading edge and is dimensioned to prevent bowing along the leading edge. At least two of the support walls comprise alignment features that are configured to engage corresponding guide features of a communication system.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.

Abstract: A fan tray for a network element that is installable and removable from the front and back of a network element. The fan tray includes one or more fans in a housing to provide cooling for the network element, an engagement rod with ends that protrude out a front and back of the housing, a first engagement lever at one end of the engagement rod and a second engagement lever at an opposite end of the engagement rod, the first and second engagement levers are movable between an unlocked and locked position and movement is tied together, a gearing mechanism coupled to the engagement rod to translate rotational force applied to the engagement levers into linear force to extend and withdraw a backplane connector assembly coupled to the gearing mechanism.

Abstract: This invention relates to photovoltaic modules and arrays, methods of assembling photovoltaic arrays, and methods for shipping components of photovoltaic arrays.

Abstract: The present invention relates to a device for supporting, stacking, and transporting kiln run, in particular for firing ceramic products, comprising an assembly of supports and support beams, like carrier beams and cross beams, on which, in particular one or several supports for placing the kiln run are provided. Thus, for supporting at least one support beam, at least one loose bearing is provided, comprising a support body, moveably disposed, substantially in the direction of the support beam.

Abstract: An apparatus has a plurality of printed board units each including a printed board, a frame to have the printed board arranged therein, a first rail to be arranged at a first lower end of an inner wall of the frame having the printed board located thereon in a lower opening of the frame, and a second rail to be arranged at a second lower end opposed to the first lower end in the opening; a housing including a rail holding unit to movably hold the first rail of a first printed board unit and the second rail of a second printed board unit adjacent to the first printed board unit among the plurality of printed board units; and a cooling fan to be arranged on an upper side or underside of the housing to send air into the frame.

Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, The packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.

Abstract: Cabinet structures resistant to racking deformation for rack mount computing systems are disclosed. The cabinet structure may generally include a first and a second side wall each extending between a front side and a rear side. The first side wall includes a first front corner post, a first rear corner post, and two first rails each extending between the first corner posts, at least one of the first rails being a first angled rail having a first angled face with a first outer edge and a first recessed edge recessed from an exterior surface of the first corner posts relative to the first outer edge, the first angled face further having two first end edges each extending between the first outer and recessed edges, the two first end edges being at an angle less than 90° relative to the exterior surface of the first corner posts and being substantially attached to the first corner posts. The second side wall may include a second front corner post and a second rear corner post.

Abstract: Support structure for solar panels, of the type that supports at least a polar rotation axis for at least a solar panel, the mounting of the structure including two parallel support profiles. It is characterised by the fact that the above-mentioned polar rotation axis is assembled in a flip-top frame around an axis of rotation that joins the above-mentioned parallel support profiles. Therefore, in folded position the above-mentioned polar rotation axis stays in the plane determined by said parallel support profiles with their ends contiguous to each of the profiles. Consequently, in lifted position the above-mentioned polar rotation axis remains inclined with regard to the horizontal plane and in a plane perpendicular to the longitudinal axis of the parallel support profiles. It all makes the invention particularly light and of easy and quick assembly, especially adapted for its installation on building roofs.

Abstract: A collapsible rack for transport and storage, includes a first and a second panel and a plurality of distance bars. The first and second panel include a groove side including at least one groove. A first and a second edge is arranged on opposite sides and adjacent to these, a third and a fourth edge. The third and fourth edges each include at least one hole that extends parallel to the first and second edges. The hole has a non-circular shape. The distance bars at each of their ends includes a hole coupling mechanism. The hole coupling mechanism extends perpendicular to the extension of the bar. The hole coupling mechanisms include clutching sections that match the hole, wherein pivoting between the bars and the first and second panel is prevented where the hole coupling mechanism and hole are fully mated.

Abstract: A securing apparatus is provided for securing an expansion card with a shielding plate to an enclosure of an electronic device. The securing apparatus includes a panel, a limiting member, a locking member, and the latch member. The limiting member is pivotably mounted to the panel to abut the shielding plate in cooperation with the panel. A first locking portion is formed on the limiting member. The locking member is pivotably attached to the limiting member and overlaps on the limiting member. A second locking portion is formed on the locking member to engage with the first locking portion. The latch member is pivotably mounted to the locking member. A hook is formed on the panel to catch the latch member, thereby securing the expansion card to the enclosure.

Abstract: A cable tray is provided comprising a housing defining an interior portion, the housing having at least one positioned opening formed therein and also having plural, open ends in communication with the interior portion and the at least one positioned opening for passage of at least one cable therethrough. The housing is adapted to be coupled to at least one external surface, such that at least one of the plural, open ends substantially aligns with at least one open end of a housing of at least one further cable tray.

Abstract: A circuit board carrier has main frame, at least one first holder, at least one slide and at least one second holder. The first and second holders are mounted on and selectively slide on the main frame. The slide is mounted on and selectively slides on the corresponding first holder. The slide has a first pin and the second holder has a second pin. The circuit board is held on the circuit board carrier by the pins. Therefore, the circuit board is kept from being contacted to the delivering wheels during manufacturing and is not polluted and trapped by the delivering wheels.

Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, the packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.

Abstract: A server module includes a tray, a motherboard installed in the tray, and at least one storage device. The tray includes a port erected from a rear end of the tray, a roomage inwardly and concavely disposed on an edge of the motherboard and proximate to the port, and a socket disposed at an edge of the roomage and opposite to the port for connecting the insert roomage of the storage device, such that the storage device is disposed onto the roomage of the motherboard, and the motherboard can be used for expanding the storage device directly.

Abstract: The present invention includes a ceiling portion 8, bottom portion 9, a substrate housing portion 3 formed by a side walls 5 to 7, a plurality of wafer slots 11 arrayed in parallel on the inner surface of the side walls 6 and 7, a slit portion 12 formed in an extended manner along the array direction of the wafer slots 11 on each of a second side wall 6 and a third side wall 7, a slide portion 18 movably arrayed along each of the slit portions 12, a plurality of substrate securing pieces arrayed with substantially the same intervals with the intervals of the wafer slots 11 on the inner surface of the slide portion 18, in which, with the slide portion being in a substrate securing position, the substrate housing pieces press and secure the substrate on the wafer slot 11, and in a substrate securing releasing position, the substrate housing pieces move separately from a circumferential portion of the substrate and releases a securing state of the substrate.

Abstract: A server enclosure includes an enclosure body, hard disk drives (HDDs), and heat dissipating devices. The enclosure body includes HDD receiving spaces. The HDD receiving spaces are positioned at one end portion of the enclosure body. Each of the receiving spaces receives one of the heat dissipating device or one of the HDDs.

Abstract: A photovoltaic module ground mounting system can include a collapsible photovoltaic module mounting assembly framework.

Abstract: An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening.

Abstract: Disclosed herein are embodiments of modular racking systems for solar panels and in particular, modular solar panel racks, racking systems, arrays of racks, kits and methods of use. One embodiment of a modular solar panel rack comprises a plurality of discrete ballast holders and a plurality of panel support members each having two upright portions, a transverse portion contiguously connected between the two upright portions, the connection such that the transverse portion is non-perpendicular to the two upright portions, and a retainer attached to the transverse portion and configured to retain a solar panel. Each of the plurality of ballast holders is connected to no more than four panel support members, each ballast holder perpendicularly connected to one of the upright portions.

Abstract: Apparatus and methods for thermal conditioning equipment. In a preferred embodiment, an equipment enclosure comprises a body, a wall, a fluid port, and a fixture. The body defines an outer plenum and an inner chamber in the latter of which the fixture retains the equipment. The wall, which is between the outer plenum and the inner chamber, isolates the thermally conditioned first fluid from a second fluid in the inner chamber. Since the wall is thermally conductive it allows heat to be transferred between the outer plenum and the inner chamber. The fluid port is in communication with the outer plenum to allow the thermally conditioned first fluid to flow into the outer plenum. Baffle plates are also provided to distribute flow of the second fluid to the equipment.

Abstract: A circuit board carrier has main frame, at least one first holder, at least one slide and at least one second holder. The first and second holders are mounted on and selectively slide on the main frame. The slide is mounted on and selectively slides on the corresponding first holder. The slide has a first pin and the second holder has a second pin. The circuit board is held on the circuit board carrier by the pins. Therefore, the circuit board is kept from being contacted to the delivering wheels during manufacturing and is not polluted and trapped by the delivering wheels.

Abstract: A scalable computer system includes a reconfigurable chassis module, plural hardware units and one or more inter-plane. The chassis module has plural modular units for configuring the hardware units therein respectively. Each of the modular units has dedicated framework to attach the inter-plane or dedicated fans. The inter-plane is to connect with the separated hardware units between the modular units. Each of the modular units is equipped with compatible male and female joints to engage with each other. Certain fastening assemblies may be applied to secure male-male or female-female joints, thereby enabling the modular units to be front-to-back and/or side-by-side connections.

Abstract: Disclosed is a holding apparatus for a card used in a computing resource, the apparatus including a holding base, and at least one card associating arm extending from the base, the at least one associating arm being configured to hold the card via a screwless association.

Abstract: A cassette device for accepting substrates includes a frame, a plurality of slots protruding from opposing sides of the frame, and at least two supporting bars connected to at least two of the slots.

Abstract: A partitioning device for holding slots of a host computer case, including: a host computer outer case provided with a horizontal upper panel; an upper cover; more than one rectangular partition; vertical connecting holes are defined in an upper side of each of the rectangular partitions, which provide for vertical penetration into the holding slot; bolts bolt into the through holes and into the vertically connecting holes, thereby fixing the partitions within the holding slot, thus partitioning the holding slot and forming at least more than two holding spaces, thereby achieving control of the number and size of the more than two holding spaces so as to accommodate he insertion of modular cases of various size specifications.

Abstract: An exemplary mounting apparatus for a storage device includes a bracket, and a latch member assembly. The storage device includes a plurality of apertures defined in a sidewall thereof. The bracket includes a plurality of apertures defined in a side panel thereof, corresponding to the apertures of the storage device. The latch assembly includes a frame fixed to the side panel, a sliding member slidably attached to the frame, and a latch member attached to sliding member. The latch member includes a plurality of tips extending therefrom. The sliding member is movable in a direction parallel to the side panel. The latch member is accordingly movable toward or away from the side panel in a direction perpendicular to the side panel. The tips of the latch member extend into or withdraw from the apertures of the side panel and the storage device to secure or disengage the storage device.

Abstract: Thermosetting resin compositions for manufacturing circuit boards and build-up circuit boards, and build-up boards, and multilayer bodies and circuit boards manufactured using these compositions are provided. A composition contains polyimide resin (A), phenol resin (B), and epoxy resin (C) components. The mixing ratio by weight (A)/[(B)+(C)] is 0.4 to 2.0, the ratio being the ratio of the weight of (A) to the total weight of (B) and (C). By using such a composition, multilayer bodies and circuit boards, excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. can be manufactured. A composition contains a polyimide resin (A), a phosphazene (D), and a cyanate ester (E). D includes a phenolic hydroxyl group-containing phenoxyphosphazene (D-1) and/or a crosslinked phenoxyphosphazene (D-2) prepared by crosslinking (D-1), (D-2) having at least one phenolic hydroxyl group.

Abstract: An external expanding apparatus or “docking station” operable with a portable computer device of a type having a display unit having a display screen on an inner surface thereof and a hard shell backing surface opposite thereof and pivotally mounted on a substantially rigid casing having a pair of locating holes adjacent to opposite corners of a substantially planar bottom surface thereof, and an input/output (I/O) connector positioned on a back plane thereof with a pair of positioning apertures provided on opposite sides thereof.

Abstract: In one embodiment, a holder for holding printed circuit boards includes a base plate with a plurality of holding unit formed thereon. Each of the holding units includes a spring member, a securing member, and a blocking structure. The spring member includes a first end and a second end. The first end is attached to the base plate. The securing member is slideably mounted on the base plate. The securing member includes a connecting end and a securing end. The connecting end is connected with the second end of the spring member. The blocking structure is located on the base plate. The spring member is configured for pressing the securing member to move toward the blocking structure such that a printed circuit board is retainable between the securing end of the securing member and the blocking structure on the base plate. The holder is capable of holding printed circuit boards in batches.

Abstract: A method and system for housing electronic components includes a chassis having a first sub-chassis slidably dockable into a first end of the chassis. The first sub-chassis houses a first set of electronic components and includes a backplane to electrically couple the first set of electronic components to a second set of electronic components located adjacent to the first sub-chassis. The second set of electronic components is housed in a second sub-chassis, which is accessible via a second end of the chassis. The backplane is accessible by slidably undocking the first sub-chassis without removal of any one of the second set of electronic components. Some of the second set of electronic components are accessible by slidably undocking the first sub-chassis and without removal of the backplane.

Abstract: The present invention provides a supporting member for thin-film-coated boards that is capable of sufficiently suppressing dust generated because of particles and the like. The present invention also provides a storage container suitable for storing thin-film-coated boards that has such a supporting member so as to store the thin-film-coated boards at a high level of cleanliness. The supporting members (2) and (5) have supporting means for supporting the thin-film-coated boards (1) such as mask blanks. The surface of at least a portion of the supporting means that comes into contact with the thin-film-coated boards (1) is permitted to be a smooth plane having an arithmetic average surface roughness (Ra) of 0.1 ?m or lower. The surface of at least the portion of the supporting means that comes into contact with the thin-film-coated boards (1) is composed of, for instance, a resin material.

Abstract: An accommodation apparatus accommodates a unit which needs maintenance from at least three planes. The accommodation apparatus includes a chassis, a first frame structure configured to accommodate the unit, and a supporting mechanism coupled to the first frame structure and the chassis to support the first frame structure to the chassis such that at least one of attitude and position of the unit is changeable with respect to the chassis.

Abstract: An anti-static polymer composition comprises a thermoformable, moldable, hybrid urethane-vinyl polymer composition which exhibits relatively low surface and volume resistivities and good toughness. The hybrid polymer composition can be made without volatile organic compounds such as solvents, neutralizing amines, or both.

Abstract: An electronic control device includes a circuit substrate consisting of four rigid portions and intervening flexible portions which are serially connected to each other. This circuit substrate is accommodated in a casing in such a manner that respective flexible portions are folded by 180° to dispose respective rigid portions to be parallel to each other. The rigid portions, positioned at both ends of the circuit substrate, mount connectors so as to face to mutually opposed directions. Other rigid portions mount electronic components and heater components. The outermost connectors are connected to different connection objects. The casing is made of a metal material so that heat generating from the heater components can be transmitted via heat dissipation gel to the casing and efficiently released to the outside.

Abstract: A glass substrate cassette includes a bottom structure, a top structure, and a pair of side supports affixed to space the bottom structure and the top structure for forming an accommodation space in between. A plurality of support plates are horizontally affixed between the side supports. Each of the support plates is shaped as a corrugated plate structure for supporting thereon a glass substrate. The corrugated support plate has recess portions for allowing a delivering device to load and/or unload the glass substrates.

Abstract: A mounting apparatus includes a bracket (50) for receiving a storage device (60) therein. A position-translating member (10) is attached to outside of the bracket selectively at first and second positions. A slidable member (30) is slidably attached to the position-translating member. A retention member (20) is received in the slidable member. The retention member includes four latches (213) for engaging in the storage device at the first and second positions thereby securely attaching the storage device in the bracket.

Abstract: A system and method for an improved multiple hard-disk-drive data-storage enclosure. Some embodiments position drives in counter-rotating pairs, each simultaneously accessing half the data, such that seek-caused actuator rotational-acceleration vibration cause simultaneous canceling rotational torque. Some embodiments position the edge of a first drive (or drive pair) at an angle to the actuator midpoint of a nearby second drive (or drive pair), such that rotational-acceleration vibration from a seek-caused actuator rotation in the first drive does not cause a rotational movement into the second drive that affects the tracking or seek operation. Some further embodiments position drives in a herringbone pattern to redirect air flow in addition to reducing rotational-acceleration vibration interaction. Other embodiments include a printed wire circuit board mounted to reduce the rotational-acceleration vibration interaction.

Abstract: A mounting apparatus is provided for mounting expansion cards. The mounting apparatus includes a rear panel, a retainer, and a clip. The rear panel has a support wall for supporting the bent portion of the cover plate, the rear panel defining an opening for facilitating installing or removing the expansion card. The retainer has a pressing plate pivotally coupled to the support wall. The clip has a resilient member for securing the retainer to the rear panel. The retainer has a fixing member for clasping the bent portion of the cover plate when the retainer is rotated to a first position and unclasping the bent portion of the cover plate if the retainer is rotated to a second position.

Abstract: A distributing frame (for example, FIG. 11) comprising a first distribution portion having a first series of verticals, and a first series of horizontal shelves; a second distribution portion having a second series of verticals, and a second series of horizontal shelves, the second distribution portion being disposed generally parallel to and spaced apart from the first distribution portion; and at least one horizontal bridge between the first distribution portion and the second distribution portion to support interconnections between a shelf of the first distribution portion and a shelf of the second distribution portion. Openings are provided for walkways 99. A distributing frame wherein a portion of a first face of a portion of the shelves is used for terminal blocks for connecting outside connector cables to the interconnections. A method for designing a distributing frame and a computer readable medium having computer instructions thereon for causing a computer to perform the method.

Abstract: An auxiliary fixing mechanism is used for fixing an interface card to the housing of a computer. The auxiliary fixing mechanism includes an I/O window and an auxiliary fastener. The I/O window has a fixing slot and a first screw hole. The auxiliary fastener includes a first baffle, a second baffle, a third baffle, a fixing hook and a positioning hook. A screw is passed through the second screw hole of the auxiliary fastener in a direction that is vertical to the interface card. The bracket of the interface card is pushed and stopped by the baffles to restrict the movement of the interface card. Thereby, the auxiliary fixing mechanism can change the fixing direction for fixing the screw to prevent the prior art problem that the interface card could not be fixed to the housing via a screw due to space limitations.

Abstract: A support system comprising a chassis having an interchangeable design and layout is disclosed. The support system further includes a front panel, a rear panel, an indicator segment, and an outlet segment. The indicator and outlet segments are detachably mounted to the chassis such that a user can convert the chassis to a front or a rear access position. It is noted that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to ascertain quickly the subject matter of the technical disclosure and is not be used to interpret or limit the scope or meaning of the claims.

Abstract: Techniques for accommodating chassis tolerances use joiners which enable outer side panels for a front card cage to reference a front side of a midplane, and outer side panels for a rear card cage to reference a rear side of the midplane. The joiners couple the outer side panels together in a rigid but accommodating manner regardless of variations in midplane board thickness. Accordingly, both the front and rear card cages are capable of accurately and consistently referencing from the midplane sides. Not only do these techniques solve registration drawbacks which exist in conventional midplane installation approaches involving the bolting of midplanes to the middles of pre-constructed frames, these techniques further enable accurate direct connection of other components such as a power supply subsystem (e.g., to the midplane front side) and a fan assembly (e.g., to the midplane rear side) thus alleviating the need for burdensome cables.