Etching Of Semiconductor Material To Produce An Article Having A Nonelectrical Function Patents (Class 216/2)
  • Patent number: 8398865
    Abstract: A method of manufacturing a mechanical part includes the steps of providing a micro-machinable substrate; etching a pattern which includes the part through the entire substrate using photolithography; mounting the etched substrate on a support so as to leave the top and bottom surfaces of said substrate accessible for coating; depositing a tribological quality improving coating of on the outer surface of the part; and releasing the part from the substrate.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: March 19, 2013
    Assignee: The Swatch Group Research and Development Ltd
    Inventors: Rudolf Dinger, Thierry Ravenel
  • Patent number: 8394283
    Abstract: The present invention relates to a three-dimensional structure manufacturing method for performing surface treatment processes, and a replication step to provide hydrophobicity on an external surface of the three-dimensional structure. In the manufacturing method, the hydrophobicity may be provided to the external surface of the three-dimensional structure, a high cost device required in the conventional MEMS process is not used, the manufacturing cost is reduced, and the manufacturing process is simplified. In addition, it has been difficult to provide the hydrophobicity on an external surface of a three-dimensional structure having a large surface due to a spatial limitation, but in the exemplary embodiment of the present invention, the hydrophobicity may be provided to the external surface of the three-dimensional structure having a large surface, such as a torpedo, a submarine, a ship, and a vehicle, without the spatial limitation.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: March 12, 2013
    Assignee: Postech Academy-Industry Foundation
    Inventors: Dong-Seob Kim, Sang-Min Lee, Woon-Bong Hwang, Kun-Hong Lee, Geun-Bae Lim, Joon-Won Kim, Dong-Hyun Kim, Hyun-Chul Park
  • Publication number: 20130059438
    Abstract: A pattern formation method, mask pattern formation method and a method for manufacturing semiconductor devices are provided in this disclosure, which are directed to the field of semiconductor processes. The pattern formation method comprises: providing a substrate; forming a polymer thin film containing a block copolymer on the substrate; forming a first pattern through imprinting the polymer thin film with a stamp; forming domains composed of different copolymer components through directed self assembly of the copolymer in the first pattern; selectively removing the domains composed of copolymer components to form a second pattern. In the embodiments of the present invention, finer pitch patterns can be obtained through combining the imprinting and DSA process without exposure, which as compared to the prior art methods has the advantage of simplicity. Furthermore, stamps used in imprinting may have relative larger pitches, facilitating and simplifying the manufacture and alignment of the stamps.
    Type: Application
    Filed: November 10, 2011
    Publication date: March 7, 2013
    Applicant: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventors: JUNQING ZHOU, XIAOYING MENG, HAIYANG ZHANG
  • Publication number: 20130047738
    Abstract: A method for the manufacture of a platform having a membrane bed includes providing a platform body, which comprises silicon; and removing silicon material from a surface of the platform body by means of laser ablation. Preferably, this is followed by oxidizing the ablated surface and then etching the oxidized surface. In an example of the invention, a resulting pressure sensor comprises two platforms, each with a membrane bed having a contour for supporting a measuring membrane, wherein the contour essentially corresponds to a bend line of the measuring membrane.
    Type: Application
    Filed: April 14, 2011
    Publication date: February 28, 2013
    Applicant: Endress + Hauser GmbH + Co. KG
    Inventors: Anh Tuan Tham, Dieter Stolze, Rafael Teipen
  • Patent number: 8382995
    Abstract: Methods are disclosed for manufacturing piezoelectric devices. In an exemplary method a base substrate is prepared that defines multiple device bases. Multiple cutting grooves are defined on a surface of the base substrate in a grid pattern to define therebetween the size of the devices. A frame substrate is also prepared from a piezoelectric material. The frame substrate defines multiple frames surrounding respective vibrating pieces and being alignable with respective bases in the base substrate. Also prepared is a lid substrate defining multiple lids being alignable with respective frames and bases. The three substrates are aligned and bonded together such that the frame substrate is between the lid and base substrates and the surface defining the cutting grooves faces outward. The base substrate is mounted on a dicing sheet such that cutting grooves face the dicing sheet. Cutting is performed, using a dicing blade, through the sandwich from the lid substrate to the cutting grooves.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: February 26, 2013
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventors: Ryoichi Ichikawa, Mitoshi Umeki
  • Patent number: 8377147
    Abstract: The present invention uses externally applied electromagnetic stimulus to control and heat porous magnetic particles and material associated with the particles. The particles contain magnetic material, such as superparamagnetic iron oxide and are infused with a material. Application of a DC magnetic field allows them to be moved with their infused material, and application of an AC RF electromagnetic field allows them to be heated with their infused material. The material can be infused into pores of the particles and the particles can also adhere to an aqueous droplet. The present invention also provides a multi-layer porous magnetic particle. The particle includes a host layer having pores sized to accept magnetic nanoparticles. Magnetic nanoparticles are infused within pores of the host layer. An encoding layer includes pores that define a spectral code. The pores in the encoding layer are sized to substantially exclude the magnetic nanoparticles.
    Type: Grant
    Filed: May 16, 2007
    Date of Patent: February 19, 2013
    Assignee: The Regents of the University of California
    Inventors: Michael J. Sailor, Ji-Ho Park, Austin Derfus, Ester Segal, Kenneth S. Vecchio, Sangeeta N. Bhatia
  • Patent number: 8377315
    Abstract: A method for manufacturing porous microstructures in a silicon semiconductor substrate, porous microstructures manufactured according to this method, and the use thereof.
    Type: Grant
    Filed: November 19, 2008
    Date of Patent: February 19, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Dick Scholten, Tjalf Pirk, Michael Stumber, Franz Laermer, Ralf Reichenbach, Ando Feyh
  • Patent number: 8377319
    Abstract: Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.
    Type: Grant
    Filed: February 7, 2008
    Date of Patent: February 19, 2013
    Assignee: FUJIFILM Dimatix, Inc.
    Inventors: Zhenfang Chen, Andreas Bibl, Paul A. Hoisington
  • Patent number: 8372295
    Abstract: Methods for fabricating sublithographic, nanoscale arrays of openings and linear microchannels utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. Embodiments of the invention use a self-templating or multilayer approach to induce ordering of a self-assembling block copolymer film to an underlying base film to produce a multilayered film having an ordered array of nanostructures that can be removed to provide openings in the film which, in some embodiments, can be used as a template or mask to etch openings in an underlying material layer.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: February 12, 2013
    Assignee: Micron Technology, Inc.
    Inventor: Dan B. Millward
  • Patent number: 8372731
    Abstract: The invention disclosed relates to the fabrication of electronic devices. A method for fabricating an electronic device is disclosed, comprising embossing a surface of a work-piece 200, 202 using an embossing tool 204, so as to form a microstructure having at least two levels of thickness contrast on the work-piece surface, and depositing fluid 208 containing a functional material onto the microstructure. In a preferred embodiment, the step of depositing fluid 208 comprises ink-jet printing. An embossing tool 204 for creating a microstructure on a work-piece 200, 202 is also disclosed, the embossing tool 204 comprising a first surface and steps of at least two different heights relative to the first surface.
    Type: Grant
    Filed: March 6, 2007
    Date of Patent: February 12, 2013
    Assignee: Seiko Epson Corporation
    Inventors: Shunpu Li, Christopher Newsome, David Russell, Thomas Kugler
  • Patent number: 8372297
    Abstract: A method for fabricating a membrane is disclosed, to provide both hydrophilicity and hydrophobicity to predetermined positions of a surface of a single membrane. The method for fabricating a membrane includes: preparing a template with nano-scale holes formed on its outer surface; coating a polymer material on a predetermined pattern region of the outer surface of the template; attaching a hydrophilic film on the outer surface of the template; and removing the template from the hydrophilic film.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: February 12, 2013
    Assignee: Postech Academy-Industry Foundation
    Inventors: Chang-woo Lee, Dong-seob Kim, Sun Wei, Woon-bong Hwang
  • Patent number: 8361331
    Abstract: A MEMS mirror for a laser printing application includes providing a CMOS substrate including a pair of electrodes, and providing a reflecting mirror moveable over the substrate and the electrodes. Voltages applied to the electrodes create an electrostatic force causing an end of the mirror to be attracted to the substrate. A precise position of the mirror can be detected and controlled by sensing a change in capacitance between the mirror ends and the underlying electrodes.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: January 29, 2013
    Assignee: Miradia Inc.
    Inventors: Xiao Yang, William Spencer Worley, III, Dongmin Chen, Ye Wang
  • Publication number: 20130021405
    Abstract: Disclosed is a substrate structure for an ejection chip that includes a first substrate layer, a second substrate layer disposed beneath the first substrate layer, and an intermediate layer configured between the first substrate layer and the second substrate layer. The substrate structure also includes a plurality of fluid channels configured within the second substrate layer. Further, the substrate structure includes a plurality of fluid ports configured within the first substrate layer. At least one fluid port of the plurality of fluid ports is configured in alignment with a corresponding fluid channel of the plurality of fluid channels. Furthermore, the substrate structure includes a plurality of slots configured within the intermediate layer such that the at least one fluid port is in fluid communication with the to corresponding fluid channel. Further disclosed is a method for fabricating the substrate structure and an ejection chip employing the substrate structure.
    Type: Application
    Filed: July 21, 2011
    Publication date: January 24, 2013
    Inventors: JIANDONG FANG, JAMES MRVOS
  • Patent number: 8354033
    Abstract: A method for producing porous microneedles (10) situated in an array on a silicon substrate includes: providing a silicon substrate, applying a first etching mask, patterning microneedles using a DRIE process (“deep reactive ion etching”), removing the first etching mask, at least partially porosifying the Si substrate, the porosification beginning on the front side of the Si substrate and a porous reservoir being formed.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: January 15, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Dick Scholten, Julia Cassemeyer, Michael Stumber, Franz Laermer, Ando Feyh, Christian Maeurer
  • Patent number: 8354032
    Abstract: A method of manufacturing a mechanical part includes providing a substrate of micro-machinable material; etching, using photolithography, a pattern that includes said part through said entire substrate; assembling a clip on said part so that said part is ready to be mounted without the portion made of micro-machinable material having to be touched by a tool other than the clip; releasing the part from the substrate so as to mount said part in a device such as a timepiece movement.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: January 15, 2013
    Assignee: The Swatch Group Research and Development Ltd
    Inventors: Rudolf Dinger, Thierry Ravenel
  • Patent number: 8347469
    Abstract: An object of the present invention is to provide a crystal oscillator piece in which the generation of leakage vibration is suppressed, and a method for manufacturing such a crystal oscillator piece.
    Type: Grant
    Filed: March 26, 2008
    Date of Patent: January 8, 2013
    Assignee: Citizen Holdings Co., Ltd.
    Inventors: Akiko Katoh, Takashi Moriya
  • Patent number: 8347696
    Abstract: A method of forming a microchannel as well as a thin film structure including same is made by forming a first thin film on a side of a substrate, forming a fugitive second thin film on the first thin film such that the second thin film defines a precursor of the elongated microchannel and a plurality of extensions connected to and extending transversely relative to the precursor along a length thereof A third thin film is formed on the first thin film and the fugitive second thin film such that the second thin film resides between the first thin film and the third thin film. A respective access site is formed in a region of the third thin film residing on a respective extension and penetrating to the fugitive second thin film. The fugitive second thin film forming the precursor is selectively removed from between the first thin film and the third thin film using an etching medium introduced through the access sites, thereby forming the microchannel between the first thin film and the third thin film.
    Type: Grant
    Filed: July 1, 2010
    Date of Patent: January 8, 2013
    Assignee: Northwestern University
    Inventors: Horacio D. Espinosa, Nicolaie A. Moldovan
  • Patent number: 8351742
    Abstract: Systems and methods for sensing properties of a workpiece and embedding a photonic sensor in metal are disclosed herein. In some embodiments, systems for sensing properties of a workpiece include an optical input, a photonic device, an optical detector, and a digital processing device. The optical input provides an optical signal at an output of the optical input. The photonic device is coupled to the workpiece and to the output of the optical input. The photonic device generates an output signal in response to the optical signal, wherein at least one of an intensity of the output signal and a wavelength of the output signal depends on at least one of thermal characteristics and mechanical characteristics of the workpiece. The optical detector receives the output signal from the photonic device and is configured to generate a corresponding electronic signal.
    Type: Grant
    Filed: October 15, 2010
    Date of Patent: January 8, 2013
    Assignee: The Trustees of Columbia University in the City of New York
    Inventors: Chee Wei Wong, Rohit Chatterjee, Xiaochun Li, Xugang Zhang
  • Patent number: 8343365
    Abstract: The invention provides a color filter producing method that is based on dry etching and makes it possible to produce a color filter which has fine and rectangular pixels and is excellent in flatness, and color filters produced by the method. The method is a color filter producing method of forming a first colorant-containing layer on a support, removing the first colorant-containing layer corresponding to a region where a second colorant-containing layer is to be formed by dry etching, forming the second colorant-containing layer so as to be embedded into the layer-removed region, removing the first and second colorant-containing layers corresponding to a region where a third colorant-containing layer is to be formed by dry etching, forming the third colorant-containing layer so as to be embedded into the layer-removed region, and removing the colorant-containing layers laminated on other colorant-containing layers.
    Type: Grant
    Filed: July 17, 2007
    Date of Patent: January 1, 2013
    Assignee: FUJIFILM Corporation
    Inventor: Mitsuji Yoshibayashi
  • Publication number: 20120327161
    Abstract: A method of making a hole in a substrate having a first surface and a second surface opposing the first surface and on which the hole is formed, includes forming a first depression in which the first depression is formed at the first surface of the substrate; forming a film in which the film is formed at the first depression; forming a second depression in which the second depression is formed at a location opposing the first depression of the second surface; and forming a hole in which the film is removed, the first depression and the second depression communicate with each other and thereby the hole is formed, wherein the second depression includes a plurality of straight lines and arcs in a plan view.
    Type: Application
    Filed: June 12, 2012
    Publication date: December 27, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Atsushi KANDA, Junichi TAKEUCHI
  • Patent number: 8329047
    Abstract: The present invention provides a method for producing a liquid discharge head including a silicon substrate having, on a first surface, energy generating elements, and a supply port penetrating the substrate from the first surface to a second surface, which is a rear surface of the first surface of the substrate. The method includes the steps of: preparing the silicon substrate having a sacrifice layer at a portion on the first surface where the ink supply port is to be formed and an etching mask layer having a plurality of openings on the second surface, the volume of a portion of the sacrifice layer at a position corresponding to a portion between two adjacent said openings being smaller than the volume of a portion of the sacrifice layer at a position corresponding to the opening; etching the silicon substrate from the plurality of openings and etching the sacrifice layer.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: December 11, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tadanobu Nagami, Junichi Kobayashi, Takeshi Terada, Makoto Watanabe, Hiroyuki Abo, Mitsunori Toshishige, Yoshinori Tagawa, Shuji Koyama, Kenji Fujii, Masaki Ohsumi, Jun Yamamuro, Hiroyuki Murayama, Yoshinobu Urayama, Taichi Yonemoto
  • Patent number: 8327707
    Abstract: An RFID, Bluetooth as well as zigbee based thermal bubble type angular accelerometer includes a flexible substrate, a base layer, at least one cavity, and at least one sensing assembly. The base layer is formed on the flexible substrate. The at least one cavity is formed on the base layer. The at least one sensing assembly is suspended over the at least one cavity. The sensing assembly comprises a heater and two temperature sensing elements, wherein the two temperature sensing elements are substantially symmetrically disposed on opposite sides of the heater, and the heaters and the two temperature sensing elements extend in a radial direction.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: December 11, 2012
    Assignee: Chung Hua University
    Inventor: Jium Ming Lin
  • Patent number: 8323519
    Abstract: A method for manufacturing a liquid discharge head including a flow path forming member to form a flow path communicating with a discharge port for discharging liquids includes forming an organic material layer on a substrate, applying a soluble resin on the organic material layer to form a resin layer, patterning the resin layer to form a pattern with a shape of the flow path, forming a cover layer as the flow path forming member on the pattern, forming the discharge port to expose a part of the pattern from the cover layer, eluting the pattern from the discharge port to form the flow path, irradiating a substance sticking to a surface of the flow path forming member on which the discharge port is formed with ultraviolet light, wherein the substance contains at least the organic material, and removing the sticking substance.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: December 4, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Mitsunori Toshishige, Yoshinori Tagawa, Hideo Tamura, Taichi Yonemoto
  • Patent number: 8308968
    Abstract: A scanning probe where the micromachined pyramid tip is extended by the growth of an epitaxial nanowire from the top portion of the tip is disclosed. A metallic particle, such as gold, may terminate the nanowire to realize an apertureless near-field optical microscope probe.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: November 13, 2012
    Assignee: International Business Machines Corporation
    Inventors: Guy M. Cohen, Hendrik F. Hamann
  • Patent number: 8308960
    Abstract: The invention relates in a general aspect to a method of making vertically protruding elements on a substrate, said elements having a tip comprising at least one inclined surface and an elongated body portion extending between said substrate and said tip. The method comprises an anisotropic, crystal plane dependent etch forming said inclined surface(s); and an anisotropic, non crystal plane dependent etch forming said elongated body portion; combined with suitable patterning processes defining said protruding elements to have a predetermined base geometry.
    Type: Grant
    Filed: December 14, 2006
    Date of Patent: November 13, 2012
    Assignee: Silex Microsystems AB
    Inventors: Edvard Kälvesten, Thorbjörn Ebefors, Thierry Corman
  • Patent number: 8307708
    Abstract: An RFID based thermal bubble type accelerometer includes a flexible substrate, an embedded system on chip (SOC) unit, an RFID antenna formed on the substrate and coupled to a modulation/demodulation module in the SOC unit, a cavity formed on the flexible substrate, and a plurality of sensing assemblies, including a heater and two temperature-sensing elements, disposed along the x-axis direction and suspended over the cavity. The two temperature-sensing elements, serially connected, are separately disposed at two opposite sides and at substantially equal distances from the heater. Two sets of sensing assemblies can be connected in differential Wheatstone bridge. The series-connecting points of the sensing assemblies are coupled to the SOC unit such that an x-axis acceleration can be obtained by a voltage difference between the connecting points. The x-axis acceleration can be sent by the RFID antenna to a reader after it is modulated and encoded by the modulation/demodulation module.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: November 13, 2012
    Assignee: Chung Hua University
    Inventor: Jium Ming Lin
  • Patent number: 8309465
    Abstract: A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: November 13, 2012
    Assignee: Infineon Technologies AG
    Inventors: Oskar Neuhoff, Tobias Gamon, Norbert Martin Haueis, Dirk Pikorz, Michael Wolfgang Larisch, Franz Reithner
  • Patent number: 8303827
    Abstract: The present invention discloses a method for making a MEMS device, comprising: providing a zero-layer substrate; forming a MEMS device region on the substrate, wherein the MEMS device region is provided with a first sacrificial region to separate a suspension structure of the MEMS device from another part of the MEMS device; removing the first sacrificial region by etching; and micromachining the zero-layer substrate.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: November 6, 2012
    Assignee: Pixart Imaging Incorporation
    Inventors: Chuan Wei Wang, Sheng Ta Lee
  • Patent number: 8307461
    Abstract: A microwave probe having a metal tip on the free end of a microcantilever. In one embodiment, a pyramidal pit is isotropically etched in a device wafer of monocrystalline silicon. Oxidation may sharpen the pit. Deposited metal forms the metal tip in the pit and a bottom shield. Other metal sandwiched between equally thick dielectric layers contact the tip and form a conduction path along the cantilever for the probe and detected signals. Further metal forms a top shield overlying the conduction path and the dielectrically isolated tip and having equal thickness to the bottom shield, thus producing together with the symmetric dielectric layers a balanced structure with reduced thermal bending. The device wafer is bonded to a handle wafer. The handle is formed and remaining silicon of the device wafer is removed to release the cantilever.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: November 6, 2012
    Assignee: PrimeNano, Inc.
    Inventors: Xinxin Li, Yongliang Yang
  • Patent number: 8298432
    Abstract: A method and system of location specific processing on a substrate is described. The method comprises establishing a gas cluster ion beam (GCIB) according to a set of beam properties and measuring metrology data for a substrate. Thereafter, the method comprises determining at least one spatial gradient of the metrology data at one or more locations on the substrate and adjusting at least one beam property in the set of beam properties for the GCIB according to the determined at least one spatial gradient. Using the metrology data and the adjusted set of beam properties, correction data for the substrate is computed. Following the computing, the adjusted GCIB is applied to the substrate according to the correction data.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: October 30, 2012
    Assignee: TEL Epion Inc.
    Inventors: Ruairidh MacCrimmon, Nicolaus J. Hofmeester, Steven P. Caliendo
  • Publication number: 20120267337
    Abstract: A process for forming a porous nanoscale membrane is described. The process involves applying a nanoscale film to one side of a substrate, where the nanoscale film includes a semiconductor material; masking an opposite side of the substrate; etching the substrate, beginning from the masked opposite side of the substrate and continuing until a passage is formed through the substrate, thereby exposing the film on both sides thereof to form a membrane; and then simultaneously forming a plurality of randomly spaced pores in the membrane. The resulting porous nanoscale membranes, characterized by substantially smooth surfaces, high pore densities, and high aspect ratio dimensions, can be used in filtration devices, microfluidic devices, fuel cell membranes, and as electron microscopy substrates.
    Type: Application
    Filed: April 20, 2012
    Publication date: October 25, 2012
    Applicant: UNIVERSITY OF ROCHESTER
    Inventors: Christopher C. STRIEMER, Philippe M. FAUCHET, Thomas R. GABORSKI, James L. MCGRATH
  • Patent number: 8293126
    Abstract: A method and system of location specific processing on a substrate is described. The method comprises acquiring metrology data for a substrate, and computing correction data for adjusting a first region of the metrology data on the substrate. Thereafter, a first gas cluster ion beam (GCIB) for treating the high gradient regions is established, and the first GCIB is applied to the substrate according to the correction data. The method further comprises optionally acquiring second metrology data following the applying of the first GCIB, and computing second correction data for adjusting a second region of the metrology data, or the second metrology data, or both on the substrate. Thereafter, a second gas cluster ion beam (GCIB) for treating the second region is established, and the second GCIB is applied to the substrate according to the second correction data.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: October 23, 2012
    Assignee: TEL Epion Inc.
    Inventors: Ruairidh MacCrimmon, Nicolaus J. Hofmeester, Steven P. Caliendo
  • Publication number: 20120263626
    Abstract: An apparatus, according to one aspect, may include a chromatograph and a bulk acoustic resonator. The chromatograph may include a channel that is defined at least partially in a monolithic substrate. The channel may have an inlet to receive a sample and an outlet. A chromatography material may be included in the channel. The bulk acoustic resonator may have a first electrode and a second electrode that has a chemically functionalized surface. The chemically functionalized surface may be included in a chamber that is defined at least partially in the monolithic substrate and that is coupled with the outlet of the channel. Methods of making and using such apparatus, and systems including such apparatus, are also disclosed.
    Type: Application
    Filed: May 4, 2012
    Publication date: October 18, 2012
    Inventors: Li-Peng Wang, Qing Ma
  • Patent number: 8287744
    Abstract: Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: October 16, 2012
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Thomas Hantschel, David K. Fork, Eugene M. Chow, Dirk De Bruyker, Michel A. Rosa
  • Publication number: 20120256027
    Abstract: The present invention relates to a cell lysis apparatus and a manufacturing method thereof, and more particularly, to a cell lysis apparatus, which mechanically performs cell lysis, and a manufacturing method thereof. The cell lysis apparatus includes: an inlet port through which fluid containing cells is supplied; a fluid channel defining a passage through which the cell containing fluid supplied from the inlet port flows; a nano blade array including a plurality of nano blades having pointed leading ends and arranged such that the pointed leading ends of the nano blades are oriented in a direction of the fluid supplied through the inlet port to disrupt the cells passing therethrough; and an outlet port through which the disrupted cells and the fluid are discharged.
    Type: Application
    Filed: August 30, 2010
    Publication date: October 11, 2012
    Applicant: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sung Yang, Sung Sik Yun, Sang Youl Yoon
  • Publication number: 20120250157
    Abstract: Methods of forming microelectronic structures are described. Embodiments of those methods may include forming a photomask on a (110) silicon wafer substrate, wherein the photomask comprises a periodic array of parallelogram openings, and then performing a timed wet etch on the (110) silicon wafer substrate to form a diffraction grating structure that is etched into the (110) silicon wafer substrate.
    Type: Application
    Filed: March 30, 2011
    Publication date: October 4, 2012
    Inventors: Yun-Chung Na, John Heck, Haisheng Rong
  • Patent number: 8277667
    Abstract: A magnetic element and its manufacturing method are provided. A magnetic element includes an actuation part having a first surface and a second surface, a torsion bar connected to the actuation part, and a frame connected to the first torsion bar, wherein the first surface of the actuation part is an uneven surface. The manufacturing method of the magnetic element starts with forming an passivation layer on a substrate and defining a special area by the mask method, then continues with forming the adhesion layer and electroplate-initializing layer on the substrate sequentially. The photoresist layer are formed and the magnetic-inductive material is electroformed on the electroplate area. Finally, the substrate is etched and the passivation layer is removed to obtain the magnetic element. The manufacturing method of magnetic element of the present invention can be applied in the microelectromechanical system field and other categories.
    Type: Grant
    Filed: January 14, 2008
    Date of Patent: October 2, 2012
    Assignee: National Tsing Hua University
    Inventors: Hsueh-An Yang, Weileun Fang, Tsung-Lin Tang
  • Publication number: 20120234946
    Abstract: Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.
    Type: Application
    Filed: May 30, 2012
    Publication date: September 20, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Gregory DeBrabander, Mark Nepomnishy
  • Patent number: 8262916
    Abstract: Embodiments of the invention are directed to multi-layer, multi-material fabrication methods (e.g. electrochemical fabrication methods) which provide improved versatility in producing complex microdevices and in particular in removing sacrificial material from passages, channels, or cavities that are complex or that include etching access ports in their final configurations that are small relative to passage, channel, or cavity lengths. Embodiments of the present invention provide for removal of sacrificial material from these passages, channels or cavities using one or more initial or preliminary removal steps that occur prior to completion of the such passages that results from the completion of the layer forming steps. In some embodiments, first sacrificial material is replaced after a secondary solid sacrificial material after the initial removal step or steps. In other embodiments, the first sacrificial material is replaced after a liquid material after the initial removal step or steps.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: September 11, 2012
    Assignee: Microfabrica Inc.
    Inventors: Dennis R. Smalley, Michael S. Lockard, Adam L. Cohen
  • Patent number: 8261368
    Abstract: Devices for performing nanofabrication are provided which provide small volume reaction space and high reaction versatility. A device may include a reaction chamber adapted for nanoscale modification of a substrate and vacuum conditions; a scanning probe tip assembly enclosed within the reaction chamber; a first port coupled to the reaction chamber for delivering a gas; a second port coupled to the reaction chamber for applying a vacuum; and a substrate assembly insertedly mounted to the reaction chamber. The reaction chamber may include a body having one or more flexible walls and one or more supports to prevent the reaction chamber from collapsing under a vacuum. The device may further include an electrical conduit for coupling the tips of the scanning probe tip assembly to electrical components outside the reaction chamber. Also provided are apparatuses incorporating the devices and methods of using the devices and apparatuses.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: September 4, 2012
    Assignee: NanoInk, Inc.
    Inventors: John Edward Bussan, Michael R. Nelson, Joseph S. Fragala, Albert K. Henning, Jeffrey R. Rendlen
  • Patent number: 8231795
    Abstract: An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: July 31, 2012
    Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: David Martin, Joel Philliber, John Choy
  • Patent number: 8226836
    Abstract: Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The interferometric modulator disclosed herein comprises a movable mirror. Some embodiments of the disclosed movable mirror exhibit a combination of improved properties compared to known mirrors, including reduced moving mass, improved mechanical properties, and reduced etch times.
    Type: Grant
    Filed: August 12, 2008
    Date of Patent: July 24, 2012
    Assignee: Qualcomm MEMS Technologies, Inc.
    Inventors: Clarence Chui, Jeffrey B. Sampsell
  • Publication number: 20120174860
    Abstract: A template 100 for three-dimensional thin-film solar cell substrate formation for use in three-dimensional thin-film solar cells. The template 100 comprises a substrate which comprises a plurality of posts 102 and a plurality of trenches 104 between said plurality of posts 102. The template 100 forms an environment for three-dimensional thin-film solar cell substrate formation.
    Type: Application
    Filed: January 9, 2012
    Publication date: July 12, 2012
    Applicant: SOLEXEL, INC.
    Inventor: Mehrdad Moslehi
  • Publication number: 20120174861
    Abstract: A semiconductor template having a top surface aligned along a (100) crystallographic orientation plane and an inverted pyramidal cavity defined by a plurality of walls aligned along a (111) crystallographic orientation plane. A method for manufacturing a semiconductor template by selectively removing silicon material from a silicon template to form a top surface aligned along a (100) crystallographic plane of the silicon template and a plurality of walls defining an inverted pyramidal cavity each aligned along a (111) crystallographic plane of the silicon template.
    Type: Application
    Filed: January 9, 2012
    Publication date: July 12, 2012
    Applicant: SOLEXEL, INC.
    Inventors: David Xuan-Qi Wang, Mehrdad M. Moslehi
  • Patent number: 8216434
    Abstract: A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.
    Type: Grant
    Filed: March 3, 2008
    Date of Patent: July 10, 2012
    Assignee: University of Southern California
    Inventors: Tzung K. Hsiai, Gopikrishnan Soundararajan, Eun Sok Kim, Hongyu Yu, Mahsa Rouhanizadeh, Christina Tiantian Lin
  • Patent number: 8216482
    Abstract: A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole.
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: July 10, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Seok Kim, Yong-Seop Yoon, Moon-Chul Lee, Yong-Won Jeong, Dong-Sik Shim, Hyung Choi
  • Patent number: 8211321
    Abstract: A method of forming an array of selectively shaped optical elements on a substrate, the method including the steps of providing the substrate, the substrate having an optical layer placed thereon; placing a layer of particles on the optical layer; performing an etching cycle. The cycle includes the steps of: etching the layer of particles, using a first etching process so as to reduce the size of the particles within the layer, then; simultaneously etching the optical layer and the layer of particles, using a second etching process, the further reducing particles forming a mask over areas of the optical layer to create discrete optical elements from the optical layer.
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: July 3, 2012
    Assignee: Agency for Science, Technology and Research
    Inventors: Benzhong Wang, Soo Jin Chua
  • Publication number: 20120156886
    Abstract: Production efficiency of a substrate (in particular, a substrate on which a SiC epitaxial film is formed) is improved and formation of the film inside a gas supply port is suppressed. This is accomplished by a substrate processing apparatus including a reaction chamber configured to accommodate a plurality of substrates 14, a heating part installed to surround the reaction chamber and configured to heat the reaction chamber, and a first gas supply pipe 60 extending in the reaction chamber, wherein the first gas supply pipe 60 includes a first gas supply port 68 configured to inject a first gas toward the plurality of substrates 14, and first shielding walls installed at both sides of the first gas supply port to expose the first gas supply port 68, the first shielding walls extending toward the plurality of substrates 14 from the first gas supply port 68.
    Type: Application
    Filed: December 20, 2011
    Publication date: June 21, 2012
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Kenji Shirako, Masanao Fukuda, Takafumi Sasaki, Yoshinori Imai, Daisuke Hara, Shuhei Saido, Koei Kuribayashi
  • Publication number: 20120154919
    Abstract: Photonic nanostructures, light absorbing apparatuses, and devices are provided. The photonic nanostructures include a plurality of photonic nanobars configured to collectively absorb light over an excitation wavelength range. At least two of the photonic nanobars of the plurality have lengths that are different from one another. Each photonic nanobar of the plurality has a substantially small width and a substantially small height relative to the different lengths. A method for forming such may comprise forming a plurality of first photonic nanobars comprising a width and a height that are smaller than a length of the plurality of first photonic nanobars, and forming a plurality of second photonic nanobars comprising a width and a height that are smaller than a length of the second photonic nanobar, wherein the lengths of the plurality of first photonic nanobars and the lengths of the plurality of second photonic nanobars are different from one another.
    Type: Application
    Filed: December 14, 2010
    Publication date: June 21, 2012
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Yongjun Jeff Hu, Allen McTeer, Lijing Gou
  • Publication number: 20120155820
    Abstract: Embodiments of the invention use crystallographic etching of SOI wafers with a (110)-oriented epi layer to form both the vertical input facet and the re-entrant mirror. Proposed layout design combined with proposed orientation of the epi enables both vertical facets and re-entrant (upward-reflecting) mirror facets to be made in a single wafer-level wet etch process.
    Type: Application
    Filed: December 20, 2010
    Publication date: June 21, 2012
    Inventors: John Heck, Haisheng Rong