Abstract: Monopropellant and pre-mixed bipropellant storage and supply systems for rocket engines and other work producing systems are subject to damage when detonation progresses upstream from a combustion chamber to and through supply lines. Interposing one or more micro porous or micro fluidic elements into the supply conduit can limit the flame front that accompanies such unintended detonation, but inevitably restrict the flow of the propellant to the combustion chamber. A tiered micro fluidic element where a bulk of the element has relatively large pores but forms a structurally robust supports a second, relatively thin region having appropriately small mean pore diameter provides an effective flashback barrier that can resist catastrophic failure during such detonations. Such elements can be used in isolation, or they can be incorporated into detonation wave arrestors or pressure wave-triggered cut-off valves or the like to decrease the incidence of unintended detonations.

Abstract: A process for producing a microfine structure which comprises: a first stage of disposing a polymer layer comprising a block copolymer (103) having at least a first segment (101) and a second segment (102) on a surface of a substrate (105); and a second stage of having the polymer layer undergo microphase separation and form a structure composed of a continuous phase (204) made of the second segments (102) and microdomains (104) which are made of the first segments (101) and are arranged in a penetration direction of the continuous phase (204). The process is characterized in that the substrate (105) has pattern members, each of the pattern members being sparsely disposed at a position where the microdomain (104) is to be formed and different in chemical property from the surface of the substrate (105).

Abstract: A micropattern is joined to a substrate (W1) by: a first group of covering step and micropattern forming step by etching in a transfer step; and a second group of covering step and micropattern forming step by etching in the transfer step.

Abstract: Provided is a fabrication method with which a laminate having a hollow structure can be produced more easily, while enabling to produce a multilayer structure as well. That is, a method for producing a hollow structure, a fabrication method by stacking-up a structural material among fabrication methods of a hollow structure on a substrate, the method including a step of forming a structural material layer on a substrate, a step of forming a pattern on the structural material layer, a step of forming a sacrificial material layer by burying between the patterns with a water-soluble or an alkaline-soluble polymer as the sacrificial material to be buried between the patterns, a step of further laminating a structural material layer and forming a pattern on the structural material layer laminated, and a step of finally removing the sacrificial material after all of lamination is completed.

Abstract: Example embodiments relate to methods of manufacturing and transferring a larger-sized graphene layer. A method of transferring a larger-sized graphene layer may include forming a graphene layer, a protection layer, and an adhesive layer on a substrate and removing the substrate. The graphene layer may be disposed on a transferring substrate by sliding the graphene layer onto the transferring substrate.

Abstract: Grids and collimators, for use with electromagnetic energy emitting devices, include at least a metal layer that is formed, for example, by electroplating/electroforming or casting. The metal layer includes top and bottom surfaces, and a plurality of solid integrated walls. Each of the solid integrated walls extends from the top to bottom surface and has a plurality of side surfaces. The side surfaces of the solid integrated walls are arranged to define a plurality of openings extending entirely through the layer. At least some of the walls also can include projections extending into the respective openings formed by the walls.

Abstract: Provided are a shape of a hierarchical structure, an engineering effect of the hierarchical structure according to the shape, an increasing method of the engineering effect, an application method of the hierarchical structure for novel material or parts, and a mass-manufacturing method of the hierarchical structure. The present invention relates to a hierarchical structure and a manufacturing method thereof, and includes a hierarchical structure in which at least one nano-object that has a characteristic length of a nanoscale region in an internal matrix is arranged in a predetermined pattern. According to the exemplary embodiments of the present invention, an excellent characteristic that is generated in a nanoscale region may be used in a structure of a macroscopic scale region, and structures that have different scales may be simply interconnected or interfaced regardless of the different scales.

Abstract: The present invention provides a method of fabricating at least one single layer hexagonal boron nitride (h-BN). In an exemplary embodiment, the method includes (1) suspending at least one multilayer boron nitride across a gap of a support structure and (2) performing a reactive ion etch upon the multilayer boron nitride to produce the single layer hexagonal boron nitride suspended across the gap of the support structure. The present invention also provides a method of fabricating single layer hexagonal boron nitride. In an exemplary embodiment, the method includes (1) providing multilayer boron nitride suspended across a gap of a support structure and (2) performing a reactive ion etch upon the multilayer boron nitride to produce the single layer hexagonal boron nitride suspended across the gap of the support structure.

Abstract: A keycap structure is made by providing an elastomer laminate comprising an elastomer transparent layer and an elastomer colored layer, performing an etching process to locally remove the elastomer colored layer to form a pattern, bonding the elastomer laminate and a carrier to form a bonded structure, and combining the bonded structure and a keycap body. The keycap structure and the bonded structure may be utilized to make articles. The articles thereby have a leather-like soft touch and exquisite appearance.

Abstract: A method for manufacturing a porous polymer molded article, comprising a step of laminating a first mask with a plurality of openings formed therein and a second mask with a plurality of openings formed therein and having a mean opening diameter that is larger than the mean opening diameter of the first mask, on a polymer molded article, and a step of forming through-holes in the polymer molded article by dry etching from the second mask side.

Abstract: The invention relates to a method for making an electronic display device (1) having a screen (3) covered by a protection plate, and to a substrate (2) covered by said screen for obtaining such a device. The method comprises the following steps: a) applying glue (10) at the non cross-linked state substantially on the entire surface of the screen and/or the assembling surface (11a) of the plate (11) following a deposit on the screen connection area (5) of at least one organic layer (15) for protecting the connection area from the glue; applying the assembling surface against the screen via the glue; c) emitting a radiation through the plate for cross-linking the glue; and d) removing a portion of the plate covering the connection area so that the latter can be electrically accessible, the protection layer being removed from the connection area upon said removal or during a further surface processing step.

Abstract: A method of removing material layer is disclosed. First, a semiconductor substrate is fixed on a rotating platform, where a remnant material layer is included on the surface of the semiconductor substrate. Afterward, an etching process is carried out. In the etching process, the rotating platform is rotated, and an etching solution is sprayed from a center region and a side region of the rotating platform toward the semiconductor substrate until the material layer is removed. Since the semiconductor substrate is etched by the etching solution sprayed from both the center region and the side region of the rotating platform, the etching uniformity of the semiconductor substrate is improved.

Abstract: A method for reducing the roughness of a free surface of a semiconductor wafer that includes establishing a first atmosphere in an annealing chamber, replacing the first atmosphere with a second atmosphere that includes a gas selected to and in an amount to substantially eliminate or reduce pollutants on a wafer, and exposing the free surface of the wafer to the second atmosphere to substantially eliminate or reduce pollutants thereon. The second atmosphere is then replaced with a third atmosphere that includes pure, and rapid thermal annealing is performed on the wafer exposed to the third atmosphere in the annealing chamber to substantially reduce the roughness of the free surface of the wafer.

Abstract: An apparatus for etching a substrate includes (a) a nozzle system including at least one nozzle through which acid solution containing at least hydrofluoric acid is sprayed onto the substrate, (b) a mover which moves at least one of the nozzle system and the substrate relative to the other in a predetermined direction in such a condition that the substrate and the nozzle system face each other, (c) a filter system which filters off particles out of the acid solution having been sprayed onto the substrate, and (d) a circulation system which circulates the acid solution having been sprayed onto the substrate, to the filter system, and further, to the nozzle system from the filter system.

Abstract: A packaged semiconductor device has a metal plate (1200) with sawed sides (1200c), a flat first surface (1200a) and a parallel second surface (1200b); the plate is separated into a first section (1201) and a second section (1202) spaced apart by a gap (1230). The plate has on the second surface (1200b) at least one insular mesa (1205) of the same metal in each section, the mesas raised from the second plate surface. The device further has an insulating member (1231), which adheres to the first plate surface, bridges the gap, and thus couples the first and second sections together. The device further has a vertical stack (1270) of two power FET chips (1210) and (1220), each having a pair of terminals on the first chip surface (1211 and 1212; 1221 and 1222 respectively) and a single terminal on the second chip surface. The single terminals of chip (1210) and chip (1220) are attached to each other to form the common terminal (1240).

Abstract: A method for producing a micromechanical component is proposed, a trench structure being substantially completely filled up by a first filler layer, and a first mask layer being applied on the first filler layer, on which in turn a second filler layer and a second mask layer are applied. A micromechanical component is also proposed, the first filler layer filling up the trench structure of the micromechanical component and at the same time forming a movable sensor structure.

Abstract: A microchip with capillaries and method for making same is described. A sacrificial material fills microchannels formed in a polymeric substrate, the filled microchannels are covered by a top cover to form filed capillaries, and the sacrificial material is removed to form the microcapillaries. The sacrificial material fills the microchannels as a liquid whereupon it becomes solid in the microchannels, and is liquefied after the top cover is applied and affixed to remove the sacrificial material. The top cover may be solvent sealed on the substrate and of the same or different material as the substrate. The top cover may also be an in situ applied semipermeable membrane.

Abstract: A fabrication method is described for forming an electronic circuit on a flexible substrate consisting of plastic and opaque foils. Corresponding circuit structures are also described herein. The opaque substrate can be selected from a set of polymers which have the appropriate thermo-mechanical properties. The foil geometry of the opaque substrate can be selected to maximize the structural integrity on the display in the planar directions but have excellent mechanical stress distribution when bent or flexed.

Abstract: A method for forming a template useful for nanoimprint lithography comprises forming at least one pillar which provides a topographic feature extending from a template base. At least one conformal pattern layer and one conformal spacing layer, and generally a plurality of alternating pattern layers and spacing layers, are formed over the template base and pillar. A planarized filler layer is formed over the pattern and spacing layers, then the filler, the spacing layer and the pattern layer are partially removed, for example using mechanical polishing, to expose the pillar. One or more etches are performed to remove at least a portion of the pillar, the filler, and the spacing layer to result in the pattern layer protruding from the spacing layer and providing the template pattern.

Abstract: A method of forming an actuator and a relay using a micro-electromechanical (MEMS)-based process is disclosed. The method first forms the lower sections of a square copper coil, and then forms an actuation member that includes a core section and a horizontally adjacent floating cantilever section. The core section, which lies directly over the lower coil sections, is electrically isolated from the lower coil sections. The method next forms the side and upper sections of the coil, along with first and second electrodes that are separated by a switch gap. The first electrode lies directly over an end of the core section, while the second electrode lies directly over an end of the floating cantilever section.

Abstract: A multi-layer fabrication method for making three-dimensional structures is provided. In one embodiment, the formation of a multi-layer three-dimensional structure comprises: 1) fabricating a plurality of layers with each layer comprising at least two materials; 2) aligning the layers; 3) attaching the layers together to form a multi-layer structure; and 4) removing at least a portion of at least one of the materials from the multi-layer structure. Fabrication methods for making the required layers are also disclosed.

Abstract: Methods for fabricating arrays of nanoscaled alternating lamellae or cylinders in a polymer matrix having improved long range order utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.

Abstract: A suspension load beam used for attachment to a slider assembly and an actuation arm in a disc drive for data storage has a rigid middle beam section comprising a rigid bottom layer, a rigid top layer and a composite core layer sandwiched between the bottom layer and the top layer. A method for fabricating a vibration resistant mechanical member used a disc drive subject to high frequency motion operations is also disclosed. The method involves making an integral laminate structure and fabricating the mechanical member from the integral laminate structure. The integral laminate structure has a rigid bottom layer, a composite core layer on top of the rigid bottom layer, and a rigid top layer on top of the core layer so that the composite core layer is sandwiched between the rigid bottom layer and the rigid top layer.

Abstract: A method of forming an organic semiconductor pattern is provided. A pattern is formed on a first substrate. An adhesive is coated on the pattern to form an adhesive pattern. An organic semiconductor layer is formed on a second substrate. The second substrate is combined with the first substrate to remove a portion of the organic semiconductor layer attached to the pattern from the second substrate to form the organic semiconductor pattern.

Abstract: A method includes forming multiple trenches in a first wafer, forming a sensor structure on a first surface of a second wafer, and bonding the first wafer and the second wafer. The method also includes etching a second surface of the second wafer to form a sensor diaphragm in the second wafer. The method further includes removing a portion of the first wafer by cutting the first wafer in multiple areas of the first wafer associated with the trenches. A sensor includes a substrate and a surface acoustic wave (SAW) resonator on a first surface of the substrate. The sensor also includes a bonding pad electrically coupled to the SAW resonator and a notch formed in a second surface of the substrate. The sensor further includes a cover separated from the first surface of the substrate by a spacer. The SAW resonator is located between the cover and the substrate.

Abstract: The invention relates to a process for producing a bond between a first and a second substrate (2, 4), comprising: a) a step of preparing surfaces (6, 8) to be assembled, b) an assembly of these two surfaces, by direct molecular bonding, c) a heat treatment step involving at least maintaining the temperature within the range of 50° C. to 100° C. for at least one hour.

Abstract: A method of fabricating a flexible circuit interconnect comprising a conductive pattern on a flexible substrate comprising layers of different components having different coefficients of thermal expansion, including exposing the flexible substrate sequentially to different temperature regimes tending to differentially expand the flexible circuit components, dimensionally stabilizing the flexible substrate with an added stainless steel layer only during said exposing to different temperature regimes, and removing stainless steel of the added layer from the flexible circuit after exposing the flexible circuit.

Abstract: A method for manufacturing an electronic component includes preparing an element substrate having a function section for providing a function of an electronic component, and an external-connection electrode; bonding a low-sandblast-resistant case plate to the element substrate through a high-sandblast-resistant adhesive layer; forming, by sandblast processing, a hole in the case plate above the external-connection electrode so that the adhesive layer is exposed to the outside; removing, by etching, an adhesive layer portion that is exposed in the hole; forming an electrode film so as to be electrically connected to the exposed external-connection electrode; and forming, by mechanical machining, a projection having a leading end surface on which a terminal electrode resulting from the electrode film is defined.

Abstract: The present invention provides a bonded substrate fabricated to have its final active layer thickness of 200 nm or lower by performing the etching by only 1 nm to 1 ?m with a solution having an etching effect on a surface of an active layer of a bonded substrate which has been prepared by bonding two substrates after one of them having been ion-implanted and then cleaving off a portion thereof by heat treatment. SC-1 solution is used for performing the etching. A polishing, a hydrogen annealing and a sacrificial oxidation may be respectively applied to the active layer before and/or after the etching. The film thickness of this active layer can be made uniform over the entire surface area and the surface roughness of the active layer can be reduced as well.

Abstract: A fluidic structure and a method for production of a fluidic structure are provided. The method may comprise, in order, introducing at least one externally accessible opening into at least one base substrate of the fluidic structure, partially introducing at least one section of a fluidic conductor, which has at least one inner lumen and at least one conductor wall, in particular of a tube or flexible tube, into the at least one opening, introducing at least one curable fluid sealing material into the at least one opening, entirely or partially curing the at least one fluid sealing material, and producing at least one connecting channel between at least one inner lumen in the at least one fluidic conductor and at least one fluid channel in the fluidic structure, the at least one connecting channel passing through at least one conductor wall.

Abstract: A method suitable for etching hydrophilic trenches into a substrate, such as silicon, is provided. The method comprises etching and sidewall passivation processes for achieving anisotropy. Sidewalls of the etched trench are made hydrophilic during the etch by virtue of a hydrophilizing dopant in a passivating gas plasma. The method is useful for etching ink supply channels in inkjet printheads.

Abstract: A method for forming a wiring on a substrate includes the steps of preparing a copper substrate, plating a copper-nickel layer on a portion of the copper substrate, combining the copper substrate with a soft polyimide substrate, and etching the copper substrate.

Abstract: A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate to the one side of the wafer using an adhesive bonding agent, the substrate overlying the patterned layer of material; selectively removing portions of the wafer from the side opposite the one side to define stationary and movable MEMS elements; and selectively removing the adhesive bonding agent to release the movable MEMS element, at least a portion of the layer of material being disposed so as to be attached to the movable MEMS element.

Abstract: The invention relates to a method for forming silicon atomic force microscope tips. The method includes the steps of depositing a masking layer onto a first layer of doped silicon so that some square or rectangular areas of the first layer of doped silicon are not covered by the masking layer, etching pyramidal apertures in the first layer of doped silicon, removing the masking layer, depositing a second layer of doped silicon onto the first layer of doped silicon, the second layer of doped silicon being oppositely doped to the first layer of doped silicon and etching away the first layer of doped silicon. Further steps may be added to form the atomic force microscope tips at the end of cantilevers.

Abstract: A DMFC (direct methanol fuel cell) includes two bipolar plates, a membrane electrode assembly, a bonding layer, and a fuel container base. The bipolar plate is a releasable substrate that includes a releasable copper carrier, a release layer, and a metal foil. The bipolar/MEA assembly is formed by laminating the releasable bipolar, the MEA, and the bonding sheet, peeling off the release carrier, and printing a carbon ink or plating Au.

Abstract: In accordance with the present invention, there is provided a method for manufacturing a semiconductor package. The method comprises the initial step of applying first and second photoresist layers to respective ones of opposed first and second surfaces of a metal plate which includes a die paddle and a plurality of leads extending at least partially about the die paddle in spaced relation thereto. The first and second photoresist layers are then patterned to expose the die paddle and prescribed portions of each of the leads. Thereafter, first and second conductive layers are applied to portions of respective ones of the first and second surfaces which are not covered by the first and second photoresist layers. The first and second photoresist layers are then removed to facilitate the creation of an exposed area in each of leads which is not covered by the first and second conductive layers.

Abstract: A technique for manufacturing a micro-electro mechanical structure includes a number of steps. Initially, a cavity is formed into a first side of a handling wafer, with a sidewall of the cavity forming a first angle greater than about 54.7 degrees with respect to a first side of the handling wafer at an opening of the cavity. Then, a bulk etch is performed on the first side of the handling wafer to modify the sidewall of the cavity to a second angle greater than about 90 degrees, with respect to the first side of the handling wafer at the opening of the cavity. Next, a second side of a second wafer is bonded to the first side of the handling wafer.

Abstract: A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant comprised of different first and second polymers The solid encapsulant is comprised of a polymer prepared by polymerizing an encapsulant fluid comprising a homogeneous mixture of first and second constituents. The first constituent is comprised of a first monomer suitable for in situ polymerization to form the first polymer. The second constituent is comprised of the second polymer or a second monomer suitable for in situ polymerization to form the second polymer. The first constituent does not substantially react with the second constituent. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.

Abstract: Stand-alone conformal coverings for electronic devices and methods of making and using such coverings.

Abstract: A fluid ejection device includes a first substrate having a first crystal orientation, a second substrate having a second crystal orientation, bound to the first substrate, a manifold through the first and second substrates, a chamber formed in the second substrate, connected with the manifold, and a plurality of nozzles connecting to the chamber, wherein the first crystal orientation is different from the second crystal orientation. A method of fabricating the same is also disclosed.

Abstract: In accordance with the present invention, there is provided a method for manufacturing a leadframe. The method comprises the initial step of bonding a primary leadframe to an adhesive tape layer, the primary leadframe including a die paddle and a plurality of leads which extend at least partially about the die paddle in spaced relation thereto. Thereafter, a photo resist is applied to the primary leadframe and to the adhesive tape layer. The photo resist is then patterned to define at least one exposed area in each of the leads of the primary leadframe. The exposed areas of the leads are then etched to divide the leads into an inner set which extends at least partially about the die paddle and an outer set which extends at least partially about the inner set. Thereafter, the photo resist is removed from the die paddle and from the inner and outer sets of the leads.

Abstract: A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed on the metal layer 12. Then, an etchant of a mixed solution prepared by mixing ferric chloride with water without adding any acids is used for etching and removing an undesired portion of the metal layer 12 to form a metal circuit 12 on the at least one side of the ceramic substrate 10.

Abstract: A magnetic recording medium is disclosed that includes a substrate; an anodic alumina film formed on the substrate; a pore formed in the anodic alumina film; a carbon layer covering the surface of the anodic alumina film and the inner wall of the pore; a magnetic particle formed on the carbon layer inside the pore; and a lubrication layer covering the carbon layer and the magnetic particle.

Abstract: There is disclosed a transfer body including at least a peelable layer, a transparent conductive layer and an adhesive layer all sequentially laminated on a supporting body, wherein the supporting body has a heat resisting property enough to withstand heat treatment to the layers on the supporting body and a large rigidity compared with an opponent member to which the layers are to be transferred, and wherein the peelable layer is formed to have a pull strength of 100 g/cm or more.

Abstract: A method of manufacturing a micromechanical component has a substrate (1), a movable sensor structure (6) in a micromechanical functional layer (5) located over the substrate; a first sealing layer (8) on the first micromechanical functional layer (5) which is at least partly structured; a second micromechanical functional layer (10) on the first sealing layer (8), which has at least one sealing function and is anchored at least partly in the first micromechanical functional layer (5); and a second sealing layer (8) on the second micromechanical functional layer (10). The sensor structure (6) is provided with trenches (7) whose width is not larger than a maximum trench width (66), which is sealable by the first sealing layer (8) in the form of plugs (9) which do not extend to the trench bottoms.

Abstract: An electro-optical deflector device, having a thin ferroelectric oxide film and a method of fabricating the deflector device is described. One embodiment of a thin film electro-optic deflector device includes: a planar optical waveguide, having a thin ferroelectric oxide layer; a first electrode, having a conductive substrate and a conductive epoxy; a second electrode coupled to the planar optical waveguide; a supporting substrate; a cladding layer attached to the second electrode deposited on the supporting substrate; and a hole through the supporting substrate and the cladding layer for connecting the second electrode to an external voltage source.

Abstract: In a method for patterning a polymer film forming a coating on a material surface, a thin film of polymer is deposited on the surface and the patterning takes place by applying to the material surface a stamp made of an elastomeric material in conformal contact with the surface of the thin film, such that portions thereof contacting one or more protruding elements of the elastomeric stamp formed by one or more indentations thereof, are attached to the protruding element or elements and removed from the material surface with the stamp. In a method for transferring a patterned polymer film onto a material surface, a thin film polymer is deposited on a stamp surface and the stamp is applied in conformal contact with the material surface, such that thin film of polymer is transferred thereto from one or more protruding elements of the elastomeric stamp formed by at least one indentation thereof, thus leaving a patterned thin film of polymer on the material surface when removing the stamp therefrom.

Abstract: The invention provides a forming method of an ink jet print head substrate and an ink jet print head substrate, and a manufacturing method of an ink jet print head and an ink jet print head, in which adhesion between a substrate for forming an ink discharging pressure generating element and an ink flow path forming member is increased to increase reliability even if an ink flow path forming member is formed covering a long distance. In a forming method of an ink jet print head substrate or the like, in which an ink flow path forming member is attached onto a substrate on which an ink discharging pressure generating element is formed, minute pit is formed on an attachment region of the substrate for attaching the liquid flow path forming member.

Abstract: A method for treating a film of material, which can be defined on a substrate, e.g., silicon. The method includes providing a substrate comprising a cleaved surface, which had a porous silicon layer thereon. The substrate may have a distribution of hydrogen bearing particles defined from the cleaved surface to a region underlying said cleaved surface. The method also includes increasing a temperature of the cleaved surface to greater than about 1,000 Degrees Celsius while maintaining the cleaved surface in a etchant bearing environment to reduce a surface roughness value by about fifty percent and greater. Preferably, the value can be reduced by about eighty or ninety percent and greater, depending upon the embodiment.

Abstract: A method of fabricating a printhead is provided. The printhead includes a substrate, a plurality of nozzles positioned on the substrate and a nozzle guard that is mounted on the substrate to cover the nozzle arrangements. The nozzle guard defines a plurality of apertures that are aligned with respective nozzles so that ink ejected from the nozzles can pass through the apertures and onto a print medium. The method includes the step of depositing a layer of a sacrificial material onto the substrate to cover the nozzles. The nozzle guard is positioned on the sacrificial material and the sacrificial material is removed.