Abstract: An optical element manufacturing method includes: disposing a light-shielding layer (14) that includes at least an Si layer as an uppermost layer, on a substrate (12) used as a base member, forming an optical aperture (14a) at the light-shielding layer (14) and forming a fine recession/projection structure (MR) at a surface of the uppermost layer through dry etching.

Abstract: Medical devices having a barrier layer comprising an inorganic material. The medical device has a reservoir containing a therapeutic agent and the barrier layer is disposed over the reservoir. In one aspect, the barrier layer has one permeability to the therapeutic agent at one portion of the medical device and a different permeability at another portion of the medical device. In another aspect, the dosage amount of the therapeutic agent in the reservoir at one portion of the medical device is different from the dosage amount of the therapeutic agent in the reservoir at another portion of the medical device. In another aspect, a bioresorbable layer is disposed over the barrier layer at one or more portions of the medical device, wherein the bioresorbable layer comprises a bioresorbable material. Also, methods of coating a medical device are disclosed, in which a barrier layer over a medical device is formed using a lithographic etching process where a plurality of particles serve as an etch mask.

Abstract: A process of manufacturing a solar cell is provided. The process comprising the steps of: i) ink jet printing an alkali removable water insoluble hot melt ink jet ink onto a substrate comprising a silicon wafer to form a resist image on the substrate; ii) etching or plating the substrate in an aqueous acid medium; and iv) removing the resist image with an aqueous alkali.

Abstract: In order to achieve low cost of manufacture of a display device by reducing the use of primary material used in a manufacturing process of a display device and saving labor taken for a vacuum process, according to the invention, liquid droplets containing conductive particles are ejected on a film being processed by using a first liquid droplet ejecting apparatus having a liquid droplet ejecting head provided with a plurality of liquid droplet ejecting orifices, thereby a conductive film is formed. After that, a resist pattern is locally formed on the conductive film by using a second liquid droplet ejecting apparatus having a liquid droplet ejecting head provided with a plurality of liquid droplet ejecting orifices. The conductive film is etched with the resist pattern as a mask to form a wiring.

Abstract: Disclosed is a structure and method for forming a structure including a SiCOH layer having increased mechanical strength. The structure includes a substrate having a layer of dielectric or conductive material, a layer of oxide on the layer of dielectric or conductive material, the oxide layer having essentially no carbon, a graded transition layer on the oxide layer, the graded transition layer having essentially no carbon at the interface with the oxide layer and gradually increasing carbon towards a porous SiCOH layer, and a porous SiCOH (pSiCOH) layer on the graded transition layer, the porous pSiCOH layer having an homogeneous composition throughout the layer. The method includes a process wherein in the graded transition layer, there are no peaks in the carbon concentration and no dips in the oxygen concentration.

Abstract: A method of manufacturing a printhead includes providing a polymeric substrate having a surface; providing a patterned material layer on the surface of the polymeric substrate; and removing at least some of the polymeric substrate not covered by the patterned material layer using an etching process.

Abstract: A magnetoresistive reader having a sensor, current contacts with low parasitic resistance and a top shield with substantially planar topology is fabricated by first defining a stripe height back edge of the sensor. Next, a reader width of the sensor is defined. The current contacts are deposited to a thickness such that a top surface of the current contacts is substantially level with a top surface of the sensor. The top shield is deposited over the sensor and the current contacts. Defining the stripe height back edge prior to the reader width results in current contacts with low parasitic resistance and inhibits the formation of magnetic domains in the top shield.

Abstract: A method for fabricating magnetic side shields for an MR sensor of a magnetic head. Following the deposition of MR sensor layers, a first DLC layer is deposited. Milling mask layers are then deposited, and outer portions of the milling mask layers are removed such that a remaining central portion of the milling mask layers is formed having straight sidewalls and no undercuts. Outer portions of the sensor layers are then removed such that a relatively thick remaining central portion of the milling mask resides above the remaining sensor layers. A thin electrical insulation layer is deposited, followed by the deposition of magnetic side shields. A second DLC layer is deposited and the remaining mask layers are then removed utilizing a chemical mechanical polishing (CMP) liftoff step. Thereafter, the first DLC layer and the second DLC layer are removed and a second magnetic shield layer is then fabricated thereabove.

Abstract: A read sensor for a magneto resistive head is formed through the use of a bilayer lift-off mask. According to one embodiment, a release layer is formed on top of a sensor layer. A silicon-containing resist layer is formed over the release layer. The resist layer is patterned according to the desired dimensions of the read sensor. Then, plasma etching, such as oxygen plasma etching, is used to remove the portion of the release layer that is exposed by removal of resist material. The release layer may be etched to undercut the patterned resist layer, or may entirely removed beneath the patterned resist layer to provide a bridge of the resist material. In either case, isotropic plasma etching, anisotropic plasma etching, or some combination thereof may be applied.

Abstract: Provided is a method of making hierarchical structures that contain nanofeatures and microstructures. The method includes adding the nanofeatures to existing microstructures using nanoparticles as an etch mask.

Abstract: A method for fabricating sliders (magnetic heads) with a recessed surface around a magnetic feature such as the active components of the write head on the air-bearing surface (ABS) is described. An embodiment of the method applies a positive photoresist to the exposed ABS surface, a magnetic field is applied, then liquid ferrofluid is applied on top of the photoresist. The pole pieces around the write gap will interact with the applied magnetic field so that the field gradient is highest around the write gap and the mobile ferrofluid will preferentially collect in the areas of the surface having the highest magnetic field gradient. The opaque magnetic particles in the ferrofluid form an optical ferrofluid mask over the photoresist around the write gap. The unmasked surface of the slider is milled which results in the recession of material around the write gap.

Abstract: A method for producing a nozzle plate comprises a liquid-repellant coat removal step for conducting a plasma treatment to each chip from a same side as a liquid droplet ejecting surface under an atmospheric pressure, while supplying a gaseous mask material for protection of the liquid-repellant coat through nozzle holes from an opposite side of the liquid droplet ejecting surface in such a manner that the gaseous mask material is leaked out over the liquid droplet ejecting surface around the nozzle holes, to thereby remove the liquid-repellant coat exposed outside the mask material; and a bonding step for bonding each chip to the nozzle plate body at the area from which the liquid-repellant coat is removed by the liquid-repellant coat removal step.

Abstract: A method is proposed which will enable cavities having optically transparent walls to be produced simply and cost-effectively in a component by using standard methods of microsystems technology. For this purpose, a silicon region is first produced, which is surrounded on all sides by at least one optically transparent cladding layer. At least one opening is then produced in the cladding layer. Over this opening, the silicon surrounded by the cladding layer is dissolved out, forming a cavity within the cladding layer. In this context, the cladding layer acts as an etch barrier layer.

Abstract: A dry etching apparatus that performs etching on a substrate 1 placed on a tray 13 inside a chamber 18 by covering the substrate 1 with a plate 14 provided with opening portions 15, in which a distance D between the surface opposing the substrate 1 and the substrate 1 in the peripheral portion of the plate 14 is set shorter than the distance D between the surface opposing the substrate 1 and the substrate 1 in the central portion of the plate 14. Textures can be thus formed homogeneously on the surface of the substrate.

Abstract: A process for etching a metal or alloy surface which comprises applying an etch-resist ink by ink jet printing to selected areas of the metal or alloy, solidifying the etch-resist ink without the use of actinic light and/or particle beam radiation and then removing the exposed metal or alloy by a chemical etching process wherein the etch-resist ink comprises the components: A) 60 to 100 parts carrier vehicle comprising one or more components which contain at least one metal chelating group; D) 0 to 40 parts colorant; and E) 0 to 5 parts surfactant; wherein the ink has a viscosity of not greater than 30 cPs (mPa·s) at the firing temperature, all parts are by weight and the total number of parts A)+B)+C)=100.

Abstract: A method of processing a substrate of a device comprises the as following steps. Form a cap layer over the substrate. Form a dummy layer over the cap layer, the cap layer having a top surface. Etch the dummy layer forming patterned dummy elements of variable widths and exposing sidewalls of the dummy elements and portions of the top surface of the cap layer aside from the dummy elements. Deposit a spacer layer over the device covering the patterned dummy elements and exposed surfaces of the cap layer. Etch back the spacer layer forming sidewall spacers aside from the sidewalls of the patterned dummy elements spaced above a minimum spacing and forming super-wide spacers between sidewalls of the patterned dummy elements spaced less than the minimum spacing. Strip the patterned dummy elements. Expose portions of the substrate aside from the sidewall spacers. Pattern exposed portions of the substrate by etching into the substrate.

Abstract: The invention provides a method to form a pattern of a functional material on a substrate for use in electronic devices and components. The method uses a stamp having a relief structure to transfer a mask material to a substrate and form a pattern of open area on the substrate. The functional material is applied to the substrate in at least the open area. The mask material is removed from the substrate, forming the pattern of functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.

Abstract: The present invention provides a hardmask that is located on a surface of a low k dielectric material having at least one conductive feature embedded therein. The hardmask includes a lower region of a hermetic oxide material located adjacent to the low k dielectric material and an upper region comprising atoms of Si, C and H located above the hermetic oxide material. The present invention also provides a method of fabricating the inventive hardmask as well as a method to form an interconnect structure containing the same.

Abstract: A substrate processing apparatus of the invention has a self-propelled carrying mechanism 15 configured to enable a processing target substrate W to be carried to/from each of liquid processing apparatuses HB, COT and DEV where at least two liquid processing apparatuses W are linearly disposed and to be movable in parallel with an arrangement direction of the liquid processing apparatuses HB, COT and DEV, substrate delivering/receiving mechanism 20 and 21 configured to enable the processing target substrate W to be delivered and received to/from the self-propelled carrying mechanism 15, and a non-self-propelled carrying mechanism 10 configured to enable the processing target substrate to be delivered and received to/from the substrate delivering/receiving mechanisms 20 and 21.

Abstract: A method of fabricating a fluid ejection device comprises providing a barrier layer which defines fluidic spaces. The fluidic spaces defined by the barrier layer are filled with filler. A throughway is etched through the substrate. The filler is removed from the fluidic spaces after etching the throughway.

Abstract: A method of fabricating a flat panel display device including: coating an etch-resist on a thin film; forming a soft mold having a groove and a protrusion for patterning the thin film; treating an end surface of the protrusion; applying the soft mold to the etch-resist to form an etch-resist pattern; separating the soft mold from the etch-resist pattern; and etching the thin film by using the etch-resist pattern to form a thin film pattern.

Abstract: A method is presented for fabricating a read head having a read head sensor and a hard bias/lead layer which includes depositing a strip of sensor material in a sensor material region, and depositing strips of fast-milling dielectric material in first and second fast-milling dielectric material regions adjacent to the sensor material region. A protective layer and a layer of masking material is deposited on the strip of sensor material and the strips of fast-milling dielectric material to provide masked areas and exposed areas. A shaping source, such as an ion milling source, is provided which shapes the exposed areas. Hard bias/lead material is then deposited on the regions of sensor material and fast-milling dielectric material to form first and second leads and a cap on each of these regions. The cap of hard bias/lead material and the masking material is then removed from each of these regions.

Abstract: A textured surface and oxidation layer coating on a metallic material is accomplished through the chemical and/or electrochemical etching of the surface to modify the surface texture and an in-situ oxidation procedure. The surface is useful for the fabrication of prosthetic devices, particularly medical implants, due to the corrosion and wear resistance imparted by the oxidation layer and the ability to enhance grafting of the implant onto bone imparted by the surface texture.

Abstract: The present invention provides a fluorine-containing cyclic compound represented by general formula (1): wherein R1 represents a halogen atom, and R2 and R3 each represents hydrogen or a hydrocarbon group. The above-mentioned hydrocarbon group is a straight-chain, branched or cyclic hydrocarbon group having 1 to 25 carbon atoms or an aromatic hydrocarbon group, and may contain a halogen atom, an oxygen atom, a nitrogen atom or a sulfur atom. Further, a fluorine-containing polymerizable monomer derived from the above-mentioned fluorine-containing cyclic compound, a fluorine-containing polymer compound obtained by polymerization or copolymerization using the above-mentioned compound or monomer, further a resist material and a pattern forming process using the above-mentioned polymer compound are also disclosed.

Abstract: A layer of polyimide or polysilicon is used as a mask in vapor hydrogen fluoride etching. Both non-photosensitive and photosensitive type polyimide may be used. A non-photosensitive polyimide mask requires the use of photoresist for patterning with a lithographic mask. Alternatively, photosensitive type polyimide may be patterned directly with the use of a lithographic mask. The resulting polyimide mask enables the etching of very small features with great uniformity. Such etching may be used to expose micropoint emitters of field emission devices.

Abstract: To provide a manufacturing method for simultaneously forming machined patterns different in dept in a small number of steps and a machined pattern having a U-shaped sectional form in which depths and widths are smoothly changed. Mask patterns 62 respectively having a semicircular sectional form and mask patterns 65 respectively having a V-shaped sectional form are formed at different opening widths 63 and 64 respectively to perform sandblasting by using the mask patterns 62 and 65 as masks. Though a deep groove is formed between the semicircular-sectional-form mask patterns 62, a shallow groove is formed between the V-shaped-sectional-form mask patterns 65.

Abstract: A method and system for fabricating an array of electronic devices, typically a display or sensor is described. In the method, a droplet source ejects droplets of a masking material for deposit on a thin film or substrate surface to mask an element of the array of electronic devices. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

Abstract: A process for forming an etch mask having a discontinuous regular pattern utilizes beads, each of which has a substantially unetchable core covered by a removable spacer coating. Beads are dispensed as a hexagonally packed monolayer onto a thermo-adhesive layer. Following a vibrational step which facilitates hexagonal packing of the beads, the resultant assembly is heated so that the beads adhere to the adhesive layer. Excess beads are then discarded. Spacer shell material is then removed from each of the beads, leaving core etch masks. The core-masked target layer is then plasma etched to form a column of target material directly beneath each core. The cores and any spacer material underneath the cores are removed. The resulting circular island of target material may be used as an etch mask during wet isotropic etching of an underlying layer.

Abstract: Methods of making a magnetic recording device with an “anchored” conductive stud which is securely attached within its surrounding insulator materials. The conductive stud is formed over a conductive layer which is coupled to or part of a read or a write head element of the magnetic recording device. The conductive stud has a top stud portion and a bottom undercut portion formed over the conductive layer. In one illustrated embodiment, the bottom undercut portion has a width that is greater than the width of the top stud portion. Since an insulator is formed around the conductive stud and over its bottom undercut portion, a secure coupling between the conductive stud and the conductive layer is provided. Preferably, the conductive layer is made of copper (Cu), the conductive stud is made of gold (Au), and the insulator is alumina (Al2O3). A seed layer may be formed between the conductive stud and the conductive layer.

Abstract: Due to lights with different wavelengths having different indexes of refraction in a liquid crystal, a retardation between lights with different wavelengths occurs and causes the problem of viewing angle of the liquid crystal display. The present invention provides a manufacturing method of light-guiding apparatus of a liquid crystal display to form light-guiding pillars having a characteristic of total reflection as a fiber. The light from back light module through the light-guiding pillars enters the liquid crystal at an incident angle smaller than 150 for reducing the retardation between lights with different wavelengths.

Abstract: Redundantly constrained laminar structures as weak-link mechanisms and a novel method for manufacturing the redundantly constrained laminar structures as weak-link mechanisms are provided. The method for producing the redundantly constrained laminar structures as weak-link mechanisms is carried out by lithographic techniques. A designed pattern is repeatedly chemically etched with a mask to produce a plurality of individual identical units. The units are stacked together to form the laminar structure and are secured together with fasteners. A high quality adhesive can be applied to the sides of the laminar structure to provide the mechanism equivalent to a single piece mechanism. The redundantly constrained laminar structures as weak-link mechanisms of the invention include a stack of a plurality of thin material structures.

Abstract: The invention provides a coated metal substrate comprising a metal substrate having an outer surface, a maskant film adhered to at least a portion of the outer surface of the metal substrate, the maskant film having a pattern of scribed lines therein, and a line sealant composition applied to the scribed lines in a maskant film. Both the maskant film and the line sealant composition are preferably radiation cured and substantially solvent-free. The invention also provides a method of protecting a metal substrate from chemical exposure by utilizing the radiation-cured maskant film and line sealant composition.

Abstract: A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

Abstract: A method of forming a photo-resist image on a substrate, such as a conductive film. The method provides that a photo-resist image is printed directly onto the conductive film, such as by using an ink jet printer. Specifically, a CAD image may be sent from a computer to the ink jet printer, and the ink jet printer may use the CAD image to print the photo-resist image. The method may provide that a copper film is applied to a dielectric substrate, and then the photo-resist image is printed directly onto the copper film. Then, at least a portion of the copper film is removed, such as by etching, and at least a portion of the photo-resist image which has been printed on the copper film is removed, such as by etching. By printing the photo-resist image directly onto the copper film, it is not necessary to perform steps such as: applying a mask, exposing to UV light, and developing.

Abstract: A slider prevent the phenomenon of sticking and reduce entrapping of foreign particles between sliding surfaces. A method for making micro-protrusions or micro-cavities on a surface of a substrate comprises placing the substrate in a process chamber, supporting a mask member having a micro shielding surface independent of and in front of the substrate, and irradiating fast atomic beams onto the surface of the substrate through the mask member.

Abstract: A susceptor provided as a base of a liquid crystal substrate in a vacuum chamber of a thin film deposition apparatus is provided. The susceptor includes a susceptor main body and a stepped portion provided on the susceptor main body to support the substrate from the bottom. The stepped portion is formed of a size smaller than the substrate. By the provision of the stepped portion, conduction between a film formed at an end plane of the substrate and a film formed at the portion around the substrate can be avoided.

Abstract: A substrate is placed on a charging surface, to which a first voltage is applied. Etch-resistant dry particles are placed in a cup in a nozzle to which a second voltage, less than the first voltage, is applied. A carrier gas is directed through the nozzle, which projects the dry particles out of the nozzle toward the substrate. The particles pick up a charge from the potential applied to the nozzle and are electrostatically attracted to the substrate. The particles adhere to the substrate, where they form an etch mask. The substrate is etched and the particles are removed. Emitter tips for a field emission display may be formed in the substrate.

Abstract: A resist composition comprising as the base resin a blend of a fluorinated polymer which is sensitive to high-energy radiation and highly transparent at a wavelength of up to 200 nm and a sulfonate-containing polymer exhibiting a high contrast upon alkali dissolution is improved in transparency and alkali dissolution contrast as well as plasma etching resistance.

Abstract: The present invention relates to a photoresist composition for an MMN (multi-micro nozzle) head coater, more particularly to a photoresist composition comprising a novolak resin with a molecular weight ranging from 2000 to 12,000, a diazide photoactive compound, an organic solvent, and a Si-based surfactant for use in liquid crystal display circuits.

Abstract: A read sensor for a magneto resistive head is formed through the use of a bilayer lift-off mask. According to one embodiment, a release layer is formed on top of a sensor layer. A silicon-containing resist layer is formed over the release layer. The resist layer is patterned according to the desired dimensions of the read sensor. Then, plasma etching, such as oxygen plasma etching, is used to remove the portion of the release layer that is exposed by removal of resist material. The release layer may be etched to undercut the patterned resist layer, or may entirely removed beneath the patterned resist layer to provide a bridge of the resist material. In either case, isotropic plasma etching, anisotropic plasma etching, or some combination thereof may be applied.

Abstract: A method of forming a pattern in a layer of material on a substrate, comprising providing a plurality of spheres, covering the layer on the substrate with the plurality of spheres to form a mask, reducing the diameter of at least one sphere of the plurality of spheres, etching the layer on the substrate using at least one sphere having a reduced diameter as a mask, and etching the substrate.

Abstract: A process for forming an etch mask having a discontinuous regular pattern utilizes beads, each of which has a substantially unetchable core covered by a removable spacer coating. Beads which have a core and a spacer coating are dispensed as a hexagonally-packed monolayer onto a thermo-adhesive layer, which is on a target layer. The beads are kept in place by a bead confinement wall. Following a vibrational step which facilitates hexagonal packing of the beads, the resultant assembly is heated so that the beads adhere to the adhesive layer. Excess beads are then discarded. Spacer shell material is then removed from each of the beads, leaving core etch masks. The core-masked target layer is then plasma etched to form a column of target material directly beneath each core. The cores and any spacer material underneath the cores are removed. The resulting circular island of target material may be used as an etch mask during wet isotropic etching of an underlying layer.

Abstract: A relatively facile, inexpensive method for patterning a layer of glass or a substrate involves patterning a seed material containing a nucleating agent adjacent a layer of thermally crystallizable glass and heat treating the seed material and the layer of thermally crystallizable glass to induce highly oriented crystal growth from the seed material through the thickness of the thermally crystallizable glass layer at selected portions thereof. After the heat treatment, the layer of thermally crystallizable glass is converted into a desired pattern of glass surrounded by crystalline material. The crystalline material is removed with an etchant to leave a desired glass pattern.

Abstract: A magnetic recording disk having on its surface a texture structure of fine surface irregularities with reduced variations, which is suitable for high-density magnetic recording, and a method of manufacturing such a magnetic recording disk are provided. A magnetic recording disk has a substrate 11, 12 (16) coated on a surface thereof with a magnetic layer 13, a carbon layer 14, and a lubricating film 15. The substrate has on a surface thereof a texture structure of fine surface irregularities for reducing friction when the substrate is brought into contact with a head and controlling an amount of lift of the head. The fine surface irregularities have a height of 20 nm or less and are formed from a pattern shape or profile of a shield with a high-speed atomic beam emitted from a high-speed atomic beam source.

Abstract: A method of fabricating a semiconductor memory device, particularly a mask ROM. A sacrificial oxide layer is formed on a silicon substrate and then a photoresist layer is formed on the sacrificial oxide layer. The photoresist layer is patterned to form a plurality of openings where bit lines are to extend respectively. Taking the patterned photoresist layer as a mask, arsenic ions are implanted into the silicon substrate through the openings and then boron ions are implanted into the silicon substrate through the openings. The implantation depth of boron ions are deeper than arsenic ions. The photoresist layer and the sacrificial oxide layer are removed after implantation. A gate oxide and a field oxide are grown simultaneously on the non-implanted and the implanted regions of the semiconductor layers respectively and a gate conductive layer is deposited on the silicon substrate.

Abstract: A process and a device for producing a printing tool in which a mask for sectional chemical passivation is applied to the surface of a workpiece that is to be subjected to a chemical surface working. In accordance with one embodiment, the process for producing a printing tool includes the steps of providing a workpiece having a surface which is subjected to a chemical surface working and spot spraying the surface of the workpiece section-by-section with a mask for sectional chemical passivation where the mask is essentially a wax and is sprayed onto the surface of the workpiece by a plurality of nozzles that are controlled with EDP support.

Abstract: A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

Abstract: A printer head substrate having a silicon substrate on which heat generating elements and partitions are formed and an orifice plate which adhered to the partitions is placed on a stage of a helicon-wave dry etching system. Helicon-wave dry etching is performed while cooling the printer head substrate by allowing a coolant gas to be intervened between the substrate and the stage. This allows multiple orifices of a desired and adequate shape to be simultaneously and quickly bored in the orifice plate even if a thin film sheet having adhesive layers adhered to both sides thereof is used as the orifice plate, thereby improving the working efficiency.

Abstract: A process for producing a head slider wherein a floating surface is formed on a slider substrate by photolithography. The process for the production of a head slider has a step of forming, on a slider substrate by photolithography, a patterned floating surface having a resist material on its upper surface; a step of sticking an adhesive sheet on the upper surface of the resist material present on the floating surface; and a step of peeling off the adhesive sheet together with the resist material from the floating surface.

Abstract: A method of forming a pattern in a layer of material on a substrate, comprising providing a plurality of spheres, covering the layer on the substrate with the plurality of spheres to form a mask, reducing the diameter of at least one sphere of the plurality of spheres, etching the layer on the substrate using at least one sphere having a reduced diameter as a mask, and etching the substrate.