Nongaseous Phase Etching Patents (Class 216/53)
  • Publication number: 20140277580
    Abstract: A method of manufacturing a tubular medical implant is provided. The method includes forming a hollow first tube with a first diameter and a first plurality of pores formed thereon and a hollow second tube with a second unstretched diameter and a second plurality of pores formed thereon. The second unstretched diameter is greater than the first diameter. At least a portion of the first tube slides within the second tube to create an overlapped area of the first tube and the second tube. The first tube and second tube are then bonded together in the overlapped area.
    Type: Application
    Filed: March 11, 2014
    Publication date: September 18, 2014
    Applicant: SMed-TA/TD, LLC
    Inventors: Troy D. Knapp, Gregory C. Stalcup, Joseph W. Jurick, Paul S. Nebosky
  • Publication number: 20140251952
    Abstract: In one embodiment, a polishing pad includes a hydrophilic polymer base having a polishing surface, and a metal oxide coating. The metal oxide coating has nanoparticles of metal oxide disposed on the polishing surface. In another embodiment, a processing station includes a rotatable platen, a polishing head, and a precursor delivery system. The polishing head is configured to retain a substrate against the polishing pad. The precursor delivery system is configured to form an oxide coating on a surface of a polishing pad disposed on the platen. In yet another embodiment, a method for modifying a surface of a polishing pad includes wetting the surface of the polishing pad and delivering a precursor to the wetted surface of the polishing pad surface. The method also includes forming a metal oxide coating having nanoparticles of metal oxide on the surface from the precursor.
    Type: Application
    Filed: March 8, 2013
    Publication date: September 11, 2014
    Inventors: Rajeev BAJAJ, Terrance Y. LEE, Fred C. REDEKER
  • Publication number: 20140248424
    Abstract: When mirror polishing is performed on a glass substrate by bringing a polishing pad into contact with the surface of the glass substrate while supplying a polishing liquid containing polishing grains to the substrate surface, the pH of the polishing liquid is maintained within a certain range or the agglomeration degree or dispersion degree of the polishing liquid is controlled. Consequently, an adequate mirror polishing rate can be maintained and there can be obtained a glass substrate having a good end shape.
    Type: Application
    Filed: May 12, 2014
    Publication date: September 4, 2014
    Applicant: HOYA CORPORATION
    Inventors: Toshio TAKIZAWA, Takumi KOSHIMIZU, Yoshinori MARUMO, Masahiro KATAGIRI
  • Publication number: 20140246398
    Abstract: Method for preparing a particulate material including particles of an element of group IVa, an oxide thereof or an alloy thereof, the method including: (a) dry grinding particles from an ingot of an element of group IVa, an oxide thereof or an alloy thereof to obtain micrometer size particles; and (b) wet grinding the micrometer particles dispersed in a solvent carrier to obtain nanometer size particles having a size between 10 to 100 nanometers, optionally a stabilizing agent is added during or after the wet grinding. Method can include further steps of (c) drying the nanometer size particles, (d) mixing the nanometer size particles with a carbon precursor; and (e) pyrolysing the mixture, thereby forming a coat of conductive carbon on at least part of the surface of the particles. The particulate material can be used in fabrication of an anode in an electrochemical cell or electrochemical storage energy apparatus.
    Type: Application
    Filed: September 19, 2012
    Publication date: September 4, 2014
    Applicant: Hydro-Quebec
    Inventors: Karim Zaghib, Abdelbast Zaghib, Dominic Leblanc
  • Patent number: 8821735
    Abstract: An object of the invention is to effectively remove particles on the glass substrate surfaces, even in the case wherein abrasive particles having a small particle size is used in the polishing step of the glass substrate and a supersonic treatment is performed at a high frequency at the supersonic cleaning step after the polishing step. In a manufacturing method of a glass substrate for a magnetic disk comprising a polishing step for performing polishing of the glass substrate and a supersonic cleaning step for performing supersonic cleaning of the glass substrate after the polishing step, the polishing step uses abrasive particles having a particle size of 10 nm to 30 nm and a first supersonic cleaning is performed at a frequency of 300 kHz to 1,000 kHz to form secondary particles and then a second supersonic cleaning is performed at a frequency of 30 kHz to 100 kHz in the supersonic cleaning step.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: September 2, 2014
    Assignee: Hoya Corporation
    Inventor: Yosuke Suzuki
  • Publication number: 20140242369
    Abstract: A coating having a thickness between 0.1 and 2 mm is obtained from a mixture with the following composition: 10-25% by weight of micronized powder; 40-60% by weight of inorganic gravels of petrographic origin of sizes between 0.063-2 mm; 10-40% by weight of a polymerisable base resin selected from polyurethane, polyester, epoxy or acrylic, with additives, and optionally pigments. The proportion of the mentioned gravel and micronized powder of the coating being up to 90% in an inner most area of interphase between coating and surface of the petrous substrate, covering one third of the thickness of the coating. The method includes depositing the mentioned mixture on the substrate and vibrating the assembly, and subsequently proceeding to a step of curing and subsequent mechanical finishing of the surface.
    Type: Application
    Filed: May 31, 2012
    Publication date: August 28, 2014
    Applicant: SILICALIA, SL
    Inventors: Erik Schoneveld, Francisco Sanchis Brines, Alberto Ortola, Bernardo Sanchez Sevilla
  • Publication number: 20140224766
    Abstract: An embodiment includes an annular ring having an intended direction of rotation, the ring having a top side and a bottom side, and further having an outer perimeter and an inner perimeter, and a multitude of grooves in the bottom side of the ring, each groove having an entry point at the outer perimeter connected to an exit point at the inner perimeter creating an opening through the ring, and each groove oriented so that an angle of each groove is obtuse, wherein the angle of each groove is defined as an angle between a first ray having an initial point at the entry point and having a direction along the groove towards the exit point, and a second ray having an initial point at the entry point and having a direction tangent to the annular ring at the entry point and opposite the intended direction of rotation.
    Type: Application
    Filed: February 8, 2013
    Publication date: August 14, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Taiwan Semiconductor Manufacturing Company, Ltd.
  • Publication number: 20140209566
    Abstract: The invention provides a chemical-mechanical polishing composition and a method of chemically-mechanically polishing a substrate with the chemical-mechanical polishing composition. The polishing composition comprises (a) abrasive particles, wherein the abrasive particles comprise zirconia, (b) at least one metal ion oxidizer, wherein the at least one metal ion oxidizer comprises metal ions of Co3+, Au+, Ag+, Pt2+, Hg2+, Cr3+, Fe3+, Ce4+, or Cu2+, and (c) an aqueous carrier, wherein the pH of the chemical-mechanical polishing composition is in the range of about 1 to about 7, and wherein the chemical-mechanical polishing composition does not contain a peroxy-type oxidizer.
    Type: Application
    Filed: January 30, 2013
    Publication date: July 31, 2014
    Applicant: CABOT MICROELECTRONICS CORPORATION
    Inventors: Lin Fu, Steven Grumbine, Matthias Stender
  • Patent number: 8790527
    Abstract: A method for providing waveguide structures for an energy assisted magnetic recording (EAMR) transducer is described. The waveguide structures have a plurality of widths. At least one waveguide layer is provided. Mask structure(s) corresponding to the waveguide structures and having a pattern are provided on the waveguide layer(s). The mask structure(s) include a planarization stop layer, a planarization assist layer on the planarization stop layer, and a hard mask layer on the planarization assist layer. The planarization assist layer has a low density. The pattern of the mask structure(s) is transferred to the waveguide layer(s). Optical material(s) that cover the waveguide layer(s) and a remaining portion of the mask structure(s) are provided. The optical material(s) have a density that is at least twice the low density of the planarization assist layer. The method also includes performing a planarization configured to remove at least a portion of the optical material(s).
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: July 29, 2014
    Assignee: Western Digital (Fremont), LLC
    Inventors: Guanghong Luo, Ming Jiang, Danning Yang, Yunfei Li
  • Patent number: 8790521
    Abstract: A combination, composition and associated method for chemical mechanical planarization of a tungsten-containing substrate are described herein which afford tunability of tungsten/dielectric selectivity and low selectivity for tungsten removal in relation to dielectric material. Removal rates for both tungsten and dielectric are high and stability of the slurry (e.g., with respect to pH drift over time) is high.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: July 29, 2014
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Rachel Dianne McConnell, Ann Marie Hurst
  • Publication number: 20140202950
    Abstract: The present invention relates to an anodized aluminum oxide tubular nano-porous membrane array module and method of manufacture thereof. Further the invention relates to a system of such modules. The tubular membrane modules of the present invention can be cascaded to up-scale the surface area of the overall system rather than scaling the surface area of a single tubular membrane. Thus the volume density that is the available surface area for filtration per unit volume of the system is substantially enhanced without compromising on mechanical stability to withstand the pressure differential defines by the end use application.
    Type: Application
    Filed: January 23, 2013
    Publication date: July 24, 2014
    Applicant: ASIAN INSTITUTE OF TECHNOLOGY
    Inventors: Nitin Afzulpurkar, Ajab Khan Kasi
  • Patent number: 8764996
    Abstract: A method of patterning a first material on a polymeric substrate is described. The method includes providing a polymeric film substrate having a major surface with a relief pattern including a recessed region and an adjacent raised region, depositing a first material onto the major surface of the polymeric film substrate to form a coated polymeric film substrate, forming a layer of a functionalizing material selectively on the raised region of the coated polymeric film substrate to form a functionalized raised region and an unfunctionalized recessed region, and etching the first material from the polymeric substrate selectively from the unfunctionalized recessed region.
    Type: Grant
    Filed: October 18, 2006
    Date of Patent: July 1, 2014
    Assignee: 3M Innovative Properties Company
    Inventors: Matthew H. Frey, Khanh P. Nguyen
  • Patent number: 8734661
    Abstract: A flattening method, by utilizing the advantages of the CARE method and making up for the disadvantages, can perform removal processing of a surface of a workpiece at a sufficient processing rate and can provide a processed surface having enhanced flatness without leaving damage in the processed surface. A flattening method comprises at least two surface removal steps and at least two cleaning steps, the final surface removal step being a catalyst-referred etching step comprising immersing a workpiece in a processing solution containing at least one of hydrohalic acid, hydrogen peroxide water and ozone water, and bringing a surface of a catalyst platen into contact with or close proximity to a surface to be processed of the workpiece to process the surface, said catalyst platen having in a surface a catalyst selected from the group consisting of platinum, gold, a ceramic solid catalyst, a transition metal, glass, and an acidic or basic solid catalyst.
    Type: Grant
    Filed: October 14, 2008
    Date of Patent: May 27, 2014
    Assignee: Ebara Corporation
    Inventors: Kazuto Yamauchi, Yasuhisa Sano, Hideyuki Hara, Junji Murata, Keita Yagi
  • Publication number: 20140138355
    Abstract: A pressure control assembly for a carrier head of a polishing apparatus includes a pressure supply line configured to fluidically connect to a chamber of a carrier head, a sensor to responsive to pressure in the chamber and configured to generate a signal representative of the pressure, and a pneumatic control unit configured to receive the signal, to control a pressure applied to the pressure supply line, and to record the signal in a non-transitory storage media of a storage device removably attached to the pneumatic control unit.
    Type: Application
    Filed: November 15, 2013
    Publication date: May 22, 2014
    Inventor: Simon Yavelberg
  • Patent number: 8728942
    Abstract: Mirror-polishing a front surface of a silicon wafer using polishing liquid composed of an abrasive grain-free alkaline solution including water-soluble polymers simplifies a polishing process, thus leading to an increase in productivity and a reduction in cost, and reduces the density of LPDs attributable to processing and occurring in the front surface of a mirror-polished wafer, thus improving the surface roughness of the wafer front surface.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: May 20, 2014
    Assignee: Sumico Corporation
    Inventors: Shinichi Ogata, Kazushige Takaishi, Hironori Nishimura, Shigeru Okuuchi, Shunsuke Mikuriya, Yuichi Nakayoshi
  • Patent number: 8703004
    Abstract: According to one embodiment, a method is disclosed for chemical planarization. The method can include forming a surface layer on a to-be-processed film having irregularity. The surface layer binds to or adsorbs onto the to-be-processed film along the irregularity to suppress dissolution of the to-be-processed film. The method can include planarizing the to-be-processed film in a processing solution dissolving the to-be-processed film, by rotating the to-be-processed film and a processing body while the to-be-processed film contacting the processing body via the surface layer, removing the surface layer on convex portions of the irregularity while leaving the surface layer on concave portions of the irregularity and making dissolution degree of the convex portions larger than dissolution degree of the concave portions.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: April 22, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yukiteru Matsui, Masako Kodera, Hiroshi Tomita, Gaku Minamihaba, Akifumi Gawase
  • Publication number: 20140083973
    Abstract: A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure, forming a planarization layer on the auxiliary layer and on the substrate, exposing the auxiliary layer by a chemical mechanical polishing process and removing at least partly the auxiliary layer to form a planar surface of the remaining auxiliary layer or of the layer structure and the planarization layer. The chemical mechanical polishing process has a first removal rate with respect to the planarization layer and a second removal rate with respect to the auxiliary layer and the first removal rate is greater than the second removal rate.
    Type: Application
    Filed: November 27, 2013
    Publication date: March 27, 2014
    Applicant: Infineon Technologies AG
    Inventors: Sandra Obernhuber, Christof Jalics, Joerg Adler, Uwe Hoeckele, Walter Preis, Reinhard Goellner, Tanja Schest, Patricia Nickut
  • Publication number: 20140069890
    Abstract: Embodiments of the present invention are generally directed to a substrate polishing and slurry recycling system. The system includes an extendable gutter that may be positioned to collect processing slurry from the polishing pad during processing and deliver the consumed slurry to a reclamation tank. The reclaimed slurry may be treated and mixed with fresh slurry for delivery to the polishing pad during subsequent substrate polishing. The extendable gutter may be positioned in a second position during rinsing of the polishing pad so that rinsing fluid passes underneath the gutter and is removed from the system without mixing with the reclaimed slurry.
    Type: Application
    Filed: September 9, 2013
    Publication date: March 13, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventor: Simon YAVELBERG
  • Publication number: 20140054266
    Abstract: The present invention provides chemical-mechanical polishing (CMP) methods for polishing a platinum and/or ruthenium containing substrate, and compositions suitable for use in the methods. The polishing compositions used with the methods of the invention, which contain alumina and at least one additive selected from the group consisting of a suppressor, a complexing agent, and an amino compound, allow for platinum and ruthenium to be polished. The methods of the invention provide for tailoring the relative removal rates of platinum, ruthenium, silicon oxide and silicon nitride.
    Type: Application
    Filed: August 24, 2012
    Publication date: February 27, 2014
    Inventors: Wiechang JIN, Elizabeth REMSEN
  • Publication number: 20140034606
    Abstract: A method of forming an implant to be implanted into living bone is disclosed. The method comprises the act of roughening at least a portion of the implant surface to produce a microscale roughened surface. The method further comprises the act of immersing the microscale roughened surface into a solution containing hydrogen peroxide and a basic solution to produce a nanoscale roughened surface consisting of nanopitting superimposed on the microscale roughened surface. The nanoscale roughened surface has a property that promotes osseointegration.
    Type: Application
    Filed: October 9, 2013
    Publication date: February 6, 2014
    Applicant: Biomet 3i, LLC
    Inventors: Robert L. Mayfield, Ross W. Towse
  • Publication number: 20140027407
    Abstract: A chemical mechanical polishing apparatus includes a carrier head including a retaining ring having a plastic portion with a bottom surface to contact a polishing pad, an in-situ monitoring system including a sensor that generates a signal that depends on a thickness of the plastic portion, and a controller configured to receive the signal from the in-situ monitoring system and to adjust at least one polishing parameter in response to the signal to compensate for non-uniformity caused by changes in the thickness of the plastic portion of the retaining ring.
    Type: Application
    Filed: March 8, 2013
    Publication date: January 30, 2014
    Inventors: Sameer Deshpande, Zhihong Wang, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate, Hung Chih Chen, Wen-Chiang Tu
  • Publication number: 20130330688
    Abstract: The present invention relates to a modified polymeric material. The modified polymeric material includes a polymer having a modified surface, where the modified surface includes nano, micron, and/or submicron scale features. The present invention also relates to an implant comprising the modified polymeric material. The present invention further relates to processes for making the modified polymeric material and the implant.
    Type: Application
    Filed: June 22, 2011
    Publication date: December 12, 2013
    Applicant: NANOVIS, INC.
    Inventors: Matthew Hedrick, Ganesan Balasundaram, Chang Yao
  • Publication number: 20130327985
    Abstract: A ceramic composite for light conversion comprising a solidified body in which crystalline phases of oxides are three-dimensionally entangled and a method for manufacture thereof. A manufacture method of a ceramic composite for light conversion is characterized in that a polishing step is provided in a chemical mechanical polishing (CMP) process applied to the surface of a solidified body with a structure in which an Al2O3 phase and other phases are three-dimensionally entangled.
    Type: Application
    Filed: December 2, 2011
    Publication date: December 12, 2013
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Dai Inamori, Takafumi Kawano, Toshiro Doi, Syuhei Kurokawa
  • Publication number: 20130319833
    Abstract: A rigid substrate, a touch panel including the rigid substrate, and a processing method of the rigid substrate are provided. The rigid substrate includes an ion strengthened surface layer completely covering the entire outer surface thereof. The rigid substrate has an etched wall, wherein an average depth of the ion strengthened surface layer on the etched wall is substantially equivalent to an average depth of the ion strengthened surface layer outside of the etched wall.
    Type: Application
    Filed: May 30, 2013
    Publication date: December 5, 2013
    Applicants: WINTEK CORPORATION, Wintek (China)Technology Ltd.
    Inventors: Chia-Huang Lee, Ming-Kung Wu, Heng-Chia Kuo
  • Publication number: 20130313226
    Abstract: The invention provides a chemical-mechanical polishing composition containing wet-process silica, an oxidizing agent that oxidizes nickel-phosphorous, a chelating agent, polyvinyl alcohol, and water. The invention also provides a method of chemically-mechanically polishing a substrate, especially a nickel-phosphorous substrate, by contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.
    Type: Application
    Filed: May 23, 2012
    Publication date: November 28, 2013
    Applicant: CABOT MICROELECTRONICS CORPORATION
    Inventors: Selvaraj Palanisamy Chinnathambi, Haresh Siriwardane
  • Publication number: 20130313225
    Abstract: The invention provides a chemical-mechanical polishing composition containing zirconia particles, a modifying agent that adheres to the zirconia particles, an organic acid, and water, as well as a method of using such a polishing composition to polish substrates and a method of using a polishing composition comprising zirconia particles, an organic acid, an oxidizing agent, and water to polishing substrates containing metal and oxide-based dielectric materials.
    Type: Application
    Filed: May 22, 2012
    Publication date: November 28, 2013
    Applicant: CABOT MICROELECTRONICS CORPORATION
    Inventors: Wiechang Jin, John Parker, Elizabeth Remsen
  • Patent number: 8592315
    Abstract: In an embodiment, a chemical mechanical polishing method for a substrate having a first layer and a stepped portion. A surface of the first layer is positioned above an upper face of the stepped portion. A polishing process for selectively removing the stepped portion is performed on the first layer by using a first slurry composition that has a self-stopping characteristic so that the first layer is changed into a second layer having a substantially flat surface. A second polishing process is performed using a second slurry composition that does not have the self-stopping characteristic, until the upper face of the stepped portion is exposed.
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: November 26, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Keun Kim, Chung-Ki Min, Yong-Sun Ko, Kyung-Hyun Kim
  • Publication number: 20130292357
    Abstract: Processes of fabricating different surface topographies, which may include separate macro processing, micro processing, and nano processing steps, in order to produce an interbody spinal implant having at least three distinct surfaces including (1) at least one integration surface having a roughened surface topography including macro features, micro features, and nano features, without sharp teeth that risk damage to bone structures; (2) at least one graft contact surface having a coarse surface topography including micro features and nano features; and (3) at least one soft tissue surface having a substantially smooth surface including nano features.
    Type: Application
    Filed: June 28, 2013
    Publication date: November 7, 2013
    Inventors: Peter F. Ullrich, JR., Chad J. Patterson, Jennifer M. Schneider
  • Patent number: 8563436
    Abstract: A method for chemical mechanical polishing of a semiconductor wafer containing a nonferrous metal is provided, comprising: providing a chemical mechanical polishing composition comprising 1 to 25 wt % of an oxidizer; 0.01 to 15 wt % of an inhibitor for the nonferrous metal; 0.005 to 5 wt % of a copolymer of poly(ethylene glycol) methyl ether(meth)acrylate and 1-vinylimidazole; and water; wherein the chemical mechanical polishing composition has an acidic pH; providing a chemical mechanical polishing pad; providing a semiconductor wafer containing the nonferrous metal; creating dynamic contact between the chemical mechanical polishing pad and the semiconductor wafer; and, dispensing the polishing solution at or near the interface between the chemical mechanical polishing pad and the semiconductor wafer.
    Type: Grant
    Filed: April 1, 2013
    Date of Patent: October 22, 2013
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Tirthankar Ghosh, Terence M. Thomas, Hongyu Wang, Scott A. Ibbitson
  • Patent number: 8562842
    Abstract: A method of fabricating a nanoimprint stamp includes forming a resist pattern having a nano size width on a stamp substrate by performing imprint processes repeatedly. In the imprint processes, resist layers that are selectively etched are sequentially used. The stamp substrate is etched using the resist pattern as an etch mask.
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: October 22, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Du-hyun Lee, Byung-kyu Lee, Woong Ko
  • Publication number: 20130260027
    Abstract: Provided are: a method for manufacturing a glass substrate for a magnetic disk by using an alternative abrasive having the same polishing performance as cerium oxide, which has conventionally been used as an abrasive for polishing principal faces of glass substrates for magnetic disks; and a method for manufacturing a magnetic disk. At the time of polishing a principal face of a magnetic disk glass substrate by using a slurry, the disclosure employs a slurry containing: an abrasive made of granular zirconia; a first additive including a phosphate and/or a sulfonate; and a second additive including a re-aggregation inhibitor.
    Type: Application
    Filed: December 29, 2011
    Publication date: October 3, 2013
    Applicant: HOYA CORPORATION
    Inventors: Kyosuke IIIzumi, Yoshihiro Tawara, Kotaro Yoshimaru
  • Patent number: 8546261
    Abstract: A polishing slurry includes an abrasive, a dispersion agent, a polish accelerating agent and an adhesion inhibitor. The adhesion inhibitor includes a benzene compound combined with a carboxyl group. Methods of planarizing an insulating layer using the slurry are also provided.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: October 1, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sangkyun Kim, NamSoo Kim, JongWoo Kim, Yun-Jeong Kim
  • Publication number: 20130248486
    Abstract: A highly polished surface on an aluminum substrate is formed using any number of machining processes. During the machining process, intermetallic compounds are typically generated at a top surface area of the aluminum substrate caused by spot heat generated between the tool edge and the cut tip of the aluminum substrate during the cutting process. The intermetallic compounds can leave surface imperfections after conventional mechanical polishing operations that render the surface of the aluminum substrate difficult to obtain a desired high glossiness due to exfoliation of the intermetallic compounds from the top surface. In order to remove the effect of the intermetallic compounds, an electron beam is applied to the surface resulting in Joule heating to melt down a top surface zone. In this way, any tooling traces and intermetallic compounds are eliminated.
    Type: Application
    Filed: September 26, 2012
    Publication date: September 26, 2013
    Applicant: Apple Inc.
    Inventors: SIMON R. LANCASTER-LAROCQUE, Purwadi RAHARJO, Kensuke UEMURA
  • Publication number: 20130248487
    Abstract: A method of forming an implant to be implanted into living bone is disclosed. The method comprises the act of roughening at least a portion of the implant surface to produce a microscale roughened surface. The method further comprises the act of immersing the microscale roughened surface into a solution including potassium hydroxide to produce a nanoscale roughened surface consisting of a web-like structure superimposed on the microscale roughened surface. The nanoscale roughened surface has a property that promotes osseointegration.
    Type: Application
    Filed: March 11, 2013
    Publication date: September 26, 2013
    Applicant: Biomet 3i, LLC
    Inventors: Robert L. Mayfield, Ross W. Towse
  • Patent number: 8541310
    Abstract: The present invention provides a chemical-mechanical polishing (CMP) composition for polishing a ruthenium-containing substrate in the presence of hydrogen peroxide without forming a toxic level of ruthenium tetroxide during the polishing process. The composition comprises (a) a catalytic oxidant comprising a water-soluble peroxometalate complex, an oxidizable precursor of a peroxometalate complex, or a combination thereof, (b) a particulate abrasive; and (c) an aqueous carrier. The peroxometalate complex and the precursor thereof each have a reduced form that is oxidizable by hydrogen peroxide to regenerate the peroxometalate complex during chemical-mechanical polishing. CMP methods for polishing ruthenium-containing surfaces with the CMP composition are also provided.
    Type: Grant
    Filed: May 4, 2007
    Date of Patent: September 24, 2013
    Assignee: Cabot Microelectronics Corporation
    Inventors: Daniela White, John Parker
  • Publication number: 20130244433
    Abstract: The invention provides a chemical-mechanical polishing composition containing a ceria abrasive, one or more nonionic polymers, optionally one or more phosphonic acids, optionally one or more nitrogen-containing zwitterionic compounds, optionally one or more sulfonic acid copolymers, optionally one or more anionic copolymers, optionally one or more polymers comprising quaternary amines, optionally one or more compounds that adjust the pH of the polishing compositions, water, and optionally one or more additives. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains silicon oxide, silicon nitride, and/or polysilicon.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 19, 2013
    Applicant: Cabot Microelectronics Corporation
    Inventors: Brian Reiss, Glenn Whitener
  • Publication number: 20130220973
    Abstract: Provided is a method for producing a glass hard disk substrate, including steps of polishing a glass substrate with an acidic polishing liquid; and subjecting the obtained substrate to alkali cleaning. This method can inhibit degradation of surface roughness of the glass substrate in the alkali cleaning step while maintaining a polishing rate in the polishing step, and further can improve cleanliness. The method for producing a glass hard disk substrate includes the following steps (1) and (2): (1) polishing a glass substrate to be polished using a polishing composition of pH 1.0-4.2 that contains a polyvalent amine compound having 2 to 10 nitrogen atoms in the molecule; and (2) cleaning the substrate obtained in the step (1) using a cleaner composition of pH 8.0-13.0.
    Type: Application
    Filed: October 26, 2011
    Publication date: August 29, 2013
    Applicant: KAO CORPORATION
    Inventors: Haruhiko Doi, Nobuyuki Aono
  • Patent number: 8518297
    Abstract: The present invention provides a polishing composition that can be suitably used in polishing of polysilicon, and a polishing method using the polishing composition. The polishing composition contains abrasive grains and an anionic surfactant having a monooxyethylene group or a polyoxyethylene group and has a pH of 9 to 12. If the anionic surfactant contained in the polishing composition has a polyoxyethylene group, the number of repeating oxyethylene units in the polyoxyethylene group is preferably 2 to 8. The anionic surfactant contained in the polishing composition can be an anionic surfactant that has a phosphate group, a carboxy group, or a sulfo group as well as a monooxyethylene group or a polyoxyethylene group. The content of the anionic surfactant in the polishing composition is preferably 20 to 500 ppm.
    Type: Grant
    Filed: January 30, 2009
    Date of Patent: August 27, 2013
    Assignee: Fujimi Incorporated
    Inventors: Mikikazu Shimizu, Tomohiko Akatsuka, Kazuya Sumita
  • Patent number: 8506832
    Abstract: Example embodiments are directed to a wafer dividing apparatus and method thereof. The wafer dividing apparatus includes a chuck unit having upper and lower chucks, a cutting wire that is provided in a space between the upper and lower chucks to cut a wafer and driven by a first driving unit, and an etchant supplying nozzle supplying etchant to a groove of the wafer, which is formed by the cutting wire.
    Type: Grant
    Filed: August 11, 2010
    Date of Patent: August 13, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hotae Jin, Seonju Oh, HeuiSeog Kim
  • Publication number: 20130196289
    Abstract: Two-part implant for attachment of artificial teeth comprising a base body having a bone contact surface and a soft tissue contact surface. Said soft tissue contact surface is at least partially hydroxylated or silanated which results in an improved soft tissue integration.
    Type: Application
    Filed: January 31, 2013
    Publication date: August 1, 2013
    Applicant: Straumann Holding AG
    Inventors: Frank Schwarz, Jurgen Becker, Marco Wieland, Michel Dard
  • Patent number: 8486288
    Abstract: A pattern forming method including: (a) forming a porous layer above an etching target layer; (b) forming an organic material with a transferred pattern on the porous layer; (c) forming, by use of the transferred pattern, a processed pattern in a transfer oxide film that is more resistant to etching than the porous layer; and (d) transferring the processed pattern to the etching target layer by use of the transfer oxide film as a mask.
    Type: Grant
    Filed: March 16, 2011
    Date of Patent: July 16, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Takashi Ohashi
  • Publication number: 20130163801
    Abstract: A transparent panel including a plurality of microholes, which has improved shock resistance by distributing external shocks and allows distortion-free audio data to pass through the same while preventing or substantially preventing infiltration of foreign materials, a method for manufacturing the same, and a mobile device using the same. A transparent panel including a panel having a thickness and a plurality of microholes formed at a side of the panel, a diameter of each of the microholes being 50 to 500 ?m.
    Type: Application
    Filed: September 12, 2012
    Publication date: June 27, 2013
    Inventors: Chung Soo Ha, Byung Chul Oh
  • Publication number: 20130142691
    Abstract: Provided is a method for preventing the elution of Bi from copper alloy, in which the elution of Bi is prevented in leadless copper-alloy plumbing equipment and the like containing a trace of lead and a predetermined amount of Bi. The present invention relates to a method for preventing the elution of Bi from copper alloy in which at least Bi present on the surface of copper alloy containing Bi is selectively removed by preferentially dissolving Bi in a 4 to 20 mass % concentration of nitric acid while suppressing Cu dissolution. Furthermore, elution of Pb is suppressed using a 10-20 mass % concentration of nitric acid. In this case, by removing at least Bi present on the surface of copper alloy containing Bi using nitric acid and then treating the surface of the copper alloy by shot-blasting corrosive products, such as oxides, produced from the nitric acid are removed, and gloss is imparted to the surface.
    Type: Application
    Filed: August 24, 2011
    Publication date: June 6, 2013
    Applicant: KITZ CORPORATION
    Inventor: Tomoyuki Ozasa
  • Publication number: 20130141769
    Abstract: A method for fabricating a micro-structure is provided, which can simply and easily fabricate the micro-structure by a batch process of directly forming a highly aligned nano-material array on a micro-structure to be used as an adhesive material during plastic deformation of the micro-structure without the use of existing complicated fabrication process.
    Type: Application
    Filed: June 4, 2012
    Publication date: June 6, 2013
    Applicant: INDUSTRY-ACADEMIC COOPERATION FOUNDATION YONSEI UNIVERSITY
    Inventors: Jongbaeg KIM, Youngkee EUN, Jae-Ik LEE, Jungwook CHOI, Youngsup SONG
  • Publication number: 20130140273
    Abstract: A slurry for chemical mechanical polishing of Co. The slurry comprises components by weight as follows, Inhibitor 0.01-2%, Oxidant 0-5%, Abrasive 0.1-10%, Complexing agent 0.001-10%, and the rest of water. The pH value of the slurries is adjusted to 3-5 by a pH value adjustor. The inhibitor is chosen from one or more kinds of five-membered heterocycle compound containing S and N atoms or containing S or N atom. The oxidant is one or more chosen from H2O2, (NH4)2S2O8, KIO4, and KClO5. The abrasive is one or more chosen from SiO2, CeO2, and Al2O3. The complexing agent is one or more chosen from amino acid and citric acid. The slurry can effectively prevent Co over corrosion and reduce the polishing rate of Co in the polishing process.
    Type: Application
    Filed: December 5, 2011
    Publication date: June 6, 2013
    Inventors: Haisheng Lu, Xinping Qu, Jingxuan Wang
  • Publication number: 20130139948
    Abstract: A vacuum insulated glass (VIG) panel includes a first glass panel and a second glass panel spaced from the first glass panels. A spacer is disposed between the first and second glass panels. The spacer includes first and second generally opposed faces, and a plurality of sides extending therebetween. The spacer is processed using tumbling and polishing operations to preferably round all corners of the spacer and form a circular contact footprint on opposed side faces of the spacer. The spacer surface break conditions are measured during tumbling and/or polishing operations using optical flat measuring equipment. Following the polishing operation the spacer is thermally processed to strengthen the spacer.
    Type: Application
    Filed: December 5, 2011
    Publication date: June 6, 2013
    Applicant: RAYOTEK SCIENTIFIC, INC.
    Inventor: William Raggio
  • Publication number: 20130135974
    Abstract: The present invention relates to a balance spring intended to equip a balance of a mechanical timepiece, formed by a spiral bar resulting from machining a fused quartz plate, which has a positive thermal coefficient of rigidity, the bar constituting a core at least locally covered by at least one outer layer having a different structure to modify the thermal coefficient of rigidity.
    Type: Application
    Filed: December 14, 2011
    Publication date: May 30, 2013
    Applicant: CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA RECHERCHE ET DEVEL
    Inventors: Philippe NIEDERMANN, Jacek BABOROWSKI
  • Publication number: 20130126474
    Abstract: The invention describes a process to remove a recast layer and/or burrs from machining processes to provide a surface of a titanium medical device without dissipation of copper or zinc from the surface of the medical device.
    Type: Application
    Filed: November 21, 2011
    Publication date: May 23, 2013
    Inventors: Alan Shi, Bernard Q. Li, Daniel D. Sorensen, Darren A. Janzig
  • Publication number: 20130119015
    Abstract: An object of the invention is to effectively remove particles on the glass substrate surfaces, even in the case wherein abrasive particles having a small particle size is used in the polishing step of the glass substrate and a supersonic treatment is performed at a high frequency at the supersonic cleaning step after the polishing step. In a manufacturing method of a glass substrate for a magnetic disk comprising a polishing step for performing polishing of the glass substrate and a supersonic cleaning step for performing supersonic cleaning of the glass substrate after the polishing step, the polishing step uses abrasive particles having a particle size of 10 nm to 30 nm and a first supersonic cleaning is performed at a frequency of 300 kHz to 1,000 kHz to form secondary particles and then a second supersonic cleaning is performed at a frequency of 30 kHz to 100 kHz in the supersonic cleaning step.
    Type: Application
    Filed: March 31, 2011
    Publication date: May 16, 2013
    Applicant: HOYA CORPORATION
    Inventor: Yosuke Suzuki
  • Publication number: 20130115728
    Abstract: Provided is a fusing method of a substrate layer including: treating a joining surface of a substrate layer formed from a resin using an organic solvent having solubility with respect to the resin; and heating the treated substrate layer at less than a glass transition temperature or a softening point temperature of the resin and crimping the heated substrate layer.
    Type: Application
    Filed: October 29, 2012
    Publication date: May 9, 2013
    Applicants: SONY DADC CORPORATION, SONY CORPORATION
    Inventors: Sony Corporation, Sony DADC Corporation