Abstract: A method to fabricate a hierarchical graduated-branched structure that grows in a three-dimensional pattern down to fractal-branching, nano-size level is detailed. The fractal patterning is accomplished on a three-dimensional (i.e., non-planar) surface, by exposing the surface to a properly focused particle beam, which causes the spontaneous growth of graduated branches all over the surface. The structure can be fabricated with a single material and the fractal-patterning is done in a one step process. No addition of material is required for the formation of each branch. The fractal graduated branching structure can then be molded in order to produce replicas.

Abstract: Disclosed is a polishing slurry for sapphire polishing that is capable of obtaining polishing speeds and smooth surfaces during the polishing of sapphire substrates that are equivalent to or better than in prior polishing processes even if the number of polishers and polishing hours are reduced. Also disclosed is a sapphire substrate polishing method. The slurry includes alumina abrasives and has a pH adjusted to the range of 10.0 to 14.0, and the sapphire is polished by means of the CMP technique by applying said slurry. The aforementioned alumina abrasives more preferably include at least ?-alumina, and the content thereof is more preferably 0.01 to 50 wt %. The mean particle size of the aforementioned alumina abrasives is preferably 0.05 to 10 ?m.

Abstract: Disclosed is a method for polishing a silicon wafer, wherein a surface to be polished of a silicon wafer is rough polished, while supplying a polishing liquid, which is obtained by adding a water-soluble polymer to an aqueous alkaline solution that contains no free abrasive grains, to a polishing cloth. Consequently, the surface to be polished can be polished at high polishing rate and the flatness of the edge portion including roll-off and roll-up can be controlled.

Abstract: The present invention relates to slurry for polishing crystalline phase-change materials and to a method for producing a phase-change device using the same. The slurry for polishing crystalline phase-change materials according to one embodiment of the present invention comprises an abrasive, an alkaline abrasive enhancer, an oxidizing agent having a standard reduction potential higher than that of perchlorates, and ultrapure water. In addition, the method for producing a phase-change device according to one embodiment of the present invention comprises the following steps: preparing a substrate; forming a crystalline phase-change material film on the substrate; and removing the phase-change material film through a chemical-mechanical polishing process using slurry for polishing phase-change materials, which comprises an abrasive, an alkaline abrasive enhancer, an oxidizing agent having a standard reduction potential higher than that of perchlorates, and ultrapure water.

Abstract: Diamond electrodes with improved adhesion of the diamond layer to the electrode are produced by sandblasting a surface of the electrode body, and then non-oxidatively etching the roughened (sandblasted) surface so as to remove at least 5 ?m of material from under the roughened surface. By removing at least 5 ?m of material, the sand particulates in the surface of the electrode body are eliminated, and damage in the form of cracks in the electrode body which result from sandblasting is reduced or eliminated, and further, a surface metal oxide coating is not created. All of these contribute to preparing a surface where spalling of the diamond layer is less likely to occur. Concentrated phosphoric acid is an exemplary non-oxidative etchant used in the process.

Abstract: This invention provides an inexpensive and rapid method for fabricating a high-anisotropic-etch ratio, shaped glass structures using a novel photosensitive glass composition. Structures of the photosensitive glass may include micro-channels, micro-optics, microposts, or arrays of hollow micro-needles. Furthermore, such shaped glass structures can be used to form a negative mold for casting the shape in other materials.

Abstract: The polishing solution for copper polishing of the invention comprises a first organic acid component which is at least one type selected from among an organic acid containing a hydroxyl group, an organic acid salt and an organic acid anhydride, an inorganic acid component which is at least one type selected from among a dibasic or greater inorganic acid and an inorganic acid salt, an amino acid, a protective film-forming agent, an abrasive grain, an oxidizing agent and water, wherein the inorganic acid component content in terms of inorganic acid is 0.15 mass % or greater, the amino acid content is 0.30 mass % or greater, the protective film-forming agent content is 0.10 mass % or greater, based on the entire polishing solution for copper polishing, and the ratio of the first organic acid component content in terms of organic acid with respect to the protective film-forming agent content is at least 1.5.

Abstract: An aqueous polishing agent, comprising, as the abrasive, at least one kind of polymer particles (A) finely dispersed in the aqueous phase and having at their surface a plurality of at least one kind of functional groups (al) capable of interacting with the metals and/or the metal oxides on top of the surfaces to be polished and forming complexes with the said metals and metal cations, the said polymer particles (A) being preparable by the emulsion or suspension polymerization of at least one monomer containing at least one radically polymerizable double bond in the presence of at least one oligomer or polymer containing a plurality of functional groups (a1); graft copolymers preparable by the emulsion or suspension polymerization of at least one monomer containing at least one radically polymerizable double bond in the presence of at least one oligomeric or polymeric aminotriazine-polyamine condensate; and a process for the chemical and mechanical polishing of patterned and unstructured metal surfaces making

Abstract: A composite interbody spinal implant including a body having a top surface, a bottom surface, opposing lateral sides, and opposing anterior and posterior portions; a first integration plate affixed to the top surface of the body; and an optional second integration plate affixed to the bottom surface of the body. At least a portion of the first integration plate, optional second integration plate, or both has a roughened surface topography including macro features, micro features, and nano features, without sharp teeth that risk damage to bone structures, adapted to grip bone through friction, inhibit migration of the implant, and promote bone growth. Also disclosed are processes of fabricating a roughened surface topography, which may include separate and sequential macro processing, micro processing, and nano processing steps.

Abstract: A chuck apparatus for holding a substrate is the disclosed. The chuck apparatus includes a first surface portion on which the substrate is to be held and a second surface portion adjacent to the first surface portion and extending at least partially around an edge of the first surface portion and which, in use, is arranged to deflect gas over the first surface portion and thus the substrate that is to be held on the first surface portion.

Abstract: An interbody spinal implant, such as a solid-body or composite implant, includes at least one graft contact surface as one or more of the internal surfaces of the implant. The graft contact surface, for example, having at least one ridge or groove is designed to contact and promote retention and stabilization of bone growth-inducing materials placed within the internal openings of the implant body. In addition, the ridges or grooves may influence the biological processes to promote bone healing and fusion. Also disclosed are processes of fabricating the graft contact surfaces and other surface topographies on the implant.

Abstract: A method for treatment of a product wafer temporarily bonded on a carrier wafer with the following steps: grinding and/or backthinning of the product wafer on one flat side facing away from the carrier wafer to a product wafer thickness D of <150 ?m, especially <100 ?m, preferably <75 ?m, even more preferably <50 ?m, especially preferably <30 ?m, surface treatment of the flat side with means for reducing an especially structural intrinsic stress of the product wafer.

Abstract: In a liquid processing apparatus configured to remove, from a substrate including a first film and a second film formed above the first film, the first film and the second film, a first chemical-liquid supply part supplies, to a substrate W, a first liquid for dissolving the first film, a second chemical-liquid supply part supplies a second chemical liquid for weakening the second film, and a fluid supply part serving also as an impact giving part gives a physical impact to the second film so as to break the second film and supplies a fluid for washing away debris of the broken second film. A control device controls the respective parts such that, after the second liquid has been supplied and then the fluid has been supplied from the fluid supply part, the first chemical liquid is supplied.

Abstract: The invention relates to a method for obtaining a surface of a titanium-based metal implant intended to be inserted into bone tissue, comprising: (a) projecting particles of aluminum oxide under pressure on the external area of the implant; (b) chemically treating the sandblasted external area of the implant with an acid composition comprising sulfuric acid and hydrofluoric acid; and (c) thermally treating the sandblasted external area of the implant by heating at a temperature of 200-450° C. for 15-120 min. The invention likewise defines a metal implant having said surface. The surface thus obtained has good micrometer-scale roughness with a suitable morphology, as well as a composition which is virtually free of impurities and a thickness which is approximately three times the thickness of conventional surfaces, which characteristics provide it with very good osseointegration properties.

Abstract: A polishing mixture and related method of polishing a material wafer surface, such as silicon carbide, are disclosed. The polishing mixture comprises; an abrasive and an oxidizer mixed in an acidic solution. Alumina may be used as the abrasive and the polishing mixture may have a pH less than or equal to seven (7).

Abstract: A process for removing a bulk material layer from a substrate and planarizing the exposed surface by CMP by (1) providing an CMP agent exhibiting at the end of the chemical mechanical polishing, without the addition of supplementary materials, the same SER as at its start and a lower MRR than at its start,—an SER which is lower than the initial SER and an MRR which is the same or essentially the same as the initial MRR or a lower SER and a lower MRR than at its start; (2) contacting the surface of the bulk material layer with the CMP agent; (3) the CMP of the bulk material layer with the CMP agent; and (4) continuing the CMP until all material residuals are removed from the exposed surface; and a CMP agent and their use for manufacturing electrical and optical devices.

Abstract: A method of producing a generally uniformly roughened surface on Ti 6/4 alloy or titanium for contact with living bone comprises exposing the Ti 6/4 alloy or titanium in an aqueous solution of citric acid and hydrofluoric acid for a suitable time period to remove the native oxide from the Ti 6/4 alloy or titanium so as to expose the Ti 6/4 or titanium metal surface and create the desired surface topography.

Abstract: A method of making an injectable or implantable active agent delivery device capable of delivering a diagnostic, therapeutic, and/or prophylactic agent to a desired targeted site having orifice(s) on the surface is disclosed herein providing unidirectional release of the agent at a controlled desirable rate. The agent may include, but is not limited to, drugs, proteins, peptides, biomarkers, bioanalytes, and/or genetic material. The technology of the invention is based on parallel processing to fabricate micro-holes on tubes employing photo-lithography and reactive ion etching techniques and also incorporates a simple molding method to form the micro-holes on flexible polymer tubes, including bio-degradable tubes. The parallel processing method of the instant invention is fast, economical and well suited for mass production. The developed device, due to its composite structure, has the ability to combine several release mechanisms, leading to zero-order release kinetics for most of the time.

Abstract: A polishing agent for copper polishing, comprising (A) an inorganic acid with divalent or greater valence, (B) an amino acid, (C) a protective film-forming agent, (D) an abrasive, (E) an oxidizing agent and (F) water, wherein the content of the component (A) is at least 0.08 mol/kg, the content of the component (B) is at least 0.20 mol/kg, the content of the component (C) is at least 0.02 mol/kg, and either or both of the following conditions (i) and (ii) are satisfied. (i): The proportion of the content of the component (A) with respect to the content of the component (C) is 2.00 or greater. (ii): It further comprises (G) at least one kind selected from among organic acids and their acid anhydrides.

Abstract: A method of manufacturing a glass substrate for a magnetic recording medium, wherein inner and outer circumference end faces of a disk-like glass substrate having a central aperture are at least treated by: a step of grinding, a step of etching, and a step of polishing, wherein the steps are performed in this order.

Abstract: A substrate having appropriate strength and allowing firm bonding to a piezoelectric substrate and the like can be obtained at a lower cost. The substrate for an SAW device is formed of spinel, and PV value representing difference in level of one main surface of the substrate is at least 2 nm and at most 8 nm. Preferably, average roughness Ra of one main surface of the substrate is at least 0.01 nm and at most 0.5 nm. With such characteristics, the main surface of the substrate to be bonded to a piezoelectric substrate of the SAW device can be bonded satisfactorily to the piezoelectric material forming the piezoelectric substrate utilizing van der Waals interaction.

Abstract: A processes for treating the surface of a dental implant wherein the dental implant after the machining operation undergoes a sequence of processes that are associated with the removal of all surface contamination, promoting the conditions to form a texturing and an oxide layer with thickness and composition that induces the interaction between the organism and the implant.

Abstract: A method of forming an image. The method includes: a transfer layer on a substrate; forming on the transfer layer, an etch barrier layer; pressing a template having a relief pattern into the etch barrier layer; exposing the etch barrier layer to actinic radiation forming a cured etch barrier layer having thick and thin regions corresponding to the relief pattern; removing the template; removing the thin regions of the cured etch barrier layer; removing regions of the transfer layer not protected by the etch barrier layer; removing regions of the substrate not protected by the transfer layer and any remaining etch barrier layer; and removing remaining transfer layer. The transfer layer may be removed using a solvent, the etch barrier layer may include a release agent and an adhesion layer may be formed between the transfer layer and the etch barrier layer. A reverse tone process is also described.

Abstract: An abrasive liquid for a metal comprising (1) an oxidizing agent for a metal, (2) a dissolving agent for an oxidized metal, (3) a first protecting film-forming agent such as an amino acid or an azole which adsorbs physically on the surface of the metal and/or forms a chemical bond, to thereby form a protecting film, (4) a second protecting film-forming agent such as polyacrylic acid, polyamido acid or a salt thereof which assists the first protecting film-forming agent in forming a protecting film and (5) water; and a method for polishing.

Abstract: A polishing agent for copper polishing, comprising (A) an inorganic acid with divalent or greater valence, (B) an amino acid, (C) a protective film-forming agent, (D) an abrasive, (E) an oxidizing agent and (F) water, wherein the content of the component (A) is at least 0.08 mol/kg, the content of the component (B) is at least 0.20 mol/kg, the content of the component (C) is at least 0.02 mol/kg, and either or both of the following conditions (i) and (ii) are satisfied. (i): The proportion of the content of the component (A) with respect to the content of the component (C) is 2.00 or greater. (ii): It further comprises (G) at least one kind selected from among organic acids and their acid anhydrides.

Abstract: A method for growing a crystalline composition, the first crystalline composition may include gallium and nitrogen. The crystalline composition may have an infrared absorption peak at about 3175 cm?1, with an absorbance per unit thickness of greater than about 0.01 cm?1. In one embodiment, the composition ay have an amount of oxygen present in a concentration of less than about 3×1018 per cubic centimeter, and may be free of two-dimensional planar boundary defects in a determined volume of the first crystalline composition.

Abstract: A process for preparing an imaging surface of an imaging transfer member in a printing machine, the process comprises providing a surface roughness to the imaging surface to produce a plurality of pits having sharp features on the surface, and then exposing the pitted imaging surface to an acid dip for a time period sufficient to substantially reduce the sharp features on the imaging surface. This process may be followed by anodization. The process produces an imaging surface having a pit structure providing reduced oil consumption and wear of components of the printing machine that contact the imaging surface.

Abstract: A method for texturing a surface of a substrate comprising creating micro-fractures in the surface of the substrate to be textured, and etching the surface of the substrate to be textured to open the micro-fractures.

Abstract: An electronic grade synthetic quartz glass substrate having a recess, channel or step is manufactured by machining at least one surface of a synthetic quartz glass substrate having a maximum birefringence of up to 3 nm/cm in its entirety to form a recess, channel or step, and removing the residual stress due to machining.

Abstract: Super-hydrophobic and self-cleaning articles produced by imprinting exposed surfaces with suitable fine-grained and/or amorphous metallic embossing dies to transfer a dual surface structure, including ultra-fine features less than or equal to 100 nm embedded in and overlaying a surface topography with macro-surface structures greater than or equal to 1 micron are disclosed.

Abstract: A method of forming an implant to be implanted into living bone is disclosed. The method comprises the act of roughening at least a portion of the implant surface to produce a microscale roughened surface. The method further comprises the act of immersing the microscale roughened surface into a solution containing hydrogen peroxide and a basic solution to produce a nanoscale roughened surface consisting of nanopitting superimposed on the microscale roughened surface. The nanoscale roughened surface has a property that promotes osseointegration.

Abstract: A method for manufacturing a glass substrate for a magnetic disk comprises a surface grinding step of processing a mirror-surface plate glass, having a main surface in the form of a mirror surface, to a required flatness and surface roughness using fixed abrasive particles. The method comprises, before the surface grinding step using the fixed abrasive particles, a surface roughening step of roughening the surface of the mirror-surface plate glass by frosting.

Abstract: Abrasive particles having a particle diameter of not more than 100 nm are manufactured from raw material. The manufactured abrasive particles are separately dispersed, and are coated with a polymer. Coated abrasive particles having a particle diameter of not more than 100 nm are selected and are mixed with a liquid component of a slurry to manufacture the slurry. A pH adjuster and a viscosity agent are added to the slurry. A glass substrate is polished using the manufactured slurry. Since the abrasive particles having a particle diameter of more than 100 nm or an agglomerate of the cohering abrasive particles does not contact the glass and does not cause big scratches on the glass, the generation of the scratches of 70 nm or more on the glass during polishing are suppressed.

Abstract: A method for manufacturing surgical blades from either a crystalline or poly-crystalline material, preferably in the form of a wafer, is disclosed. The method includes preparing the crystalline or poly-crystalline wafers by mounting them and machining trenches into the wafers. The methods for machining the trenches, which form the bevel blade surfaces, include a diamond blade saw, laser system, ultrasonic machine, and a hot forge press. The wafers are then placed in an etchant solution which isotropically etches the wafers in a uniform manner, such that layers of crystalline or poly-crystalline material are removed uniformly, producing single or double bevel blades. Nearly any angle can be machined into the wafer which remains after etching. The resulting radii of the blade edges is 5-500 nm, which is the same caliber as a diamond edged blade, but manufactured at a fraction of the cost.

Abstract: A chemical mechanical polishing slurry containing multiple oxidizers and nano abrasive particles (including engineered nano diamond particles) suitable for polishing multilayer substrate with tungsten and Ti/TiN barrier layers. The slurry contains no metallic catalyst and has low total abrasive particle content. The absence of metal ions can be advantageous for certain applications as certain metal ions may present contamination issues. A low total abrasive content may also lower the total defect counts, reduce the slurry waste treatment burden, and simplify the post CMP clean process.

Abstract: A method produces nanoparticles by electrospinning a silicon composition having at least one silicon atom. The electrospinning of the silicon composition forms fibers. The fibers are pyrolyzed to produce the nanoparticles. The nanoparticles have excellent photo-luminescent properties and are suitable for use in many different applications.

Abstract: The present invention relates to a method for polishing a substrate to be polished, including polishing a Ni—P-plated aluminum alloy substrate as the substrate to be polished while keeping a polishing composition in contact with a polishing pad. The polishing composition contains an abrasive, an acid, an oxidizing agent, a heterocyclic aromatic compound, an aliphatic amine compound or alicyclic amine compound, and water. The heterocyclic aromatic compound includes two or more nitrogen atoms in its ring structure, the aliphatic amine compound or alicyclic amine compound includes two to four nitrogen atoms in its molecules, and the polishing composition has a pH of 3.0 or less.

Abstract: A water electrolysis apparatus includes a plurality of unit cells. A membrane electrode assembly of the unit cell includes an anode side power feeding element and a cathode side power feeding element stacked on an anode catalyst layer and a cathode catalyst layer on both surfaces of a solid polymer electrolyte membrane. A surface of the anode side power feeding element is subjected to a grinding process, and then, subjected to an etching process to form a smooth surface.

Abstract: An elevator load bearing member assembly includes at least one traction enhancing surface (46) on a jacket (44). In one example, a mechanical removal process is used to strip away at least some of an amide-rich layer from the surface (46) after the jacket has been extruded onto tension members (42). In another example, a chemical removal process is used. Another disclosed example includes disrupting the surface.

Abstract: A ceramic substrate has a base material composed of an amorphous phase and particles composed of a crystalline phase and dispersed in the base material. Some of the particles are permitted to protrude from at least one surface of the base material.

Abstract: An elevator load bearing member assembly includes at least one traction enhancing surface (46) on a jacket (44). In one example, a mechanical removal process is used to strip away at least some of an amide-rich layer from the surface (46) after the jacket has been extruded onto tension members (42). In another example, a chemical removal process is used. Another disclosed example includes disrupting the surface.

Abstract: A manufacturing method is provided for manufacturing a substrate for information storage media having various properties that are demanded for a next generation of information storage media substrate purposes exemplified by perpendicular magnetic recording systems, etc., and above all, having high fracture toughness and a smooth surface at low cost. The method of manufacturing a substrate for information storage media includes a step of preparing glass material of a plate shape containing SiO2 component, Al2O3 component, and R?2O component, R? being at least one selected from Li, Na, and K, and the step of lapping includes at least one sub-step of lapping the glass material with a diamond pad.

Abstract: Nanoimprint molds for molding a surface of a material are provided. A nanoimprint mold includes a body with a molding surface that is formed by shaped nanopillars. The nanopillars may be formed on a substrate and shaped by performing at least a first partial oxidation of the nanopillars and then removing at least a portion of the oxidized material. Once shaped, a hard substance is deposited on the nanopillars to begin forming the molding surface of the nanoimprint mold. The deposition of a hard substance is followed by the deposition of carbon nanotube on the hard substance and then the removal of the substrate and nanopillars from the molding surface.

Abstract: A method for removing an undesirable material from an electronic or electrical component and introducing a desirable material in place of the undesirable material. The method can include the replacement of a leaded material found on the component with a no-lead material to meet governmental directives including those of the European Union.

Abstract: It is an object of the present invention to securely and integrally join a metal and a resin, more particularly, a shaped titanium alloy substrate and a resin composition. A titanium alloy substrate is used that has undergone surface roughening by chemical etching or the like so as to have a ultrafine textured face in which bent, ridge-like protrusions having a width and height of from ten to a few hundred nanometers and a length of from a few to a few hundred microns rise up on the surface at a spacing period of from ten to a few hundred nanometers. A titanium alloy piece 1 with its surface treated is inserted into the cavity of a metallic mold for injection molding 10 and a specific resin composition 4 is injected to obtain an integrated composite 7. The main resin component of the resin composition 4 that is used can be a polyphenylene sulfide resin (PPS) or a polybutylene terephthalate resin (PBT).

Abstract: A method of manufacturing thin closure magnetic read/write heads, such as magnetic tape heads is provided. The method provides improved flexural strength of the closure so that the closure breakage during fabrication of the heads is mitigated and closure thickness is reduced. An array of chips is fabricated on a wafer. The array is closed, with a closure strip bonded to each row of the array. Closures span only the length of a row, so that the closures are not subjected to flexure during processing and breakage due to flexure is mitigated. Side bars are bonded to the array to form a column with dimensions similar to prior art columns. This allows columns manufactured by the invention to undergo additional processing using existing processes.

Abstract: In an example embodiment, a wet system includes a proximity head and a holder for substrate (e.g., a semiconductor wafer). The proximity head is configured to cause a flow of an aqueous fluid in a meniscus across a surface of the proximity head. The surface of the proximity head interfaces with a surface of a substrate through the flow. The surface of the head is composed of a non-reactive material (e.g., thermoplastic) with modifications as to surface topography that confine, maintain, and/or facilitate the flow. The modifications as to surface topography might be inscribed on the surface with a conical scribe (e.g., with a diamond or SiC tip) or melt printed on the surface using a template. These modifications might produce hemi-wicking or superhydrophobicity. The holder exposes the surface of the substrate to the flow.

Abstract: The invention provides a method of chemically-mechanically polishing a substrate having at least one feature defined thereon, wherein the feature has at least one dimension with a size W, with a chemical-mechanical polishing composition. The polishing composition comprises particles of an abrasive wherein the particles have a mean particle diameter DM wherein the mean particle diameter of the particles satisfies the equation: DM>W. The invention further provides a method of preparing the chemical-mechanical polishing composition.

Abstract: A cylindrical boss portion is press-formed on a baseplate of a disk drive suspension. The boss portion is penetrated by a ball insertion hole relative to the thickness of the baseplate. The baseplate is formed of stainless steel. A chemically-polished surface is formed on an inner circumferential wall of the ball insertion hole by chemically polishing the baseplate after heat-treating it. The boss portion is inserted into a mounting hole of an actuator arm. A ball having a diameter larger than the inside diameter of the ball insertion hole is passed through the ball insertion hole. As the diameter of the boss portion is enlarged by the ball, the boss portion is fixed to the actuator arm.

Abstract: The invention provides a method of polishing a substrate comprising (i) providing a chemical-mechanical polishing system comprising (a) a polishing component selected from an abrasive, a polishing pad, or both an abrasive and a polishing pad, (b) an aqueous carrier, and (c) the halogen adduct resulting from the reaction of (1) an oxidizing agent selected from the group consisting of iodine, bromine, and a combination thereof, and (2) a carbon acid having a pKa of about 3 to about 14, wherein the halogen adduct is present in a concentration of about 0.001 mM or more in the aqueous carrier, (ii) contacting the substrate with the polishing system, and (iii) abrading at least a portion of the surface of the substrate with the polishing system to polish the substrate.