Etching Using Radiation (e.g., Laser, Electron-beam, Ion-beam, Etc.) Patents (Class 216/94)
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Patent number: 8637409Abstract: An etching method includes: applying a radiation to an etching aqueous solution; and etching a material to be etched by using the etching aqueous solution irradiated with the radiation.Type: GrantFiled: February 17, 2012Date of Patent: January 28, 2014Assignee: Fujitsu LimitedInventors: Shirou Ozaki, Masayuki Takeda
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Patent number: 8603590Abstract: The invention relates to a method of embedding a metal trace in a silicone containing polymer layer, by the steps of applying an agent that does not adhere to a substrate; applying a polymer layer on the non adhering agent; irradiating a surface of the polymer with a light beam emitted by an excimer laser creating cuts, grooves, blind holes or vias; immersing the irradiated polymer in an autocatalytic bath containing metal ions and metallizing the polymer; thermally treating the metallized polymer layer to induce diffusion of the metalized metal into the first polymer layer; applying a polymer layer on the thermally treated metallized polymer; and thermally treating the metallized polymer.Type: GrantFiled: October 25, 2007Date of Patent: December 10, 2013Assignee: Second Sight Medical Products, Inc.Inventors: Lucien D. Laude, Neil Hamilton Talbot, Robert J. Greenberg
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Publication number: 20130323472Abstract: A method for producing a component with at least one functional element includes providing a substrate; enriching a plasma jet with material of the at least one functional element to be formed; and applying at least one functional element on the substrate, in that material in at least essentially liquid form is applied by means of the enriched plasma jet, connected to the substrate and consolidated.Type: ApplicationFiled: November 7, 2011Publication date: December 5, 2013Inventor: Kristian Müller-Niehuus
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Patent number: 8585911Abstract: The present invention discloses a thin film multi-band antenna, which is formed by PVD-Roll to Roll process and is formed of metal-oxide, conductive polymer, conductive glue or CNT. In another aspect, the present invention discloses a manufacturing method of thin film antenna, comprising preparing gel, followed by coating the gel on a substrate to form a transparent thin film. Thermal process is performed to heat the thin film. The gel includes vinyl oxide and metal compounds, wherein the vinyl oxide includes PEO having In(NO)3.3H2O, In(Ac)3, SnCl2.2H2O, or Sn(C2O4) contained thereof.Type: GrantFiled: March 16, 2010Date of Patent: November 19, 2013Inventor: Kuo-Ching Chiang
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Patent number: 8568605Abstract: A method for forming nanometer-sized patterns and pores in a membrane is described. The method comprises incorporating a reactive material onto the membrane, the reactive material being a material capable of lowering an amount of energy required for forming a pore and/or pattern by irradiating the membrane material with an electron beam, thus leading to a faster pore and/or pattern formation.Type: GrantFiled: November 17, 2011Date of Patent: October 29, 2013Assignee: California Institute of TechnologyInventors: Sameer Walavalkar, Axel Scherer, Andrew P. Homyk
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Patent number: 8551869Abstract: A method for roughening an epitaxy structure layer, including: providing an epitaxy structure layer; and etching a surface of the epitaxy structure layer by an excimer laser having an energy density of 1000 mJ/cm2 or less to form a roughened surface. In addition, a method for manufacturing a light-emitting diode having a roughened surface is provided.Type: GrantFiled: June 21, 2011Date of Patent: October 8, 2013Assignee: National Cheng Kung UniversityInventors: Shui-Jinn Wang, Wei-Chi Lee
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Publication number: 20130248486Abstract: A highly polished surface on an aluminum substrate is formed using any number of machining processes. During the machining process, intermetallic compounds are typically generated at a top surface area of the aluminum substrate caused by spot heat generated between the tool edge and the cut tip of the aluminum substrate during the cutting process. The intermetallic compounds can leave surface imperfections after conventional mechanical polishing operations that render the surface of the aluminum substrate difficult to obtain a desired high glossiness due to exfoliation of the intermetallic compounds from the top surface. In order to remove the effect of the intermetallic compounds, an electron beam is applied to the surface resulting in Joule heating to melt down a top surface zone. In this way, any tooling traces and intermetallic compounds are eliminated.Type: ApplicationFiled: September 26, 2012Publication date: September 26, 2013Applicant: Apple Inc.Inventors: SIMON R. LANCASTER-LAROCQUE, Purwadi RAHARJO, Kensuke UEMURA
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Patent number: 8540892Abstract: High quantum yield InP nanocrystals are used in the bio-technology, bio-medical, and photovoltaic, specifically IV, III-V and III-VI nanocrystal technological applications. InP nanocrystals typically require post-generation HF treatment. Combining microwave methodologies with the presence of a fluorinated ionic liquid allows Fluorine ion etching without the hazards accompanying HF. Growing the InP nanocrystals in the presence of the ionic liquid allows in-situ etching to be achieved. The optimization of the PL QY is achieved by balancing growth and etching rates in the reaction.Type: GrantFiled: October 5, 2012Date of Patent: September 24, 2013Assignee: The Florida State University Research Foundation, Inc.Inventors: Geoffrey F. Strouse, Derek D. Lovingood
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Patent number: 8534709Abstract: The present invention relates to a method for manufacturing a security element (12) having a metalized microrelief pattern and a negative pattern in register therewith, in which P) a substrate (20) is provided with an embossing pattern having elevations (24) and depressions (26) that form first and second regions having different first and second height levels, wherein the desired microrelief pattern (28) is introduced into the first regions of the embossing pattern, and the second regions of the embossing pattern are developed in the form of the desired negative pattern, M) the embossing pattern with the first and second regions is contiguously metalized (30), and L) the metalized embossing pattern is impinged on with laser radiation, to selectively remove the metalization (30) in the second regions of the embossing pattern through the action of the laser radiation.Type: GrantFiled: February 9, 2009Date of Patent: September 17, 2013Assignee: Giesecke & Devrient GmbHInventors: Winfried Hoffmuller, Marius Dichtl, Andre Gregarek
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Publication number: 20130232783Abstract: Disclosed is a ceramic substrate including silicon in which the concentration of a silicon oxide and a silicon composite oxide in the surface thereof is less than or equal to 2.7 Atom %.Type: ApplicationFiled: April 22, 2013Publication date: September 12, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Hiroshi Tonomura, Takeshi Kitahara, Hiroya Ishizuka, Yoshirou Kuromitsu, Yoshiyuki Nagatomo
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Patent number: 8529782Abstract: A microstructure manufacturing method includes (a) generating first light including an interference fringe by crossing two laser beams, (b) forming a denatured region and a non-denatured region on an object having thermal non-linearity by applying the first light onto the object, so that the denatured region and the non-denatured region are disposed so as to correspond to a period of the interference fringe of the first light, and (c) etching the object so that the denatured region or the non-denatured region is selectively eliminated.Type: GrantFiled: February 19, 2008Date of Patent: September 10, 2013Assignee: Seiko Epson CorporationInventor: Jun Amako
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Patent number: 8512579Abstract: The invention relates to methods and apparatus for manufacturing intravascular stents wherein the intravascular stent has its inner surface treated to promote the migration of endothelial cells onto the inner surface of the intravascular stent. In particular, the inner surface of the intravascular stent has at least one groove formed therein.Type: GrantFiled: June 24, 2011Date of Patent: August 20, 2013Assignee: Advanced Bio Prosthetic Surfaces, Ltd.Inventors: Christopher E. Banas, Julio C. Palmaz, Eugene A. Sprague
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Patent number: 8512588Abstract: A method of fabricating a nanoporous membrane filter having a uniform array of nanopores etch-formed in a thin film structure (e.g. (100)-oriented single crystal silicon) having a predetermined thickness, by (a) using interferometric lithography to create an etch pattern comprising a plurality array of unit patterns having a predetermined width/diameter, (b) using the etch pattern to etch frustum-shaped cavities or pits in the thin film structure such that the dimension of the frustum floors of the cavities are substantially equal to a desired pore size based on the predetermined thickness of the thin film structure and the predetermined width/diameter of the unit patterns, and (c) removing the frustum floors at a boundary plane of the thin film structure to expose, open, and thereby create the nanopores substantially having the desired pore size.Type: GrantFiled: August 13, 2010Date of Patent: August 20, 2013Assignee: Lawrence Livermore National Security, LLCInventors: Joseph W. Tringe, Rodney L. Balhorn, Saleem Zaidi
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Patent number: 8506833Abstract: A method for producing a molded body, said method comprising: providing a film comprising a thermoplastic plastic and having a film thickness D ranging from 1 ?m to 1000 ?m; irradiating the film with ionizing radiation, to produce irradiated regions in the film; thermally reshaping the film into a molded body and generating at least one hollow structure, wherein a temperature of the thermal reshaping remains below the melting temperature for the thermoplastic plastic; removing the irradiated regions, to create pores having a diameter ? from about 10 nm to about 10 ?m in the molded body; and removing the molded body from a mold.Type: GrantFiled: January 28, 2010Date of Patent: August 13, 2013Assignee: Karlsruhe Institute of TechnologyInventors: Stefan Giselbrecht, Roman Truckenmüller, Christina Trautmann
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Patent number: 8507829Abstract: A method for producing rough surface structures comprising the following step: running a laser beam along filling lines (1) over an area to be processed, wherein the filling line (1) is broken down into particular laser dots (2) with a distance a, and wherein the laser dots (2) are moved in a X direction and in a Y direction in a plane with a random factor b relative to the filling line (1) so that they form a cloud of dots.Type: GrantFiled: January 26, 2011Date of Patent: August 13, 2013Assignee: ACSYS Lasertechnik GmbHInventors: Silvo Heinritz, Uwe Heinritz, Marcus Polster, Claudia Hartmann, Mirko Jedynak
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Publication number: 20130196513Abstract: Disclosed is a processing method which can achieve a high processing rate, and is capable of making a surface smooth, In order to achieve this an SiC substrate is arranged in a potassium hydroxide solution containing hydrogen peroxide, and ultraviolent radiation is irradiated on the surface of the SiC substrate.Type: ApplicationFiled: March 18, 2011Publication date: August 1, 2013Inventors: Akihisa Kubota, Mutsumi Touge
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Publication number: 20130195723Abstract: Methods of forming at least one nanochannel include: (a) providing a substrate having a thick single or a thick multi-layer overlayer; (b) milling at least one channel through the overlayer into the substrate; then (c) removing the overlayer; and (d) forming at least one nanochannel in the substrate having an average width and depth dimension that is less than about 10 nm in response to the milling and removing steps.Type: ApplicationFiled: September 19, 2011Publication date: August 1, 2013Inventors: John Michael Ramsey, Laurent Menard, Valeri Gorbuounov
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Publication number: 20130168356Abstract: An object and project of the present invention is to provide a method for producing silicon fine particles and a method for controlling a particle diameter of silicon fine particles which enable efficient production of silicon fine particles having a uniform particle diameter.Type: ApplicationFiled: September 9, 2011Publication date: July 4, 2013Applicant: BRIDGESTONE CORPORATIONInventors: Seiichi Sato, Mari Miyano, Shigeki Endo, Osamu Shiino, Shingo Ono, Masato Yoshikawa
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Patent number: 8451146Abstract: A method for manufacturing keycap includes applying a first coating layer on a surface of a keycap layer, applying a second coating layer on top of the first coating layer, etching at least a portion of the first coating layer to a first depth to form a first etched area, and etching at least a portion of the first etched area to a second depth to form a second etched area.Type: GrantFiled: June 11, 2010Date of Patent: May 28, 2013Assignee: Apple Inc.Inventors: Peter H. Mahowald, Omar Sze Leung
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Patent number: 8449808Abstract: A plastic shell with ink-free pattern and its manufacturing method thereof are provided. The manufacturing method includes a step of providing a multilayered film with ink-free pattern, a step of adhering a protective layer of the multilayered film on a surface of a plastic shell body, and a step of performing a laser engraving procedure to present a relief pattern on a surface of the protective layer.Type: GrantFiled: March 9, 2010Date of Patent: May 28, 2013Assignee: Quanta Computer Inc.Inventor: Shu-Chen Lin
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Patent number: 8449787Abstract: A wet etching method that includes forming an insulating film on a substrate, and irradiating laser light to the insulating film during wet etching of the insulating film using an etching solution.Type: GrantFiled: February 22, 2008Date of Patent: May 28, 2013Assignee: Fujitsu LimitedInventors: Tadahiro Imada, Yoshihiro Nakata, Koji Nozaki
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Publication number: 20130126478Abstract: The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant:Type: ApplicationFiled: January 15, 2013Publication date: May 23, 2013Applicant: INKTEC CO., LTD.Inventors: Kwang-Choon CHUNG, Hyun-Nam CHO, Young-Kwan SEO
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Publication number: 20130126474Abstract: The invention describes a process to remove a recast layer and/or burrs from machining processes to provide a surface of a titanium medical device without dissipation of copper or zinc from the surface of the medical device.Type: ApplicationFiled: November 21, 2011Publication date: May 23, 2013Inventors: Alan Shi, Bernard Q. Li, Daniel D. Sorensen, Darren A. Janzig
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Patent number: 8435607Abstract: A housing for a portable electronic device includes a metallic base, a chemical plating layer, a prime layer, a color coating layer, a decorative layer, and a transparent protection layer. The chemical plating layer, the prime layer, the color coating layer, the decorative layer, and the transparent protection layer are coated on the metallic base in that order. The decorative layer defines a pattern extending through the decorative layer.Type: GrantFiled: August 3, 2009Date of Patent: May 7, 2013Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Jen-Hong Hsu, Hai-Lin Chen, Jian-Wei Zhang, Yong Yang, Ying-Hao Feng, Yu-Guo Zhang
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Publication number: 20130092657Abstract: The present invention relates to a novel etching media in the form of printable, homogeneous etching pastes with non-Newtonian flow properties for the improved etching of inorganic oxides and silicon surfaces and which allow to prepare smaller features.Type: ApplicationFiled: May 17, 2011Publication date: April 18, 2013Applicants: NANO TERRA, INC., MERCK PATENT GESELLSCHAFT MIT BESCHRANKTER HAFTUNGInventors: Jennifer Gillies, Ralf Kuegler, Eric Stern, Brian Mayers, Patrick Reust, Lindsay Hunting
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Publication number: 20130092555Abstract: Methods and apparatuses for use in such methods for removing islands from laser cut articles. Methods include using a chemical etching solution to remove material in the strut-island gap. Optionally, heat and/or agitation can be applied during the etching process to increase the chemical activity of the chemical etching solution and/or to vibrate the islands out of position.Type: ApplicationFiled: October 12, 2011Publication date: April 18, 2013Applicant: ABBOTT CARDIOVASCULAR SYSTEMS, INC.Inventors: Nicholas R. Haluck, Austin M. Leach, Patrick C. Vien
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Publication number: 20130089701Abstract: A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO3, HF and, optionally acetic acid.Type: ApplicationFiled: October 6, 2011Publication date: April 11, 2013Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.Inventors: Andy Hooper, Daragh Finn, Tim Webb, Lynn Sheehan, Kenneth Pettigrew, Yu Chong Tai
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Patent number: 8409672Abstract: It is an object to provide a method of manufacturing a light-emitting device, which improves use efficiency of an evaporation material and increases accuracy in forming an evaporated pattern by using an evaporation donor substrate by which a material layer to be a transfer layer is prevented from being excessively evaporated and a desired evaporated pattern can be formed. In a method of manufacturing an evaporation donor substrate, a first substrate which is an evaporation donor substrate is irradiated with first light (laser light) through a second substrate which is a mask substrate, whereby a material layer over the first substrate is patterned. In addition, in a method of manufacturing a light-emitting device, the first substrate provided with the material layer which is patterned by the above method is irradiated with second light, whereby the material layer can be evaporated onto a third substrate which is a deposition target substrate.Type: GrantFiled: April 16, 2009Date of Patent: April 2, 2013Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Kohei Yokoyama, Yosuke Sato
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Publication number: 20130008868Abstract: According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.Type: ApplicationFiled: July 3, 2012Publication date: January 10, 2013Inventors: Yoshihiro UOZUMI, Shinsuke Kimura, Yoshihiro Ogawa, Hiroyasu Iimori, Tatsuhiko Koide, Hideaki Hirabayashi, Yuji Nagashima
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Publication number: 20120308765Abstract: A nanostructure forming method includes: preparing a substrate having an appropriate processing value; applying laser beam having a pulse duration of picosecond order or less to a planar surface oriented in a propagation direction of the laser beam and a direction perpendicular to a polarization direction (electric field direction) of the laser beam in the interior of the substrate at an irradiation intensity which is close to the appropriate processing value of the substrate; forming a structure-modified portion at a focus at which the laser beam is concentrated and in a region which is close to the focus; and forming a nanostructure formed of a nano-hole by selectively etching the structure-modified portion.Type: ApplicationFiled: August 3, 2012Publication date: December 6, 2012Applicants: FUJIKURA LTD., THE UNIVERSITY OF TOKYO, BIO ELECTRO-MECHANICAL AUTONOMOUS NANO SYSTEMS LABORATORY TECHNOLOGY RESEARCH ASSOCIATIONInventors: Osamu NUKAGA, Seiji SAMUKAWA, Masakazu SUGIYAMA
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Publication number: 20120292117Abstract: Wellbore tools include a body and a superhydrophobic surface disposed over at least a portion of the body. The superhydrophobic surface includes a patterned surface of a hydrophobic material exhibiting a higher hydrophobicity than an unpatterned surface of the hydrophobic material. A wellbore tool may include a seal, at least one sensor, and at least one flow line, each having at least one superhydrophobic surface. Methods of forming wellbore tools include forming a body, forming a hydrophobic surface over at least a portion of the body, and forming a pattern in a surface of the body, such that the patterned surface exhibits a higher hydrophobicity than an unpatterned surface of the same material.Type: ApplicationFiled: May 19, 2011Publication date: November 22, 2012Applicant: BAKER HUGHES INCORPORATEDInventors: Hendrick John, Sunil Kumar
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Publication number: 20120285930Abstract: The invention pertains to a printing form and a process for preparing the printing form from a curable composition that includes an epoxy novolac resin having an epoxide equivalent weight of 156 to 300 g/equivalent, and an amine curing agent selected from primary amines and secondary amines, the agent having an amine equivalent weight of less than or equal to 60 g/equivalent. The process includes applying the curable composition to a supporting substrate to form a layer, curing the layer at one or more temperatures in a temperature range, and engraving to form at least one cell in the cured layer. The process prepares printing forms, particularly gravure printing forms, having a cured resin composition layer that is engravable, resistant to solvent inks and to mechanical wear, and capable of printing gravure-quality images.Type: ApplicationFiled: May 11, 2012Publication date: November 15, 2012Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: Douglas J. Adelman, Cara L. Blankenbicker, Andrew P. Davis, Barbara B. Fones, Helen S. M. Lu, Mark E. Wagman
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Patent number: 8282998Abstract: The present invention relates to a method of realizing an optical function on a component of a motor vehicle indicating or lighting device. This method is more particularly suited to producing a mask for a headlamp or light and/or to treating reflective surfaces. The method comprises a step of forming said component in a predetermined material and a step of exposing at least one surface of said component to laser radiation.Type: GrantFiled: December 4, 2003Date of Patent: October 9, 2012Assignee: Valeo VisionInventors: Ghislain Lefevre, Thomas Giroud
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Patent number: 8266785Abstract: A method for manufacturing a magnetoresistive sensor having improved pinned layer stability at small track widths. The method includes providing a substrate, and depositing a plurality of sensor layers. A layer of material that is resistant to removal by chemical mechanical polishing (CMP stop layer) and an antireflective coating layer are deposited. A photoresist mask is formed on the antireflective layer, and a reactive ion etch (RIE) is performed to remove portions of the ion mill resistant mask that are not covered by the photoresist mask, the RIE being performed in a plasma chamber having a platen, the performing the RIE further comprising applying a platen power of at least 70 W. An ion milling is performed to remove a portion of the sensor layers, the ion milling being terminating before all of the sensor materials have been removed.Type: GrantFiled: November 12, 2007Date of Patent: September 18, 2012Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: James Mac Freitag, Wipul Pemsiri Jayasekara, Mustafa Michael Pinarbasi
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Patent number: 8269742Abstract: A manufacturing method of a coordinate position detecting device includes the steps of forming the common electrode on the resistive film of tour sides of the substrate having a rectangular-shaped configuration; measuring the electric potential of the resistive film by plural probes contacting a surface of the resistive film where the electric potential is supplied from the common electrode to the resistive film; calculating a resistive film removing area, based on a value of a measured electric potential, by a calculating part so that the electric potential distribution of the resistive film is made uniform; and removing the resistive film in the resistive film removing area calculated by the calculating part, by a laser light.Type: GrantFiled: April 8, 2009Date of Patent: September 18, 2012Assignee: Fujitsu Component LimitedInventor: Koichi Kondoh
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Patent number: 8246847Abstract: There are provided an aqueous solution for separation of a conductive ceramics sintered body in which a conductive ceramic sintered body separated form a glass can be collected in a recyclable condition, and a separating method therefor, and an aqueous solution for separation with which a dark ceramics sintered body, a conductive ceramics sintered body and a glass are separately collected from a glass with a dark ceramics sintered body in which a conductive ceramics sintered body is formed on the dark ceramics sintered body, and a separating method therefor. A treatment liquid having an etching ability for at least one of a glass and a conductive ceramic sintered body is prepared as an aqueous solution 20 for separation of the conductive ceramics sintered body, then the aqueous solution 20 for separation is filled in a container 11, and a glass with a conductive ceramics sintered body 30 is immersed into the aqueous solution 20 for separation in the container 11.Type: GrantFiled: September 11, 2006Date of Patent: August 21, 2012Assignee: Nippon Sheet Glass Company, LimitedInventors: Masahiro Hori, Kazuishi Mitani, Yasuhiro Saito, Nobuyuki Takatsuki, Kyouichi Shukuri, Shunji Kuramoto
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Patent number: 8235769Abstract: To provide an electron beam assisted EEM method that can realize ultraprecision machining of workpieces, including glass ceramic materials, in which at least two component materials different from each other in machining speed in a machining process are present in a refined mixed state and the surface state is not even, to a surface roughness of 0.2 to 0.05 nm RMS. The EEM method comprises a working process in which a workpiece and chemically reactive fine particles are allowed to flow along the working face to remove atoms on the working face chemically bonded to the fine particles together with the fine particles through chemical interaction between the fine particles and the working face interface. The workpiece comprises at least two component materials present in a refined mixed state and different from each other in machining speed in the machining process.Type: GrantFiled: August 3, 2006Date of Patent: August 7, 2012Assignees: JTEC CorporationInventor: Yuzo Mori
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Publication number: 20120178956Abstract: A method for preparing a functional structured surface includes the controlled removal of material from a film including at least one buried pore, the inner surface of the pore including at least one chemical linkage group, where the material is removed so as to expose part of the inner surface of the pore that is not affected by the removal of material.Type: ApplicationFiled: September 8, 2010Publication date: July 12, 2012Inventors: Sandrine Dourdain, Pierre Terech
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Patent number: 8206600Abstract: A method of etching a foil for use in an electrolytic capacitor utilizes a nanoimprinted optic to control the etch pattern. The optic is formed by creating a self-assembled monolayer (SAM) of hemispheres onto the surface of an optical quartz substrate. A laser is directed onto the optic while the foil underlies the optic, and the concentrated light source is used to effectively image an array of submicron spots. The resulting spots allow for controlled initiation of etch tunnels during a subsequent electrochemical etch of the foil, with the purpose of ultimately increasing foil capacitance through the increased surface area.Type: GrantFiled: September 15, 2008Date of Patent: June 26, 2012Assignee: Pacesetter, Inc.Inventor: Bruce Ribble
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Publication number: 20120152902Abstract: A method for forming nanometer-sized patterns and pores in a membrane is described. The method comprises incorporating a reactive material onto the membrane, the reactive material being a material capable of lowering an amount of energy required for forming a pore and/or pattern by irradiating the membrane material with an electron beam, thus leading to a faster pore and/or pattern formation.Type: ApplicationFiled: November 17, 2011Publication date: June 21, 2012Inventors: Sameer WALAVALKAR, Axel SCHERER, Andrew P. HOMYK
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Publication number: 20120145673Abstract: A dielectric barrier discharge plasma generator includes a dielectric chamber. The chamber contains or incorporates a solid surface that is to be treated with non-thermal plasma. The chamber can be substantially sealed and confine an atmosphere therein. An atmosphere control system is provided for controlling the atmosphere within the chamber. At least one or two electrodes are located outside of the chamber. When actuated by an appropriate source of plasma generating electrical power the electrodes cause the generation of a solid surface modifying non-thermal plasma in a plasma zone within the chamber. A transport system is provided for moving the electrode and the chamber relative to one another. A plasma zone is confined within the chamber adjacent to the electrodes, and remains substantially stationary relative to the electrodes. The chamber carries the solid surface through the plasma zone. The solid surface remains substantially stationary relative to the chamber.Type: ApplicationFiled: November 30, 2011Publication date: June 14, 2012Applicant: Tri-Star TechnologiesInventor: Igor Murokh
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Patent number: 8196285Abstract: A method and system for providing a PMR pole in a transducer including an intermediate layer are disclosed. A mask including line(s) having side(s) is provided. A hard mask is provided on the mask. Portions of the hard mask reside on the line side(s) and intermediate layer surface. The hard mask includes a wet-etchable layer and a high removal ratio layer on the wet-etchable layer. Part of the hard mask on the side(s) of the line is removed, exposing part of the line. The high removal ratio layer has a low angle removal rate on the line side(s) and a high angle removal rate on the intermediate layer surface. The low angle removal rate is at least four times the high angle removal rate. The line is removed, providing an aperture in the hard mask. A trench is provided in the intermediate layer. A PMR pole is provided.Type: GrantFiled: December 17, 2008Date of Patent: June 12, 2012Assignee: Western Digital (Fremont), LLCInventors: Jinqiu Zhang, Liubo Hong
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Publication number: 20120123135Abstract: A silsesquioxane resin is applied on top of the patterned photo-resist and cured to produce a cured silsesquioxane resin on top of the pattern surface. Subsequently, an aqueous base stripper or a reactive ion etch recipe containing CF4 is used to “etch back” the silicon resin to the top of the photoresist material, exposing the entire top surface of the photoresist. Then, a second reactive ion etch recipe containing O2 to etch away the photoresist. The result is a silicon resin film with via holes with the size and shape of the post that were patterned into the photoresist. Optionally, the new pattern can be transferred into the underlying layer(s).Type: ApplicationFiled: June 22, 2010Publication date: May 17, 2012Inventors: Michael L. Bradford, Eric Scott Moyer, Kasumi Takeuchi, Sheng Wang, Craig Rollin Yeakle
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Patent number: 8177988Abstract: A method for manufacturing a substrate for a liquid discharge head having a silicon substrate provided with a supply port of a liquid comprises steps of preparing a substrate which is provided with a passive film on one side face thereof, has a first recess and a second recess provided therein so as to penetrate from the one side face into the inner part through the passive film, wherein the recesses satisfy a relation of a ×tan 54.7 degrees?d, where a is defined as a distance between the first recess and the second recess, and d is defined as a depth of the second recess, and forming the supply port by anisotropically etching the crystal from the one side face.Type: GrantFiled: September 3, 2008Date of Patent: May 15, 2012Assignee: Canon Kabushiki KaishaInventors: Hiroto Komiyama, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Keisuke Kishimoto, Shimpei Otaka, Sadayoshi Sakuma
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Publication number: 20120091144Abstract: Provided is a flexible cryostat for use in applications including surrounding high temperature superconductor cabling. The flexible cryostat disclosed here in an embodiment includes a polymer pipe as the outer surface of the cryostat. In an embodiment, both the inner and outer pipes of a cryostat are replaced with polymer pipes which have the same or different thickness and composition. One or both of the polymer pipes can be used in combination with a permeation barrier, which is, in separate embodiments, ethylene vinyl alcohol, or a metallic layer such as aluminum or stainless steel. The flexible polymer pipe can surround the permeation barrier, or the permeation barrier can be positioned at the inner or outer surface of one or both flexible polymer pipes.Type: ApplicationFiled: March 7, 2011Publication date: April 19, 2012Inventors: Rolf Gerald Baumgartner, Ryan Andrew Sievers
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Patent number: 8133554Abstract: Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces are disclosed herein. In one embodiment, a method includes depositing molecules of a gas onto a microfeature workpiece in the reaction chamber and selectively irradiating a first portion of the molecules on the microfeature workpiece in the reaction chamber with a selected radiation without irradiating a second portion of the molecules on the workpiece with the selected radiation. The first portion of the molecules can be irradiated to activate the portion of the molecules or desorb the portion of the molecules from the workpiece. The first portion of the molecules can be selectively irradiated by impinging the first portion of the molecules with a laser beam or other energy source.Type: GrantFiled: May 6, 2004Date of Patent: March 13, 2012Assignee: Micron Technology, Inc.Inventors: Ross S. Dando, Dan Gealy
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Patent number: 8114305Abstract: A method of manufacturing a silicon substrate for a liquid discharge head with a liquid supply opening formed therein includes: forming one processed portion by laser processing on the substrate from one surface of the substrate; expanding the one processed portion to form a recess portion by performing laser processing at a position which overlaps a part of the one processed portion and does not overlap another part of the one processed portion; and etching from the one surface the substrate with the recess portion formed therein to form the liquid supply opening.Type: GrantFiled: September 3, 2008Date of Patent: February 14, 2012Assignee: Canon Kabushiki KaishaInventors: Hiroto Komiyama, Hirokazu Komuro, Satoshi Ibe, Takuya Hatsui, Keisuke Kishimoto, Kazuhiro Asai, Shimpei Otaka
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Publication number: 20120017825Abstract: A method for growing a crystalline composition, the first crystalline composition may include gallium and nitrogen. The crystalline composition may have an infrared absorption peak at about 3175 cm?1, with an absorbance per unit thickness of greater than about 0.01 cm?1. In one embodiment, the composition ay have an amount of oxygen present in a concentration of less than about 3×1018 per cubic centimeter, and may be free of two-dimensional planar boundary defects in a determined volume of the first crystalline composition.Type: ApplicationFiled: November 9, 2006Publication date: January 26, 2012Applicant: General Electric CompanyInventors: Mark Philip D'Evelyn, Kristi Jean Narang, Dong-Sil Park, Huicong Hong, Xian-An Cao, Larry Qiang Zeng
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Patent number: 8092558Abstract: There is disclosed a microchannel reactor module for the immediate catalytic release of hydrogen from hydrogenated organic molecules along with the recovery of hydrogen gas and the recovery of dehydrogenated organic molecules as a liquid. More specifically, the disclosure provides a polyimide-based microchannel plate that is particularly useful for a process of immediate catalytic release of hydrogen from a hydrogenated organic molecule or formulation of molecules.Type: GrantFiled: January 20, 2009Date of Patent: January 10, 2012Assignee: Asemblon, Inc.Inventors: David G. O'Connor, Robert B. Nelson
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Publication number: 20110304485Abstract: A method for manufacturing keycap includes applying a first coating layer on a surface of a keycap layer, applying a second coating layer on top of the first coating layer, etching at least a portion of the first coating layer to a first depth to form a first etched area, and etching at least a portion of the first etched area to a second depth to form a second etched area.Type: ApplicationFiled: June 11, 2010Publication date: December 15, 2011Applicant: Apple Inc.Inventors: Peter H. Mahowald, Omar Sze Leung