Abstract: Systems and methods for improving the cutting efficiency and cut profile of stent strut is provided. A means for altering the energy distribution of a laser beam is provided, along with various ways of controlling a laser to provide for improved strut configurations are provided. A method for improved cutting speeds using a combination of laser sources is also provided.

Abstract: A laser system simulates heat flux levels of rocket motor output. A laser is mechanically associated with a platform. The laser is configured to emit an electromagnetic beam. A plurality of positions are associated with the platform. Optical elements are associated with the platform. Each optical element is positionable in a plurality of positions without changing a location of the corresponding positioner. The optical elements are arrangeable into a plurality of combinations corresponding to at least one optical path beginning at the laser and terminating at a sample. Each combination corresponds to one of a plurality of distinct permutations of operatively positioned optical elements that reducingly interact with an emitted electromagnetic beam, yielding one of many versions of the emitted electromagnetic beam that is incidented upon the sample. Each version of the emitted electromagnetic beam that is incidented upon the sample has a lower power than the emitted electromagnetic beam.

Abstract: An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses.

Abstract: A laser beam irradiation apparatus and method of manufacturing an organic light emitting display device using the same are disclosed. The laser beam irradiation apparatus is configured to irradiate a laser beam to an object extending in a first direction while moving the laser beam relative to the object in the first direction, where the laser beam has a cross-section taken in a plane perpendicular to a second direction in which the laser beam is irradiated from the apparatus, the cross-section comprising two substantially symmetrical portions that are substantially symmetrical about a centerline of the cross-section extending in the first direction, where the cross-section has a centerline length taken in the centerline, where at least part of the substantially symmetrical portions has a length in the first direction that is longer than the centerline length.

Abstract: A process is provided for forming shaped air holes, such as for use in turbine blades. Aspects of the disclosure relate to forming shaped portions of air holes using a short pulse laser, forming a metered hole corresponding to each shaped portion, and separately finishing the shaped portion using a short-pulse laser. In other embodiments, the order of these operations may be varied, such as to form the shaped portions and to finish the shaped portions using the short-pulse laser prior to forming the corresponding metered holes.

Abstract: To provide an image processing method including at least one of recording an image onto a thermoreversible recording medium in which transparency or color tone reversibly changes depending upon temperature, by applying a laser beam with the use of a CO2 laser device so as to heat the thermoreversible recording medium, and erasing an image recorded on the thermoreversible recording medium, by heating the thermoreversible recording medium, wherein an intensity distribution of the laser beam applied in the image recording step satisfies the relationship represented by Expression 1 shown below, 1.59<I1/I2?2.00??Expression 1 where I1 denotes an irradiation intensity of the applied laser beam in a central position of the applied laser beam, and I2 denotes an irradiation intensity of the applied laser beam on a plane corresponding to 80% of the total irradiation energy of the applied laser beam.

Abstract: A laser crystallization device includes a first light source providing a first light and a second light source providing a second light. The device further includes a first lens set receiving the first light to generate a first transmitted light, the first transmitted light having a first profile, the first profile having a first profile error portion and a first non-error portion. The device further includes a second lens set receiving the second light to generate a second transmitted light, the second transmitted light having a second profile, the second profile having a second profile error portion and a second non-error portion, the second profile error portion corresponding to the first non-error portion, the second non-error portion corresponding to the first profile error portion. The device further includes an optical system combining the first transmitted light with the second transmitted light.

Abstract: A system and method for precision welding using a fiber laser is disclosed in which varying intensity laser pulses are spread across the material junction in a number of high aspect ratio areas. The power density applied along each area is varied to accommodate differences in the material characteristics of each material while allowing for the creation of a more uniform weld pool alloy.

Abstract: The invention relates to a system and method for forming sleeved containers. The system includes a conveyor for transporting a row of containers, a sleeving unit for arranging sleeves around containers and a heat oven for attaching the sleeve around the container by heat shrinking. The conveyed containers are provided with a sleeve and the sleeved container is transported in the oven to allow the sleeve to shrink. According to the invention, part of the sleeve is removed using a removal unit. The part is removed after heat shrinking. Removing the part allows to uncover part of the container otherwise covered by sleeve.

Abstract: A series of laser pulses in a pulse train, each pulse with a beneficial temporal power shape instead of the conventional laser temporal power shape, scribes a line in a thin film of material on a substrate. The beneficial temporal pulse shape has a spike/plateau chair shape or a square pulse shape. Scribing a line in the thin film is achieved by placing the series of laser pulse spots on the line to be scribed such that there is an overlapping area between adjacent laser pulse spots along the line. The use of a series of laser pulses with beneficial pulse shape to scribe a line in the thin film results in a better quality and cleaner scribing process compared to that achieved with the conventional pulse shape.

Abstract: A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser beam towards a surface of the wafer and converging the laser beam to form a focal point so that a focal volume defined by the focal point and a boundary of the laser beam within the wafer is formed. Energy encompassed within the focal volume causes the wafer located at the periphery of the focal volume to contract faster than the wafer located within the focal volume, thereby generating a crack within the wafer.

Abstract: A laser system for processing conductive link structures includes a seed laser generating a seed laser beam. The seed laser is sliced by a modulator into a user configurable series of pulses and the pulses are optically amplified and applied to a conductive link structure. Preferably, the bandwidth of the seed laser is less than 1 nm with an IR center frequency, and the frequency of the laser light of the pulses is doubled or quadrupled prior to application to the conductive structure. Preferably, the pulses are about 1-18 nanosecond pulsewidth and are separated by 100-400 nanoseconds.

Abstract: Multi-beam, multi-wavelength processing systems include two or more lasers configured to provide respective beams to a substrate. The beams have wavelengths, pulse durations, beam areas, beam intensities, pulse energies, polarizations, repetition rates, and other beam properties that are independently selectable. Substrate distortion in processes requiring local heating can be reduced by preheating with a large area beam at a first wavelength followed by exposure to a focused beam at a second wavelength so as to heat a local area to a desired process temperature. For some processing, multiple wavelengths are selected to obtain a desired energy deposition within a substrate.

Abstract: Methods and systems for welding are disclosed, including generating electromagnetic radiation from an ultrashort pulse laser; coupling the electromagnetic radiation from the ultrashort pulse laser to a scanner comprising a scanning and focus range, wherein the scanner is configured to receive the electromagnetic radiation from the ultrashort laser and to scan and focus the electromagnetic radiation onto a joining interface of one or more materials; using a computer to adjust the pulse repetition rate and the average power of the ultrashort pulse laser; using one or more stages to position the joining interface; using a dichroic filter positioned between the scanner and the one or more materials; and focusing an imager and processor through the dichroic filter and onto the joining interface to monitor the joining interface of the one or more materials within the scanning and focus range of the electromagnetic radiation. Other embodiments are described and claimed.

Abstract: A light-emission output of a flash lamp for performing a light-irradiation heat treatment on a substrate in which impurities are implanted is increased up to a target value L1 over a period of time from 1 to 100 milliseconds, is kept for 5 to 100 milliseconds within a fluctuation range of plus or minus 30% from the target value L1, and is then attenuated from the target value L1 to zero over a period of time from 1 to 100 milliseconds. That is, compared with conventional flash lamp annealing, the light-emission output of the flash lamp is increased more gradually, is kept to be constant for a certain period of time, and is then decreased more gradually. As a result, a total heat amount of a surface of the substrate increases compared with the conventional case, but a surface temperature thereof rises more gradually and then drops more gradually compared with the conventional case.

Abstract: An apparatus and method for exposing the surface of a drum to patterned illumination from a pulsed laser source to form a dense, regular array of 3-D microstructures is provided. The method may include locating a mask relative to a target area, projecting a uniform line shaped laser beam through the mask to project an image including a plurality of features of the mask onto the target area, de-magnifying the image, rotating the drum continuously so the surface moves in a first direction perpendicular to the axis of rotation of the drum and simultaneously moving the projected beam in a second direction parallel to the axis of rotation of the drum, tilting the projected array of microstructures to correspond to the helical path followed by the laser beam on the drum surface, and controlling the pulsed laser based on an angular position of the drum.

Abstract: Apparatus for manufacturing a hydrogen 21 line precision measuring device, comprising: a hydrogen 21 line generator, which may be a hydrogen maser, which generates an emission spectrum comprising a spectral line at substantially 1420.40575177 MHz and communicates the spectral line to a frequency counter; which is adapted to receive the spectral line, measures frequency of the spectral line, and communicates an indication of the measured frequency to a computer, which receives the indicated frequency, calculates wavelength of the indicated frequency and communicates control signals to a laser or other marking device to scribe markings on a measuring device substrate at one or more intervals of the calculated wavelength and subdivisions thereof, resulting in the measuring device substrate having a plurality of scribed markings, each pair of the scribed markings at an interval of substantially the calculated wavelength and each of the subdivisions thereof equaling a portion of the calculated wavelength.

Abstract: Patterns are written on workpieces, such as, glass sheets and/or plastic sheets used in, for example, electronic display devices such as LCDs. The workpiece may be larger than about 1500 mm may be used. An optical writing head with a plurality of writing units may be used. The workpiece and the writing head may be moved relative to one another to provide oblique writing.

Abstract: In accordance with said control method, the transmission of the laser beam is periodically interrupted with the aid of means for masking the laser beam placed between the reference point and a source of the laser beam. Moreover, the transmission power of the source of the laser beam is varied between the minimum and maximum values, such that the emission times of the source of the laser beam at the minimum power substantially coincide with the masking times of the laser beam via the masking means. Preferably, the minimum value is at least equal to 10% and the maximum value at most equal to 90% of a maximum emission power of the source of the laser beam.

Abstract: A series of laser pulses, each pulse characterized by one or more predetermined pulse characteristics including wavelength, pulse energy, inter-pulse time interval, pulse width or pulse shape, is provided to drill a hole in a material. Drilling the hole in the material is achieved by placing the series of laser pulse spots at the location wherein the hole is to be drilled. One or more characteristics of one or more laser pulses in the series is changed in order to optimize the drilling process for the hole. The ability to change the characteristics of one or more laser pulses in the series of pulses to optimize the drilling process results in holes with desired attributes and a high drilling rate.

Abstract: A substrate is diced using a program-controlled pulsed laser beam apparatus having an associated memory for storing a laser cutting strategy file. The file contains selected combinations of pulse rate ?t, pulse energy density E and pulse spatial overlap to machine a single layer or different types of material in different layers of the substrate while restricting damage to the layers and maximising machining rate to produce die having predetermined die strength and yield. The file also contains data relating to the number of scans necessary using a selected combination to cut through a corresponding layer. The substrate is diced using the selected combinations. Gas handling equipment for inert or active gas may be provided for preventing or inducing chemical reactions at the substrate prior to, during or after dicing.

Abstract: Provided are: a table on which a workpiece is placed, a laser oscillator emitting a laser beam; a light-guide optical system deflecting the beam emitted from the oscillator; a cylindrical extensible bellows surrounding an optical path of the beam after the light-guide optical system deflects the beam; a bend mirror moving in an axial direction of the bellows while extending/contracting the bellows and deflecting the beam having passed through the bellows toward the table; a machining head irradiating the workpiece with the beam deflected by the mirror; an abnormality detector including a beam-sensor light-emitting unit emitting a beam advancing parallel with an axis of the bellows and a beam-sensor light-receiving unit measuring the amount of received light of the beam; and a control device bringing down the laser oscillator when the amount of received light of the beam in the beam-sensor light-receiving unit falls below a first threshold.

Abstract: A laser welding apparatus includes a laser welding unit including a first lens adapted to focus a laser beam; a second lens adapted to diffuse the laser beam to the first lens; and a third lens adapted to guide the laser beam to the second lens. The relative positions of the first lens, the second lens, and the third lens, are adjusted to adjust a diffusion angle and a beam width of the laser beam entering the first lens. The laser welding apparatus performs: actuating the laser welding unit to travel at a predetermined speed along a predetermined trajectory; directing the laser beam at a first welding spot; adjusting the focal length to focus the laser beam at the first welding spot; holding the laser focal spot size substantially constant; and directing the laser beam at a second welding spot after completion of welding for the first welding spot.

Abstract: In a method for scribing fragile material, a laser beam is irradiated onto a work plate of the fragile material. The work plate is heated by absorption of the irradiated laser beam and generating thermal stress by the heating. The laser beam is formed by a plurality of laser beam groups arranged along a beam scanning direction on a same line, and the plurality of laser beam groups are divided into two groups. One takes charge of initial heating and rising up temperature of the work plate, and another takes charge of temperature holding of the work plate. The laser beam intensity corresponding to each of the laser beam groups is adjusted so as to obtain optimum values. By the method, it is possible to remarkably increase scribing speed of the work plate of the fragile materials without increasing heating temperature.

Abstract: Device for processing a substrate are described herein. Devices can include a radiation source and an aperture positioned to receive radiant energy from the radiation source. The aperture can include one or more members, and one or more interfering areas, wherein the interfering areas surround a transmissive area. The one or more structures can affect transmission of radiant energy through a portion of the transmissive area of the aperture. Structures disposed on the aperture can reduce or redirect transmission to provide for more uniform overall transmission of radiant energy through the aperture.

Abstract: A laser beam processing machine includes a laser beam application device and a controller. The controller controls deflecting of the optical axis of a pulse laser beam from the laser beam application device in the processing-feed direction according to a plurality of processing position coordinates, and according to the frequency of the beam, to ensure that there is a predetermined time interval between pulses applied to the same processing position coordinates. One pulse is applied at a time to each of the plurality of processing position coordinates.

Abstract: Methods and apparatuses for laser microdissection are provided. For example, by a user at least one first system parameter is adjusted, for example varied, and at least one second system parameter of the laser microdissection system is adjusted automatically by the laser microdissection system such that a cut line has a desired cut line parameter.

Abstract: The present invention aims to rapidly and easily create processed data for scan controlling a laser light beam, and to create the processed data for the laser processing apparatus at high precision. A setting plane corresponding to a scanning region of a laser marker is displayed on a processed data generating device. A user operates the processed data generating device to arrange the processing pattern on the setting plane. Here, a marker head coincides an optical axis of the laser light beam L on a position corresponding to the reference point of the processing pattern, and photographs a work W with a camera which light receiving axis is coaxial with the optical axis of the laser light beam L. A photographed image monitor displays the photographed image along with a symbol indicating the position of the light receiving axis of the camera.

Abstract: A laser crystallization system is disclosed. In one embodiment, the laser crystallization system includes i) a mother substrate including first, second, and third display regions sequentially arranged in a first direction and ii) a stage for supporting the mother substrate and moving in the first direction and in a second direction. The system also includes i) a first laser irradiation unit for irradiating a first laser beam having a width greater than or identical to a width of a side of one of the display regions in the first direction and ii) a second laser irradiation unit spaced apart from the first laser irradiation unit and irradiating a second laser beam having a width greater than or identical to the width of the side in the first direction. Furthermore, the first and second laser beams may correspond to widths of sides of the first and third display regions.

Abstract: A method and laser processing system (2) addresses a substrate (102) with three different sets of laser processing parameters to achieve different surface effects in the substrate (102). A first set of laser parameters is employed to form a recess (106) in the substrate. A second set of laser parameters is employed to polish a surface (108) of the recess (106). A third set of laser parameters is employed to modify a polished surface (108) of the recess (106) to have optical characteristics that satisfy conditions for a desirable visual appearance.

Abstract: A method of forming stiffened plate by welding a plurality of stiffener materials and a steel plate, so that closed cross-sectional structures are secured onto a surface of the steel plate. The stiffener materials are joined to the steel plate as a result of edge portions of the stiffener materials which are in contact with the steel plate by being laser welded at a predetermined welding speed as a result of a laser having a predetermined output being irradiated from a predetermined direction thereon from the external side of the closed cross-sectional structures. Accordingly, it is possible to achieve an improvement in the weld quality when welding stiffener materials onto a steel plate, and to achieve an improvement in fatigue strength.

Abstract: Systems and methods for performing semiconductor laser annealing using dual loop control are disclosed. The first control loop operates at a first frequency and controls the output of the laser and controls the 1/f laser noise. The second control loop also controls the amount of output power in the laser and operates at second frequency lower than the first frequency. The second control loop measures the thermal emission of the wafer over an area the size of one or more die so that within-die emissivity variations are average out when determining the measured annealing temperature. The measured annealing temperature and an annealing temperature set point are used to generate the control signal for the second control loop.

Abstract: A laser annealing device for compensating wafer heat maps and its method are disclosed. A laser annealing device comprises a pump laser source array including of a plurality of pump laser sources for irradiating a tunable mask, each pump laser source emitting pump laser, an annealing laser source for emitting annealing laser and irradiating the tunable mask, and a tunable mask for transmitting at least part of the annealing laser after being irradiated by the pump laser.

Abstract: A method for production of safety/rupture discs (1) comprises the steps providing a foil element (1a), selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers, selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz, selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut (2) in the foil element by directly applying said laser beam to the foil element to remove material from the foil element (1a) thereby obtaining a safety/rupture disc.

Abstract: In different embodiments, a method is provided for processing at least one crystalline Silicon-wafer or a Solar-cell wafer. The method may include: a movement of the wafer with respect to a laser producing a laser beam; and therefore the formation of a laser channel in the wafer by means of a laser beam, wherein a thermal budget applied on the wafer by means of the laser beam is reduced in the peripheral region of the wafer, wherein the peripheral region includes a wafer edge, through which the laser beam exits the wafer after formation of the laser channel.

Abstract: The disclosure relates to an illuminating apparatus for illuminating a sample on a work stage, optionally with a relatively narrow illuminating line of relatively controlled energy, as well as methods for controlling energy of a laser source when illuminating a sample on a work stage with a relatively narrow illuminating line.

Abstract: A laser welding apparatus and method reproduces a welding state substantially identical to an actual operation of a robot at a manufacturing site even when an operating speed of the robot is changed. When a moving speed of the robot is, for example, 50% of an override ratio, a welding point speed, which is a resultant speed of a focus moving speed of the laser beam by movement of the robot having a scanner head and the focus moving speed of the laser beam by rotation of the laser scanning mirror, becomes identical to that when an override ratio is 100%. This is achieved by increasing a rotating speed of a laser scanning mirror within the scanner head.

Abstract: Temporal focusing of spatially chirped femtosecond laser pulses overcomes previous limitations for ablating high aspect ratio features with low numerical aperture (NA) beams. Simultaneous spatial and temporal focusing reduces nonlinear interactions, such as self-focusing, prior to the focal plane so that deep (˜1 mm) features with parallel sidewalls are ablated at high material removal rates.

Abstract: A laser lap welding method, for a galvanized steel sheet, includes preparing two steel sheets in lap configuration, at least one of which is the galvanized steel sheet, so that a galvanized layer thereof is located at an interface of the steel sheets; and irradiating a surface of any one of the two steel sheets in an overlapped region with a laser to perform lap welding. The welding is performed by applying the laser to travel at a predetermined power density and at a predetermined traveling velocity so as to partially and temporarily form an elongated hole in a molten pool extending backward from a laser irradiation spot at least in the steel sheet on the surface side, whereby metal vapor produced by laser irradiation is vented through the elongated hole backward in a laser traveling direction and in a laser irradiation source side.

Abstract: A method of forming a laser induced periodic surface structure (LIPSS), comprises directing a beam of picosecond laser pulses across the surface of a polycrystalline material to pattern the material with a LIPSS, where the laser pulses have a time duration of no greater than a selected pulse duration T and a pulse fluence above a threshold value of about H; wherein the laser pulses are directed across the surface so as to expose the polycrystalline material to at least a selected dosage; wherein T is 40 ps and the selected dosage is 20 J/mm2; and wherein H is in J/cm2 and is given by H=[0.0284×ln (T)]+0.0195. Also disclosed are methods for forming a LIPSS on a semiconductor, for solid colorization of materials, and for forming cone-like features and/or regions of grating-like features where the grating-like features are oriented in substantially different directions.

Abstract: The present invention is a method for separating a workpiece from a common substrate. It includes the steps of providing the workpiece, generating, within a beam source, a beam of laser pulses configured to modify a portion of the workpiece, determining a depth for creating a modified region based upon a characteristic of the workpiece and modifying a plurality of regions within the workpiece to form a plurality of modified regions. Modifying the plurality of regions includes directing the beam of laser pulses from an output of the beam source onto the workpiece, causing relative motion between the workpiece and the output of the beam source while directing the beam of laser pulses onto workpiece, and modifying a characteristic of the pulses of the beam upon generating a number of pulses which generally correspond to creating the modified regions to the determined depth.

Abstract: A device for the exact manipulation of material, especially of organic material, includes a pulsed laser system with a radiation source, said radiation source being a cavity-dumped fs oscillator.

Abstract: A pulse width controller for a thermal processing system is disclosed. Pulsed electromagnetic radiation is directed through a rotatable wave plate to a polarizing beam splitter, which reflects and transmits according to the phase angle of the wave plate. Radiation transmitted by the polarizing beam splitter is directed into an optical circuit that returns the radiation to the polarizing beam splitter after a transit time. A second rotatable wave plate is positioned in the optical circuit. The polarizing beam splitter reflects and transmits the returned radiation according to the phase angle of the second rotatable wave plate. A second pulse width controller may be nested in the optical circuit, and any number of pulse width controllers may be nested.

Abstract: A method for production of safety/rupture discs comprises the steps providing a foil element, selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers, selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz, selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut in the foil element by directly applying said laser beam to the foil element to remove material from the foil element thereby obtaining a safety/rupture disc.

Abstract: The present invention generally describes apparatuses and methods used to perform an annealing process on desired regions of a substrate. In one embodiment, pulses of electromagnetic energy are delivered to a substrate using a flash lamp or laser apparatus. The pulses may be from about 1 nsec to about 10 msec long, and each pulse has less energy than that required to melt the substrate material. The interval between pulses is generally long enough to allow the energy imparted by each pulse to dissipate completely. Thus, each pulse completes a micro-anneal cycle. The pulses may be delivered to the entire substrate at once, or to portions of the substrate at a time. Further embodiments provide an apparatus for powering a radiation assembly, and apparatuses for detecting the effect of pulses on a substrate.

Abstract: A micro melting process to melt surface irregularities or features on a surface of a substrate. The method includes providing a laser and a control mechanism associated with the laser. The control mechanism is used to melt the surface irregularities on the substrate. The control mechanism varies the laser intensity and direction by varying and monitoring the power of the laser. The approach direction of the laser is used to control the manner in which irregularities or surface features are melted, ambient atmospheric conditions, induced motion between the laser and the surface being processed.

Abstract: A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M2 values) to provide acceptable shaped beam profiles.

Abstract: Provided is a method for marking on a pressed metallic component whose visibility and corrosion resistance in a marking target is ensured. The method includes a step of irradiating a base treatment target region including a marking target region with a laser beam on a first irradiation condition, and a step of irradiating the marking target region with the laser beam on a second irradiation condition, in which a charged energy of the laser beam is set to be smaller on the first irradiation condition than the second irradiation condition, thereby providing between the marking pattern and a non-irradiation region, a base region having a residual stress greater than that of the non-irradiation region and a residual stress smaller than that of the marking pattern, so as to ensure a visibility. Furthermore, a corrosion resistance is ensured by using a metallic member which is heat-treated to enhance the hardness.

Abstract: A laser processing method of applying a pulsed laser beam having a repetition frequency of 20 kHz or more to a workpiece to thereby process the workpiece. The relation between the wavelength of the pulsed laser beam and the pulse width generating no cracks is determined by experiment on the basis of the absorption edge of the workpiece, thereby setting the processing conditions. The relation between various set values for the wavelength and the limits of the pulse width is plotted to prepare a graph having a vertical axis representing the wavelength and a horizontal axis representing the pulse width. The pulsed laser beam is applied in the region below a curve obtained by connecting the limits of the pulse width at the various set values for the wavelength.

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.