Abstract: A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.

Abstract: A method for controlling formation of glass bumps in a glass article with laser-irradiation without the use of a growth-limiting structure. Standard deviation of height between the glass bumps on the article is less than 1 micron by controlling the laser radiation dose provided on the glass article.

Abstract: A laser ablation system and methods are disclosed for performing material analysis. The laser ablation system includes a sample chamber which holds and encloses a sample material to be ablated; a laser source that produces a laser beam which is directed into the sample chamber to a surface of the sample material to cause laser ablation; a laser measuring device which is physically attached to the sample chamber to measure a power/energy value of the laser beam; and a material analyzing module that is coupled to the sample chamber to receive the ablated material from laser ablation of the sample material.

Abstract: A laser rod assembly includes a first and second laser rod embedded in a cladding material. The assembly has a first end and a second end. The laser rods generate laser light at ?laser (?laser light) when pumped by pump power at ?pump. A reflecting outer surface at ?pump is on or over a majority of an outer surface of the cladding material. Fold optic(s) on the second end provides optical coupling between the laser rods. An optical resonator includes a highly reflecting (HR) mirror at ?laser over an end of the first laser rod on the first end and an output coupler over an end of the second laser rod also on the first end.

Abstract: A cardboard-handling system with a rule-die associated to a first drum and a counter die associated to a second drum for pre-treating cardboards. A cardboard-alignmentor on a first side of the rule-die and counter-die aligns and conveys a cardboard together with one or more synchronized-cardboard transferors toward a side-gripper conveyor. The side-gripper conveyor transfers the cardboard toward and through the rule-die and counter-die drums for pre-treatment of the cardboard. Next the side-gripper conveyor conveys the cardboard toward and through a laser-treatment module to be further pre-treated. The side gripper conveyor movement is synchronized with a laser-treatment module for which a base with a plurality of protruding elements has moving capabilities and is synchronized with the side-gripper conveyor (via a timing belt for example).

Abstract: The disclosure is directed to laser spike annealing using fiber lasers. The method includes performing laser spike annealing of a surface of a wafer by: generating with a plurality of fiber laser systems respective CW output radiation beams that partially overlap at the wafer surface to form an elongate annealing image having a long axis and a length LA along the long axis; heating at least a region of the wafer to a pre-anneal temperature TPA; and scanning the elongate annealing image over the wafer surface and within the pre-heat region so that the annealing image has a dwell time tD in the range 30 ns?tD?10 ms and raises the wafer surface temperature to an annealing temperature TA.

Abstract: A traceable cable and method of forming the same. The cable includes at least one data transmission element, a jacket at least partially surrounding the at least one data transmission element, and a side-emitting optical fiber incorporated with and extending along at least a portion of the length of the cable. The side-emitting optical fiber has a core and a cladding substantially surrounding the core to define an exterior surface. The cladding has spaced apart scattering sites penetrating the exterior surface along the length of the optical fiber. The scattering sites scattering light so that the scattered light is emitted from the side-emitting optical fiber at discrete locations. When light is transmitted through the core, light scattered from the side-emitting optical fiber allows the cable to be traced along at least a portion of the length thereof.

Abstract: A system and method for controlling a hybrid welding process. An integrated hybrid welding power source includes a first power supply for providing a first welding output and a second power supply for providing a second welding output. The first power supply and the second power supply are operatively connected to coordinate the first welding output with the second welding output in real time while operating concurrently.

Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.

Abstract: A laser processing method including a first step of irradiating a surface of a workpiece with a laser beam with a focal point spaced from the surface, and forming a bottomed hole on the workpiece, which is defined with a tubular inner circumferential face opening at the surface and a bottom face; and a second step of irradiating the bottom face with a laser beam while an assist gas is blown into an opening of the bottomed hole but not blown onto an area surrounding the opening, and forming a through hole penetrating through the workpiece. A laser processing system includes a processing head focusing a laser beam emitted from a laser oscillator so as to irradiate a workpiece with the laser beam and blowing an assist gas onto the workpiece; and a control section controlling the first and second steps as an operation of the processing head.

Abstract: There are provided high power laser devices and systems for transmitting a high power laser beam across a rotating assembly, including optical slip rings and optical rotational coupling assemblies. These devices can transmit the laser beam through the rotation zone in free space or within a fiber.

Abstract: An aviation obstruction lighting system having a lamp mounted on the an aviation obstruction at an elevation sufficiently high to serve as a warning of the presence of the obstruction to pilots of approaching aircraft, a remote light source, and an optical waveguide connecting the lamp and the light source and conducting light from the light source to the lamp. The optical waveguide contains quartz glass fibers. The light source is mounted at an elevation to be manually accessible by a technician standing on, or on a platform less than two meters from, the ground. The lamp includes an optical waveguide end receiver, and a Fresnel lens surrounding a reflective element having a conical or frustoconical surface positioned to intercept and reflect light emanating from an optical waveguide, such that the reflected light is directed to an inner incident surface of the Fresnel lens.

Abstract: Apparatus and methods of thermally processing semiconductor substrates are disclosed. Aspects of the apparatus include a source of intense radiation and a rotating energy distributor that distributes the intense radiation to a rectifier. The rectifier directs the radiation toward the substrate. Aspects of the method include using a rotating energy distributor to distribute pulsed energy to a substrate for processing. The rotational rate of the energy distributor is set based on the pulse repetition rate of the energy source. A substrate may be continuously translated with respect to the energy distributor at a rate set based on the pulse repetition rate of the energy source.

Abstract: The present invention provides a method for manufacturing a grain oriented electrical steel sheet, including preparing as a material a steel slab having a predetermined composition and carrying out at least two cold rolling operations, characterized in that a thermal treatment is carried out, prior to any one of cold rolling operations other than final cold rolling, at temperature in the range of 500° C. to 750° C. for a period in the range of 10 minutes to 480 hours. The grain oriented electrical steel sheet of the present invention exhibits through utilization of austenite-ferrite transformation superior magnetic properties after secondary recrystallization.

Abstract: A device for assembling a first upper transparent part to a second lower absorbent part, the parts being positioned on a support. The device includes a mechanism projecting a laser beam onto the upper part, a first clamp geometrically referencing the assembly formed by the two parts and positioned on the support, a second clamp exerting a pre-determined stress on the assembly of parts, and a management system associated with the second clamp, adjusting the stress exerted at a pre-determined welding interface. An assembly method is intended for laser-transparent welding of two parts assembled using one such assembly device. The clamping fitting is configured to apply the stress exerted at the welding interface.

Abstract: An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer processing chamber. The apparatus further includes radiant heating elements disposed in different zones and operable to heat different portions of a wafer located within the wafer processing chamber. The apparatus further includes sensors disposed outside the wafer processing chamber and operable to monitor energy from the radiant heating elements disposed in the different zones. The apparatus further includes a computer configured to utilize the sensors to characterize the radiant heating elements disposed in the different zones and to provide a calibration for the radiant heating elements disposed in the different zones such that a substantially uniform temperature profile is maintained across a surface of the wafer.

Abstract: The invention relates to a method and an apparatus (1) for the production of a welding seam or a three-dimensional structure (26) on a surface of a metallic work piece (14) with the help of a welding torch (7) for carrying out a welding process with a welding wire (9) guided in a welding torch (7), whereby an electric arc (13) is ignited between the welding wire (9) and the work piece (14), and for stabilizing the electric arc (13) a laser (27?) for emitting a laser beam (27) with a maximum power of 2000 W is arranged, with a point of impact being on that position of the work piece (14) where the welding seam or structure (26) is produced. An improvement of the stabilization of the electric arc (13) is obtained if the laser (27?) is connected to a means (28) for the control of the laser (27?), which control means (28) is designed to activate the laser beam (27) prior to the ignition of the electric arc (13).

Abstract: A joining machine for joining ends of successive strips in a strip treatment installation includes a device welding a first end of a strip to a second end of another strip, a first pair of symmetrical clamping jaws including a first upper and a first lower clamping jaw gripping the first end of a strip, a second pair of symmetrical clamping jaws including a second upper and a second lower clamping jaw gripping the second end of a strip, the clamping jaws holding and positioning the first end facing the second end for welding the ends together. At least two clamping jaws of the two pairs each include a part for contacting one of the ends to be welded to another end. The part has a geometry and at least one constituent material reducing a strength of eddy currents likely to be created in the clamping jaw by electromagnetic induction.

Abstract: Embodiments described herein relate to thermal processing of semiconductor substrates. More specifically, embodiments described herein relate to laser thermal processing of semiconductor substrates. In certain embodiments, a uniformizer is provided to spatially and temporally decorrelate a coherent light image.

Abstract: The invention is a method of forming a layered-open-network polishing pad useful for polishing at least one of magnetic, semiconductor and optical substrates. Exposing a first and second polymer sheet or film of a photocurable polymer creates an exposure pattern in the first and second polymer sheet. The exposure pattern has elongated sections exposed to the energy source. The light exposure is of an exposure time sufficient to cure the photocurable polymer, but insufficient to cure adjacent elongated sections together. Attaching the first and second polymer sheets forms a polishing pad with the patterns of the first and second polymer sheets crossing. Curing the layered-open-network polishing pad to secure the layered-open-network polishing pad with the first and second sheets having sufficient stiffness to reduce sagging and maintain an orthogonal relationship between the elongated channels and the parallel planes of the polymer sheets.

Abstract: An optical power transfer system comprising a fiber spooler, a fiber optic rotary joint mechanically connected to the fiber spooler, and an electrical power extraction subsystem connected to the fiber optic rotary joint with an optical waveguide. Optical energy is generated at and transferred from a base station through fiber wrapped around the spooler, through the rotary joint, and ultimately to the power extraction system at a remote mobility platform for conversion to another form of energy.

Abstract: A method and apparatus for welding members formed of thermoplastic resin material, with high welding strength and small strength variations. A laser welding apparatus 1 brings a first member 2 formed of a transmissive thermoplastic resin that transmits a laser beam into contact with a second member 3 formed of an absorptive thermoplastic resin that absorbs the laser beam, and joins the thermoplastic resin members by melting their contact surfaces 4 with the laser beam. The laser welding apparatus 1 further comprises a laser beam generator 10 for irradiating the contact surfaces with the laser beam shone from the side of the first member 3 so as to melt at least one of the contact surfaces of the first member and the second member.

Abstract: Hybrid welding methods include directing a laser beam from a laser onto a first component that is vertically offset from a second component, and, directing a weld arc from an arc welder onto a weld joint between the first component and the second component to weld the first and second components together.

Abstract: A method of making a photoresist with rare-earth sensitizers is provided. The rare-earth sensitizer could be a salt or a rare-earth complex. According to the invention, photoresist composition is useful to pattern circuits by visible light.

Abstract: Disclosed is a laser peening apparatus, including: a liquid holding head to shape and hold liquid to trap plasma on a local surface of a workpiece; and a laser irradiation head to irradiate the surface with laser through the liquid held in the liquid holding head.

Abstract: A laser material processing system which includes a pulsed fiber laser source having a continuous wavelength bandwidth of larger than 100 nm and pulse width of from 100 femtosecond to 1 microsecond, a broad band laser emitted from one core of an optical fiber, where the broad band laser is applied to a subject material to produce removal of the subject material and/or color change of the subject material.

Abstract: An apparatus and method of operation for a high power broad band elongated thin beam laser annealing light source, which may comprise a gas discharge seed laser oscillator having a resonance cavity, providing a seed laser output pulse; a gas discharge amplifier laser amplifying the seed laser output pulse to provide an amplified seed laser pulse output; a divergence correcting multi-optical element optical assembly intermediate the seed laser and the amplifier laser. The divergence correcting optical assembly may adjust the size and/or shape of the seed laser output pulse within a discharge region of the amplifier laser in order to adjust an output parameter of the amplified seed laser pulse output. The divergence correcting optical assembly may comprise a telescope with an adjustable focus. The adjustable telescope may comprise an active feedback-controlled actuator based upon a sensed parameter of the amplified seed laser output from the amplifier laser.

Abstract: A method is disclosed for varying a mechanical property of a material at two depths. The method involves the application of at least two laser pulses of different durations. The method involves a determination of the density of the material from the surface to each depth, a determination of the heat capacity of the material from the surface to each depth, and a determination of the thermal conductivity of the material from the surface to each depth. Each laser pulse may affect the density, heat capacity, and thermal conductivity of the material, so it may be necessary to re-evaluate those parameters after each laser pulse and prior to the next pulse. The method may be applied to implantation materials to improve osteoblast and osteoclast activity.

Abstract: A converging point of processing laser light is made to accurately follow a laser light irradiation surface of an object to be processed. An object to be processed 1 is irradiated with measuring laser light along a line to cut 5, astigmatism is added to a reflected light component of the measuring laser light reflected by a front face 3 of the object 1 irradiated with the measuring laser light, a displacement sensor signal corresponding to a converged light image of the reflected light component having the astigmatism added thereto is detected, and the displacement sensor signal is made to become a feedback reference value corresponding to the quantity of the reflected light component, so as to locate the converging point of the processing laser light at a predetermined position with respect to the front face 3.

Abstract: A system and method for precision cutting using multiple laser beams is described. The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided.

Abstract: A flexible drill with a shaft having a nitinol portion (or nitinol region) provided between a stainless steel driver end and a stainless steel drill tip. The flexible drill with nitinol shaft is provided with a bearing surface to allow centering within a drill guide, low friction bearing and flexibility to drill around a curve. The bearing surface may be formed of a fluoropolymer such as LDPE (Low Density Polyethylene). The flexible drill shaft may be used through a drill guide, such as a curved drill sleeve.

Abstract: A laser annealing apparatus carries out an annealing treatment an amorphous silicon film on a TFT substrate. The apparatus includes: a mask having a plurality of apertures; a microlens substrate having a plurality of microlenses arranged on a surface thereof and configured to focus the plurality of laser beams Lb, that have passed through the respective apertures of the mask, onto the TFT substrate to apply a predetermined energy to the amorphous silicon film; a pair of guides each having a semi-cylindrical shape and disposed along both sides across the microlens substrate so that the axes of the guides are parallel to each other and that the tips of the guides protrude from the positions of tips of the microlenses toward the TFT substrate; and a film that is provided in a tensioned state between the pair of guides so as to be movable and that transmits a laser beam.

Abstract: A thermal cutter for cutting with heat a board mounted upon a table having an internal space includes a plurality of walls and a sound absorbent material. The walls are disposed in the internal space of the table to partition a plurality of exhaust chambers with each of the exhaust chambers having an aperture that opens towards a side on which the board is mounted. The sound absorbent material is provided to at least a portion of at least one of the walls, the sound absorbent material being removably coupled to the table.

Abstract: In a method for re-imaging a printing form that has been used for printing in a prior printing process a substrate of the printing form is cleaned globally of ink or varnish and the substrate is treated abrasively globally in order to erase a preceding printing image. The substrate to be imaged with a new printing image is treated locally in image regions with a pulsed laser beam and, in the process, a nanoscopic and hydrophobic surface structure is produced locally. The substrate is treated globally with a hydrophilicity intensifier, as a result of which the substrate becomes hydrophilic locally in the previously hydrophobic image regions. An apparatus has a corresponding erasing unit and an imaging unit with a femtosecond laser.

Abstract: A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 ?m is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

Abstract: A method for treating a surface is disclosed. According to some aspects, the method includes ejecting matter from the surface by projecting an ejection agent on the surface. The ejection agent is selected from gases, fluids in supercritical state, solid materials in divided form, solid materials in a gas vector and electromagnetic radiation. The method includes trapping the ejected matter in one or several pieces of an aerogel situated on trajector of the ejected matter. A device for carrying out this method as well as the use of an aerogel to trap the matter ejected from a surface during a treatment of that surface are also disclosed. The method may be applied in fields including cleaning, satinizing, polishing, deburring, etching, marking, pre-adhesion surface preparation metallization enameling, painting or varnishing operations are done, in particular electronics, microelectronics, optics, optoelectronics, bijouterie, jewelry, and the restoration of art and antiques.

Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.

Abstract: A laser machining device is provided with a laser light source, a spatial light modulator, a driving unit, a control unit, and a condensing optical system. The control unit selects a basic hologram corresponding to each basic machining pattern included in a whole machining pattern in a workpiece from a plurality of basic holograms stored by the storage unit, and determines a display region of the basic hologram in the spatial light modulator so that the deviation of the value of “I?/n” becomes small for the selected respective basic hologram when the intensity of a laser beam input to a display region of the basic hologram in the spatial light modulator is defined as I, the diffraction efficiency of the laser beam in the basic hologram is defined as ?, and the number of condensing points in a basic machining pattern corresponding to the basic hologram is defined as n.

Abstract: A method for the manufacture of a cutting tool provided with a tool holder (1) to which a cutter (2) is separably attached, includes applying a generative production process to a tool base body (3) to create the tool holder (1) with a desired finished shape.

Abstract: Processes and corresponding or associated arrangements for removal of a burr from a workpiece, particularly micromachined workpieces, involving irradiating a plasma plume source material with a laser beam to generate a plasma plume. The plasma plume at least in part impacts the burr disposed on the workpiece to at least in part remove the burr from the workpiece. In select embodiments, the plasma plume source material can be a part of the workpiece or a non-workpiece sacrificial material.

Abstract: A nozzle holder for a nozzle changer that is configured for at least one of mounting nozzles to and demounting nozzles from a processing head of a laser processing machine includes a nozzle storage chamber that widens along a nozzle removal direction to a nozzle removal opening. The nozzle storage chamber includes at least two nozzle storage seats that are offset in steps from each other and that store respective nozzles. A nozzle changer includes such several nozzle holders, and a laser processing machine includes such a nozzle changer.

Abstract: A pulse laser machining apparatus and method generates a clock signal, emits a pulse laser beam in synchronization with the clock signal, scans the pulse laser beam in synchronization with the clock signal only in a one-dimensional direction, moves a stage in a direction perpendicular to the one-dimensional direction, passes or cuts off the pulse laser beam in synchronization with the clock signal, and controls the passing or cutting off of the pulse laser beam based on the number of light pulses of the pulse laser beam.

Abstract: A modified region is accurately formed at a desirable position with respect to a laser light irradiation surface of an object to be processed. When an average difference ? has a value exceeding a predetermined threshold during trace recording, a particle segment Z including a line segment S where the average difference ? exceeds the predetermined threshold is defined. This determines that a particle exists on a line to cut 5 and randomly reflects measuring laser light, whereby a segment where the presence of the particle affects a control signal in a line segment to cut is detected as the particle segment Z. Correcting the control signal in the particle segment Z inhibits a converging lens from moving more than necessary because of an error included in the signal value under the influence of the presence of the particle, thus allowing the converging point of the processing laser light to accurately follow a front face 3.

Abstract: A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.

Abstract: There is provided a method of forming a nanoparticle including: preparing a wire formed of a material for forming a nano-sized particle; connecting the wire to first and second electrodes; pre-heating the wire using a pre-heating device; and applying energy to the wire using a power supply to form the nano-sized particle, wherein after the pre-heating is performed, a skin depth of the wire is larger than a radius of the wire.

Abstract: An apparatus for forming a pattern of a nanoparticle-based ink on a substrate has a printing apparatus that is energizable to deposit the nanoparticle-based ink in a pattern on a surface of the substrate. An illumination apparatus is energizable to direct a patterned illumination to cure the deposited ink pattern on the substrate, the illumination apparatus having an array having at least a first and a second laser diode, each laser diode coupled to a channel in a laser light coupling element through an optical fiber and having an illumination lens disposed to direct illumination from the coupling element onto the surface of the substrate. A transport apparatus is energizable to provide relative motion between the substrate and the illumination apparatus.

Abstract: An apparatus for reducing resources for selecting seed to be produced in commercial quantities or for research is disclosed. Samples of seed which are candidates for selection are collected and given an identifier. Specific tissue or structure from candidate seed is removed. A test or analysis is performed on the candidate seed or the removed tissue or structure. Results of the test or analysis are recorded and correlated to the seed's identifier. The results are evaluated and a decision is made whether to select a candidate seed for commercial production or for research. Time, space, and labor associated with growing plants in an experimental plot or greenhouse and taking tissue samples from growing plants is saved.

Abstract: A laser processing device for processing workpieces such as by welding includes a laser processing head and a workpiece clamping claw defining an opening through which the laser beam is focused on the workpiece. Each of the laser processing head and the clamping claw have respective shielding portions and movable relative to each other to selectively form a light-tight housing about a portion of the beam extending between the laser head and the clamping claw.

Abstract: A system and method for precision cutting using multiple laser beams is described, The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided.

Abstract: The present disclosure relates to a method and a system for generating low-energy electrons in a biological material. The biological material is held in position by a support. Laser beam pulses are directed by a focusing mechanism toward a region of interest within the biological material. This generates filaments of low-energy electrons within the region of interest. The method and system may be used for radiotherapy, radiochemistry, sterilization, nanoparticle coating, nanoparticle generation, and like uses.