Methods Patents (Class 219/121.71)
  • Patent number: 10503148
    Abstract: A computer aided technology system includes a processor. The processor may receive a design model for a blade that has multiple diffuser holes. Also, the processor may derive a hole position and a vector for each of the multiple diffuser holes. In addition, the processor may translate the hole position to a machine coordinate system to create a translated hole position. Moreover, the processor may generate a manufacturing program based on the translated hole position and the vector. The blade includes a stator vane, a rotor vane, or a combination thereof. Further, the blade is included in a compressor, a gas turbine engine, or a combination thereof.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: December 10, 2019
    Assignee: General Electric Company
    Inventors: Jason Anton Byers, Anthony Centa, Zhaoli Hu, Brian Christopher Wheeler
  • Patent number: 10471552
    Abstract: Systems and methods are disclosed herein for repairing components. A material layer may be deposited on a surface of a component. The material layer may cover a cooling hole. A pulsed heat source may heat the component and the material layer. An infrared camera may take a series of images of the component. A location of the cooling hole may be identified based on thermal properties of the component. A removal tool may remove a portion of the material layer in order to expose the cooling hole.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: November 12, 2019
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: David A. Raulerson, Kevin D. Smith, Zhong Ouyang, Lisa J. Brasche, William J. Brindley, David N. Potter
  • Patent number: 10391586
    Abstract: An aluminum covered with an anodically formed aluminum oxide layer is marked by repeated bursts of two or more individual laser pulses. The intensity of the individual pulses in the bursts is kept below a level experimentally determined to compromise the integrity of the aluminum oxide layer. The collective fluence in a burst is sufficient to mark the aluminum, but not sufficient to compromise the integrity of the oxide layer.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: August 27, 2019
    Assignee: Coherent, Inc.
    Inventors: Edward C. Rea, Jr., Hatim Haloui
  • Patent number: 10376989
    Abstract: An assembly and method of reducing discoloration of a foam material resulting from laser processing the material comprising an assembly configured for positioning below the material being processed and for directing air into open cells of the open-cell foam material to pressurize the material during laser processing. The assembly comprises an air delivery mechanism comprising one or more apertures for an air chamber positioned directly below the material travel path. Aligning the one or more apertures with the axis of the laser beam and its focal point when the material is positioned above the one or more apertures and pressurizing or filling of the open cells with air in the direct vicinity of the target area reduces processing related discoloration of the material. The cells are laser processed concurrently with pressurization thereby substantially reducing settling of debris and smoke on the material and reducing discoloration.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: August 13, 2019
    Assignee: PRESCO, INC.
    Inventors: Austin Dando, Daniel B. Miller, Joshua Butz, Donald R. Sloan
  • Patent number: 10307862
    Abstract: A series of laser pulse bundles or bursts are used for micromachining target structures. Each burst includes short laser pulses with temporal pulse widths that are less than approximately 1 nanosecond. A laser micromachining method includes generating a burst of laser pulses and adjusting an envelope of the burst of laser pulses for processing target locations. The method includes adjusting the burst envelope by selectively adjusting one or more first laser pulses within the burst to a first amplitude based on processing characteristics of a first feature at a target location, and selectively adjusting one or more second laser pulses within the burst to a second amplitude based on processing characteristics of a second feature at the target location. The method further includes directing the amplitude adjusted burst of laser pulses to the target location.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: June 4, 2019
    Assignee: ELECTRO SCIENTIFIC INDUSTRIES, INC
    Inventor: Yunlong Sun
  • Patent number: 10160059
    Abstract: A head assembly for a liquid jet guided laser system is disclosed having a coupling unit removably disposed to a laser focus optic module of the laser system. The coupling unit has a nozzle assembly removably connected to the coupling unit. The nozzle assembly has a liquid jet nozzle and a nozzle cap. The nozzle cap has a plurality of axial assist gas conduits and static assist gas conduits in fluid communication with an assist gas source extending through the nozzle cap body to individually transport assist gas to axial exit ports and static exit ports positioned to exhaust assist gas proximate the liquid jet. At least a portion of the plurality of axial assist gas conduits are partitioned from fluid communication with the liquid jet hole. A lateral movement assembly can be configured between the laser focus optic module and coupling unit.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: December 25, 2018
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Zhaoli Hu, Abe Denis Darling, William A. Zimmerman
  • Patent number: 10156075
    Abstract: A roofing component formed of polyethylene thermoplastic treated to prevent degradation due to exposure to ultraviolet (UV) light and an apparatus and method of forming the same. The UV treatment may include one or more of a UV absorber and a UV inhibitor. In one embodiment, the UV absorber comprises carbon black that is mixed with the polyethylene thermoplastic. The roofing component may comprise step flashing or a shingle.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: December 18, 2018
    Inventor: Michael John McDonough
  • Patent number: 10115521
    Abstract: An electronic component includes a multilayer body formed by laminating an insulator substrate and a plurality of insulator layers, a coil including coil conductors provided on the insulator substrate, and an internal magnetic path penetrating the insulator substrate. A manufacturing method for the electronic component includes: forming the coil conductors and a sacrificial conductor at the same time on a mother insulator substrate, which is the assemblage of a plurality of the insulator substrates; laminating insulator sheets, which are to be the corresponding insulator layers mentioned above, on the mother insulator substrate so as to cover the coil conductors; and exposing the sacrifice conductor by removing part of the insulator sheets.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: October 30, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Akinori Hamada
  • Patent number: 10096731
    Abstract: A method for vias and monolithic interconnects in thin-film optoelectronic devices (100, 200) wherein at least one line segment via hole (163, 165, 165?, 167) is formed by laser drilling and passes through front-contact layers (150, 152, 154, 156, 158) and semiconductive active layer (130), and wherein laser drilling causes forming a CIGS-type wall (132, 134, 136, 138) of electrically conductive permanently metalized copper-rich CIGS-type alloy at the inner surface (135) of the via hole, thereby forming a conductive path between at least a portion of front-contact and a portion of back-contact layers (120, 124, 126, 128, 129), forming a bump-shaped raised portion (155) at the surface of the front-contact layer, forming a raised portion (125, 127, 127?) of the back-contact layer, and optionally forming a raised portion of copper-rich CIGS-type alloy (155?) covering a portion of the front-contact layer (150). A thin-film CIGS device comprises at least one line segment via hole obtainable by the method.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: October 9, 2018
    Assignee: FLISOM AG
    Inventors: Roger Ziltener, Thomas Netter
  • Patent number: 10022790
    Abstract: A method of forming an airfoil (12), including: abutting end faces (72) of cantilevered film hole protrusions (64) extending from a ceramic core (50) against an inner surface (80) of a wax die (68) to hold the ceramic core in a fixed positional relationship with the wax die; casting an airfoil including a superalloy around the ceramic core; and machining film cooling holes (34) in the airfoil after the casting step to form an pattern of film cooling holes comprising the film cooling holes formed by the machining step and the cast film cooling holes (102) formed by the film hole protrusions during the casting step.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: July 17, 2018
    Assignees: SIEMENS AKTIENGESELLSCHAFT, MIKRO SYSTEMS, INC.
    Inventors: Ching-Pang Lee, Nan Jiang
  • Patent number: 9887102
    Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: February 6, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Tai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
  • Patent number: 9883088
    Abstract: A method of assembling a camera suitable for vehicular use includes providing a lens accommodated in a lens barrel, a camera front housing, and a printed circuit board with an imager disposed thereat. An adhesive is dispensed to establish a layer of uncured adhesive one of (i) between the lens barrel and a front portion of the camera front housing and (ii) between the printed circuit board and a rear portion of the camera front housing. With the lens in focus with the imager and optically center-aligned therewith, the adhesive is initially cured to an initially-cured state in an initial radiation curing process that includes exposure to UV light for a first period of time. The initially-cured adhesive is further cured to a further-cured state in a secondary curing process. The further-cured state is achieved within a second period of time that is longer than the first period of time.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: January 30, 2018
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Brian J. Winden, Robert A. Devota, Matthew C. Sesti, Joseph A. Stemmer, Steven V. Byrne, John R. Garcia, David F. Olson
  • Patent number: 9758876
    Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: September 12, 2017
    Assignee: CORNING INCORPORATED
    Inventors: Aric Bruce Shorey, Garrett Andrew Piech, Xinghua Li, John Christopher Thomas, John Tyler Keech, Jeffrey John Domey, Paul John Shustack
  • Patent number: 9717610
    Abstract: Polymeric composite stents reinforced with fibers for implantation into a bodily lumen are disclosed.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: August 1, 2017
    Assignee: Abbott Cardiovascular Systems Inc.
    Inventors: Bin Huang, David C. Gale
  • Patent number: 9707645
    Abstract: Certain embodiments of the disclosure may include systems, methods, and apparatus for locating and drilling closed holes of a gas turbine component. According to an example embodiment, the method can include receiving position data associated with one or more holes in a gas turbine component; receiving predefined hole position data from manufacturing data associated with the gas turbine component; determining at least one missing hole, based at least in part on comparing the received position data to the predefined hole position data; and drilling at least one hole in the gas turbine component corresponding to the determined at least one missing hole.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: July 18, 2017
    Assignee: General Electric Company
    Inventors: Yusuf Eren Ozturk, Selami Haydar Icli
  • Patent number: 9676062
    Abstract: Process for producing a line of weakness in a cover element comprising at least one slit. This slit is produced through a plurality of machining cycles in which a pulsed laser beam is guided in each instance over the cover element along an imaginary line so that the energy of the laser pulses is introduced into the cover element. The slits are produced in two segments. More energy is introduced over the machining cycles in the first, comparatively short segments than in the second, comparatively long segments. The residual wall below the slits decreases with each machining cycle until the first residual wall segment thickness in the first segment is so small that energy portions transmit through the first residual wall segment and are detected by a sensor arrangement arranged downstream. Accordingly, the first residual wall segment thickness is detected, and inferences can be drawn from this about the second residual wall segment thickness.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: June 13, 2017
    Assignee: JENOPTIK Automatisierungstechnik GmbH
    Inventors: Walter Lutze, Martin Griebel, Juergen Weisser
  • Patent number: 9662743
    Abstract: A method for manufacturing an airfoil is provided, the method including drilling a hole in a near wall of the airfoil using a laser drill and activating a back strike protection in a cavity of the airfoil. The method additionally includes detecting a breakthrough of a laser from the laser drill through the near wall of the airfoil and subsequently initiating a drilling subroutine, with the drilling subroutine including a continued operation of the laser drill. Such a method may provide for an improved hole, such as a cooling passage, in the airfoil.
    Type: Grant
    Filed: January 27, 2014
    Date of Patent: May 30, 2017
    Assignee: General Electric Company
    Inventors: Zhaoli Hu, Abe Denis Darling, Shamgar Elijah McDowell, Douglas Anthony Serieno
  • Patent number: 9661419
    Abstract: A microphone having a microphone capsule is provided. The microphone capsule has a diaphragm carrier, a diaphragm and an adhesive tape ring which is used to fasten the diaphragm to or in the diaphragm carrier. The microphone capsule is in the form of a dynamic sound transducer. A dynamic sound transducer for headphones, earphones or headsets is also provided. The sound transducer has a diaphragm carrier, a diaphragm and a moving coil which is coupled to the diaphragm. In a similar manner to the microphone capsule, the sound transducer has an adhesive tape ring between the diaphragm and the diaphragm carrier, which ring is used to fasten the diaphragm to the diaphragm carrier.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: May 23, 2017
    Assignee: Sennheiser electronics GmbH & Co. KG
    Inventors: Alwin Harms, Heinz Epping, André Michaelis, Günter Pöppel
  • Patent number: 9561555
    Abstract: A method of machining cooling holes in a component includes the steps of inserting an electro discharge machining guide that houses an electrode into an internal cavity of a component, and machining a cooling hole into a wall of the component with the electrode. A gas turbine engine component includes first and second spaced apart walls providing an internal cavity. The first wall has outer and inner surfaces. The inner surface faces the internal cavity. A cooling hole extends through the first wall from the inner surface to the outer surface. The cooling hole includes entry and exit openings respectively provided in the inner and outer surfaces. The exit opening includes a cross-sectional area that is smaller than a cross-sectional area of the entry opening.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: February 7, 2017
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: James M. Koonankeil, Edward F. Pietraszkiewicz, Karl A. Schachtner, Kevin J. Klinefelter, Markus W. Fritch, Jason Daley
  • Patent number: 9492882
    Abstract: The present invention relates to a cutting method for cutting an upper edge and a lower edge of a cutting plane into a curved shape, when a cutting object is cut by supplying plasma gas to the periphery of an electrode of a plasma torch and ejecting plasma arc from a nozzle. In order to melt the upper edge and the lower edge of the cutting plane to form a curved shape, at least one condition selected from plural conditions including a cutting electric current, cutting speed, height of a plasma torch, angle of the plasma torch, and flow rate of plasma gas upon performing the vertical cutting for forming the upper edge and the lower edge of the cutting object substantially at right angles is changed.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: November 15, 2016
    Assignee: KOIKE SANSO KOGYO CO., LTD.
    Inventors: Tetsuo Koike, Akira Furujo, Ryuta Hirai
  • Patent number: 9457430
    Abstract: The invention relates to a protective device (1) for the laser machining of holes (3) in at least one component (2) by means of a laser beam (5), wherein the protective device (1) is positionable in the beam direction downstream of the beam-exit-side end (8) of a hole (3) to be machined in the component wall (10), in order to protect an adjoining rear space having a component wall (11), opposite the hole (3), of the component (2) from the incident laser beam. The protective device (1) according to the invention is formed from a composite made of a matrix composed of polyether ether ketone plastics material and fibers embedded therein, wherein the fibers are embedded such that, with respect to their particular fiber extending direction, they extend in a criss-cross manner in the plastics material and are distributed at approximately the same density in the volume of the plastics material of the protective device (1).
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: October 4, 2016
    Assignee: Robert Bosch GmbH
    Inventors: Thorsten Bauer, Ulrich Graf
  • Patent number: 9449890
    Abstract: Methods for temporary bussing of semiconductor package substrates are disclosed and may include metal plating regions of a packaging substrate utilizing a plurality of bussed traces, which may be decoupled by forming debuss holes at intersections of the bussed traces. The decoupled traces may then be electrically tested, and the packaging substrate may be singulated into a plurality of substrates utilizing a sawing process through singulation areas in the packaging substrate. The traces may be electrically coupled via plating bars in the substrate. The plating bars may be located in the singulation areas. The intersections of the bussed traces may be in a Y pattern, which may be repeated along the singulation areas. The debuss holes may be formed utilizing mechanical drilling or lasing. The regions of the packaging substrate may be metal plated utilizing an electroplating process. The plurality of bussed traces may be biased for the electroplating process.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: September 20, 2016
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Johnnie Quan, August Joseph Miller, Jr., Kurt Raymond Raab, Jeffery Alan Miks
  • Patent number: 9381663
    Abstract: The method is used to drill at least one hole into a front wall section of a workpiece (12) by way of a machining jet formed from liquid, to which abrasive material is admixed as needed. As seen looking in the drilling direction, the front wall section is located in front of a rear wall section of the workpiece, which is disposed with an intermediate space at a distance from the front wall section. The hole is drilled at least partially by the machining jet impinging on the front wall section in a pulsed manner. This pulsed jet is generated by the recurrent interruption of the impingement of the liquid and/or of the abrasive material on the front wall section.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: July 5, 2016
    Assignee: MICROWATERJET AG
    Inventor: Walter Maurer
  • Patent number: 9364916
    Abstract: A method and device for producing a hole in an object is disclosed. The method includes the generation of a beam for removing material such that a bottom of a borehole is placed in a focus position of the beam, and a removal of material by impingement of the beam on the bottom of the borehole. A repeated placing of the bottom of the borehole in a focus position of the beam in order to compensate for the increased depth of the hole as a result of the removal of material is combined with a step of changing a radiation characteristic of the beam when the bottom of the borehole is repeatedly placed in a focus position.
    Type: Grant
    Filed: May 29, 2010
    Date of Patent: June 14, 2016
    Assignee: MTU Aero Engines GmbH
    Inventors: Mark Geisel, Stefan Schur
  • Patent number: 9350137
    Abstract: The disclosed invention relates to a method of realizing a laser processing system. The system relating to one aspect of the invention is provided with a processing laser, a vaporization laser, and an oscillator controller. The processing laser is a flashlamp-pumped 1.06 ?m solid-state laser, a pulsed iodine laser or an oxygen molecule laser. The vaporization laser is a pulsed laser whose wavelength is longer than 1.4 ?m.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: May 24, 2016
    Inventor: Kiwamu Takehisa
  • Patent number: 9328618
    Abstract: A high temperature turbine nozzle with automatic regulation of flow of cooling air passing therethrough. Each of vanes includes a first sleeve drilled with holes and a second sleeve that is engaged in the first sleeve, drilled with corresponding holes, and made of a material possessing a coefficient of expansion different from that of the first sleeve.
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: May 3, 2016
    Assignee: SNECMA
    Inventors: Régis Grohens, Renaud Gabriel Constant Royan
  • Patent number: 9303178
    Abstract: A suspension for protecting a semiconductor material includes a polymeric matrix as carrier medium, inorganic particles, and at least one of an absorber dye or a plasticizer.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: April 5, 2016
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Gudrun Geyer, Mathias Kämpf, Kathrin Lampert
  • Patent number: 9289318
    Abstract: A bioabsorbable polymeric stent with time dependent structure and properties and methods of treating a diseased blood vessel with the bioabsorable polymeric stent are disclosed. The structure and properties of the stent change with time and allow the vessel to be restored to a natural unstented state. The bioabsorbable stent loses mechanical integrity in a controlled manner due to modification of selected structural elements.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: March 22, 2016
    Assignee: Abbott Cardiovascular Systems Inc.
    Inventors: Mikael Trollsas, Dariush Davalian, Michael Huy Ngo, Hao-Ming Hsiao, Boris Anukhin, Syed Hossainy, David Gale
  • Patent number: 9260074
    Abstract: An instrument panel has a base member and a cover member, which is adhered to the top surface of the base member. A first cleavage groove serving as a start point of rupture of the base member caused by inflation pressure of an airbag is formed in the back surface of the base member. The cover member is configured by a ground fabric layer, a cover layer adhered to the top surface of the ground fabric layer, and a cushion layer adhered to the back surface of the ground fabric layer. The cushion layer is formed of a knitted original fabric. A second cleavage groove is formed only in the back surface of the cushion layer out of the layers configuring the cover member in correspondence with the first cleavage groove of the base member.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: February 16, 2016
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Junichi Fujita, Minoru Toda, Chiharu Totani, Shunta Asakuma
  • Patent number: 9221271
    Abstract: Systems and methods for pharmacy messaging are described. A system includes a laser module and a control module. The laser module includes a marking chamber with a plurality of laser heads therein. A first and second entry gate are adjacent the marking chamber. The first entry gate is configured to open when the second entry gate is closed. A first and second exit gate are adjacent the marking chamber at a side different from the first entry and second entry gate. The first exit gate is configured to open when the second exit gate is closed. A transporter moves the objects being marked into and out of the marking chamber through the various gates. The control module is communicatively coupled to the laser module and adapted to control the laser module. Additional methods and systems are disclosed.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: December 29, 2015
    Assignee: Express Scripts, Inc.
    Inventors: Charles E. Eller, Jacob J. Reinhardt, Katherine H. Sundararaman
  • Patent number: 9211751
    Abstract: A system is described for tracking a position of a receiver medium as it travels along a media path. A laser provides heat to the receiver medium in a localized area sufficient to permanently alter a physical property of the receiver medium thereby forming a reference mark. A sensor at a downstream position along the media path is adapted to sense the reference mark providing a sensed signal. The sensed signal is analyzed to determine a position of the receiver medium as the receiver medium passes through the second position along the media path by detecting a position of the reference mark.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: December 15, 2015
    Assignee: EASTMAN KODAK COMPANY
    Inventors: Michael J. Piatt, Robert Edward Kauffman, James Douglas Wolf
  • Patent number: 9188504
    Abstract: Methods for testing turbine blades. One method for testing turbine blades includes measuring dimensions of each of a first set of turbine blades. The method also includes testing airflow through first openings in each of the first set of turbine blades to determine airflow properties of each of the first set of turbine blades. The method includes determining a relationship between the dimensions and the airflow properties of each of the first set of turbine blades. The method includes measuring dimensions of each of a second set of turbine blades. The method also includes determining airflow properties for each of the second set of turbine blades based at least partially on the dimensions of the second set of turbine blades and the relationship.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: November 17, 2015
    Assignee: General Electric Company
    Inventors: Michelle Rene Bezdecny, Michael Evans Graham, Michael Lee Bartholomew
  • Patent number: 9187195
    Abstract: A process for making perforations in a plastic film material to be used in a package for products prone to decay, in which the surface area of the perforations made in a defined surface area of the plastic film material must have a predetermined value, which process has the following steps: A. making of one perforation or a number of perforations in the defined surface area of the plastic film material, B. measuring the surface area of the perforation or of the number of perforations made in step A, C. calculating the difference between the predetermined perforation value minus the surface area of all perforations present in the defined surface area, D. if the difference is smaller than a first predetermined reference value, stopping the making of perforations in the defined surface area of the plastic film material, or if the difference is larger than the first predetermined reference value repeating the steps A to C until the difference is at most equal to the first predetermined reference value.
    Type: Grant
    Filed: April 29, 2008
    Date of Patent: November 17, 2015
    Assignee: Perfotec B.V.
    Inventors: Martijn Willem de Bruin, Bastian Rinke Antony Groeneweg
  • Patent number: 9138913
    Abstract: Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are presented, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create multiple scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces different types of sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination through either light scattering or light reflection and nearly invisible without illumination. Transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: September 22, 2015
    Assignee: IMRA AMERICA, INC.
    Inventors: Alan Y. Arai, Gyu C. Cho, Jingzhou Xu, Fumiyo Yoshino, Haibin Zhang, James Bovatsek, Makoto Yoshida
  • Patent number: 9113547
    Abstract: In some embodiments, same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning (SAP) is presented. In this regard, a method is introduced including patterning a first density region of a laminated substrate surface using LPP, patterning a second density region of the laminated substrate surface using SAP, and plating the first and second density regions of the laminated substrate surface, wherein features spanning the first and second density regions are directly coupled. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: August 18, 2015
    Assignee: Intel Corporation
    Inventors: John Guzek, Yonggang Li
  • Patent number: 9089930
    Abstract: The object of the present invention is provision of a surface protection sheet for laser processing to be applied to the surface on the opposite side of the laser beam irradiation face, which can protect the surface of an application object, and does not allow easy development of a dross during laser cutting processing. According to the present invention, a surface protection sheet 1 for laser processing to be applied to the surface on the opposite side of the laser beam irradiation face 2a of a workpiece 2 during a cutting process by irradiation of a laser beam 6 on the workpiece 2 is provided, which contains a substrate layer and an adhesive layer formed on one surface of the substrate layer, wherein the substrate layer is made of a resin material having a melt viscosity measured based on JIS K7199 (1999) at 290° C. of not more than 200 Pa·s, and has a thickness of 0.01-0.12 mm.
    Type: Grant
    Filed: September 22, 2010
    Date of Patent: July 28, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventors: Ikkou Hanaki, Keiji Hayashi, Kazuhito Okumura
  • Patent number: 9067277
    Abstract: A method is described for simultaneously writing patterns in thin films of material coated on the opposite sides of thin glass or plastic substrates by direct write, laser ablation. The substrates are fully or partially transparent to the laser radiation used and in addition the surfaces of the substrates are not assumed to be flat. Different registered patterns may be applied at the same time to opposite sides of the substrates.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: June 30, 2015
    Assignee: M-Solv Ltd.
    Inventor: Phillip Thomas Rumsby
  • Patent number: 9044830
    Abstract: A method for forming cavity in substrate includes setting start position on closed loop line having circumference L for substrate, consecutively irradiating laser from laser device upon board for the substrate such that holes are formed, and moving the device in loop from the start position along the line such that penetrating hole is formed through the board. The start position of first loop is set as base position, the moving includes shifting the start position by distance d after each loop and controlling such that the moving satisfies p=?di, m?L/p and M=m×n, where i=1 to n, n represents number of loops, p represents pitch of the holes, m represents number of the holes in loop, ?di is distance from the base position for the start position after i-th loop, and M is number of the holes by the loops.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: June 2, 2015
    Assignee: IBIDEN CO., LTD.
    Inventors: Yukinobu Mikado, Yuki Tanaka
  • Patent number: 9040871
    Abstract: Methods for producing a continuous hole in a substrate are provided. A laser is used for producing an inner proportion and a diffuser of the continuous hole, wherein an angular position of the laser with respect to the substrate is changed at least three times.
    Type: Grant
    Filed: August 12, 2010
    Date of Patent: May 26, 2015
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Jan Münzer, Thomas Podgorski
  • Publication number: 20150129688
    Abstract: Microfluidic flow-through elements and methods for forming and using the same, particularly, low cost, easily sterilized, disposable microfluidic flow-through elements may include an orifice region suitable, for example, for fluid jet formation (such as in a droplet sorter or flow cell) or sample injection or hydrodynamic focusing (such as in a non-droplet flow cytometer). Laser drilling, for example laser ablation, may be used to form an orifice region extending through an orifice wall section of a base substrate. The base substrate may be unitarily-formed by injection molding a polymeric material. The orifice region may be advantageously configured to form a predetermined geometry by controlling the characteristics of the ablating beam.
    Type: Application
    Filed: September 18, 2014
    Publication date: May 14, 2015
    Inventors: Kristopher Scott Buchanan, Johnathan Charles Sharpe
  • Patent number: 9029729
    Abstract: A process for reopening cooling-air holes by a laser in order to remove coat down is provided. A nanosecond laser is provided and used for reopening the holes, wherein pulse times between 1 ?s and 20 ?s and a pulse frequency between 20 kHz and 40 kHz provided by the nanosecond laser are used.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: May 12, 2015
    Assignee: Siemens Aktiengesellschaft
    Inventors: Andrea Massa, Rolf Wilkenhöner, Adrian Wollnik
  • Publication number: 20150121962
    Abstract: A laser material processing system which includes a pulsed fiber laser source having a continuous wavelength bandwidth of larger than 100 nm and pulse width of from 100 femtosecond to 1 microsecond, a broad band laser emitted from one core of an optical fiber, where the broad band laser is applied to a subject material to produce removal of the subject material and/or color change of the subject material.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 7, 2015
    Inventors: Shibin Jiang, Jihong Geng, Qing Wang
  • Patent number: 8993923
    Abstract: A system for manufacturing an airfoil includes a laser beam and a first fluid column surrounding the laser beam to create a confined laser beam directed at the airfoil. A liquid flowing inside the airfoil disrupts the first fluid column inside the airfoil. A method for manufacturing an airfoil includes confining a laser beam inside a first fluid column to create a confined laser beam and directing the confined laser beam at a surface of the airfoil. The method further includes creating a hole through the surface of the airfoil with the confined laser beam, flowing a liquid inside the airfoil, and disrupting the first fluid column with the liquid flowing inside the airfoil.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: March 31, 2015
    Assignee: General Electric Company
    Inventors: Zhaoli Hu, Douglas Anthony Serieno, Sharon Trombly Swede, Jane Marie Lipkin
  • Publication number: 20150075845
    Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; an inner layer build-up layer formed on the base substrate and including a first inner layer circuit layer, a second inner layer circuit layer, an inner layer insulating layer, and an inner layer via having a tapered section; and an outer layer build-up layer formed on the inner layer build-up layer and including an outer layer circuit layer, an outer layer insulating layer, and an outer layer via having a rectangular section.
    Type: Application
    Filed: September 12, 2014
    Publication date: March 19, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Ki Young Yoo
  • Publication number: 20150068455
    Abstract: Disclosed is a method of manufacturing a metal mask. A method of manufacturing a metal mask in accordance with an exemplary embodiment of the present invention includes forming through holes in a plate using a laser, by scanning the laser onto sequentially smaller overlapping portions of the plate.
    Type: Application
    Filed: September 4, 2014
    Publication date: March 12, 2015
    Inventors: Choong Ho LEE, Tong-Jin Park, Doh-Hyoung Lee, Sung Sik Yun, Da Hee Jeong, Jun Ho Jo
  • Patent number: 8969752
    Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: March 3, 2015
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Kenshi Fukumitsu, Fumitsugu Fukuyo, Naoki Uchiyama
  • Patent number: 8969760
    Abstract: A system for manufacturing an airfoil includes a laser beam and a first fluid column surrounding the laser beam to create a confined laser beam directed at the airfoil. A gas flowing inside the airfoil disrupts the first fluid column inside the airfoil. A method for manufacturing an airfoil includes confining a laser beam inside a first fluid column to create a confined laser beam and directing the confined laser beam at a surface of the airfoil. The method further includes creating a hole through the surface of the airfoil with the confined laser beam, flowing a gas inside the airfoil, and disrupting the first fluid column with the gas flowing inside the airfoil.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: March 3, 2015
    Assignee: General Electric Company
    Inventors: Zhaoli Hu, Douglas Anthony Serieno
  • Patent number: 8969759
    Abstract: An apparatus for creating a hole in solid sheet material (1) by laser beam irradiation is described comprising a source of laser radiation; a focusing apparatus (11) for impinging a beam of laser radiation from the source onto a surface of solid sheet material (1) in which holes are to be formed in use; and a holding device (7) for holding said solid sheet material (1); wherein the holding device (7) is structured to hold the sheet material (1) in use in an arcuate configuration. A method of creating a hole in solid sheet material making use of such an arcuate configuration is also described.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: March 3, 2015
    Assignee: CAV Advanced Technologies Limited
    Inventor: Bryan Humphreys
  • Publication number: 20150034603
    Abstract: Components, such as turbine blades or vanes, are formed to a desired shape and dimensions by ablation machining a work piece surface. Recast layer material created on the work piece surface during the ablation machining is subsequently removed by fluoride ion cleaning (FIC). Exemplary ablation machining methods include laser machining and electric discharge machining (EDM). The work piece material may include superalloys commonly used for fabrication of turbine blades or vanes, which are susceptible to recast layer formation during EDM or laser machining. Post ablation FIC recast layer removal is easier than known methods, such as mechanical grinding, secondary EDM machining of the layer at lower speeds and/or current intensity, or chemical etching processes. Ablation machining processes can be optimized for speed and efficiency without regard for recast layer avoidance, with knowledge that the recast layer will be subsequently removed by the complimentary FIC process.
    Type: Application
    Filed: July 30, 2013
    Publication date: February 5, 2015
    Inventor: Ivan F. Oliver Vargas
  • Patent number: 8946588
    Abstract: A process for providing a protection against damages in a machine head is claimed. The process comprises the following steps: First a blind steel plate (protection plate 20) is fixed to a protection chamber (10). Then the transparent liquid jet (WJ) guided laser beam (LB) is started, which drills a transit-hole into it. This protection plate (20) has the transit-hole (23) precisely arranged on the optical axis. Therefore no further alignment is required. Further an apparatus for treating a work piece by means of a laser beam (LB) which is guided in a transparent liquid jet (WJ) is claimed. The apparatus comprises a protection chamber (10) mounted on the output (5) of a coupling unit (CU) and a protection plate (20) replaceable fixed to the first chamber (10) protecting the outlet (15) of the first chamber (10) from sputtered debris.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: February 3, 2015
    Assignee: Synova SA
    Inventors: Grigore Suruceanu, Benjamin Carron