Abstract: A shaping apparatus is equipped with: a beam shaping system having a beam irradiation section that includes a condensing optical system which emits a beam and a material processing section which supplies a shaping material irradiated by the beam from the beam irradiation section; and a controller which, on the basis of 3D data of a three-dimensional shaped object to be formed on a target surface, controls a workpiece movement system and the beam shaping system such that a target portion on the target surface is shaped by supplying the shaping material from the material processing section while moving the beam from the beam irradiation section and the target surface on a workpiece (or a table) relative to each other. Further the intensity distribution of the beam in the shaping plane facing the emitting surface of the condensing optical system can be modified.

Abstract: A laser marking system for marking a product comprising a laser source for providing a laser beam, a marking head for projecting the laser beam on to the product, a housing comprising an extraction device configured to generate a flow of extraction fluid for extracting matter generated by an interaction between the laser beam and the product, and a controller for controlling the laser source and the marking head. The laser marking system further comprises an umbilical assembly connecting the housing to the marking head.

Abstract: A laser marker includes: a base including: a first guide portion; and a restriction part; a laser oscillator configured to emit laser light, the laser oscillator being removably mounted to the base by sliding in a mounting direction with being placed on the base, the laser oscillator including: a second guide portion extending in the mounting direction, the second guide portion being configured to be engaged with the first guide portion; a contact part configured to be in contact with the restriction part in a case the laser oscillator is mounted to the base; and an expander; and a scanner having an insertion part, the expander being inserted into the insertion part in a case the laser oscillator is mounted to the scanner, and the scanner being configured to scan the laser light emitted from the laser oscillator.

Abstract: In an optical device capable of adjusting a focal position of laser light, the accuracy of laser processing is improved. An optical device which processes a subject by irradiating the subject with laser light, includes: a focal position adjustment mechanism configured to adjust a focal position of the laser light; an incident position adjustment mechanism configured to adjust an incident position of the laser light incident on the subject in a direction perpendicular to a focal direction of the laser light; and a control unit configured to control driving of the focal position adjustment mechanism and the incident position adjustment mechanism, wherein the control unit controls the driving of the incident position adjustment mechanism based on an amount of driving of the focal position adjustment mechanism to correct a shift of the incident position due to change of the focal position.

Abstract: The present invention relates to a checking tool and a method for checking whether a laser cutting machine is provided with a correct workpiece from a set of workpieces, comprising the method steps of: Detecting actual workpiece properties of a workpiece which is provided or is prepared to be provided to the laser cutting machine for cutting; Providing a set of cutting plans, wherein one cutting plan of the set of cutting plans is forwarded to a control unit of the laser cutting machine, wherein each cutting plan is associated to target workpiece properties; Comparing the detected actual workpiece properties with the target workpiece properties, and providing a comparison result, indicating whether the correct workpiece is provided according to the cutting plan; Depending on the comparison result: Issuing a stop signal to stop the cutting process or issuing an adaption signal to change the sequence in the set of cutting plans.

Abstract: Systems, devices, and methods for identifying a target in a body using a spectroscopic feedback from the target are disclosed. An exemplary surgical feedback control system comprises a feedback analyzer configured to receive a reflected signal from a target in response to electromagnetic radiation directed at a target, and a controller in operative communication with the feedback analyzer. The controller can generate a control signal to a surgical system to perform a predetermined operation based upon the received reflected signal, including determining a composition of the target, or programming a laser setting to direct laser energy to the target.

Abstract: A laser processing apparatus emits processing light, measurement light, processing guide light, and measurement guide light with which a surface of a workpiece is irradiated. Respective wavelengths of the processing guide light and the measurement guide light are set to wavelengths at which a deviation amount between an irradiation position of the processing guide light and an irradiation position of the measurement guide light due to a chromatic aberration of magnification of a lens, and a deviation amount between an irradiation position of the processing light and an irradiation position of the measurement light due to the chromatic aberration of magnification of the lens are equal to each other. Therefore, positioning of spot positions of a plurality of laser lights having different output differences can be realized with high accuracy and high speed.

Abstract: Implementations of methods of singulating a plurality of die included in a substrate may include forming a groove through a backside metal layer through laser ablating a backside metal layer at a die street of a substrate and singulating a plurality of die included in the substrate through removing substrate material of the substrate in the die street.

Abstract: A method and an apparatus for processing an object by generation of laser radiation as a collimated laser beam, influencing the intensity distribution and/or the phase progression over the cross section of the laser beam, splitting the laser beam into two partial beams, and deflection and focusing of the partial beams so that the partial beams are superimposed in a processing zone in the material of the object.

Abstract: An optical axis adjusting method includes a position detecting step of emitting a laser beam from a laser oscillator, applying the laser beam to a processing point, and detecting the position of the laser beam by using a position detecting unit set at the processing point, a storing step of storing the position of the laser beam as detected in the position detecting step as a reference position, and an adjusting step of operating an adjusting mechanism of each optical component holder in the case that the position of the laser beam is deviated from the reference position after performing maintenance of each optical component, thereby adjusting the position of the laser beam so that the position of the laser beam is shifted back to the reference position.

Abstract: A manufacturing method for a printed circuit board includes: passing a first laser beam output from a laser output device through a first aperture so as to define an outer diameter of the first laser beam, positioning the first laser beam by an optical axis positioning device including a galvano device and an f? lens, and irradiating the printed circuit board with the first laser beam such that a through-hole is formed in a copper layer; and passing a second laser beam output from the laser output device through a second aperture so as to define an outer diameter of the second laser beam whereby a diameter of the second aperture is smaller than a diameter of the first aperture, positioning the second laser beam by the optical axis positioning device, and irradiating the printed circuit board with the second laser beam such that an insulating layer is processed.

Abstract: Aspects of the invention may be directed to a method of creating a predetermined structure from a diamond bulk. In some embodiments, the method may include: irradiating the diamond bulk with at least one laser having a focal point at a predetermined location, the laser may create graphitization at locations where the focal point of the laser engages the diamond bulk; at least one of: moving the diamond bulk to be positioned with the focal point of the laser within the diamond bulk, and moving the at least one laser such that diamond bulk be positioned with the focal point of the laser, along at least one axis wherein the movement corresponds to a predefined scheme; removing of the graphite from the diamond bulk; and extracting the predetermined structure from the diamond bulk.

Abstract: An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece.

Abstract: An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas to minimize deleterious surface modifications and mitigate oxide formation associated with laser machining.

Abstract: A laser peening device includes: a laser oscillator; an irradiation nozzle for irradiating a laser beam onto an irradiation target; an optical transmission unit; a shutter attached to the optical transmission unit; a liquid feeder for supplying the irradiation nozzle with liquid to cause the liquid to flow along an optical path of the laser beam running from the irradiation nozzle to the irradiation target; an ongoing irradiation sensor for obtaining information on ongoing laser beam irradiation indicating whether the laser beam is being appropriately irradiated for execution of ongoing laser peening operation on the irradiation target; and a control unit controlling the shutter according to the information on the ongoing laser beam irradiation obtained by the ongoing irradiation sensor.

Abstract: A method of fabricating a frame to enclose one or more semiconductor dies includes forming one or more features including one or more cavities and one or more through-vias in a substrate by a first laser ablation process, filling the one or more through-vias with a dielectric material, and forming a via-in-via in the dielectric material filled in each of the one or more through-vias by a second laser ablation process. The one or more cavities is configured to enclose one or more semiconductor dies therein. In the first laser ablation process, frequency, pulse width, and pulse energy of a first pulsed laser beam to irradiate the substrate are tuned based on a depth of the one or more features. In the second laser ablation process, frequency, pulse width, and pulse energy of a second pulsed laser beam to irradiate the dielectric material are tuned based on a depth of the via-in-via.

Abstract: The present invention relates to a deflection unit (10) having an optical element (20), which partly reflects a first wavelength and which partly transmits a different, second wavelength. The deflection unit defines an operating beam path traversed by the operating beam (14) from a first window (12) to a second window (24) via a reflection at the optical element (20). The deflection unit comprises an XY-deflection device (22), which is arranged in the operating beam path in order to scan the operating beam that has emerged, a focusing device (16) for focusing the operating beam (14), wherein the focusing device has a variable focal length and is arranged in the operating beam path between the first window (12) and the optical element (20).

Abstract: A method for manufacturing a peeled substrate has a laser condensing step for focusing laser light at a prescribed depth from the surface of a substrate and a positioning step for moving and positioning a laser condenser relative to the substrate, the method involving forming a processed layer in the substrate. The laser condensing step includes a laser light adjustment step in which a diffraction optical element is used to branch the laser light into a plurality of branched laser beams, and at least one of the branched laser beams is branched such that the intensity thereof differs from the other branched laser beams. The processed layer is elongated using the branched laser beam having a relatively high intensity among the plurality of branched laser beams to process the substrate, and the elongation of the processed layer is restrained using the branched laser beams having a relatively low intensity.

Abstract: Disclosed is a method for marking an optical article coated with an interference coating including at least two layers, an inner layer and an outer layer, and having reflection coefficient Re; by exposure of the inner layer, at a marking point, by way of a laser beam at a marking wavelength, in such a way as to ablate the inner layer and any layer further away from the substrate; the ablated area having a reflection coefficient Rm different from Re by at least 1%; the inner layer absorbing the marking wavelength to a greater degree than any layer further away from the substrate. Also disclosed is an optical article coated with an interference coating having at least two layers, an inner layer and an outer layer, the article including a marking pattern formed by local absence of layers.

Abstract: An apparatus for finishing a component includes at least one articulating arm, at least one plasma gun disposed at an end of a first articulating arm of the at least one articulating arm, at least one shot peen nozzle maintained in a fixed positioned relative to the plasma gun, and a controller controllably coupled to the articulating arm such that output signals from the controller control motions of the articulating arm.

Abstract: Methods and apparatus for extending the lifetime of optical components are disclosed. A beam of laser energy directed along a beam path that intersects a scan lens, through which it can be transmitted. The beam path can be deflected within a scan region of the scan lens to process a workpiece with the laser energy transmitted by the scan lens. The scan region can be shifted to a different location within the scan lens, e.g., to delay or avoid accumulation of laser-induced damage within the scan lens, while processing a workpiece.

Abstract: The present invention relates to apparatus for cutting out a human or animal tissue, such as a cornea, or a lens, said apparatus including a treatment device for producing a pattern consisting of at least two impact points in a focusing plane from a L.A.S.E.R. beam generated by a femtosecond laser (1), the treatment device being positioned downstream from said femtosecond laser, remarkable in that the treatment device comprises an optical focusing system (5) for focusing the L.A.S.E.R. beam in a cutting-out plane, and a control unit (6) able to control the displacement of the optical focusing system along an optical path of the L.A.S.E.R. beam for displacing the focusing plane in at least three respective cutting-out planes so as to form a stack of surfaces for cutting out the tissue.

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and a flexible substrate region (30d) of a plastic film (30) of a multilayer stack (100) are divided, the interface between the flexible substrate region (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into the first portion (110) and the second portion (120) while the multilayer stack (100) is kept in contact with the stage (210). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (210). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate region (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i).

Abstract: A processing machine includes a plurality of radiating modules disposed in a row, and a process chamber module configured to releasably attach to the plurality of radiating modules. The process chamber module includes a process chamber defining a processing field, a construction platform, a powder coater, and a powder reservoir. The powder coater is configured to apply a powder material layer-by-layer in a direction of the construction platform within the processing field. The powder reservoir is configured to infeed the powder material to the powder coater. Each radiating module includes a respective energy beam source configured to generate an energy beam, and a respective beam guide configured to guide the energy beam in a direction of the construction platform within a portion of the processing field. The portions of the processing field of two adjacent radiating modules partially overlap.

Abstract: Implementations of methods of singulating a plurality of die included in a substrate may include forming a groove through a backside metal layer through laser ablating a backside metal layer at a die street of a substrate and singulating a plurality of die included in the substrate through removing substrate material of the substrate in the die street.

Abstract: The present disclosure relates to a cooling apparatus (1) comprising a metal and/or electrically conductive EMC enclosure (2) and a converter (E1) and also a plurality of electrically operated units (E2, . . . , En) within the EMC enclosure (2) which are designed to influence a local temperature in at least one region (30, 31) inside or outside the EMC enclosure (2), wherein the converter (E1) directly supplies at least one or more of the units (E2, . . . , En) with a respective supply voltage, and wherein the converter (E1) and the units (E2, . . . , En) are each designed such that the line-bound and/or field-bound interference (Sxy) which is specifically generated by this unit during operation of the cooling apparatus (1) is compensated for by a line-bound and/or field-bound interference (Sxy) of at least one of the respectively other units (E1, . . . , En) partially or completely in terms of its respective interference level (Pn).

Abstract: Systems and methods for fragmenting a lens by a laser cataract surgery system includes a sub-nanosecond laser source generating a treatment beam that includes a plurality of laser beam pulses. An optical delivery system is coupled to the sub-nanosecond laser source to receive and direct the treatment beam. A processor is coupled to the sub-nanosecond laser source and the optical delivery system. The processor includes a tangible non-volatile computer readable medium comprising instructions to determine a lens cut pattern for lens fragmentation and determine a plurality of energies of the treatment beam as a linear function of a depth of the lens cut pattern. The treatment beam is output according to the lens cut pattern and the determined energies.

Abstract: A laser processing apparatus includes: a scanner configured to adjust a path of at least one of a first laser beam and a second laser beam; and a lens unit configured to condense the first laser beam and the second laser beam received from the scanner. The scanner may include a first reflection member for providing the first laser beam to the lens unit and a second reflection member for providing the second laser beam to the first reflection member.

Abstract: Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a semiconductor region can be formed in or above a substrate. A first metal layer can be formed over the semiconductor region. A laser can be applied over a first region of the metal layer to form a first metal weld between the metal layer and the semiconductor region, where applying a laser over the first region comprises applying the laser at a first scanning speed. Subsequent to applying the laser over the first region, the laser can be applied over a second region of the metal layer where applying the laser over the second region includes applying a laser at a second scanning speed. Subsequent to applying the laser over the second region, the laser can be applied over a third region of the metal layer to form a second metal weld, where applying the laser over the third region comprises applying the laser at a third scanning speed.

Abstract: An apparatus includes a beam splitter and a plurality of mirrors. The beam splitter is positioned to receive a laser beam from a source and split the received laser beam to a first plurality of split laser beams and a second plurality of split laser beams. The plurality of mirrors is configured to direct the first plurality of split laser beams and further configured to direct the second plurality of split laser beams. The first plurality of split laser beams is directed by the plurality of mirrors is configured to cut a glass substrate. The second plurality of split laser beams is directed by the plurality of mirrors is configured to shape the glass substrate.

Abstract: A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).

Abstract: For material processing of a material, which is in particular for a laser beam to a large extent transparent, asymmetric shaped modifications are created transverse to the propagation direction of the laser beam. Thereby, the laser beam is shaped for forming an elongated focus zone in the material, wherein the focus zone is such that it includes at least one intensity maximum, which is transverse flattened in a flattening direction, or a transverse and/or axial sequence of asymmetric intensity maxima, which are flattened in a sequence direction. After positioning the focus zone in the material, a modification is created and the material and the focus zone are moved relative to each other in the or across to the flattening direction or in the or across to the sequence direction for forming a crack along an induced preferred direction.

Abstract: An additive manufacturing system includes a laser device, a build plate, and a scanning device. The laser device is configured to generate a laser beam with a variable intensity. The build plate is configured to support a powdered build material. The scanning device is configured to selectively direct the laser beam across the powdered build material to generate a melt pool on the build plate. The scanning device is configured to oscillate a spatial position of the laser beam while the laser device is configured to simultaneously modulate the intensity of the laser beam to thermally control the melt pool.

Abstract: In a laser machining apparatus, a controller is configured to perform: supplying an initial drive current to a pump light emitting device during an initial drive current supply period; controlling a scanner to start scanning a laser beam emitted from a laser beam emitting device after a standby period has elapsed from a start of supplying the initial drive current; and supplying a prescribed drive current to the pump light emitting device after the initial drive current supply period has elapsed, a prescribed drive current value being smaller than an initial drive current value, the pump light emitting device emitting the pump light having prescribed light intensity upon receipt of the prescribed drive current, the laser beam emitting device emitting the laser beam having prescribed beam intensity when the pump light having the prescribed light intensity is incident upon the laser beam emitting device.

Abstract: Provided herein is a method for forming a periodic microstructure on a surface of zirconia-based ceramics, which are not easily mechanically workable, without causing thermal adverse effects. A zirconia-based ceramic having a surface periodic microstructure is also provided. A linearly or circularly polarized laser beam is irradiated to a zirconia-based ceramic surface, and periodic irregularities are formed in a spot of the laser beam. Stripe-pattern irregularities parallel to the direction of polarization can be formed in a spot of a laser beam by irradiating a linearly polarized ultrashort pulsed-laser beam to a zirconia-based ceramic surface. A mesh-like raised region and a dot-like recessed region can be periodically formed by irradiating a circularly polarized ultrashort pulsed-laser beam to a ceramic surface.

Abstract: The present embodiment relates to a semiconductor light emitting element having a structure that enables removal of zero-order light from output light of an S-iPM laser. The semiconductor light emitting element includes an active layer, a pair of cladding layers, and a phase modulation layer. The phase modulation layer has a base layer and a plurality of modified refractive index regions each of which is individually arranged at a specific position. One of the pair of cladding layers includes a distributed Bragg reflector layer which has a transmission characteristic with respect to a specific optical image outputted along an inclined direction with respect to a light emission surface and has a reflection characteristic with respect to the zero-order light outputted along a normal direction of the light emission surface.

Abstract: There is provided a manufacturing method of a hollow composite magnetic member having weakened magnetism in a portion of a ferromagnetic hollow member, the method includes: a step of forming a weak-magnetic area having weakened magnetism by melting and mixing a Ni-containing material and the hollow member by continuously supplying the Ni-containing material to a portion of the hollow member and heating the irradiation area having a line segment shape with the laser beam. Accordingly, since it is possible to prevent drop of a local portion of a hollow ferromagnetic pipe from being easily generated by a weak-magnetization treatment, to greatly reduce deformation generated by laser irradiation, and it becomes unnecessary to adjust the shielding gas pressure inside the pipe, the weak-magnetization treatment can be performed with higher efficiency and higher quality.

Abstract: The invention relates to a laser material processing system comprising a collimation optic (K) having a total collimation focal length (fK), consisting of: a beam supply (Z) for divergent beams (D); a first and second optical device (Ll, L2) having a positive or negative focal length (fl, f2), wherein the divergent beams (D) first pass through the first optical device (Ll) and subsequently pass through the second optical device (L2), and leave the second optical device (L2) in a collimated state; a third optical device (0) arranged downstream of the collimation optic (K) and having a positive focal length (fO) that focuses the beams (P) leaving the collimation optic (K) in a collimated state to a focus (F); a first and second adjusting element (Al, A2) for independently moving the first or the second optical device (LI, L2) away from one another along a beam propagation direction (R), wherein a total beam path (gs) between the beam supply (Z) and an image-side focal plane (B) of the third optical device (0) i

Abstract: The present embodiment relates to a semiconductor light emitting element having a structure that enables removal of zero-order light from output light of an S-iPM laser. The semiconductor light emitting element includes an active layer, a pair of cladding layers, and a phase modulation layer. The phase modulation layer has a base layer and a plurality of modified refractive index regions each of which is individually arranged at a specific position. One of the pair of cladding layers includes a distributed Bragg reflector layer which has a transmission characteristic with respect to a specific optical image outputted along an inclined direction with respect to a light emission surface and has a reflection characteristic with respect to the zero-order light outputted along a normal direction of the light emission surface.

Abstract: A laser processing apparatus includes a controller having (a) a section for storing the Y coordinate of a characteristic point having a predetermined positional relation to each division line formed on a wafer as a reference value with respect to a reference position where the focal point of a laser beam coincides with a predetermined position on each division line, (b) a section for detecting the amount of deviation of the Y coordinate of the characteristic point after indexing each division line of the wafer in the Y direction by the operation of a Y moving unit, from the Y coordinate stored as the reference value, and (c) a section for determining whether or not the amount of deviation detected is greater than an allowable value.

Abstract: A method of laser welding a workpiece stack-up that includes two or more overlapping metal workpieces is disclosed. The disclosed method includes directing a laser beam at a top surface of the workpiece stack-up to create a molten metal weld pool and, optionally, a keyhole, and further gyrating the laser beam to move a focal point of the laser beam along a helical path having a central helix axis oriented transverse to the top and bottom surfaces of the workpiece stack-up. The gyration of the laser beam may even be practiced to move the focal point of the laser beam along a plurality of helical paths so as to alternately convey the focal point back-and-forth in a first overall axial direction and a second overall axial direction while advancing the laser beam relative to the top surface of the workpiece stack-up along a beam travel pattern.

Abstract: A machine learning apparatus that learns laser machining condition data of a laser machining system includes: a state amount observation unit that observes a state amount of the laser machining system; an operation result acquisition unit that acquires a machined result of the laser machining system; a learning unit that receives an output from the state amount observation unit and an output from the operation result acquisition unit, and learns the laser machining condition data in association with the state amount and the machined result of the laser machining system; and a decision-making unit that outputs laser machining condition data by referring to the laser machining condition data learned by the learning unit.

Abstract: A method of manufacturing a flexible display panel includes forming a groove in a first area of a layered structure of the flexible display panel, and bending a portion of the first area including the groove from a plane of a second area of the layered structure. The second area extends from the first area. Forming the groove includes radiating a pulsating laser beam along an imaginary line corresponding to the groove such that an overlap ratio between consecutive pulse spots of the pulsating laser beam is greater than or equal to 0.80 and less than or equal to 0.90.

Abstract: Provided are a controller and a machine learning device that perform machine learning to optimize the servo gain of a machine inside a facility in accordance with action conditions, action environments, and a priority factor of the machine. The control system observes machine information on a machine as state, acquires information on machining by a machine as determination data, calculates a reward based on the determination data and reward conditions, performs the machine learning of the adjustment of the servo gain of the machine, determines an action of adjustment of the servo gain of the machine based on the state data and a machine learning result of the adjustment of the servo gain of the machine, and changes the servo gain of the machine, based on the action of adjustment of the determined servo gain.

Abstract: Systems and methods for fragmenting a lens by a laser cataract surgery system includes a sub-nanosecond laser source generating a treatment beam that includes a plurality of laser beam pulses. An optical delivery system is coupled to the sub-nanosecond laser source to receive and direct the treatment beam. A processor is coupled to the sub-nanosecond laser source and the optical delivery system. The processor includes a tangible non-volatile computer readable medium comprising instructions to determine a lens cut pattern for lens fragmentation and determine a plurality of energies of the treatment beam as a linear function of a depth of the lens cut pattern. The treatment beam is output according to the lens cut pattern and the determined energies.

Abstract: A beam director, typically comprises a first mirror rotating about a longitudinal axis, with a reflective surface at an acute angle to the longitudinal axis, which enables a laser beam to be transmitted along the longitudinal axis and redirected onto a work surface, which is typically perpendicular to the longitudinal axis. A second stationary arcuate mirror segment may be used to reflect the beam along an arcuate path on the work surface. Previous beam director systems can be improved or simplified by: 1) elimination of the second mirror with a 90° reflection to the work surface; 2) fixing the Tangent factor when drawing/rendering/sintering/cutting using f-theta like lens; and 3) fixing the Tangent factor by controlling the amount and/or the duration of energy.

Abstract: Method for determining the characteristics of a system for generating at least one pattern of light, the method comprising: a) providing a desired pattern of light, b) expressing the amplitude and the phase of the output pulse of the system as a function of the input laser pulse and in function of the characteristics of the system to obtain a calculated output pulse, the input laser pulse having a duration below or equal to 1 nanosecond, c) determining at least one characteristic of the system by minimizing a distance between the calculated output pulse and the desired output laser pulse.

Abstract: The invention concerns an optical system (10) comprising: a spatial light modulator (13) comprising an array of controllable elements adapted for generating a modulated light beam (17) by diffracting an incident light beam (12), the modulated light beam (17) comprising a modulated part and an unmodulated “zero order” part, the modulated part carrying an image to be projected into a replay volume (18), a control unit for applying a control signal to the controllable elements so as to control the modulated light beam (17) generated by the controllable elements, a perturbing optical element (30) for introducing optical aberrations in the incident light beam (12) and/or the modulated light beam (17) so as to spread the unmodulated “zero order” part of the modulated light beam in the replay volume (18), the perturbing optical element (30) generating distortions in the image to be projected, wherein the control signal comprises an image signal component carrying data representative of the image to be projected a

Abstract: Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle ? that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan ???(1), and 0.16?sin ??0.22??(2).

Abstract: Disclosed are a laser processing method for cutting a semiconductor wafer having a metal layer formed thereon and a laser processing device. The disclosed laser processing method transmits a plurality of laser beams, which propagate coaxially, to the semiconductor wafer, thereby forming focusing points in positions adjacent to a surface of the metal layer, which constitutes a boundary with the semiconductor wafer, and to one surface of the semiconductor wafer, respectively.