Abstract: Devices and methods for fabricating medical devices are disclosed. A device in accordance with the present inventions includes a laser beam source capable of producing a laser beam, a carrier coupled to a carrier motion actuator capable of moving the carrier relative to the laser beam, and a workpiece motion actuator capable of moving a workpiece relative the laser beam. A method in accordance with the present invention includes the steps of positioning the carrier between the laser beam source and the workpiece, illuminating a portion of the carrier with the laser beam, moving the carrier relative to the laser beam, and moving the workpiece relative to the laser beam.

Abstract: The present invention is a system for laser micromachining where a scan mirror and milling algorithm are used to produce high precision, controlled hole shapes in a workpiece. A picosecond laser that produces short pulses is used to reduce thermal effects to improve the quality and repeatability of the milled holes, and a Diffractive Optical Element (DOE) is used to split a single beam into a plurality of beams to allow parallel drilling of the workpiece. A method for operating a laser drilling system where high precision, controlled hole shapes in a workpiece are drilled includes using a scan mirror and milling algorithm, and using a picosecond laser in conjunction with a DOE, thus ensuring that spectral bandwidth issues and thermal issues are addressed to improve the quality and repeatability of the holes.

Abstract: Provided is a chip scale marker and a marking method. The method for marking, using a chip scale marker, wherein a laser beam is irradiated from a laser source on the wafer chips via a galvano scanner and an f-theta lens, the method comprising: (a) measuring position information of a plurality of points on the wafer; (b) transmitting the measured position information to a controller; (c) calculating a deviation between a marking distance between the f-theta lens and the point on the wafer surface and a focus distance of the f-theta lens from the transmitted position information; and (d) if the deviation is greater than a predetermined value in the step (c), calibrating the wafer chip to be positioned at the focus distance of the f-theta lens.

Abstract: A maskless patterning apparatus allows for laser beam ablation of one or more layers of material while not etching an underlying different material layer. A micromirror array produces the desired complex pattern on the workpiece and a continuous feature and end point detection system provides location and material parameter changes to accurately control the pattern position and depth of etching. End point detection includes monitoring energy reflected from a specially prepared replica of the material to be ablated, whose thickness and consistency match the active workpiece area. The process terminates when the proper amount of material is removed.

Abstract: A laser processing apparatus includes a stage for mounting a workpiece, which moves the workpiece along two axes which are in parallel with the workpiece, the two axes being perpendicular to one other; a laser optical unit including a light source uniting laser light for irradiating the workpiece mounted on the stage with laser light, a stage controller for controlling the movement of the stage in each direction of the two axes, a collecting lens for collecting laser light and irradiating the workpiece with the laser light; a casing for placing the collecting lens on an optical path of the laser light, and a driving unit for moving the casing in a direction parallel to the optical path of the laser light. The driving unit moves the casing and focuses a focal point of the collecting lens on the workpiece.

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 &mgr;m to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths.

Abstract: A machining device for simultaneously machining a plurality of work pieces 71, 72 on one machining table 7 with high positional accuracy is provided. The machining device detects positions of the work pieces 71, 72 with detectors 91, 92 mounted to respective machining heads 81, 82. The machining device has respective units for, based on the positional data, moving the machining table 7 to a position where displacements of respective machining heads 81, 82 are nearly equal, and for moving machining ranges of machining heads 81, 82 so as to substantially eliminate displacements between respective machining heads 81, 82 and work pieces 71, 72.

Abstract: In an apparatus for making and inspecting a multi-component cigarettes, each cigarette including two or more different components arranged relative to one another, the apparatus includes a device for advancing a web in a first direction. The apparatus further includes a device for positioning at least two different components of a cigarette relative to one another on the web as the web advances in the first direction. The apparatus further includes a garniture device for wrapping the web around the at least two different components by moving opposite edges of the web transversely to the first direction such that, at a closure point in the garniture device, the opposite edges overlap each other. The apparatus further includes an imaging device disposed upstream of the closure point for generating an image of the at least two different components.

Abstract: An apparatus and method for controlling twist curvature of a disc head slider is provided, where the slider has a bearing surface, a back surface, which is opposite to the bearing surface, a longitudinal axis and a transverse axis. The apparatus obtains a measure of the twist curvature of the bearing surface and selectively alters material stresses in a working surface of the slider. The material stresses are altered asymmetrically with respect to the longitudinal axis and the transverse axis based on the measure of the twist curvature to induce a change in the twist curvature.

Abstract: A laser processing apparatus includes a stage for mounting a workpiece, which moves the workpiece along two axes which are in parallel with the workpiece, the two axes being perpendicular to one other; a laser optical unit including a light source uniting laser light for irradiating the workpiece mounted on the stage with laser light, a stage controller for controlling the movement of the stage in each direction of the two axes, a collecting lens for collecting laser light and irradiating the workpiece with the laser light; a casing for placing the collecting lens on an optical path of the laser light, and a driving unit for moving the casing in a direction parallel to the optical path of the laser light. The driving unit moves the casing and focuses a focal point of the collecting lens on the workpiece.

Abstract: A laser beam position control apparatus for a CNC laser equipped machine tool, that will automatically maintain precise alignment of the beam path, though the machine may be operating in a non-uniform temperature environment. The apparatus compensates for small deviations in flatness of machine mounting surfaces by steering the laser beam. The laser beam control apparatus includes a laser beam position sensor for mounting in the beam path of the machine tool and that communicates with a signal processor that in turn communicates with at least one drive apparatus that controls at least one actuator capable of moving an object to steer the laser beam.

Abstract: A nozzle holding means (13) having a nozzle (19) being free to eject laser beam from its top end is provided being free to move along a guide means among a plurality of machine tools. Nozzle holding means operation control means (6, 33) for controlling hardening operation on a workpiece by the nozzle are provided, and communication control means (6, 33) are provided for exchanging information necessary for hardening operation on a workpiece to be machined with each machine tool between the control means and a control means of each machine tool. The nozzle moves among the machine tools and hardening operation is performed on workpieces (29, 30) in the respective machine tools, thereby it is not necessary to provide a hardening unit for exclusive use every each machine tool, and it is possible to provide a hardening equipment having high working ratio.

Abstract: A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis. The reference data is generated by the system which includes a modulator for reducing power of the material-processing laser beam to obtain a probe laser beam to measure height of the semiconductor wafer at a plurality of locations about the site to obtain reference height data.

Abstract: A galvanometer controller capable of control with stability and with immunity to changes with time and variation in environment temperature and having improved operability and expandability, and a laser machining apparatus having the galvanometer controller. The galvanometer controller comprises a correcting arrangement formed in a digital circuit, the correcting arrangement having a distortion correction section for correcting a working distortion of an optical unit including a lens, an orthogonality correction section for correcting the orthogonality between the two axes of the galvanometer, and a linearity correction section for correcting the linearity on each of the two axes.

Abstract: The invention relates to a device for influencing a laser beam by means of an adaptive mirror (12) in the beam path, having a piezoelectric adjusting member (17) arranged on the back of the mirror (12), it being the case that, in order to achieve low-aberration deformation of the mirror (12) for the purpose of influencing the divergence of the beam, there is provided between the adjusting member (17) and the back (24) of the mirror (12) a pressure-transmitting device (19) which acts on a large area of the deformable surface of the mirror (12).

Abstract: Devices and methods for fabricating medical devices are disclosed. A device in accordance with the present inventions includes a laser beam source capable of producing a laser beam, a carrier coupled to a carrier motion actuator capable of moving the carrier relative to the laser beam, and a workpiece motion actuator capable of moving a workpiece relative the laser beam. A method in accordance with the present invention includes the steps of positioning the carrier between the laser beam source and the workpiece, illuminating a portion of the carrier with the laser beam, moving the carrier relative to the laser beam, and moving the workpiece relative to the laser beam.

Abstract: A laser beam machining apparatus capable of highly accurate machining at a high speed. A parallel link mechanism including a plurality of links is fixed to a frame and a workpiece holder having moving means is provided thereunder. The links of the parallel link mechanism connect a movable member with a stationary member, and the movable member is moved with respect to the stationary member by the extending/retracting operation of the links. A laser head serving as a machining head is attached to the movable member. A supply line includes a laser transmitting optical fiber, pipes for supplying water, assist gas, etc., and an electrical signal line. A laser beam LB outputted from the laser head performs machining on a workpiece W on the workpiece holder. The supply line passes through a through hole formed inside link joint portions on the stationary member. Hollow motors for driving the links of the parallel link mechanism are mounted on the stationary member.

Abstract: A disc balancing device and a method thereof. The disc balancing device includes a disc assembly having a driving source, and a disc rotatably disposed at the driving source, a displacement measurement unit measuring vibration in the rotation of the disc assembly, a phase angle measurement unit measuring a phase angle from a reference point of the disc assembly in the rotation of the disc assembly, an operation/control unit calculating an eccentric mass and an eccentric position of the disc assembly, by using the biased vibration measured in the displacement measurement unit and the phase angle measured in the phase angle measurement unit, and a laser cutter tracking and laser-cutting the side portion of the disc corresponding to the eccentric position according to the information from the operation/control unit, whereby the eccentric mass of the disc assembly is balanced to reduce vibration in the rotation.

Abstract: A method for focusing an ultrashort pulse laser relative to a workpiece using the position of a plasma formed by a laser. A laser beam is focused to a focal point. The high peak intensity of the ultrashort pulse laser ionizes air at the focal region to form a plasma. The intensity of the plasma varies as its position relative to the workpiece varies. The intensity of the plasma formed by the focused laser beam is detected. The position of the focal point relative to the workpiece is adjusted responsive to the detected intensity of the plasma.

Abstract: In a laser machining apparatus comprising a deflector for changing a direction of a laser beam outputted from a laser oscillator, and a converging lens for refracting the laser beam introduced from the deflector and focusing the laser beam onto a work to be machined, a lens position adjusting unit is provided for changing a relative position between a plurality of lenses constituting the converging lens and the lens position adjusting unit change the relative positions of the lenses so as to cancel a change in refractance of the lenses due to a change in the temperature.

Abstract: A device for machining a hole or a shape of varying profile in a mechanical workpiece using an excimer laser comprises a screen having an aperture of predetermined shape disposed between the excimer laser and a device for focussing the laser beam, the screen being movable in a plane perpendicular to the laser beam. Control means is provided for automatically controlling displacement of the screen in real time while the hole is being machined in the workpiece, the control being effected as a function of the number of pulses emitted by the excimer laser. As an alternative, the screen may be replaced by a diaphragm comprising variable-aperture shutters.

Abstract: A laser cutting system has a specially designed frame that allows the laser cutting head to be mounted to the underside of a cross beam for a more efficient movement. The frame is further designed so as to allow the accessing of the work area of the laser cutting system along three different directions. The movement of the laser cutting head for fabricating a sheet placed in the work area of the laser cutting system is effected by a process that takes into consideration a number of parameters and determined data all of which are interpolated for generating optimal movements to further enhance the operating efficiency of the laser cutting system. The laser resonator of the laser cutting system of the instant invention is configured to have a telescopic system that maintains the density and power of the laser beam by auto focusing the same so that optimum cuts can be effected irrespective of whichever area of the worksheet is to be fabricated.

Abstract: A laser cutting system has a specially designed frame that allows the laser cutting head to be mounted to the underside of a cross beam for a more efficient movement. The frame is further designed so as to allow the accessing of the work area of the laser cutting system along three different directions. The movement of the laser cutting head for fabricating a sheet placed in the work area of the laser cutting system is effected by a process that takes into consideration a number of parameters and determined data all of which are interpolated for generating optimal movements to further enhance the operating efficiency of the laser cutting system. The laser resonator of the laser cutting system of the instant invention is configured to have a telescopic system that maintains the density and power of the laser beam by auto focusing the same so that optimum cuts can be effected irrespective of whichever area of the worksheet is to be fabricated.

Abstract: This installation (2) for laser welding at least two overlapping parts (4, 5) comprises a laser source (16), a head (18) for focusing, in the zone of overlap (6), a laser beam emitted by the source, a mechanism (24) for pressing on a first (4) of the parts and intended to co-operate with means (26) for retaining another part (5) so as to hold the parts that are to be welded pressed together in the region of their zone of overlap, and means (10, 14) for the relative displacement of the head with respect to the zone of overlap of the parts that are to be welded. The pressing mechanism (24) is subject to the displacement of the head parallel to the zone of overlap. The pressing mechanism comprises an element (44) for pressing on rolling means that are intended to roll along the first part (4). This element is free to rotate about an axis. The rolling means automatically orientate themselves in the direction of displacement of the head (18) parallel to the zone (6) of overlap by the rotation of the said element.

Abstract: A laser beam machining apparatus has machining apparatus including a laser oscillator, a stage for moving a workpiece in XY directions, and a central processing unit (CPU) for controlling laser emission of the laser oscillator and movement of the stage. The CPU causes the laser beam machining apparatus to group machining points on the workpiece into a plurality of segments, each segment being a set of machining points aligned parallel to one of the X axis and Y axis, to create a shortest route through the plurality of segments, to drive the stage along the shortest route, and to apply a laser beam on the machining points on the shortest route.

Abstract: The invention provides a method of drilling holes sequentially through a workpiece using a laser gun with a camera positioned axially in-line with the drilling beam of the laser gun. Each image from the camera is analysed by digital image processing techniques to control the positioning of the laser nozzle relative to the workpiece and/or to compensate for errors produced in previously drilled holes. By feedback from the digitally processed images it is possible to repeat the auto-focusing of the laser automatically throughout the drilling of a large number of holes in the same workpiece, to adjust the drilling of subsequent holes in order to bring the hole characteristics closed to a predefined optimum, or to abort work on a particular workpiece if hole diameters exceed a given tolerance range.

Abstract: An improved method for operating a steered laser beam system employs selective laser power control. A laser beam is provided having a selectively positionable focal point. A workpiece is provided on which a selected laser beam pattern is used to process the workpiece, and the laser beam focal point is controlled to travel along the selected pattern at varying velocities. A position of the focal point on the workpiece is dynamically determined as the focal point travels along the selected pattern. A velocity of the focal point on the workpiece is dynamically calculated based on multiple determined positions of the focal point. An energy level of the laser beam is controlled based on the calculated velocity of the focal point. In one embodiment, the energy level of the laser beam is adjusted to maintain a constant energy per unit distance traveled by the focal point.