Abstract: The invention relates to a method of displaying and monitoring the profile of a weld bead (4), in which, placed inside the groove, there is an assembly (10) comprising, facing one another, an image acquisition means (11), a light source (12), the beam of which is directed towards said image acquisition means, and, between the image acquisition means and the light source, a mask (13); the optical axis of the image acquisition means (11) is oriented so as to be approximately parallel to the sidewalls (5, 6) of the groove (3); a light beam produced by the light source (12) is directed towards the mask (13) and the image acquisition means (11); a central shadow zone and a peripheral halo are formed by means of the light beam and the mask (13), said halo illuminating, approximately perpendicularly, the weld bead (4) and the sidewalls (5, 6); the profile of the weld bead (4) and the sidewalls (5, 6) are displayed on a display/monitoring means; and said assembly (10) is moved inside the groove (3) longitudinally and

Abstract: The invention relates to a machining device (10) comprising at least one machining head (16) designed to provide at least one high-energy machining beam (22), especially an electron or laser beam. Such a machining device is used to remove material from workpieces (28) or for connecting workpieces (28) by bonding, especially by means of welding. According to the invention, at least one scanning device (32) designed as an optical coherence tomograph and provided for surface scanning is associated with the machining head (16). The invention also relates to a method for machining material using a high-energy machining beam for scanning surface areas of a workpiece which is machined, not yet machined, or being machined, by means of an optical coherence tomograph.

Abstract: A method of setting processing data for a computer-assisted laser processing apparatus is disclosed, along with a system for setting a laser processing data. The method comprises a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, a function of generating processing data representing the processing conditions for the object, and a function of visually displaying a two dimensional representation of the processing data on a display screen and a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, wherein it is enabled to set the three-dimensional profile and the processing pattern while displaying the object in two dimensions on the display screen disposed within a processing zone.

Abstract: A method of setting processing data for a computer-assisted laser processing apparatus is disclosed, along with a system for setting a laser processing data. The method comprises a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, a function of generating processing data representing the processing conditions for the object, and a function of visually displaying a two dimensional representation of the processing data on a display screen and a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, wherein it is enabled to set the three-dimensional profile and the processing pattern while displaying the object in two dimensions on the display screen disposed within a processing zone.

Abstract: A method of forming, on the surface of a glass material, a raised feature having a height within a target range, comprising (1) providing a glass material having a surface, (2) providing the glass material locally, at a location at or below the surface, with an amount of energy causing local expansion of the glass material so as to raise a feature on the surface at the location, (3) detecting the height of the raised feature or the height over time of the raised feature, (4) (a) if the height is below or approaching a value below the target range, providing the glass material at the location with energy in a greater amount, or (b) if the height is above or approaching a value above the target range, providing the glass material at the location with energy in a lesser amount, and (5) repeating steps (3) and (4) as needed to bring the height within the target range. Methods and devices for automating this process are also disclosed.

Abstract: A solid-state laser lift-off apparatus comprises: a solid-state laser (1), a light beam shaping lens (3), motors of oscillating mirrors (5,7), oscillating mirrors (4,6), a field lens (9), a movable platform (10), an industrial control computer and control software (8). The light beam shaping lens (3) is behind the solid-state laser (1), shaping the laser beam from the solid-state laser (1) into required shape. The motors of oscillating mirrors (5,7) are in front of the field lens (9), controlling the movement of the oscillating mirrors (4,6) according to the instruction of the control software (8) to implement different light beam scanning paths. A lift-off method for applying the solid-state laser lift-off apparatus uses a small laser spot to perform scanning, and enables damage-free separation of GaN from a sapphire substrate.

Abstract: A novel method of characterizing laser drilled boreholes is disclosed. The method uses x-ray microscopy for dimensional characterization. The x-ray output may be processed to control manufacturing equipment in automated production systems, including laser drilling systems and swaging apparatus.

Abstract: A method of forming a surface feature extending into a sample includes providing a laser operable to emit an output beam and modulating the output beam to form a pulse train having a plurality of pulses. The method also includes a) directing the pulse train along an optical path intersecting an exposed portion of the sample at a position i and b) focusing a first portion of the plurality of pulses to impinge on the sample at the position i. Each of the plurality of pulses is characterized by a spot size at the sample. The method further includes c) ablating at least a portion of the sample at the position i to form a portion of the surface feature and d) incrementing counter i. The method includes e) repeating steps a) through d) to form the surface feature. The sample is free of a rim surrounding the surface feature.

Abstract: A method and test block for controlling weld penetration depth in a work piece are disclosed. The test block simulates a work piece relative to a welding process of the work piece. The test block includes a test welding path. The test welding path replicates a production welding path on a weld surface of the work piece. The test block includes a melt-thru surface that underlies the test welding path. The melt-thru surface is spaced apart from the test welding path by a spacing that decreases along a length of the test welding path. The spacing varies from more than a standard weld penetration depth to less than the standard weld penetration depth.

Abstract: Aims are to provide a tubular-body residual-stress improving apparatus and an adjustment method thereof capable of adjusting irradiation position with favorable reproducibility, even when an optical fiber is eccentric. In the tubular-body residual-stress improving apparatus, an optical control unit (5) includes a rotational hold mechanism (9) for holding an optical fiber (6) in a manner that the optical fiber (6) is rotatable in a circumferential direction of the optical fiber (6), and, if a position of an intensity peak of the laser beam from the optical fiber (6) in an axial direction of the tubular body (2) is offset from the center of an irradiation profile, a position at which the optical fiber (6) is held in the circumferential direction is adjusted by the rotational hold mechanism (9) so as to eliminate the offset or to minimize an influence of the offset.

Abstract: A laser beam welding head for the welding of metal parts and method of use include at least one beam path for a welding beam and means for the optical acquisition of the position of the welding seam at a first measuring position, wherein the means for the optical acquisition of the position of the welding seam allow arrangement of the first measuring position in the welding direction running ahead of the welding position of the welding beam, and, at least as a function of a lateral deviation of the welding seam from a reference position, generate a correction signal for the correction of the welding position of the welding beam, as well as a corresponding use of the laser beam welding head.

Abstract: A method for machining a transparent material by the non-linear absorption of pulsed laser radiation, in the region of a laser focus, includes the following steps: a laser wavelength of between 300 and 1000 ?m is selected; and laser impulses having a temporally flat beam profile are applied. The method is characterized in that the irradiation intensity is selected from an interval pre-determined for the material to be machined, in which plasma is formed without plasma luminescence. An apparatus for laser treating a transparent material includes structure to set an irradiance and inspect the treatment as being within a defined interval.

Abstract: The invention relates to a method for detecting and adjusting the focus (F) of a laser beam when laser machining workpieces, having the following steps: a.) guiding and focusing a laser beam of a machining laser (1) emitted from a machining head (48) into a machining point (26) on or with respect to the surface (49) of a workpiece to be machined, wherein the focusing takes place by means of an optical focusing element (2); b.) guiding and focusing the radiation (28, 31) emitted by at least one first adjusting light source (22) and one second adjusting light source (23) onto the surface (49) of the workpiece to be machined, wherein the wavelengths of the radiation emitted by the adjusting light sources (22, 23) are different; c.

Abstract: A method for removing coating from a substrate may include: locating an edge of a substrate; directing a laser beam along a first path to a first position on a surface of the substrate proximate to an edge of the substrate at an angle of incidence suitable to redirect the laser beam along a second path, through the substrate, to a second position on a second surface of the substrate corresponding to the located edge of the substrate, where the second surface can include a coating; and ablating at least a portion of coating at the second position on the second surface of the substrate.

Abstract: Provided is a laser type soldering apparatus which performs soldering by projecting a laser beam on a to-be-soldered object, one of a plurality of optical lenses is a conical lens, wherein an incident surface or a emitting surface of the conical lens is a conical surface, and a central portion of the conical lens has a central hole having a diameter smaller than that of a circular laser beam that is incident to the conical lens, and the conical lens converts the circular laser beam to a double circular beam having a ring portion with a circular ring shape and a spot portion located at a center of the ring portion, so that the double circular beam is projected on the to-be-soldered object.

Abstract: The invention discloses a control method of optical cutting. A laser processing module is used to generate a cutting heat source and an auxiliary heat source. The control method of optical cutting includes the steps of determining a cutting path on the work piece first; then calculating a thermal stress distribution along the cutting path according to a heating condition; next determining an irradiation condition for the auxiliary cutting heat source according to the thermal stress distribution induced by the cutting heat source; and irradiating the work piece along the cutting path with the cutting heat source and simultaneously irradiating the work piece with the auxiliary cutting heat source. The cutting of the work piece is therefore finished.

Abstract: An apparatus and method for verifying a laser etch on a rubber sample. In one embodiment, the apparatus includes a tire production line, a sample holding device, a laser having a diode, and a servo-assembly. The laser of the apparatus is configured to etch indicia on a sidewall of a tire on the tire production line and is further configured to etch at least one line in a rubber sample on the sample holding device. In one embodiment, the method includes etching a production tire with a laser, interrupting the laser, moving the laser to a laser diode testing location, loading a rubber sample in a holding device, etching at least one line into the rubber sample with the laser, manually or automatically measuring a depth of the at least one line, and comparing the depth of the at least one line to an acceptable line depth range.

Abstract: The invention concerns a method for laser ablation of a surface coating from a wall, such as a painted wall finish, for example in a nuclear plant to be decontaminated, and a device for implementing said method. The inventive ablation method includes sweeping shots on the coating of at least one pulsed laser beam with a laser beam quality factor M2 less than 20, and characterized in that it comprises a direct control of said shots by optical deflection, such that the impact zones (I1, I2, I3,) of said shots on said coating are disjointed or substantially adjacent with minimized overlapping.

Abstract: The time between illumination of adjacent zones of a workpiece edge is extended by a long cool-down period or delay, by interlacing a radiation beam scanning pattern. During the cool-down period, the beam successively scans (along the fast axis) two rows separated by about half the wafer diameter, and travels back and then forth (along the slow axis) across the distance between the two rows, while the radiation beam source continuously generates the beam.

Abstract: A method is performed for determining a suitable workpiece processing focal position of a laser beam. The method includes adjusting one or more of a laser beam and a workpiece until a periphery of the laser beam contacts a lateral edge of the workpiece, determining, from at least a focal position of the laser beam associated with the peripheral beam contact with the workpiece, a suitable workpiece processing focal position of the laser beam, and then adjusting the laser beam to the suitable workpiece processing focal position.

Abstract: A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained.

Abstract: A predictive pulse triggering (PPT) method enables precise triggering of a laser beam in a link-processing system. The PPT method entails triggering the laser beam based on estimated relative motion parameters of the target and laser beam axis. The PPT method allows for a six-fold improvement in laser positioning accuracy over the conventional, entirely measurement-based method.

Abstract: A fiber cutting mechanism prevents secondary utilization of a fiber laser light source that is incorporated in a device that uses a laser light. With a characteristic fiber cutting mechanism, when a laser device is separated from a laser light source application apparatus, at least a fiber is cut in an specific area from a point within a fiber grating to a connection point between the fiber grating and the fiber containing a laser activating substance.

Abstract: The invention relates to a laser scribing system (10) for structuring substrates, said system being characterized in that the planar rotor (56) together with the laser device (60) has a mass that is essentially less than the mass of the table (20) and the substrate (30) such that the machining speed is increased, and the substrate arranged on the table (20) is still during the machining, or moves in a direction at a constant speed vSubstrat such that vibrations are reduced and the precision of the scribing traces increased. Furthermore, other planar rotors (56) can be mounted with a laser device (60) without changing the structure of the machine such that the productivity is easily increased. The laser light (65) is also guided, by means of optical fibers, as close as possible to the machining point, reducing the free length of the light beam (65) such that the adjustment requirements for the optical-mechanical components are reduced and the system is more robust.

Abstract: A method of laser micro-machining, by means of a laser, a work piece (31) of the type described comprising the steps of: locating the workpiece on a carrier forming a part of a transport system whereby the carrier can be displaced along a path (P) parallel to an X-axis of the workpiece, a Y-axis lying transverse the path, and a Z-axis lying transverse the path; focusing an image generated by means of an output beam from the laser at a working datum position (A) defined relative to the path which path is established by means of the transport system to traverse the first datum position; a plane defined by the X- and Y-Axis lying substantially perpendicular to the output beam; and displacing the workpiece along the path by way of the transport system so as to enable the work-piece to be subject to micro-machining by way of the laser characterized by the steps of: maintaining distance between the datum position and a current first surface position of the work-piece in the vicinity of the datum position; and varyi

Abstract: A method of determining a contact point of a laser beam on an edge of a body and a system for performing the same, in which the method includes a) moving the laser beam relative to the edge in a spatial direction until the laser beam touches the edge, in which the spatial direction is at a right angle relative to an axis of the laser beam and in which the edge is formed at an opening, b) measuring acoustic oscillations produced photoacoustically during the movement of the laser beam, and c) determining the laser beam point of contact with the edge based on the measured acoustic oscillations.

Abstract: An insulator for a sensor arrangement of a laser processing machine comprises an outer insulating part of plastics material for electrical shielding and an inner shielding part of a non-conductive heat-resistant material for shielding against laser irradiation and/or heat.

Abstract: A system for laser microperforated fresh produce trays for use in modifying or controlling the flow of oxygen and carbon dioxide into and/out of a fresh produce container, where the microperforations are specifically tailored such as by size, location and number for the specific produce. The packaging system tailors microperforated trays for particular produce to optimally preserve the produce, using a method of making registered microperforations on the trays using at least some of the following: a conveyor, a thickness measuring devise, a sensor mechanism, and a laser system including optics.

Abstract: A tube matrix and the corresponding method of joining a plurality of tubes to a base plate to create the tube matrix. The tube matrix has a base plate from which a plurality of parallel tubes extend. The base plate has holes formed though it to receive the tubes. The tubes are placed into the holes on the base plate. The tubes may have end flares that abut against the base plate and prevent the tubes from completely passing through the base plate. Once the tubes are in place in the holes of the base plate, the tubes and base plate are welded together with individual laser welds. The laser welds enable a very dense matrix of tubes to be welded to the base plate without damaging or obstructing the tubes.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: A system for laser shock peening includes a laser positioned to direct a laser pulse at a first side of a work piece and a coupler on a second side of the work piece. The system further includes a Doppler shift detector positioned to measure a velocity of the coupler. A method for laser shock peening includes depositing an amount of energy from a laser pulse into a first side of a work piece and transmitting a pulse having a first frequency at a second side of the work piece. The method further includes receiving a reflected pulse having a second frequency from the second side of the work piece and determining the velocity of the work piece based on the difference between the first frequency and the second frequency.

Abstract: The invention relates to a method for the parametric production of a drilled hole in a component, in particular for the parametric production of a drilled cooling hole in a blade of a gas or steam turbine. In the case of the method according to the invention, in a first method step (21) an actual wall thickness of the component is measured at the location at which the drilled hole is to be introduced. Subsequently, at least one parametric drilled-hole geometry value is determined on the basis of an adjustment of the measured, actual wall thickness with an assumed, ideal wall thickness (method step 23). The drilled hole is then produced according to the determined parametric drilled-hole geometry value (method step 24). Furthermore, the invention relates to a drilling device, in particular for carrying out the method, and to a component into which one or more drilled holes have been introduced according to the method.

Abstract: A laser marking system for marking a length of material includes a laser device for emitting a marking beam. A motor moves the length of material relative to the laser device. A sensing system detects a predetermined movement of the length of the material and provides a speed signal and a distance signal, and a controller is provided in operative communication with the sensing system and the laser device for receiving the speed signal and the distance signal and responsively directing the marking beam of the laser system onto the length of material in a predetermined pattern.

Abstract: A machining head includes a machining head element having an inner-head channel for passing laser light and assist gas, the nozzle having an inner-nozzle channel connecting to the inner-head channel and a nozzle orifice, pins protruding radially inward from a curved inner surface of the nozzle, a pin-locking part formed on the outside of the machining head element, the pin-locking part having pin-fitting openings, a head alignment part formed on a nozzle-side end surface of the machining head element, a nozzle alignment part formed on the nozzle at a location where the nozzle is aligned with the machining head element, and an O-ring fitted between the head alignment part and the nozzle to create a clearance between the head alignment part and the nozzle alignment part for mutual alignment.

Abstract: The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece (12) with a machining beam, more preferably with a laser beam, and a device that is embodied in such a way as to carry out the method. According to said method, during the machining, a machining region (13) containing the impact point of the machining beam (1) on the workpiece (12) is illuminated at least approximately coaxially to the machining beam (1) by means of additional optical radiation (2). Radiation (3) reflected by the machining region (13) is detected, parallel to an incidence direction of the optical radiation (2) or at small angle thereto, by means of an optical detector with local resolution, in order to obtain an optical reflection pattern of the machining region (13).

Abstract: The present invention relates to an apparatus and method for capturing an image of a welding spot during a welding task and determining an accurate position of the welding spot based on the captured image in order to perform an accurate welding task. A beam splitter splits a path of light reflected from a welding section of a spacer grid from a path of a laser beam generated from a laser generator. An image sensor receives light reflected from a welding spot of the spacer grid, and senses and stores an image of the spacer grid. Welding control means controls the image sensor to capture the image of the spacer grid, receives the image of the spacer grind from the image sensor, calculates an accurate position of the welding spot based on the received image, corrects position information of the welding spot based on the calculated position, and controls a servo motor so that the laser generator can accurately collimate the welding spot based on the corrected position value.

Abstract: According to example embodiments, a laser optical system includes a laser generator, at least one scan module, an objective lens, a relay lens, a review optical system, and a control device. The laser generator is configured to generate a laser beam. The at least one scan module is configured to reflect the laser beam generated by the laser generator and to direct the laser beam in different directions. The objective lens is configured to focus the laser beam on a substrate. The relay lens is configured to guide the laser beam scanned by the at least one scan module to within an incident range of the objective lens. The review optical system is configured to monitor, in real time, repair of the substrate using the laser beam. The control device is configured to control the at least one scan module.

Abstract: A laser marking system for marking a length of material includes a laser device for emitting a marking beam. A motor moves the length of material relative to the laser device. A sensing system detects a predetermined movement of the length of the material and provides a speed signal and a distance signal, and a controller is provided in operative communication with the sensing system and the laser device for receiving the speed signal and the distance signal and responsively directing the marking beam of the laser system onto the length of material in a predetermined pattern.

Abstract: A bonding device includes a bonding head including a bonding tool for sucking and holding an electronic component, and a laser heater for heating the electronic component by irradiating laser light on the electronic component held by the bonding tool from an inside of the bonding head, the laser heater including a collective unit for condensing laser light emitted from a light source. A focusing point of the laser light condensed by the collective unit is formed inside the bonding head.

Abstract: A laser processing head mounted on a robot arm moves from with a constant speed in a direction from a welding point to a next welding point, while a reflection mirror continuously turns in order to maintain laser beams focused on the welding point until the welding at the welding point is completed, and the reflection mirror quickly turns to shift the focus of the laser beams onto the next welding point when the welding at the welding point is completed.

Abstract: A cutting machine secures safety of a worker during movement of a head without lowering production efficiency. When moving a cutting head without cutting material to be cut upon a table, a moving truck and the cutting head are moved at a higher speed as compared with when cutting the material to be cut. If, when the moving truck and the cutting head are moving at high speed, a worker who is present upon the table intercepts either of light beams which are located in front of and behind a horizontal beam, then this movement speed is decelerated to a safe low speed, but the task of cutting the material is not interrupted. Subsequently, when the worker approaches the horizontal beam closer, and contacts a wire or a bar in the vicinity of the horizontal beam, movement of the moving truck and the cutting head is forcibly stopped.

Abstract: A laser marking system for marking a length of material includes a laser device for emitting a marking beam. A motor moves the length of material relative to the laser device. A sensing system detects a predetermined movement of the length of the material and provides a speed signal and a distance signal, and a controller is provided in operative communication with the sensing system and the laser device for receiving the speed signal and the distance signal and responsively directing the marking beam of the laser system onto the length of material in a predetermined pattern.

Abstract: A laser processing system and a laser processing method that can highly accurately and efficiently specify a focus position of a processing laser using visible lasers are provided.

Abstract: A method of setting processing data for a computer-assisted laser processing apparatus is disclosed, along with a system for setting a laser processing data. The method comprises a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, a function of generating processing data representing the processing conditions for the object, and a function of visually displaying a two dimensional representation of the processing data on a display screen and a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, wherein it is enabled to set the three-dimensional profile and the processing pattern while displaying the object in two dimensions on the display screen disposed within a processing zone.

Abstract: An apparatus 1 of the present invention includes a laser emitting unit 2, a monitor unit 3, a storage unit 4, an image extraction unit 5, a bead recognition unit 6, and a bead shape determination unit 7. The bead shape determination unit 7 is configured to calculate the position of the end of a bead region based on the bead region recognized by the bead recognition unit 6, and to determine whether the shape of the end of the bead region is convex or concave in the extending direction of the bead region.

Abstract: A system determines relative positions of a semiconductor substrate and a plurality of laser beam spots on or within the semiconductor substrate in a machine for selectively irradiating structures on or within the substrate using a plurality of laser beams. The system comprises a laser source, first and second laser beam propagation paths, first and second reflection sensors, and a processor. The laser source produces at least the first and second laser beams, which propagate toward the substrate along the first and second propagation paths, respectively, which have respective first and second axes that intersects the substrate at respective first and second spots. The reflection sensors are positioned to detect reflection of the spots, as the spots moves relative to the substrate, thereby generating reflection signals. The processor is configured to determine, based on the reflection signals, positions of the spots on or within the substrate.

Abstract: A photovoltaic cell manufacturing method includes: forming a photoelectric converter which has a plurality of compartment elements that are separated by a scribing line and in which adjacent compartment elements are electrically connected; detecting a structural defect existing in the compartment element; specifying a position in which the structural defect exists, as distance data indicating a distance between the structural defect and the scribing line that is closest to the structural defect; and removing a region in which the structural defect exists based on the distance data.

Abstract: A monitoring device (10) for a laser machining device (12) that has one or more laser beams (13) that are displaced along a predetermined adjustable trajectory (14, 16) along a workpiece (18) includes one or more sensors (20, 22) which monitor(s) the processing signal (24) of the machining process in a three-dimensional section (26). The one or more sensors (20, 22) activate an alarm device or interrupter (28) for the one or more laser beams (13) of the laser machining device (12) if the one or more process signals (24) in the section (26) exceed a predetermined threshold value or fall short of it, the one or more sensors (20, 22) being independent of the laser machining device (12).

Abstract: A method of setting processing data for a computer-assisted laser processing apparatus is disclosed, along with a system for setting a laser processing data. The method comprises a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, a function of generating processing data representing the processing conditions for the object, and a function of visually displaying a two dimensional representation of the processing data on a display screen and a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, wherein it is enabled to set the three-dimensional profile and the processing pattern while displaying the object in two dimensions on the display screen disposed within a processing zone.

Abstract: Systems and related methods of programming a laser processing device for automated processing of a workpiece including indicating a processing location on a workpiece with a processing location indicator. The processing location is detected with a processing location detector. The scanner optics of the laser processing device are adjusted to a set position corresponding to the detected processing location. A set position of the scanner optics is detected with a processing location evaluator, and a control program corresponding to the detected set position of the scanner optics is generated with the processing location evaluator.