Abstract: A heater assembly includes a substrate, a plurality of resistive heating elements disposed along a perimeter of the substrate, and a common ground electrical lead connected to at least some of the plurality of resistive heating elements and having a portion extending along the perimeter of the substrate. The plurality of resistive heating elements are independently controllable to provide azimuthal temperature control of the heater assembly.

Abstract: An induction heating device and a method for sensing a cooking vessel on an induction heating device are provided. The induction heating device may include a controller that converts a resonance waveform generated as current is applied to a sensing coil into a square waveform. The controller may determine whether a cooking vessel placed on the induction heating device has an inductive heating property based on a number of pulses of the converted square waveform.

Abstract: A heater assembly and method of controlling the heater assembly is provided. The heater assembly includes a resistive heater and a substrate, and the resistive heater comprises a plurality of heating zones disposed along a perimeter of the substrate. Each of the plurality of heating zones are independently controllable such that azimuthal temperature control of the heater assembly is provided. The plurality of resistive heating elements may be connected in series and have a common ground electrical lead. In the alternative, the plurality of resistive heating elements may each have a ground electrical lead and be isolated from each other.

Abstract: A cooktop appliance is provided herein. The cooktop appliance may include a ceramic plate, an electric heating element, a temperature sensor, and a thermal conduction strip. The electric heating element may be positioned below the ceramic plate. The electric heating element may define a horizontal length from a center point projected on the ceramic plate. The temperature sensor may be positioned between the ceramic plate and the electric heating element relative to a vertical direction. The temperature sensor may be spaced apart from the ceramic plate and the electric heating element. The thermal-conduction strip may be attached to the temperature sensor. The thermal-conduction strip may extend in contact with a bottom surface of the ceramic plate between an inner tip proximal to the center point and an outer tip distal to the center point.

Abstract: A low profile spring bracket for a heating element of a cooktop appliance includes features that allow the bracket to move along the axial direction in a smooth fashion with minimal force. In this way, a temperature sensor attached thereto can maintain contact with a cooking utensil placed on the heating element.

Abstract: A combination griddle and teppanyaki cooking unit for a household cooking appliance or stand-alone cooking appliance is provided in which the combination griddle and teppanyaki cooking unit includes a cooking surface, a first heating unit for heating a first portion of the cooking surface, and a second heating unit for heating a second portion of the cooking surface, wherein the first heating unit and the second heating unit are selectively operable to uniformly heat an entire area of the cooking surface in a griddle mode of operation and to concentrate a greater amount of heat in a first area of the cooking surface than in a second area of the cooking surface in a teppanyaki mode of operation.

Abstract: An induction heating system comprises inductive rings, which in one example are concentrically wound about a center axis to form a coil array. The inductive rings are situated in the coil array to permit activation of the inductive rings independent of the other inductive rings in the coil array. In one embodiment, the induction heating system includes a control structure with a power supply and switches coupled to each of the inductive rings, wherein activation of the switches permits current from the power supply to flow to the corresponding inductive ring. The induction heating system is amenable to appliances such as ovens and ranges, as well as to cooktops such as free-standing cooktops for countertops.

Abstract: For an electronic circuit apparatus including a shunt resistor, provided is a measure for improving the heat dissipation performance of the shunt resistor. The shunt resistor includes electrodes at both ends. One of the two electrodes is connected to a surface-mounting pattern on which the shunt resistor is surface-mounted. A current-generating-side pattern and a current-receiving-side pattern are arranged separately from the surface-mounting pattern. The current-generating-side pattern and the surface-mounting pattern are connected together via a connection member which creates a space between itself and a substrate.

Abstract: Methods and apparatus of substrate supports having temperature profile control are provided herein. In some embodiments, a substrate support includes: a plate having a substrate receiving surface and an opposite bottom surface; and a shaft having a first end comprising a shaft heater and a second end, wherein the first end is coupled to the bottom surface. Methods of making a substrate support having temperature profile control are also provided.

Abstract: A control device for an electrical heating device for a cooking field with a cooking field plate comprises an electro-mechanical switching device for adjusting a power of said heating device with different power levels and comprises two different heating element. The switching device is configured so that starting from a zero-position and rotating in a first rotation direction, a power level for a first heating element is adjusted in a cooking-mode. Rotation in the other direction activates a second heating element in a warm-keeping mode with significantly lower power. A relay is closed by a thermomechanical temperature sensing device below a defined switching temperature of 60° C. to 100° C. and opened above the switching temperature. When closed, the relay connects the two heating elements to an operating voltage for common operation. When opened, the first heating element is switched off for exclusive operation of the second heating element.

Abstract: A method of operating a heating plate for a substrate support assembly used to support a semiconductor substrate in a semiconductor processing apparatus, wherein the heating plate comprises power supply lines and power return lines and respective heater zone connected between every pair of power supply line and power return line. The method reduces maximum currents carried by the power supply lines and power return lines by temporally spreading current pulses for powering the heater zones.

Abstract: A capacitance sensing switch module is provided. The capacitance sensing switch module for controlling a cooktop includes a plate, at least one key, an insulating pad, a circuit board and at least one foil. The plate is disposed in a side of the cooktop and has at least one hole passing through the plate. The key is disposed in the hole. The insulating pad is disposed between the key and the plate. The key and the plate are separated by the insulating pad. The circuit board is disposed under the plate. The foil is disposed on the circuit board and on the position corresponding to the key. There is an insulation gap between the foil and the key.

Abstract: An electrical heating device has an integrally manufactured support made from insulating material. Depressed paths for introducing a heating element are provided. A klixon functioning as a thermally actuated switch is inserted from above into an opening in the central area of the support and its electrical terminals project over the bottom side and are bent round for mechanical fixing.

Abstract: A system and methods for heating substrates during high temperature processing is provided. The system uses multiple temperature inputs of the backside of a substrate carrier and known parameters within the processing chamber to estimate the temperature of substrates being processed on the substrate carrier. Temperature readings of the substrate carrier taken from above the processing volume may be used to correct any drift that may occur with respect to temperature readings taken from below the substrate carrier. Temperature readings of heat exchanging fluid flowing through a showerhead assembly may be used to estimate the temperature of the surface of the showerhead, which may be used in the estimation of the temperature of the substrates being processed. The system then uses the estimated temperature to control the amount of power supplied to a plurality of heat sources configured to heat the substrates from below the substrate carrier.

Abstract: A cooking appliance has a cooktop including a plurality of separately controlled cooking areas. A first heating element and a second heating element are positioned below one of the separately controlled cooking areas. A control switch is coupled to the first heating element and the second heating element and is operable to selectively energize the first heating element and the second heating element.

Abstract: The present invention relates to an electric range comprising a body (100) for defining an exterior, an upper plate (400) on a top of the body (100), a working coil (210) provided in the body (100) for generating an electromagnetic force, an upper insulating sheet (240) provided to cover an upper surface of the working coil (210), a temperature sensor (250) secured to the electric part of the upper insulating sheet (240) for sensing a temperature of the upper plate (400) in a close contact with a downside of the upper plate (400), and an elastic part elastically formed in the upper insulating sheet (240) for making the temperature sensor (250) in a close contact with the upper plate (400).

Abstract: Provided are an apparatus and a method for monitoring a hot surface of a cook top. The apparatus includes a display unit, a temperature detecting sensor, and a microprocessor. The display unit displays a state of a hot surface and an operation error of a hot plate as a heater operates. The temperature detecting sensor is installed closely to the heater to detect heater temperature greater than set temperature. The microprocessor compares the heater temperature greater than the set temperature that is detected by the temperature detecting sensor with heater temperature greater than the set temperature that is expected by an elapse of an operating time of the heater to judge one of a hot surface and an operation error of the hot plate, and controls the judgment results to be displayed using the display unit.

Abstract: A cooking appliance has a cooktop including a plurality of separately controlled cooking areas. A first heating element and a second heating element are positioned below one of the separately controlled cooking areas. A control switch is coupled to the first heating element and the second heating element and is operable to selectively energize the first heating element and the second heating element.

Abstract: An electrical heating arrangement (2) includes a temperature sensor assembly which comprises a housing member (34) mounted on, and extending partially across, a heater (12). The housing (34) has a first end region (36) in spaced relationship with an electric heating element (20), and a second end region (38) which traverses and extends externally of a peripheral wall (18). A first temperature-sensitive electrical element (52) is provided at the first end region (36) of the housing (34) and first electrical leads (54) extend to the second end region (38) of the housing (34). A layer (58) of thermal insulation material is provided and a second temperature-sensitive electrical element (60) overlies the layer (58). The second element (60) is provided at the first end region (36) of the housing (34) and second electrical leads (62) extend to the second end region (38) of the housing (34).

Abstract: A substrate holder for supporting a substrate in a processing system includes a temperature controlled support base having a first temperature, and a substrate support opposing the temperature controlled support base and configured to support the substrate. Also included is one or more heating elements coupled to the substrate support and configured to heat the substrate support to a second temperature above the first temperature, and a thermal insulator disposed between the temperature controlled support base and the substrate support. The thermal insulator includes a non-uniform spatial variation of the heat transfer coefficient (W/m2-K) through the thermal insulator between the temperature controlled support base and the substrate support.

Abstract: In one aspect, a cooktop heating system that include a first cooktop heating element, a second cooktop heating element, and an interface device. The system also includes a controller for selectively associating the interface device with any one or both of the first cooktop heating element and the second cooktop heating element. In another aspect, the system includes at least one cooktop heating element, a potentiometer, and controller arrangement operatively connected between the potentiometer and the at least one cooktop heating element to determine heating of the at least one cooktop heating element responsive to the input provided by the potentiometer and control power provision to the at least one cooktop heating element responsive to the determination.

Abstract: In a cooktop with a cooktop panel, beneath which at least one heating element is disposed for heating up a cooking vessel to be placed on the cooktop panel, and with a temperature sensor for sensing the temperature of the cooktop panel, which temperature sensor is in heat-conducting contact with the underside of the cooktop panel within the heating element and is connected to a control unit for controlling the heating power of the heating element, to simplify assembly/fitting, the invention provides a heat-conducting element within the heating element in heat-conducting contact with the underside of the cooktop panel, and fastens the temperature sensor in this region to the heat-conducting element.

Abstract: A ceramic heater attaining more uniform temperature distribution from the start to the end of cooling is provided. Further, in a cooling module used for cooling the heater, liquid leakage during use is prevented, degradation in cooling capability is prevented and the performance is maintained for a long period of use, and the manufacturing cost of the module is decreased. The ceramic heater includes a ceramic heater body and a cooling module cooling the heater body, and the cooling module has a structure formed by arranging a pipe in a trench formed in a plate-shaped structure.

Abstract: The present invention relates to an electric range comprising a body (100) for defining an exterior, an upper plate (400) on a top of the body (100), a working coil (210) provided in the body (100) for generating an electromagnetic force, an upper insulating sheet (240) provided to cover an upper surface of the working coil (210), a temperature sensor (250) secured to the electric part of the upper insulating sheet (240) for sensing a temperature of the upper plate (400) in a close contact with a downside of the upper plate (400), and an elastic part elastically formed in the upper insulating sheet (240) for making the temperature sensor (250) in a close contact with the upper plate (400).

Abstract: A heater strip for use as a heating element in an electric heater is made up of a profiled strip made of a flat metallic material forming a resistor section and of mounting elements extending over one common longitudinal side and they are manufactured as one piece with the resistor section for mounting the heater strip to a support. The strip has a zigzag-shaped structure. The mounting elements are provided only on the flat leg sections of the zigzag-shaped heater strip.

Abstract: A radiant heater includes a support plate substantially having a rectangular shape, a pair of connection terminals substantially perpendicularly extending, while having; a space therebetween, from one surface of the support plate, a strip-shaped heater element arranged between the pair of connection terminals and covering the one surface of the support plate) a width direction of the strip-shaped heater element being in parallel with the support plate, and bridging support members provided with insulators and extending) while having a space therebetween, from the support plate for supporting the strip-shaped heater element separately from the support plate, wherein a heating surface of the strip-shaped heater element that is to face a heated object is provided with a coating that increases a radiation factor, and an opposing surface that is on an opposite side of the heating surface and faces the support plate is not provided with the coating

Abstract: Provided is a heating cooker which includes a body constituting an appearance thereof, an upper panel on which a cooking container is laid, a heater positioned under the upper panel to heat the cooking container laid on the upper panel, a fan housing liftably positioned at one side of the body to be raised above the upper panel and having an air intake port and an air discharge port, a blast fan and a fan motor positioned in the fan housing to forcibly blow air toward a surface of the upper panel, a fan housing lifter to raise and lower the fan housing, a temperature sensor to detect the temperature of the upper panel, and a controller to control the heater, the fan motor, and the fan housing lifter. The upper panel heated by the heater can be forcibly cooled by air from the fan housing.

Abstract: A hotplate with a stainless steel top plate to support a vessel. The stainless steel top plate has an upper surface with a substantially centrally located depression having a depth and area generally sufficient to absorb upward crowning of the top plate when heated. A heating unit is in a heat transfer relation with the stainless steel top plate, and a base unit is connected to the heating plate assembly; however, the base unit is not fastened directly to the stainless steel top plate, so that the stainless steel top plate can expand more uniformly when heated.

Abstract: A method and apparatus for adjusting exhaust flow, and the apparatus has a programmable exhaust control regulator generating a first input signal to a motor control circuit, an exhaust flow meter generating a second input signal to the motor control circuit and a motor driven control valve moved to different positions according to the first and second input signals, the control valve being installed in an exhaust portion of the hot plate apparatus.

Abstract: A system, apparatus, and method for thermal processing of substrates undergoing lithographic chemical processes is provided. The thermal processing system includes at least one heating element, a heat distributing plate, having a heating surface and being disposed in thermal communication with the at least one heating element. The heat distributing plate is constructed and arranged to distribute heat from the heating element onto the heating surface. A substrate support, supports a substrate at a position above the heating surface and the system includes an actuator that rotates the substrate relative to the heating surface during a heat transfer operation.

Abstract: The appliance has a cooking plate (10) and a radiant electric heater (2) having multiple heating zones (12, 14, 16) arranged substantially side-by-side. A temperature sensing assembly (34) incorporates an electrical component (42) located in a position confined within a first heating zone (12) and having an electrical parameter which changes as a function of temperature. Electronic control apparatus (30) is connected to the electrical component (42) by means of electrical leads (44), the electronic control apparatus being adapted to detect the number of heating zones that are energised and to control energisation of the heater in dependence thereon.

Abstract: A method and the associated device for detecting cooking or boiling processes in a glass ceramic hob are described, to which power is supplied by a power supply by means of a heating element and said power is transmitted to the cooking vessel standing thereon. During a cooking process a temperature profile of the hob is measured and evaluated. The temperature profile is evaluated after ending the power supply and for evaluation purposes a temperature profile gradient is determined. During evaluation, a normal cooking or boiling process is detected if the gradient exceeds a predetermined threshold. During evaluation, a disturbed or faulty cooking or boiling process is detected if the gradient is equal to or smaller than a predetermined threshold. Such a disturbed or faulty cooking or boiling process can arise through the cooking vessel boiling dry or empty.

Abstract: A wafer-cleaning module can remove contaminants from a semiconductor wafer prior to measurement in a metrology tool. A heating chamber and heater plate of the cleaning module can be used to heat the wafer by conduction, while a separate cooling chamber can be used to cool the wafer. The system is controlled by a processor so the heating cycle, cooling cycle and the time periods between these cycles and the measurement cycle are uniform for all wafers.

Abstract: A cooking appliance includes a cooking plate (10) and a radiant electric heater (2) having multiple heating zones (12, 14, 16) arranged substantially side-by-side. A temperature sensing assembly (34) incorporates an electrical component (42) located in a position confined within a first heating zone (12) and having an electrical parameter which changes as a function of temperature. Electronic control apparatus (30) is connected to the electrical component (42) by means of electrical leads (44), the electronic control apparatus being adapted to detect the number of heating zones that are energised and to control energisation of the heater in dependence thereon.

Abstract: In a cooktop with a cooktop plate, in particular, made from glass ceramic, beneath which at least one heating element is disposed, for heating a cooking vessel to be placed on the cooktop plate, and having a temperature sensor for recording the temperature of the cooktop plate, which temperature sensor senses the temperature of the underside of the cooktop plate within the heating element and is shielded from the thermal radiation from a heating device of the heating element by insulating material, and is connected to a control unit for controlling the heating power of the heating element, to enable a good measurement accuracy to be achieved, the temperature sensor is in thermal contact with the underside of the cooktop plate by a thermally conductive element, and that the element and the temperature sensor are shielded from the thermal radiation of the heating device by insulating material.

Abstract: A gas cooker comprises temperature detection means for detecting the temperature of the bottom face of a pan and issuing a temperature signal and an heat control circuit for controlling the amount of heat issued from the gas burner based on said temperature signal. The temperature detection means is placed in a zone of the cooker around the burner and shielding means are provided in order to reduce the influence of the burner flame on the temperature detection means.

Abstract: An electrical heating assembly (2) comprises a glass-ceramic cooking plate (4) having an upper surface (6) for receiving a cooking vessel (8) and a lower surface (10). A radiant electric heater (12) incorporating at least one electric heating element (20) is supported in contact with the lower surface of the cooking plate. A thick film temperature-sensitive electrical resistance element (30) is deposited on a region (32) of the lower surface (10) of the cooking plate (4) within the confines of the radiant electric heater (12) and is provided with electrical connecting leads (34). Thermal insulation means (40) is adapted and arranged to shield the thick film temperature-sensitive electrical resistance element (30) and at least the region (32) of the lower surface (10) of the cooking plate (4) on which it is deposited, from direct thermal radiation from the at least one electric heating element (20).

Abstract: A wafer-cleaning module is disclosed for removing contaminants from a semiconductor wafer prior to measurement in a metrology tool. The cleaning module includes a heating chamber including a heater plate for heating the wafer by conduction. A separate cooling chamber is provided to cool the wafer. The system is controlled by a processor so the heating cycle, cooling cycle and the time periods between these cycles and the measurement cycle are uniform for all wafers.

Abstract: In a cooktop with a cooktop plate, in particular, made from glass ceramic, beneath which at least one heating element is disposed, for heating a cooking vessel to be placed on the cooktop plate, and having a temperature sensor for recording the temperature of the cooktop plate, which temperature sensor senses the temperature of the underside of the cooktop plate within the heating element and is shielded from the thermal radiation from a heating device of the heating element by insulating material, and is connected to a control unit for controlling the heating power of the heating element, to enable a good measurement accuracy to be achieved, the temperature sensor is in thermal contact with the underside of the cooktop plate by a thermally conductive element, and that the element and the temperature sensor are shielded from the thermal radiation of the heating device by insulating material.

Abstract: In a cooktop with a cooktop panel, beneath which at least one heating element is disposed for heating up a cooking vessel to be placed on the cooktop panel, and with a temperature sensor for sensing the temperature of the cooktop panel, which temperature sensor is in heat-conducting contact with the underside of the cooktop panel within the heating element and is connected to a control unit for controlling the heating power of the heating element, to simplify assembly/fitting, the invention provides a heat-conducting element within the heating element in heat-conducting contact with the underside of the cooktop panel, and fastens the temperature sensor in this region to the heat-conducting element.

Abstract: When an object to be heated is heated without temperature nonuniformity in its heated surface, unwanted thermal deformation can be suppressed, and thermal processing precision can be improved. For this purpose, a heat transfer plate for heating a plate-like object to be heated, and a base plate are stacked. A rod heater as a heat source is inserted in the heat transfer plate. The heat transfer plate has a larger thermal conductivity and smaller creep than the base plate.