Abstract: A semiconductor package includes a multilayer substrate, a device die, an insulating encapsulant, and a shielding structure. The multilayer substrate has a first surface and a second surface opposite to the first surface. The multilayer substrate includes through holes, and each of the through holes extends from the first surface to the second surface. The device die is disposed on the first surface of the multilayer substrate. The insulating encapsulant is disposed on the first surface of the multilayered substrate and encapsulating the device die. The shielding structure is disposed over the first surface of the multilayer substrate. The shielding structure includes a cover body and conductive pillars. The cover body covers the device die and the insulating encapsulant. The conductive pillars are connected to the cover body and fitted into the through holes of the multilayer substrate.

Abstract: A package structure includes: a substrate; a chip arranged on a part of a surface of the substrate; a metal thermal conducting layer arranged on a top surface of the chip; a capacitive structure arranged on another part of the surface of the substrate and arranged to be independent from the chip; and a cover including a first cover layer and a second cover layer connected to the first cover layer. A first opening is defined to extend through the first and the second cover layers. The second cover layer is arranged on a bottom of the first cover layer and perpendicular to the first cover layer. The first cover layer is arranged on the capacitive structure. The chip is received in the first opening. The second cover layer is arranged between the capacitive structure and the chip, and is fixed to the substrate.

Abstract: The invention relates to a press-in pin (10) for an electrical contacting assembly (1), having an elastic press-in region (12) and an electrically conductive coating (14). The invention further relates to a corresponding contacting assembly (1), and to a method for joining a press-in pin (10) and a metallized via (7). The coating (14) comprises a reactive multi-layer applied to the press-in pin (10) and a first contact layer applied to the reactive multi-layer.

Abstract: A method and structure for packaging a semiconductor device are provided. In an embodiment a first substrate is bonded to a second substrate, which is bonded to a third substrate. A thermal interface material is placed on the second substrate prior to application of an underfill material. A ring can be placed on the thermal interface material, and an underfill material is dispensed between the second substrate and the third substrate. By placing the thermal interface material and ring prior to the underfill material, the underfill material cannot interfere with the interface between the thermal interface material and the second substrate, and the thermal interface material and ring can act as a physical barrier to the underfill material, thereby preventing overflow.

Abstract: A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

Abstract: A polymer melt candle filter having a support which comprises a hollow cylindrical body defined by a first end, a second end, and a cylinder wall having a first end portion and a second end portion. The first end portion includes a screw thread on its outside surface and optionally a hex fitting on its inside surface for receiving a hex wrench. The second end portion includes a plurality of holes in the cylinder wall. The area of the openings of the holes on the outside surface of the cylinder wall may be larger than the area of the openings of the corresponding holes on the inside surface of the cylinder wall. The shape of the openings of the holes on the outside surface may be non-circular.

Abstract: An electrical element includes a flexible antenna and a rigid member higher in rigidity than the flexible antenna. At least one of the flexible antenna and the rigid member is made of thermoplastic resin. A conductor pattern defining at least a portion of a section that performs the main function of the electrical element is provided at the flexible antenna. No conductor pattern that performs the main function of the electrical element is provided at the rigid member. Opposing surfaces of the flexible antenna and the rigid member are directly joined to each other.

Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

Abstract: An oven may facilitate heating, curing, and/or drying processes for manufactured items, such as shoe parts, using multiple groups of infrared sources. Each group of infrared sources may comprise a plurality of sources having heating parameters, such as a peak wavelength, power, distance from items to be cured, number of infrared sources, etc. By staging different types of sources throughout an oven, different aspects of the curing process may be performed in an efficient fashion. Further, conditions within the oven such as temperature and relative humidity may be monitored and adjusted to optimize curing conditions.

Abstract: An electronic apparatus includes a connection target member that has a first connection portion including copper or copper alloy, a connection terminal that has a second connection portion including copper or copper alloy, the second connection portion mechanically connecting with the first connection portion by spring reaction force of the connection terminal, and a joint portion that is provided with a contact point between the first connection portion and the second connection portion. At least one of the first connection portion and the second connection portion includes an oxide film at a periphery of the joint portion on a surface thereof, the oxide film including copper oxide. The joint portion directly joints copper included in the first connection portion and copper included in the second connection portion metallurgically.

Abstract: The invention relates to a method for joining two essentially metal sheet-type workpieces. In said method. the edge regions of the workpieces to be joined are placed at a distance from one another, at least one wire-shaped filler material is introduced into a zone between the edge regions before or during the joining process, and edge regions and the filler material are then heated to a predefined joining temperature by at least one first frictional element that moves in relation to the edge regions and the filler material, are subjected to a certain contact pressure, and are joined while being deformed.

Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

Abstract: Approaches to a solder ball bonding (SBB) tool and a method for solder ball bonding work pieces. The SBB tool comprises a rotatable feed plate for transporting solder balls from a reservoir to a nozzle, which is a position at which a laser light source can irradiate and melt the solder balls. The melted solder ball is then ejected from the nozzle and onto one or more work pieces, for electrically interconnecting the work pieces. The feed plate is configured with first holes and second holes, the first holes for receiving and transporting solder balls and the second holes for providing an aperture for the laser light to irradiate the solder balls, as the feed plate rotates and the holes are moved to positions in relation to the reservoir and the nozzle.

Abstract: A process is provided for scam welding advanced high strength steel sheets together. Respective end portions of first and second advanced high strength steel sheets are placed in overlapping contact with one another, and subjected to first and second weld passes. In the first weld pass, a seam welder including weld electrodes operate at a first-pass applied current and a first-pass pressure and are moved relative to the overlapping end portions at a first-pass carriage speed to establish a weld seam containing a weld nugget with a martensite phase. In the second weld pass, the weld electrodes operate at a second-pass applied current and a second-pass pressure and move relative to the weld seam at a second-pass carriage speed selected to fuse microcracks, lap openings, and porosity in the seam, relieve the residual stress in the joint, and temper the martensite phase of the weld nugget, and thereby form a weld joint.

Abstract: A wiring material is provided by electrically connecting a connecting terminal with two single line conductors arranged in parallel. The connecting terminal is provided with a tube-shaped section for storing two single line conductors, the two single line conductors are inserted into the tube-shaped section, resistance welding is performed by carrying electricity from the external of the tube-shaped section in a status where the tube-shaped section and the single line conductors are mutually brought into contact, and the connecting terminal is electrically connected with the two single line conductors.

Abstract: A method for assembling at least two parts made of silicon carbide-based materials by non-reactive brazing is disclosed. The two parts are contacted with a non-reactive brazing composition. The assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient to melt the brazing composition. The parts and the brazing composition are cooled so that, after solidification of the brazing composition, a moderately refractory joint is formed. The non-reactive brazing composition is a binary alloy composed, in mass percentages, of about 46% to 99% silicon and 54% to 1% neodymium.

Abstract: In this soldering method, a laser is directed onto an end face of the stack in such a manner that the laser heats the stack. At least one parameter of the laser is adjusted to a value that is the image by a mathematical model of at least one thermal characteristic of the stack. The parameter of the laser is a parameter selected from an irradiation duration, a surface area of the end face of the stack that is irradiated by the laser, and an irradiating power of the laser.

Abstract: This invention introduces the welding technology of an electrical connector and its welding device. The welding device comprises of a base frame, IR lamp that can emit infrared rays, and convex lens used to collect infrared rays. The lamp and lens are set in the base frame, with the convex lens in front, which collects all infrared rays from the lamp and irradiates them to the solder paste, allowing for fast heating. The melted solder paste forms defect-free welding spots with sound electrics performance and low energy consumption, thus saving energy. This invention of welding device is used for the welding when electrical connector is assembled, solder paste is put and the connector is fixed in the conveying belt. The electrical connector goes through the heating zone in welding device, which enables the automatic welding of each cored wire in the electrical connector and wire connecting terminal. The welding is fast and the production can be continuous free of any tack welding.

Abstract: An electronic component lead manufacturing method includes irradiating a first laser beam to a second layer with a solder wettability higher than a first layer, the second layer being laminated on the outside of the first layer of the lead used by the electronic component, and exposing the first layer from the second layer based on the irradiating of the first laser beam, and forming a projecting part near a region irradiated by a second laser beam by irradiating the second laser beam to the exposed first layer.

Abstract: An apparatus for mounting and removing a component includes: a light source configured to radiate light toward a component supported by solder; a light sensor configured to sense displacement of the component; and a member mounted on the component, the member including a hole in a portion to be irradiated with the light of the light source.

Abstract: Avoiding contaminant generation within a hard disk drive due to increased temperatures during a solder reflow process is described. Energy from a beam of energy that is directed toward a plurality of polyimide regions is received. Each of the plurality of polyimide regions are disposed adjacent to at least one solder pad. The plurality of polyimide regions and the at least one solder pad comprises a first component of a hard disk drive. Then, a portion of the energy is reflected away from the plurality of polyimide regions to prevent an absorption of the portion by the plurality of polyimide regions and a burning of the plurality of polyimide regions.

Abstract: Inventive single cavities for use in a high power fiber laser systems are described that include a high reflective grating, a gain fiber, an output coupler having a bandwidth in the range of 1 nm to 2 nm; and an output fiber connected to the single cavity that supplies power from the single cavity. The single cavity can be used in a wide variety of applications, including welding, cutting, brazing or drilling a material, or to seed a downstream amplifier.

Abstract: In order to evaluate the welding current for the resistance seam welding of an overlap seam of container bodies, a welding with changing welding current intensity is carried out for a container body of the production series, resulting in a changing welding of the seam, ranging from the welding with a too high temperature to the welding with a too low temperature. The electric energy for this welding is determined several times during this welding and/or the temperature of the weld seam is determined several times and the welding current intensity is determined at which the welding of the individual container body is too cold and the welding current intensity at which the welding is too hot. This determination is based on the determined electric energy values and/or on the determined temperature values and based on this determination a preferred range for the welding current intensity within these limits of too hot and too cold is determined.

Abstract: Apparatus and methods for removing components from a circuit board. A conveyor transports circuit boards having components attached with solder through a heating section. When the solder has been melted by application of electromagnetic radiation, the circuit board is subjected to mechanical forces that dislodge the components to be removed from the circuit board. In one embodiment, the electromagnetic radiation is supplied by heaters operating at color temperatures in the vicinity of 973 Kelvin. The components are recovered in a form that allows their reuse.

Abstract: A wire bonding apparatus includes a processing block, a bond head assembly and an infrared radiation source for selectively heating the bond pad areas of one or more semiconductor dies and/or bonding sites on a substrate. Methods for forming wire bonds using selective heating of the bond pad areas of one or more semiconductor dies and/or bonding sites on the substrate are also disclosed.

Abstract: Provided is a detection method of detecting presence or absence of an object to be detected in an object hold portion that is used together with an irradiation portion that irradiates the object to be detected with a heat ray, holds the object to be detected, and has an opening, the detection method including: imaging an image signal in a predetermined region having the opening by an imaging device; and making an irradiation optical path of the irradiation portion and an imaging optical path of the imaging device substantially coincide with each other within the opening by an optical unit.

Abstract: Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.

Abstract: Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are exposed to bonding conditions effective to bond the balls with their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual solder balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are bonded with the individual associated bond pads. In another embodiment, a frame is provided having a hole. A solder ball is provided having an outer surface.

Abstract: The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape. The two carrier tapes are wound off a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. This method facilitates a continuous manufacturing process which is particularly economical and particularly fast.

Abstract: A process for encapsulating a component made of organic semiconductors is provided which includes steps of: a) providing a housing including a substrate with electrical connections and a cover; b) mixing a soldering glass with at least one of a binder and a solvent; c) applying the soldering glass at least to the cover, in the form of an encircling bank; d) expelling the binder or solvent; e) sintering-on of the solder; f) covering the substrate with layers which represent the semiconductor component together with electrodes; g) placing the cover onto the substrate; and h) locally heating the soldering glass by means of a light source with a predetermined peak wavelength, wherein the housing parts and soldering glass are matched to one another such that their coefficients of thermal expansion differ from one another by less than 1.0×10?6K?1.

Abstract: An improved seal and method of making is disclosed for sealing a filter element to a filter mounting. The improved seal comprises a bonding pad formed from a sintered matrix of randomly oriented metallic fiber. The bonding pad is disposed between the filter element and the filter mounting A mechanical fastener coacts between the filter element and the filter mounting for compressing the bonding pad to provide a seal between the filter element and the filter mounting. The bonding pad may be heated to create a frangible seal.

Abstract: An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which functions to direct the radiant energy from the lamp to a target region generally corresponding with the location of the solder layer between the electrical connector and the conductive element. The heating device is operable to rapidly and substantially heat the solder layer to a desired temperature to melt the solder layer, while substantially limiting directing of heat to the glass sheet. The electrical connector may be affixed at a vehicular or modular window assembly plant, such that the glass sheet may be transported from a glass manufacturing plant to the vehicular or modular window assembly plant without the electrical connector.

Abstract: A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.

Abstract: A method for closing and/or joining a connecting joint or joining seam between two pieces of galvanized sheet metal, in which zinc or a zinc alloy whose melting point is similar to that of zinc is heated to melting temperature and is continuously introduced into the connecting joint, with the heating being performed by a plasma jet without reaching the melting temperature of the steel sheet. The use of a plasma jet allows processing zinc or, a zinc alloy without producing any disturbing zinc spatter. The zinc can be supplied as a wire, powder or granulate, whereby it is introduced under an inert-gas bell. This method can also be employed for post-galvanizing weld seams, with a second plasma jet welding set following a first one, it being mechanically coupled with the same and performing the galvanizing of the weld seam by the supply of zinc in wire form without melting the steel sheet anew. Tin foils are used in a special embodiment which are applied in the joining zone of a flanged edge.

Abstract: A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on the contact trace of at least one of the flex circuits and the flex circuits are positioned so that the contact traces of each flex circuit are substantially aligned. A laser beam is positioned to heat the contact trace to melt the solder and fuse the contacts.

Abstract: A method for the fabrication of large metal matrix composite structures comprising the continuous brazing of aluminum matrix braze-clad tape using an infrared laser to melt the braze clad on the tape while applying pressure to the tape and simultaneously contacting it with previously applied tape layers on a rotating mandrel. The apparatus utilized to accomplish this fabrication process may include a variety of pre and post-contact heaters and preferably includes instruments for the continuous monitoring and control of the process.

Abstract: A method for the thermal connection of overlapping connecting surfaces (19, 20) of two substrates (17, 18), at least one substrate (18) being 5 transparent and laser energy being applied to the connecting surfaces (19, 20) from a rear side (26) of the transparent substrate (18), laser energy being applied separately to each of the contact pairs (37) constructed between two connecting surfaces (19, 20) of the opposing substrates (17, 18).

Abstract: A method for forming a metallic contact and manufacturing a product having an electronic component 101 and a printed circuit board 100 (PCB) includes dispensing a slurry solder paste mixture 104 including a metallic powder 105 and an acidic fluid 106, placing electronic component 101 over solder paste dispensed over a surface area of PCB 100, and applying pressure on at least a section of electronic component 101 such that at least a portion of slurry solder paste mixture 104 dispensed on the surface area and in contact with the section of electronic component 101 consolidates into at least one of an inter-metallic compound of hardened solder and a hardened alloy of solder forming the metallic contact between electronic component 101 and said PCB 100.

Abstract: A method and apparatus are provided for reliably heating the bonding areas of a substrate and/or a die or dies of a stacked die assembly or a flip-chip assembly to ensure high-quality solder or wire bonds between the substrate and the die. Embodiments include heating the wire bonding areas of the dies of a stacked die package with infrared radiation with an infrared lamp or gun directed towards the top surfaces of the dies before and during the wire bonding process, or heating the bonding pad area of the top surface of a substrate to which a flip-chip is to be mounted from above with infrared radiation from a lamp or gun to the desired temperature, then bonding the flip-chip to the substrate. The use of infrared radiant heating directed at the top surfaces of the dies and/or the substrate ensures that their respective bonding areas are heated to the proper temperature within the necessary time period, thereby enabling high-quality wire bonding or die bonding, and increasing yield.

Abstract: A method and apparatus for coupling a microelectronic component (114) to a printed circuit board (112) are disclosed. The component (114) is coupled to the circuit board (112) by placing leads (116) of component (114) in contact with conducting pads (118) on the circuit board (120), dispensing a bead of solder paste (110) onto the leads (116), and applying heat to the applied paste (110) to cause the solder to reflow. The solder bead is dispensed using a solder paste dispenser (108) and heated using a light source (102).

Abstract: An improved seal and method of making is disclosed for sealing a filter element to a filter mounting. The improved seal comprises a bonding pad formed from a sintered matrix of randomly oriented metallic fiber. The bonding pad is disposed between the filter element and the filter mounting A mechanical fastener coacts between the filter element and the filter mounting for compressing the bonding pad to provide a seal between the filter element and the filter mounting. The bonding pad may be heated to create a frangible seal.

Abstract: An improved seal and method of making is disclosed for sealing a filter element to a filter mounting. The improved seal comprises a bonding pad formed from a sintered matrix of randomly oriented metallic fiber. The bonding pad is disposed between the filter element and the filter mounting. A mechanical fastener coacts between the filter element and the filter mounting for compressing the bonding pad to provide a seal between the filter element and the filter mounting. The bonding pad may be heated to create a frangible seal.

Abstract: An improved method for mounting tape carrier package type integrated circuits on printed circuit boards. In the method, some of leads of the integrated circuit are preliminarily soldered with corresponding lead pattern on the printed circuit board after the integrated circuit is aligned on the printed circuit board so that the integrated circuit is prevented from being disordered while the printed circuit board including the integrated circuit aligned thereon is transferred to a soldering apparatus.

Abstract: An apparatus and method is disclosed for sealing a filter element to a support member. An array of bonding fibers is interposed between the filter element and the support member. Infrared energy is applied for a period of time sufficient to at least partially melt the array of bonding fibers to sinter bond the filter element to the support member.