With Measuring, Testing, Indicating, Inspecting, Or Illuminating Patents (Class 228/103)
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Patent number: 7845542Abstract: A process control procedure for a bonding process includes predetermining a deformation limit and a deforming time limit is for deforming a bonding precursor member. The bonding precursor member is deformed while monitoring instantaneous deformation values and instantaneous deforming time values for the bonding precursor member. A deforming shut-down time value is set at an instantaneous deforming time value corresponding to an occurrence of a first condition or a second condition. The first condition is an instantaneous deformation value for the bonding precursor member reaching the deformation limit and the second condition is an instantaneous deforming time value for the bonding precursor member reaching the deforming time limit. Deformation of the bonding precursor member is shut down at the deforming shut-down time value, thereby producing a deformed bond member from the bonding precursor member.Type: GrantFiled: September 22, 2005Date of Patent: December 7, 2010Assignee: Palomar Technologies, Inc.Inventors: Daniel D. Evans, Jr., James D. O'Bryan, Jr.
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Patent number: 7845543Abstract: An apparatus for bonding dice onto one or more substrates placed on a base comprises a first bond head and a second bond head. Each bond head incorporates a bonding tool which is configured for holding a die and both bond heads are driven by at least one linear motion actuator towards the substrate. The first and second bond heads are mounted on a stand and each comprises a locking mechanism which is operative to lock the bond head to the stand, and a compliant mechanism that is actuable to exert a bonding force on the bonding tool to bond each die to the substrate after the bond head has been locked to the stand.Type: GrantFiled: November 17, 2009Date of Patent: December 7, 2010Assignee: ASM Assembly Automation LtdInventors: Chung Sheung Yung, Ping Kong Choy, Hon Yu Ng
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Patent number: 7841510Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.Type: GrantFiled: January 19, 2007Date of Patent: November 30, 2010Assignee: International Business Machines CorporationInventors: Peter A. Gruber, Philip Charles Danby Hobbs
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Patent number: 7823762Abstract: A solder ball is loaded on a bump having a small height (FIG. 5(B)) and the height of the bump is intensified by melting the solder ball by heating with laser (FIG. 5(C)). Thus, the heights of the bumps are adjusted within a requested allowable range. Because the bump is not removed by heating when the height of the low bump is intensified, the printed wiring board is not subjected to local heat history thereby intensifying reliability of the bump of a printed wiring board.Type: GrantFiled: September 28, 2006Date of Patent: November 2, 2010Assignee: IBIDEN Co., Ltd.Inventors: Yoichiro Kawamura, Katsuhiko Tanno, Masanori Iriyama, Sho Akai
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Patent number: 7815760Abstract: A method of manufacturing a hermetically sealed container including a pair of substrates disposed in opposition to each other, a frame member disposed between the pair of substrates, and a bonding member bonding the substrate to the frame member, includes a bonding step of heating the bonding member for bonding the substrate to the frame member. The bonding step includes a measuring process for measuring a height of the bonding member in a direction perpendicular to the substrate, and a heating and pressing process for partially pressing the substrate to the bonding member while partially heating the bonding member. The heating and pressing process is conducted by scanning, along the bonding member, an area of the bonding member partially heated and an area of the substrate partially pressed.Type: GrantFiled: September 9, 2008Date of Patent: October 19, 2010Assignee: Canon Kabushiki KaishaInventors: Akihiro Kimura, Masahiro Tagawa, Nobuhiro Ito, Takayuki Ogawara, Tomonori Nakazawa
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Patent number: 7815093Abstract: The present invention relates to a guiding device (40) configured to guide equipment units for joining pipe sections which are arranged in a substantially upright position. The guiding device comprises a stationary body (41), one or more movable carriers being movably supported on said stationary body and configured to revolve one or more equipment units about a pipe section, a pipeline engagement device (63) configured to engage said guiding device with said pipe section and to support said stationary body, and one or more adjustable supports (44), said one or more adjustable supports being configured to make adjustment possible of a working plane of one or more equipment units (47, 48, 49) mounted on or to be mounted on said one or more carriers with respect to a pipe section on which the guiding device is mounted.Type: GrantFiled: September 4, 2006Date of Patent: October 19, 2010Assignee: Heerema Marine Contractors Nederland B.V.Inventor: Stefan Willem Hees
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Patent number: 7793817Abstract: To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.Type: GrantFiled: September 6, 2007Date of Patent: September 14, 2010Assignee: Panasonic CorporationInventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
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Patent number: 7789286Abstract: A method and apparatus for evaluating the size and/or quality of a spot weld. The apparatus includes a two-dimensional array of ultrasonic transducers arranged with a delay line for positioning adjacent a surface of a weld. A layer of gel is placed between the delay line and the weld surface. The array of transducers emit ultrasonic waves that pass into the weld. The reflected waves are received by the transducers and relayed to a central processing unit that analyzes the time delay, amplitude, and amplitude attenuation to calculate the border of the weld nugget, the thickness of the welded material, the thickness of the gel layer, and other factors contributing to weld quality.Type: GrantFiled: June 4, 2003Date of Patent: September 7, 2010Assignee: Chrysler Group LLCInventors: Roman Gr. Maev, Frank J Ewasyshyn, Serguei A Titov, John M Paille, Elena Yu Maeva, Alexey A Denisov, Fedar M Seviaryn
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Patent number: 7780060Abstract: Methods and articles for receiving times and temperatures for stages of a profile including solder heating stages to rework a populated printed circuit board (PCB), the rework including removing a first integrated circuit (IC) from the PCB, focusing heat on the first integrated circuit using an oven element during rework of the PCB, collecting actual temperature information from a plurality of temperature sensing elements to detect actual temperature information associated with the first integrated circuit, and generating a suggested modification for an operator to modify the time and/or the temperature of at least one of the stages in the profile in response to a fail status indicating that the collected actual temperature information did not meet temperatures for a variable.Type: GrantFiled: January 28, 2010Date of Patent: August 24, 2010Assignee: Raytheon CompanyInventors: Henry E. Fitzsimmons, John A. Cogliandro
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Patent number: 7775415Abstract: A method and apparatus for evaluating the size and/or quality of a spot weld. The apparatus includes a two-dimensional array of ultrasonic transducers arranged with a delay line for positioning adjacent a surface of a weld. A layer of gel is placed between the delay line and the weld surface. The array of transducers emit ultrasonic waves that pass into the weld. The reflected waves are received by the transducers and relayed to a central processing unit that analyzes the time delay, amplitude, and amplitude attenuation to calculate the border of the weld nugget, the thickness of the welded material, the thickness of the gel layer, and other factors contributing to weld quality.Type: GrantFiled: June 14, 2005Date of Patent: August 17, 2010Assignee: Chrysler Group LLCInventors: Roman Gr. Maev, Frank J Ewasyshyn, Serguei A Titov, John M Paille, Elena Yu Maeva, Alexey A Denisov, Fedar M Seviaryn
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Patent number: 7766213Abstract: Method and device (2) for monitoring a welding area of an object (14) in connection with welding, which device includes arrangements (3) for reproduction of the welding area, at least one filter (4) arranged in front of or in the reproduction arrangement (3), and an illumination arrangement (5) of the welding area with ultraviolet radiation. The filter (4) consists of a band-pass filter which is adapted for filtering around a wavelength within the ultraviolet wavelength range.Type: GrantFiled: October 5, 2004Date of Patent: August 3, 2010Assignee: Volvo Aero CorporationInventor: Per Henrikson
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Publication number: 20100181367Abstract: A wire bonding method involves bonding a wire in order at a first bonding point and a second bonding point; raising a capillary, through which the wire is inserted, on the second bonding point; cutting the wire by closing a clamper provided above the capillary at a time when the capillary has reached a prescribed height; and measuring a load incurred on the wire at a time of cutting of the wireType: ApplicationFiled: September 22, 2009Publication date: July 22, 2010Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Mitsuhiro Nakao, Junya Sagara, Katsuhiro Ishida, Noboru Okane
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Publication number: 20100181366Abstract: A method for repairing a gas turbine engine component includes identifying a distorted feature located in a first portion of the component, identifying a second portion of the component that behaves as at least one of a heat sink or a stiffener, removing the second portion of the component from the first portion, cold working the first portion of the component to repair the distorted feature, heat treating the first portion of the component, and metallurgically joining the first portion of the component to the second portion of the component.Type: ApplicationFiled: January 20, 2009Publication date: July 22, 2010Applicant: UNITED TECHNOLOGIES CORPORATIONInventor: Ganesh Anantharaman
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Patent number: 7735709Abstract: A method and apparatus for joining pipe sections (102, 104) together to form an underwater pipeline. The pipe sections (102, 104) are in an abutting position and have a generally vertical orientation. The apparatus comprises at least two welding equipment carriers (148, 152) and at least two welding heads (110, 112). Each welding head is connected to an equipment carrier (148, 152) by means of at least one umbilical (130, 132). The apparatus further comprises a welding head guide assembly (113) which is adapted to be fixed to one of said upper of lower pipe sections. The welding head guide assembly (113) guides the welding heads about the pipe sections (102, 104). The apparatus further comprises a guiding device (133) which guides the welding equipment carriers (148, 152) around said welding area (115). The welding equipment carriers (148, 152) are movable independently from one another.Type: GrantFiled: March 28, 2003Date of Patent: June 15, 2010Assignee: Heerema Marine Contractors Nederland B.V.Inventors: Frits-Jan Koppert, Cornelis van Zandwijk
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Patent number: 7735711Abstract: A method of testing wire-bond connections between a bonding wire and a substrate surface. The wire-bond connections are produced by a bonding head with a bonding tool and a wire clamp associated with the bonding tool under pressure and the action of ultrasound and/or heat. After the bonded connection has been created, the bonding head or the bonding tool is raised a short distance away from the bonding site, the bonding wire is firmly gripped by the wire clamp and the bonding head. The wire clamp with bonding wire gripped therein is raised for a second distance, during which process the tensile force acting on the bonding wire is detected.Type: GrantFiled: November 26, 2007Date of Patent: June 15, 2010Assignee: F & K Delvotec Bondtechnik GmbHInventor: Farhad Farassat
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Publication number: 20100140324Abstract: A friction stir system for processing at least a first workpiece includes a spindle actuator coupled to a rotary tool comprising a rotating member for contacting and processing the first workpiece. A detection system is provided for obtaining information related to a lateral alignment of the rotating member. The detection system comprises at least one sensor for measuring a force experienced by the rotary tool or a parameter related to the force experienced by the rotary tool during processing, wherein the sensor provides sensor signals. A signal processing system is coupled to receive and analyze the sensor signals and determine a lateral alignment of the rotating member relative to a selected lateral position, a selected path, or a direction to decrease a lateral distance relative to the selected lateral position or selected path.Type: ApplicationFiled: February 11, 2010Publication date: June 10, 2010Applicant: Vanderbilt UniversityInventors: Paul Fleming, David Lammlein, George E. Cook, D. M. Wilkes, Alvin M. Strauss, David Delapp, Daniel A. Hartman
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Publication number: 20100143656Abstract: A multiple substrate system, a method, and structure for adapting solder volume to a warped module. An illustrative embodiment comprises a method for joining a first substrate to a second substrate. A deviation from a nominal gap between the first substrate and the second substrate at a first region of the first substrate is ascertained. A volume of solder paste necessary to compensate for the deviation from a nominal gap is determined. The volume of solder paste necessary to compensate for the deviation at the first region of the first substrate is applied. Further, the second substrate is bonded to the first substrate using, at least in part, the solder paste applied at the first region of the first substrate.Type: ApplicationFiled: December 9, 2008Publication date: June 10, 2010Inventor: Longqiang Zu
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Patent number: 7718922Abstract: An optical processing apparatus that is capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.Type: GrantFiled: July 26, 2006Date of Patent: May 18, 2010Assignee: Panasonic CorporationInventors: Tomoko Fukunaka, Masashi Ishiguro, Mamoru Watanabe, Kazuhiko Yamashita, Masahiro Sato, Ryoji Inutsuka, Kenji Takahashi, Toshikazu Yoneda
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Patent number: 7712649Abstract: An electronic component mounting device according to the invention includes a bonding head for holding and pressure bonding an electronic component to a mounting substrate, a local stage provided with a support surface formed in an area which is almost equal to or slightly larger than that of a mounting surface of the electronic component and serving to support a pressure bonding force from an antimounting surface of the mounting substrate through the support surface, a length measuring mechanism for measuring a distance between the bonding head and the mounting substrate, thereby calculating a virtual plane in a predetermined mounting position on the mounting substrate, and a tilting and moving mechanism for tilting and moving the bonding head and the local stage, thereby causing a normal of the virtual plane in the mounting position to be coincident with an action line of the pressure bonding force, and the pressure bonding is carried out along the normal.Type: GrantFiled: June 26, 2008Date of Patent: May 11, 2010Assignee: Shinko Electric Industries Co., Ltd.Inventor: Toshiyuki Kuramochi
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Publication number: 20100108744Abstract: A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.Type: ApplicationFiled: October 5, 2007Publication date: May 6, 2010Applicant: KULICKE AND SOFFA INDUSTRIES, INC.Inventors: Wei Qin, Ziauddin Ahmad, John David Molnar, Deepak Sood, E. Walter Frasch, Chunlong Hu
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Patent number: 7699209Abstract: A bonding method involving detection of non-bonding of a bonding wire to a first bonding point, the method including an electrical non-bonding detection step and an optical non-bonding detection step, wherein data on whether the respective first bonding points are predetermined bonding points where an electrical non-bonding detection is not applicable are acquired from a memory unit; and when it is determined that a first bonding point is the predetermined bonding point, a non-bonding verification on the first bonding point is executed in the optical non-bonding detection step, and when the first bonding point is not the predetermined bonding point, then non-bonding detection on the first bonding point is executed in the electrical non-bonding detection step.Type: GrantFiled: December 28, 2006Date of Patent: April 20, 2010Assignee: Kabushiki Kaisha ShinkawaInventor: Shinsuke Tei
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Patent number: 7686204Abstract: A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.Type: GrantFiled: December 27, 2006Date of Patent: March 30, 2010Assignee: Kabushiki Kaisha ShinkawaInventors: Kuniyuki Takahashi, Shinsuke Tei, Noriko Suzuki, Noriko Mori, Shinji Maki
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Patent number: 7681778Abstract: A method for remanufacturing an electronic assembly includes removing a first portion of an assembly housing to expose an underside of an enclosed circuit assembly. One or more solder joints on the underside of the circuit assembly are associated with at least one component that is also affixed to a portion of the housing. The opened electronic assembly is lowered onto a desoldering fixture having a plurality of solder pots configured to encompass, and thus desolder, the solder joints associated with the component that is affixed to a portion of the housing. Once the affected solder joints are melted, the remaining portion of the housing and the component affixed thereto may be lifted away, exposing the top surface of the circuit assembly for analysis, repair, and or adjustment.Type: GrantFiled: November 20, 2007Date of Patent: March 23, 2010Assignee: Caterpillar Inc.Inventors: Paul C Gottshall, Ernesto Nicanor Santillan Guerrero
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Publication number: 20100051671Abstract: A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate.Type: ApplicationFiled: November 22, 2007Publication date: March 4, 2010Inventors: Nee Seng Ling, Soo Loo Ang, Ter Siang Pai
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Patent number: 7672819Abstract: A spot weld fracture analysis method for a spot weld portion of three or more mutually superimposed plates that are spot-welded at a common welding point comprises an analysis step of executing an analysis by using a finite element model in which each plate is modeled by shell elements, and the shell elements corresponding to a spot weld point position of each plate are individually interconnected via beam elements, and a prediction step of finding an element force of a beam element that acts on a shell element relevant to a middle plate from a difference between the element forces of two beam elements connected to the shell element on a basis of the analysis result, and predicting a possibility of fracture of a spot weld between the middle plate and an adjacent plate by using the difference element force found from the difference.Type: GrantFiled: October 13, 2006Date of Patent: March 2, 2010Assignee: Toyota Jidosha Kabushiki KaishaInventor: Koushi Kumagai
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Publication number: 20100044350Abstract: The invention discloses a method and a production installation for producing a sub-assembly consisting of a plurality of parts joined together, in which the first part (1) and second part (2) are removed from a parts delivery site in the vicinity of a transport device and deposited oriented in position on one of a plurality of parts transport carriers of the transport device, and subsequently together with the parts transport carrier transported to an assembly station. The parts transport carrier is stopped in the assembly station in a holding position, whereupon the parts (1, 2), oriented towards one another, are moved by means of a vertical positioning device (200a, 200b) together from a transport position on the parts transport carrier into a preparation position, then positioned relative to one another, clamped and then joined to form a sub-assembly, whereupon the joined subassembly is again deposited on one of a plurality of parts transport carriers and transported away thereby.Type: ApplicationFiled: December 14, 2005Publication date: February 25, 2010Inventors: Roland Heiml, Thomas Rebhan, Michael Pauditz, Markus Bittendorfer
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Publication number: 20100035021Abstract: A substrate includes a base material, a first solder part disposed on a surface of the base material and used for connection to an electronic component, and a second solder part disposed on the surface of the base material and made of the same solder as that of the first solder part. The top surface of the first solder part is made to be a flat surface, and the maximum height of the second solder part from the surface of the base material is lower than the height of the flat surface of the first solder part from the surface of the base material. Thus, a substrate for which the kind of solder can be determined easily and with certainty, a device provided with this substrate, a method of manufacturing the substrate, and a determining method are provided.Type: ApplicationFiled: August 5, 2009Publication date: February 11, 2010Applicant: NEC Electronics CorporationInventor: Chiho Ogihara
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Publication number: 20100025453Abstract: A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.Type: ApplicationFiled: September 4, 2007Publication date: February 4, 2010Applicants: TECHNISCHE UNIVERSITAET BERLIN, FRAUNHOFER-GESELLSCHAFT ZUR FOEDERUNG DER ANGEWANDTEN FORSCHUNG E.V.Inventors: Ute Geissler, Herbert Reichl, Holger Gaul, Klaus-Dieter Lang, Martin Schneider-Ramelow
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Patent number: 7654434Abstract: The invention relates to a method and also a device and a system for bonding a semiconductor element (4), in which various contact areas (8) of the semiconductor element (4) are successively connected to terminal areas (2, 3, 7) by means of bonding wire elements (6) and in which an electrical variable influenced by the semiconductor element (4) is acquired during the bonding operation.Type: GrantFiled: March 20, 2006Date of Patent: February 2, 2010Assignee: Infineon Technologies AGInventors: Dirk Siepe, Reinhold Bayerer, Andreas Lenniger
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Publication number: 20100006545Abstract: A method and apparatus utilized in forming weld joint is described. In the method, a strength weld between two members is formed by a first welding process and a first weld metal. Then, one or more strain welds are formed by depositing a second weld metal adjacent to the strength weld using a second welding process. The strain welds are configured to form a weld joint having a specific minimum height and width to handle tensile strain to a specific strain capacity.Type: ApplicationFiled: October 23, 2006Publication date: January 14, 2010Inventors: Mario L. Macia, Karel Minnaar, Scott D. Papka, Wlliam J. Sisak
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Patent number: 7641099Abstract: A solder joint determination method is disclosed that is able to inspect a joint portion between an electrode and a soldered portion and determine a soldering condition of the joint portion reliably with high precision. The method includes the steps of: scanning a surface of the electrode with the light beam; detecting a height of the electrode relative to the circuit board from data of the scanning of the electrode; scanning a surface of the solder near the electrode with the light beam; detecting a height of the solder relative to the circuit board from data of the scanning of the solder; and determining the solder joint condition between the electronic part and the solder based on the height of the electrode and the height of the solder relative to the circuit board.Type: GrantFiled: July 11, 2006Date of Patent: January 5, 2010Assignee: Ricoh Company, Ltd.Inventors: Hiromitsu Nakagawa, Katsuhiko Mukai
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Patent number: 7637413Abstract: A X-ray inspection device for inspecting a solder connection portion between a circuit device having a solder ball and a printed circuit board having a land includes: X-ray irradiating means for irradiating X-ray to the solder connection portion between the solder ball and the land; X-ray detecting means for detecting the X-ray transmitted through the solder connection portion and for outputting a detection signal; and image forming means for forming and outputting a horizontal tomographic image of the solder connection portion on the basis of the detection signal. The horizontal tomographic image shows existence or nonexistence of a solder bump disposed on a side of the land.Type: GrantFiled: February 21, 2006Date of Patent: December 29, 2009Assignee: DENSO CORPORATIONInventors: Tomoyuki Hiramatsu, Yoshinori Hayashi, Hisashi Hasegawa
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Patent number: 7637414Abstract: An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.Type: GrantFiled: July 11, 2008Date of Patent: December 29, 2009Assignee: Agere Systems Inc.Inventors: Timothy Brooks Bambridge, John Wayne Bowen, John McKenna Brennan, Joseph Michael Freund
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Publication number: 20090314412Abstract: A quality control method for ultrasound welding. The method provides for the generation of a tolerance range which is adjusted to the progress of the welding process and which is generated from measured values which influence the welding process. A measured value tolerance range is determined from measured values of executed welding processes, the measured values being associated with at least one parameter which influences the welding process and/or represents the goods of the welding process. Measured values are associated with an identical parameter of a further welding process following thereafter and are considered during the quality monitoring in such a way that the measured value tolerance range is changed in its form or composition to an average value for further welding processes, in accordance with the variance between the additional measured values and the tolerance range determined from previous measured values.Type: ApplicationFiled: September 11, 2007Publication date: December 24, 2009Applicant: SCHUNK SONOSYSTEMS GMBHInventors: Jörg Gäbler, Holger Warzelhan, Jost Eberbach
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Publication number: 20090307891Abstract: A tool is disclosed for remotely inspecting and/or treating welds, pipes, vessels and/or other components used in reactor coolant systems or other process applications to, among other things, mitigate stress corrosion cracking in the welds, pipes, vessels and/or other components. The tool is placed at the entrance to a pipe or vessel and walks into the pipe or vessel to a pre-selected weld, pipe or vessel location or other component. Upon reaching the pre-selected weld, pipe or vessel location or other component, the tool anchors itself, then advances an end effector to inspect and/or treat the pre-selected weld, pipe or vessel location or other component.Type: ApplicationFiled: June 17, 2008Publication date: December 17, 2009Applicant: GE-Hitachi Nuclear Energy Americas LLCInventors: Henry Offer, Hsueh-Wen Pao, William Dale Jones
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Patent number: 7631795Abstract: A bonder viewer system may provide an automated procedure for determining a wire bonding sequence based on information provided by a drawing management system. The bonder viewer system may include a bonding sequence decision unit receiving pad and lead coordinate data corresponding to an IC chip, and determining a bonding sequence for bonding wires of the IC chip. The bonder viewer system may further include a turning point check unit and a bonding simulation unit which may provide modifications to the bonding sequence information, which may be based on whether a capillary of a wire bonder is in contact with a pre-bonded wire of the IC chip. The bonder viewer system may also include a standard file generator for generating data based on the bonding sequence information and a translator for preparing the data in a format suitable for a wire bonder.Type: GrantFiled: November 5, 2004Date of Patent: December 15, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Byung-Soo Kim, Suk-Chun Jung, Kook-Jin Oh, Young-Han Kwon, Tae-Hyuk Kim
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Patent number: 7628308Abstract: The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.Type: GrantFiled: January 8, 2003Date of Patent: December 8, 2009Assignees: Senju Metal Industry Co., Ltd., Matushita Electric Industrial Co., Ltd.Inventors: Masayuki Ojima, Haruo Suzuki, Hirofumi Nogami, Norihisa Eguchi, Osamu Munekata, Minoru Ueshima
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Publication number: 20090297768Abstract: In a mask assembly and a method of fabricating the same, when the mask assembly is fabricated by tensile welding a pattern mask to a mask frame, a tensile welding portion of the pattern mask welded to the mask frame is structurally changed. Thus, the pattern mask can be easily welded to the mask frame, and patterns of the pattern mask can be precisely aligned, thereby minimizing stain failure rate due to the mask assembly. The mask assembly includes: a mask frame including an opening and a support; and a pattern mask including a pattern portion having a plurality of patterns arranged in a matrix and a plurality of tensile welding portions extending from the pattern portion in a first direction and spaced apart from each other in a second direction perpendicular to the first direction.Type: ApplicationFiled: January 26, 2009Publication date: December 3, 2009Inventor: Jung-Woo Ko
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Publication number: 20090294511Abstract: A friction stir system for processing at least a first workpiece includes a spindle actuator coupled to a rotary tool comprising a rotating member for contacting and processing the first workpiece. A detection system is provided for obtaining information related to a lateral alignment of the rotating member. The detection system comprises at least one sensor for measuring a force experienced by the rotary tool or a parameter related to the force experienced by the rotary tool during processing, wherein the sensor provides sensor signals. A signal processing system is coupled to receive and analyze the sensor signals and determine a lateral alignment of the rotating member relative to a selected lateral position, a selected path, or a direction to decrease a lateral distance relative to the selected lateral position or selected path.Type: ApplicationFiled: May 30, 2008Publication date: December 3, 2009Applicant: Vanderbilt UniversityInventors: Paul Fleming, David Lammlein, George E. Cook, D. M. Wilkes, Alvin M. Strauss, David Delapp, Daniel A. Hartman
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Publication number: 20090289099Abstract: A wire bonding apparatus includes a heat block and a heat plate provided on the heat block. A recess is provided in the heat plate to receive the first semiconductor chip and wires without contact therewith when the lead frame is provided on the heat plate such that the first main surface of the lead frame faces toward heat plate. A duct is provided in the heat plate to connect the recess to the outside of the heat plate. A gas supplied through the duct is heated by a heater and discharged into the recess.Type: ApplicationFiled: November 13, 2008Publication date: November 26, 2009Inventor: Shinsuke Suzuki
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Publication number: 20090291263Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.Type: ApplicationFiled: August 5, 2009Publication date: November 26, 2009Inventors: Peter A. Gruber, Philip Charles Danby Hobbs
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Patent number: 7617965Abstract: An apparatus and method are provided for measuring loads on a rotating friction stir welding tool of a friction stir welding machine. The apparatus includes a frame that can be connected to the friction stir welding machine, and rollers rotatably connected to the frame are structured to contact and rotate with the friction stir welding tool. Each roller is adapted to adjust in a respective direction and communicate with a respective load cell so that the load cells detect a positional characteristic of the rollers and measure loads applied to the rotating friction stir welding tool during operation. The rollers can contact the rotating tool directly during operation of the machine, such as while the rotating tools is being moved through a workpiece to form a friction stir weld joint, to measure the loads on the tool in the direction of movement of the tool and a direction normal to the movement, i.e., the path and path normal directions.Type: GrantFiled: April 14, 2009Date of Patent: November 17, 2009Assignee: The Boeing CompanyInventors: Kurt A. Burton, Mike P. Matlack
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Patent number: 7597234Abstract: The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.Type: GrantFiled: December 22, 2006Date of Patent: October 6, 2009Assignee: Oerlikon Assembly Equipment AG, SteinhausenInventors: Patrick Blessing, Ruedi Grueter, Dominik Werne
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Patent number: 7591409Abstract: The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16 that vibrates the semiconductor device 10 and the substrate 11 relatively by applying an ultrasonic vibration to at least one of the semiconductor device 10 and the substrate 11; a time measuring member 17 that measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor device 10 is pressed a predetermined distance; and a controlling member 18 that controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member 17.Type: GrantFiled: June 7, 2006Date of Patent: September 22, 2009Assignee: Panasonic CorporationInventors: Hiroyuki Naito, Satoshi Shida, Yasuharu Ueno, Makoto Morikawa
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Patent number: 7591408Abstract: The invention relates to a method which is used to carry out adjusting operations on a bond head, wherein a bond head element is positioned in relation to a reference element, especially an ultrasonic tool. According to the invention, at least the surrounding area of the reference element, especially the tip of the ultrasonic tool, is optically detected by means of a camera and is displayed in an image on a display device. A marking is superimposed in the display in order to facilitate positioning. The invention also relates to an ultrasonic bonder comprising a camera which is used to support the positioning of a bond head element. Said camera can optically detect at least the area surrounding the reference element, especially the tip of the ultrasonic tool.Type: GrantFiled: July 18, 2006Date of Patent: September 22, 2009Assignee: Hess & Knipps GmbHInventor: Frank Walther
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Publication number: 20090218386Abstract: An object-to-be-soldered (92) is accommodated in a sealable chamber (17). An internal pressure (P) of the chamber (17) is raised to a normal pressure (Po) or higher by feeding a reducing gas to the chamber (17). A soldering of a semiconductor element (12) with respect to a circuit board (11) is carried out in the pressurized state. The pressurized state indicating a set pressure (P1) (for example, 0.13 MPa) is maintained in a solder melting period (t3 to t7) until the molten solder (33) is solidified (t7) after the solder (33) starts melting (t3). Accordingly, voids are inhibited from being generated in the solder after being solidified.Type: ApplicationFiled: December 27, 2006Publication date: September 3, 2009Inventors: Masahiko Kimbara, Akiko Kumano, Hidehito Kubo, Keiji Toh, Masao Shiraki, Shigekazu Higashimoto
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Publication number: 20090218329Abstract: The disclosure relates to the automatic selection of a set of candidate weld guns and candidate orientations for the weld guns from a library of existing weld guns. Minimum values for weld points and test orientations are calculated. The calculated minimum values are added to the library. As each point is added to the library, the set of weld guns that are candidates for the weld point at the tested orientation may be efficiently retrieved, and a matrix of candidate weld guns and orientations is produced.Type: ApplicationFiled: February 29, 2008Publication date: September 3, 2009Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: Robert Bruce Tilove, Gopalakrishna Shastry, Sandipan Bandyopadhyay, Ashish Gupta, Narahari K. Hunsur
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Patent number: 7581666Abstract: A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.Type: GrantFiled: October 5, 2007Date of Patent: September 1, 2009Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Ho-Ming Tong, Teck-Chong Lee, Chao-Fu Weng, Chian-Chi Lin, Chih-Nan Wei, Song-Fu Yang, Chia-Jung Tsai, Kao-Ming Su
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Publication number: 20090215631Abstract: A method for production of hollow bodies, in particular for radio-frequency resonators is shown and described. The object to provide a hollow bodies and a resonator, respectively, having improved electrical properties is achieved by a method comprising the following steps: Providing a substrate having a monocrystalline region, defining a cut area through the substrate, fitting markings on both sides of the cut area, producing two wafers by cutting along the cut area, wherein the wafers are completely removed from the monocrystalline region, forming the wafers into half-cells, wherein the half-cells have a joining area, joining together the half-cells to form a hollow body, wherein the joining areas bear on one another, and wherein the markings on the half-cells are oriented with respect to one another on both sides of the joining area as on both sides of the cut areas.Type: ApplicationFiled: November 29, 2006Publication date: August 27, 2009Applicant: DEUTSCHES ELEKTRONEN-SYNCHROTRON DESYInventors: Xenia Singer, Waldemar Singer, Johannes Schwellenbach, Michael Pekeler
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Publication number: 20090188967Abstract: A method is provided for a soldering process. The method can include receiving a liquid phase heat transfer medium at a preheating container. The heat transfer medium can be received from an external supply. The method can also include heating the heat transfer medium to or above a predefined temperature that maintains the liquid phase and directing the heated heat transfer medium from the preheating container to an evaporation container. In the evaporation container, the heat transfer medium can be vaporized to convert the heat transfer medium from the liquid phase to a gas phase. Further, the method can include directing the gas phase heat transfer medium from the evaporation container to a solder chamber. The soldering process occurs in the solder chamber.Type: ApplicationFiled: April 3, 2009Publication date: July 30, 2009Applicant: Rehm Anlagenbau GmbHInventors: Hans BELL, Wilfried Kolb