Abstract: In wire bonding performed in assembling, for example, semiconductor devices, the joining or bonding strength between a ball formed at an end of bonding wire and a bonding point is brought to a satisfactory level because of the use of small diameter balls with a little variation in diameter, and the bonding is performed by setting a load, that is applied on the ball when the ball contacts the bonding point, is set larger than when the ultrasonic waves are applied onto the ball.

Abstract: An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the adhesion/dehesion between first and second substrates comprising: a. an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; b. means for measuring the instantaneous AC current and instantaneous AC supplied to said ultrasonic source; c. means for multiplying the instantaneous AC voltage and the instantaneous AC current to determine the instantaneous power supplied to said ultrasonic source; and d. monitor means coupled to said ultrasonic source and said power determining means for monitoring the instantaneous power supplied to said ultrasonic source. Also disclosed is a method for monitoring the quality and/or adhesion/dehesion between first and second substrates in the ultrasonic adhesion/dehesion monitoring apparatus.

Abstract: In a bonding method and apparatus, a vertical movement of a bonding arm holder that has a capillary at the tip end is detected by a linear sensor and data based upon such a detection is outputted by the sensor. The output date in a predetermined range is checked if it is within a permissible range. If the output data is within the permissible range, it is determined that the capillary has come into contact with a bonding surface, and such a determination can be made without being affected by noises that often occur in bonding apparatus caused by vibrations.

Abstract: A linear, direct-drive microelectronic bonding apparatus (10) provides a bondhead mounting plate (20), a stationary magnetic circuit (21), a moving coil (22), a primary wire clamp housing (23), a transducer mount (24), and a high frequency ultrasonic transducer (25) (above 100 kHz), and a capillary (26). Bondhead assembly (16) is configured to present a collective axial wire path bore (27) along which wire (12) is fed to bond site (28) for forming microelectronic bond interconnections at bond site (28). In accordance with the invention, collective wire path bore (27) provides a protected method of feeding wire (12) to bonding site (28), while magnetic circuit (21) and moving coil (22) provide actuation in a substantially linear downward direction towards the bonding site. In contradistinction, prior art bonding strokes, rather than being substantially linear, are arc-like due to the capillary and transducer being perpendicular to one another.

Abstract: A method, and apparatus for performing the method, for the ultrasonic contacting wired connection of electrical circuits to metallic leadframe strips, which apparatus essentially includes a bonding head with the energy transducer located thereon for feeding to the process point of the leadframe strip and for producing a longitudinal vibration amplitude is supplied with a first voltage, the bonding head is associated a measuring head fixed to a machine base, and the measuring head has an optical/electrical sensor which measures the instantaneous amplitude of the longitudinal vibration of the infeed of the bonding head and determining a correction factor mathematically from the measured quantities obtained, and the first ultrasonic value for the vibration amplitude of the energy transducer is calibrated with the correction factor.

Abstract: A force limiter for limiting the force between two articles getting into contact with each other, which force limiter comprises a control member (11) displaceable with respect to a holder (5), which member is pneumatically pre-stressed with a force which is substantially independent of the relative position between the holder (5) and the control member (11). The force limiter can be used in devices, in which after stopping a drive the contact force between the driven first article and the second article in contact therewith must not exceed a given threshold value. More particularly the use in ultrasonic deformation devices is considered.

Abstract: The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.

Abstract: An apparatus (10) and method is provided for bonding wire (12) to the bond sites (28) of integrated circuits. In preferred embodiments gold wire (12) is bonded to aluminum bond pad (28). Apparatus (10) includes a high frequency ultrasonic energy source (20) designed to provide ultrasonic energy at frequencies above about 100 kHz causing the interface temperature required for adequate bonding to be greatly reduced. Heating element (19) applies thermal energy to interface (32) via capillary (16) and transducer (18). Therefore, according to the invention, less thermal energy is required from heater block (22) which is heating interface (32) via IC (14) and leadframe (15). In this fashion, leadframe (15) is maintained at a lesser temperature than in the prior art. Since leadframe (15) is at a lesser temperature, it can be plated with a material having a lower melting point (e.g. tin or solder). In preferred embodiments, leadframe (15) is substantially plated with tin (melting point 185.degree. C.

Abstract: An ultrasonic transducer, bonding tool and method of bonding gold or gold plated leads to gold or gold plated bonding pads located on unheated substrates is disclosed. More particularly, the transducer of the present invention incorporates a modified transducer/tool interface which provides for increased durability as well as increased excursion control of any bonding tool placed therein. The bonding tool of the present invention includes a modified end having a raised pattern used to form an impression in the lead to be bonded to enhance gripping of the lead during bonding. The preferred methods include using the modified transducer and bonding tool to perform gold-to-gold bonding on unheated substrates while providing increased vertical clearance for bonding between structures.

Abstract: A wire bonding apparatus for connecting a chip electrode of a semiconductor chip and an inner lead of a lead frame through a bonding wire is described. The apparatus is provided with an X-Y table having a bonding head. An ultrasonic horn is attached rotatably to the bonding head, and extends in the Y direction. The ultrasonic horn has a capillary which holds the bonding wire. A Y table moving calculator which calculate a Y direction moving amount of the X-Y table, while taking a Z direction moving amount of the capillary into account, is provided. A signal from the Y table moving calculator is inputted to a Y table controller which controls Y direction movement of the X-Y table.

Abstract: A wire bonding method for connecting an electrode pad on a semiconductor chip and an inner lead of a lead frame through a metal wire is described. The wire bonding method is performed by moving a bonding tool holding the wire metal. The method comprises the steps of calculating the height difference between the electrode pad and the inner lead, determining a reverse movement amount of the bonding tool according to the height difference, and reversing the bonding tool horizontally at a predetermined level by the determined reverse movement amount while raising vertically the bonding tool. According to the present invention, the amount of reverse movement of the bonding tool may be automatically changed in accordance with the height difference and without reliance on an operator.

Abstract: Known tool configurations for ultrasonic welding are comprised of a sonotrode as an active tool and an anvil as a work fixture for the workpieces. According to the invention, the sonotrode (1, 21, 30, 40, 50) and/or anvil (2, 22) are provided with synthetic hard material on their working surfaces (6, 9, 36, 46) through which the ultrasound is injected into the workpieces (3, 4, 23, 24) to be welded together. This synthetic hard material defines a new working surface (6a, 9a, 26a, 46a, 56a). Polycrystalline diamond, polycrystalline boron nitride, or also cubic-crystalline boron nitride come under consideration as synthetic hard materials.

Abstract: A heating element is held in position by a rigid holder constructed to surround an ultrasonic bonding tool and is itself fastened in a fixed position relative to the bonding tool, such that the rigid holder and the heating element are held in close proximity to the bonding tool without physically contacting the bonding tool. This serves to heat the bonding tool, facilitating adequate bonding without overly heating the integrated circuit assembly and without interfering with the critical ultrasonic properties of the bonding tool and ultrasonic transducer horn.

Abstract: A portable ultrasonic welding device for performing ultrasonic welding upon large, awkward, or odd-shaped workpieces is disclosed. The portable ultrasonic welding device comprises a housing inside of which are disposed a transducer, a horn, an interchangeable anvil, and an air actuator. The air actuator urges the anvil toward the cone to capture the workpiece. Due to its compact size and portability, the portable ultrasonic welding device may be hand held in positions and orientations which provide welds that could not be obtained with prior art devices. This flexibility in positioning and orientation also helps eliminate weld voids by assuring maximum contact of the anvil with the workpiece.

Abstract: An LSI chip has Al bumps transferred from an Al-containing foil and formed thereon by ultrasonic bonding. The LSI chip is thereafter mounted on a circuit board by an adhesive containing fine metallic particles dispersed or arranged uniformly, an insulative adhesive with high fluidity or ultrasonic bonding.

Abstract: An automatic soldering machine for soldering a rope chain comprises a pair of gears, each with a peripheral surface defining a trench which engages one of the strands of the rope chain and which is rotatable to precisely feed and place successive link junctions of the chain relative to hollow solder applying needles. The needles are reciprocally movable and serve to apply a premeasured amount of solder paste at the link junctions of the rope chain. A heater, for example, an induction heater, heats the chain, causing the solder to flow and then set and thereby secure the chain links together.

Abstract: An apparatus and process for attaching a liner to a shell of a magnetic disk cartridge. A cover is provided that covers at least a portion of the liner and shell when in an attachment position. The cover has blow-out holes which are positioned around the periphery of the welding head of a welding device. Pressurized air is introduced into the blow holes so as to lift out any dust located in the vicinity of the half shell. An exhaust hole is provided in the cover for removal of the dust by virtue of a suction device.

Abstract: An ultrasonic rotary horn intended to be excited at a frequency of from about 18 to about 60 kHz, which horn is a shaped, solid metal object having a rotational axis and a radial surface terminated by a first end and a second end. The horn is radially symmetrical. The thickness of the horn at the rotational axis is greater than the width of the horn at the radial surface.

Abstract: The present invention relates to a device for forming electric circuits on a lead frame, which has a plurality of process points in a row, each of which is provided with a semiconductor chip. During bonding, for achieving an optimum ultrasonic power transfer necessary for the electric connection of the semiconductor chip (8) to the connection fingers (5) of the lead frame, the individual lead frame (1) is located between a heated bearing element (19) and a correspondingly constructed holding plate (40). In the case of the device (50) according to the invention, the holding plate (40) provided for a contacting member (transducer) with a correspondingly constructed window-like recess (45) is movably mounted relative to the bearing element (19) about at least one axis (S) oriented in the longitudinal direction of the holding plate (40) on two spaced studs (35, 35'), each of which is arranged on a spring element (34, 34').

Abstract: An ultrasonic rotary horn intended to be excited at a frequency of from about 18 to about 60 kHz, which horn is a shaped, solid metal object having a rotational axis and a radial surface terminated by a first end and a second end. The diameter of the horn can vary from about 4 cm to about 19 cm. The width of the horn at the radial surface is in the range of from about 0.6 cm to about 13 cm. The thickness of the horn at its rotational axis is from about 0.6 cm to about 15 cm and is independent of the width of the horn at the radial surface. The horn has a mass in the range of from about 0.06 kg to about 30 kg.

Abstract: A horn for coupling high frequency vibrations from an electroacoustic converter unit to a workpiece, such as is used for welding thermoplastic workpieces by ultrasonic vibrations, is constructed by machining sections of the horn and welding the sections together using electron beam welding or laser beam welding. The respective sections can be made from bar or plate stock.This construction eliminates the machining of deep, inaccessible slots, and as most of the surfaces to be machined are accessible, a fine surface finish can be provided, thus eliminating tool marks which cause the existence of areas of high mechanical stress concentrations when the horn is rendered resonant. Also significant economic advantages are achieved when manufacturing large, massive slotted horns in this manner.

Abstract: An ultrasonic seam welding apparatus having a head which is rotated to form contact, preferably rolling contact, between a metallurgically inert coated surface of the head and an outside foil of a plurality of layered foils or work materials. The head is vibrated at an ultrasonic frequency, preferably along a longitudinal axis of the head. The head is constructed to transmit vibration through a contacting surface of the head into each of the layered foils. The contacting surface of the head is preferably coated with aluminum oxide to prevent the head from becoming welded to layered stainless steel foils.

Abstract: A wire bonding method wherein a bonding tool is lowered in a pre-loaded state, and bonding is performed under a bonding load which is smaller than the pre-loading load. The pre-loading load is changed to the bonding load before the bonding tool contacts a bonding point, and the bonding tool contacts the bonding point under such bonding load, thus performing bonding. Such bonding is performed also by changing the pre-loading load into a load which is smaller than the bonding load before the bonding tool contracts a bonding point and further changing such load into the bonding load after the bonding tool has contacted the bonding point.

Abstract: A unitary extended width comb horn for generating ultrasonic vibrations over a width of greater than 12 inches for a frequency of 20 kHz wherein such vibrations vary by less than .+-.10% across the width of the horn. Also, processes utilizing this horn and related devices incorporating same.

Abstract: An ultrasonic wire bonding apparatus including a ultrasonic oscillation control circuit which causes a transducer having a bonding tool fastened at one end to be vibrated by ultrasonic oscillation voltage. The control circuit includes an electric current amplifier connected to the transducer, an A/D converter to which an electric current amplified by an electric current amplifier is supplied so as to be converted into digital signal which is supplied to a microcomputer, an ultrasonic oscillating circuit, and an output control circuit to which ultrasonic oscillation voltage is supplied from the ultrasonic oscillating circuit. The output control circuit controls the ultrasonic oscillating voltage by comparing it to the ultrasonic oscillating output data supplied from the computer and supplies the thus controlled voltage to the transducer through a power amplifier so as to vibrate the transducer.

Abstract: A wire bonding apparatus including a horn with a bonding tool at one end and a vibrator at the other end, an automatic tracking type ultrasonic oscillating power supply which supplies power to the vibrator and tracks changes in the resonance frequency of the horn by feeding back the error voltage generated by changes in the resonance frequency of the vibrator, a bonding head supporting the horn so that the horn can move vertically and horizontally, an X-Y table which drives the bonding head in the X and Y directions, and an arithmetic unit which converts the error voltage of the ultrasonic oscillating power supply into a coordinate error and corrects the bonding coordinates.

Abstract: An ultrasonic welding device for mounting wire ends or wire loops on terminal lugs, particularly on terminal lugs or lamellas of drum-shaped commutators for rotating electrical machines, the arrangement comprises a sonotrode, an anvil against which terminal lugs abut during a welding process, and supporting surfaces provided on the anvil and on a free end of each terminal lug for taking up a sonotrode pressure and sonotrode vibrations transverse to a pressure direction. The supporting surfaces abut against one another before a start of a welding process by a relative movement of the anvil and the terminal lugs.

Abstract: A wire bonding device is disclosed. The device has a capillary which causes a wire to make press-contact to a bonding face, a driving motor for raising and lowering the capillary, a storage, means for storing data on a capillary height when making contact to the bonding face or a capillary height with respect to a reference height when making contact to the bonding face, and a control unit for effecting control so that the capillary is lowered at a predetermined velocity down to a height corresponding to the data stored therein and is further lowered at a lower velocity than the predetermined velocity till impinging on the bonding face, the control means further functioning such that the storage means stores the data on the capillary height when impinging on the bonding face at a first bonding cycle.

Abstract: A welding mask for ultrasonic welding has a part positioning window that receives a first metallic part that is ultrasonically welded to a second metallic part. The mask is engaged with a top surface of the second part and the first part is then placed in the window with its lower surface engaging an upper surface of the second part. The first part is then engaged by ultrasonic welding apparatus which vibrates it and causes it to be welded to the second part. The internal walls defining the window are comprised of a first portion having parallel surfaces which can contact the edges of the first part. Extending from the first portion to the lower surface of the mask is a slanted or chamfered surface that slants away from the edges of the first part and does not contact the edges of the first part. The purpose of the chamfered surface is to prevent the first part from becoming adhered to the welding mask during ultrasonic welding.

Abstract: A bonding method and apparatus for bonding a wire material having a ball-like end on a bonding pad is disclosed. While the ball of the wire material on the bonding pad is being pressed by a bonding tip, an ultrasonic wave and a high frequency current are applied in combination to the bonding tip so as to improve strength of the bonding portion.

Abstract: A device for supporting an ultrasonic vibration assembly comprises an ultrasonic vibrator, a vibration transmitter coupled to the end of the vibrator coaxially thereto, two flanges provided at a prescribed distance from each other on the outside circumferential surface of the transmitter so as to act as pistons, a cylinder in which the flanges are fitted so as to be movable in the axial direction of the cylinder, and mechanisms for feeding a pressurized fluid to two openings defined between the flanges and both the ends of the cylinder. The cross-sectional area of one portion of the interior of the cylinder is made different from that of the portion of the opening, and one of the flanges is made different in outside diameter from the other thereof and fitted in the end portion.

Abstract: An automatic wire bonding apparatus, for wedge-bonding using aluminium wire, comprises a bonding head comprising a bonding tool mounted on an ultrasonic transducer, a bonding tip of the tool being arranged, in the operation of the machine, to press aluminium wire against the contact surface of an electronic or electrical component, the wire being drawn from a suitable wire supply, and a wire clamp by which the wire drawn from the wire supply may be clamped, the wire clamp being movable backward and forward generally in the direction in which the wire is fed appropriately to position the free end of wire drawn from the spool after completion of a bonding operation. The automatic wire-bonding apparatus further comprises means for monitoring, during bonding, the quality of the bond formed between the wire and the surface to which it is to be bonded, by identifying those bonds which do not fall within predetermined maximum and minimum values for deformation of the wire due to ultrasonic excitation.

Abstract: An improved ultrasonic wire bonding method and apparatus is disclosed having a wire delivery conduit for removing coil set in the wire through a serpentine movement prior to being bonded, which also provides sufficient drag to prevent displacement as the bonder with the wire is being moved from one location to another, and which orients the wire to said bonding tool end. An improved wire cutter moves independently of the wire bonding tool and is directly connected to the main Z positioning movement of said wire bonder so that the wire bonding tool and the cutter can move independently during the process. The wire bonding tool can be biased by a magnetic bias with an armature connected to the wire bonding tool. The wire bonding apparatus and the method provide a loop in the wire between first and second bonds by forming an arcuate bend in the wire as it moves away from the first point of bonding.

Abstract: An apparatus for receiving components having overlapping surfaces and welding the components together with the use of ultrasound. An ultrasound emitter receives a high frequency current and converts it into mechanical ultrasonic vibrations having the same frequency. A transmitter transmits the ultrasonic vibrations to a sonotrode which focuses the ultrasonic vibrations on the components to be welded together. The sonotrode is provided with a circumferential collar and means are provided for lowering the collar during the welding process so that a part of the collar tangentially contacts the overlapping surface of one of the components. The part of the collar which tangentially contacts the overlapping surface introduces ultrasonic energy into the components. The ultrasonic emitter, transmitter and sonotrode are rotatably mounted via a vibration node of the transmitter.

Abstract: A magnetic recording medium disk with substantially improved tolerances comprising:a hub including a center portion and recessed flange portion, the center portion having a planar drive surface; a magnetic medium, including a side zero and a side one; and an adhesive bonding the side one of the medium to the flange of the hub, wherein the side zero of the medium is fixed a precise, desired distance .alpha. from the plane of the drive surface and the total indicated runout of the hub used divided by the total indicated runout of the distance .alpha. is greater than one. A method and apparatus for manufacturing a magnetic recording medium disk with substantially improved tolerances by applying ultrasonic vibrations to the medium and a hot melt adhesive until the precise desired distance .alpha. is achieved.

Abstract: A method and apparatus for separating monofilaments, such as glass or carbon monofilaments, forming a strand, is achieved by feeding the strand in a curved path over and in forced contact with a plurality of rods, each being subjected to vibrations. The vibrations, applied transverse to the axis of the strand, provide intermittent localized contact between the filaments and the rod surface, hence preventing high tensile and shear forces which cause breakage of the delicate filaments. In one embodiment, the rods comprise a plurality of resonators dimensioned to be resonant along their longitudinal axis for a predetermined frequency of vibration. The resonators are energized with vibrations from a single resonator dimensioned to operate as a half wavelength resonator. The resonators are provided with a wear resistant, smooth surface coating at the area of contact with the filaments.

Abstract: An ultrasonic wire bonder includes first and second ultrasonic wave applying devices, the direction of vibration of the first ultrasonic wave being orthogonal to that of the second ultrasonic wave. One of the first and second ultrasonic waves or a composite ultrasonic wave thereof is applied to a capillary and/or a support base for wire bonding, depending upon the bonding direction along which a wire is extended, or the inner lead longitudinal direction. A unit for detecting the positions of a semiconductor chip and lead frame may be provided to adjust a position and control the ultrasonic wave to be applied.

Abstract: A wire bonding capillary for a bonding process comprises an elongated capillary body having an axial bore through the body for receiving a wire of a predetermined diameter to be bonded, and a working face on one end of the body for applying force to the bonding wire during the bonding process. The working face includes a first surface portion surrounding the bore and having a first radius of curvature, and a second surface portion adjacent to the first surface portion and having a second radius of curvature smaller than the first radius curvature.

Abstract: Apparatus for ultrasonic bonding wire connection of circuits to electronic components comprises a casing-like carrier member carrying a bonding assembly mounted therein so as to pivot about an axis (Z), and including a first support frame operatively connected to an electromotive drive and a second support frame constructed for receiving an energy transducer carrying a capillary element. In a first movement phase of the bonding assembly, both support frames are jointly movable about the axis (Z) and in a second movement phase, the second support frame with the energy transducer is movable about an articulation (Z') spaced from the axis (Z) relative to the first support frame. For obtaining the necessary positional stability of the second support frame, a common mass center of the individual elements is located within a circle, the center of which is located between the axis (Z) and the articulation (Z').

Abstract: This invention relates to a method and apparatus for removing and installing surface mounted devices (SMD's) with respect to a substrate such as a printed circuit board (PCB).

Abstract: Laser soldering in a tape automated bonding procedure is carried out on outer ends of a number of high density leads (72) printed on a film (78) of mylar and having inner ends connected to a circuit chip (70). The outer ends of the leads are soldered, without the use of flux, by application of heat and ultrasonic energy in a timed program while pressing an end (52) of the lead to be soldered against the substrate pad to which it is to be soldered. An elongated ultrasonically vibratable capillary (16) is employed to press the wire down against its pad (54) and to receive and guide an optical fiber (44) through which a beam of laser energy is fed coaxially through the capillary (16) to heat the wire end (52).

Abstract: A computer controlled flow solder machine is controlled by a computer, operating in conjunction with two other computers, to control the operation of the machine and to control and monitor the process parameters for each circuit board processed through the flow solder machine. The flow solder machine is made up of a conveyer system, a flux system, a preheat system, and a solder pot system.

Abstract: A wire bonding capillary tip is disclosed. A metal ball at the end of a bonding wire is positioned adjacent a material to be bonded, and pressed against the material to plastically deform the ball. The orientation of the load applied to the ball changes continuously and smoothly. Ultrasonic vibrations are applied to the metal ball to diffuse elements of the metal ball and the material mutually. The capillary tip includes a flat loading surface to press the metal ball, a through-hole opened to the loading surface for passing the wire therethrough, and a convex surface around the opening of the through-hole which connects the through-hole to the flat loading surface continuously and smoothly.

Abstract: Flexure means are provided for holding a tip member of an ultrasonically reciprocating element against lateral movement while freely permitting its longitudinal movement. The reciprocating element is held fixed at a nodal point distant from the tip member. The flexure means having a natural frequency substantially the same as the reciprocating element so as to resonate in concert therewith. In one embodiment, a flexible disc fixed around its periphery is centrally pierced to receive and engage the reciprocating element. In another embodiment, a plurality of elongated resonant supports are mounted at spaced radial positions on a fixture provided with a central opening through which the reciprocating element extends so that free ends of the resonant supports are directed at and engage the reciprocating element. In this embodiment, at least two of the resonant supports are adjustable toward and away from the longitudinal axis of the reciprocating element so as to properly position it.

Abstract: A wire bonding apparatus which bonds electrodes and external leads of a semiconductor integrated circuit element, a bonding head, a heat block having a lead frame which supports the semiconductor integrated circuit element in a bonding position, and an ultrasonic horn fixed to the bonding head and generating ultrasonic waves to bond the electrodes and the external leads of the circuit element when the circuit element is in the bonding position, the ultrasonic horn being formed of a metallic material having a thermal expansion coefficent of not more than about 5.times.10.sup.-6 /.degree.C. so as to limit locational errors of the ultrasonic horn due to thermal expansion to a specified value.

Abstract: A structure for quickly and accurately aligning an ultrasonic tool assembly on an ultrasonic machine tool table in which a mounting is provided on said table and an engaging device is secured to said tool assembly which can be made to quickly engage the mounting to accurately align the tool assembly.

Abstract: A method for ultrasonically welding electrical conductors in which the compaction of the electrical conductors carried out in a compaction chamber takes place in two compaction phases, in which the electrical conductors are first compacted substantially in a vertical direction and thereafter both in a vertical and in a horizontal direction, wherein, during the second compaction phase with superimposed movements, the ultrasonic action takes place for welding the electrical conductors. Several forms of embodiment of an apparatus for carrying out this method and modified methods are described, the common feature of which is the mounting of a crosshead (7), displaceably parallel to a sonotrode surface (2), on a second, vertically displaceable anvil part (8), the crosshead (7) being connected with a drive apparatus (19) acting in its direction of displacement.

Abstract: An apparatus and method for ultrasonically welding wires includes an ultrasonic horn tip and associated structure for allowing adjustment to accommodate different diameters of wires to be welded while maintaining a tight grip around the wires during the welding process to avoid spreading or splaying of the wires. The tip is rotable to provide several alternative and interchangeable work surfaces on a standard-shaped readily machineable cross section, thereby allowing for a longer total worklife and a reduced cost of manufacture.

Abstract: A system for securing first and second parts together via a spheroid, wherein the first part has an aperture slightly smaller than the spheroid while the second part and spheroid each include ultrasonically fusible material. The system comprises means for supporting the two parts in superposed relation so that the aperture in the first part overlies a portion of the second part, means containing the spheroid among a plurality thereof, and means including a concentrating horn for applying ultrasonic energy to the spheroid, the horn having a tip provided with a hemispherical depression connected to a source of vacuum for receiving and releasably retaining the spheroid. The system also comprises means for moving the horn from the containing means, where the tip receives and retains the spheroid, to the parts-supporting means, where the tip deposits and releases the spheroid in the aperture so that a portion of the spheroid extends therethrough into contact with the underlying portion of the second part.

Abstract: Wire bonds are closely spaced about the edge of a semiconductor chip device (150) in an orthogonal array. Even though the wires may have a fan out pattern to their second bond locations, close spacing of the first bond pads is achieved by use of rectangular pads (154) having their long dimensions all perpendicular to the chip edge, making all of the first bonds along lines perpendicular to the chip edge and then bending the wire to extend to the second bond.