Abstract: The disclosure relates to a brazing method for joining substrates, in particular where one of the substrates is difficult to wet with molten braze material. The method includes formation of a porous metal layer on a first substrate to assist wetting of the first substrate with a molten braze metal, which in turn permits joining of the first substrate with a second substrate via a braze metal later in an assembled brazed joint. Ceramic substrates can be particularly difficult to wet with molten braze metals, and the disclosed method can be used to join a ceramic substrate to another substrate. The brazed joint can be incorporated into a solid-oxide fuel cell, for example as a stack component thereof, in particular when the first substrate is a ceramic substrate and the joined substrate is a metallic substrate.

Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Abstract: An object is to solve a strength problem around a suction hole on the gap side due to internal stress caused by a suction hole sealing metal material and depressurization, and provide a glass panel having enhanced safety. One glass plate 1A of a pair of glass plates 1A, 1B has a suction hole 4 penetrating the glass plate 1A in the front-back direction thereof, air in a gap V is sucked so as to depressurize the gap V, and the suction hole 4 is sealed by a suction hole sealing metal material 15. The suction hole sealing metal material 15 is solidified on the suction hole 4 so as to keep an airtight state, and is formed concentrically with the suction hole 4 in plan view, and the following Expression (1) is satisfied: Dw<=(Fc?0.0361Pd2/Tg2.2)/{(?0.0157Tg+0.

Abstract: A filling device with a filling failure is identified less costly, and the filling amount by the filling device is adjusted quickly. The filling/sealing device includes a filler including a filling turret having a plurality of holding parts and a filling device provided for each of the holding parts to fill a container with a liquid content, forwarding turrets that hold and turret-convey a container transported from the filling turret, a sealing device that seals the container transported from the forwarding turrets with a lid, an inspection device provided in the path, in which the container is held and turret-conveyed, to inspect a filling amount in the container, and a controller that identifies a filling device with a filling failure on the basis of an inspection result from the inspection device and controls the filling amount by the filling device.

Abstract: A process of making a coupling device for physically and optically coupling an optical fiber to route optical signals to/from optical receiver/transmitter. The coupling device includes a structured reflective surface that functions as an optical element that directs light to/from the input/output ends of the optical fiber by reflection, and an optical fiber retention groove structure that positively receives the optical fiber in a manner with the end of the optical fiber at a defined distance to and aligned with the structured reflective surface. The open structure of the structured reflective surface and fiber retention structure lends itself to mass production processes such as precision stamping. The coupling device can be attached to an optical transmitter and/or receiver, with the structured reflective surface aligned to the light source in the transmitter or to the detector in the receiver, and adapted in an active optical cable.

Abstract: Radio frequency Micro-Electro-Mechanical System (“MEMS”) tags are geometrically shaped using protective structures. The MEMS tags may be added to wellbore cement, and pumped downhole. In addition to protecting the MEMS tags from the harsh downhole environment, the protective structures produce a more rounded shape which, in turns, increases the flow efficiency of the MEMS tags. An interrogation tool may be deployed downhole to interrogate the MEMS tags, to thereby perform a variety of wellbore operations such as assessing the integrity of the cement seal.

Abstract: An evaporator body for a PVD coating system comprises a basic body and an evaporator surface, to which a titanium dihydride layer is applied. A titanium hydride layer comprises an organic carrier agent and titanium hydride as the single inorganic solid. The thickness of the layer is less than or equal to 10 ?m.

Abstract: In a step (a), a guard ring is disposed on a ceramic substrate (a second member) such that one of openings of a through hole of the guard ring is covered with a joint surface of the ceramic substrate. In a step (b), a brazing material made of a metal, a powder made of a material having a smaller thermal expansion coefficient than the brazing material, and a feeding terminal are inserted into the through hole. In a step (c), the brazing material is fused to impregnate the powder with the brazing material to thereby form a joint layer including the brazing material and the powder. In this manner, the joint surface and the joint surface are joined to each other through the joint layer.

Abstract: A particle manipulation system uses a MEMS-based, microfabricated particle manipulation device which has an inlet channel, output channels, and a movable member formed on a substrate. The movable member moves parallel to the fabrication plane, as does fluid flowing in the inlet channel. The movable member separates a target particle from the rest of the particles, diverting it into an output channel. The target particles may be identified by a marker-free signal such as axial light loss to identify highly pigmented particles.

Abstract: The disclosure relates to sealant compositions for forming hermetic seals, methods of use, and hermetically sealed products. The sealant compositions comprise a first inorganic oxide chosen from at least one of MgSiO3, MgO, MgTiO3, CaO, and CaSiO3, a second inorganic oxide chosen from SiO2, at least one solvent, and optionally at least one organic resin binder.

Abstract: An improved method of sealing a ceramic part to a solid part made of ceramic, metal, cermet or a ceramic coated metal is provided. The improved method includes placing a bond agent comprising an Al2O3 and SiO2 based glass-ceramic material and organic binder material on adjoining surfaces of the ceramic part and the solid part. The assembly is heated to a first target temperature that removes or dissolves the organic binder material from the bond agent and the assembly is subjected to a second induction heating step at a temperature ramp rate of between about 100° C. and 200° C. per minute to temperatures where the glass-ceramic material flows and wets the interface between adjoining surfaces. The assembly is rapidly cooled at a cooling rate of about 140° C. per minute or more to induce nucleation and re-crystallization of the glass-ceramic material to form a dense, durable and gas-tight seal.

Abstract: A method for producing a component includes joining individual wall parts, especially for producing a melting crucible for use at a high operating temperature in a crucible-pulling method for quartz glass, wherein at least two wall parts of a refractory metal or of a base alloy of a refractory metal are provided, butt-joined to form a joint and joined together by sintering at a temperature above 1500° C. to form the component. A sealant is inserted into the joint to provide a component of improved tightness and to ensure improved sintering of the individual parts of the component. A component produced according to the method, particularly a melting crucible, particularly in a crucible pulling method for quartz glass, has the joint between the butt-joined walls closed in a gas-tight manner by a sealant.

Abstract: The present invention is an improved hermetic package for a retinal prosthesis implanted in the human body. The retinal prosthesis includes a flexible circuit electrode array suitable to stimulate the retina while connected to a hermetic package on the outside of the eye, the hermetic package including a cover and a base where the cover is bonded to the base such that the cover and base form the hermetic package.

Abstract: An implantable device, including a first electrically non-conductive substrate; a plurality of electrically conductive vias through the first electrically non-conductive substrate; a flip-chip multiplexer circuit attached to the electrically non-conductive substrate using conductive bumps and electrically connected to at least a subset of the plurality of electrically conductive vias; a flip-chip driver circuit attached to the flip-chip multiplexer circuit using conductive bumps; a second electrically non-conductive substrate attached to the flip-chip driver circuit using conductive bumps; discrete passives attached to the second electrically non-conductive substrate; and a cover bonded to the first electrically non-conductive substrate, the cover, the first electrically non-conductive substrate and the electrically conductive vias forming a hermetic package.

Abstract: The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.

Abstract: A low pressure temperature sensor for measuring the temperature of a substrate during semiconductor device manufacturing is generally described. Various embodiments describe a gas chamber having an opening disposed within a dielectric plate of a platen with a seal disposed around the opening in the gas chamber such that the opening in the gas chamber may be sealed against the substrate. Furthermore, a temperature sensor and a spring are disposed in the gas chamber, the spring biased to place the temperature sensor in contact with the substrate. Additionally, a gas source configured to pressurize the gas chamber with a low pressure gas in order to increase thermal conductivity between the substrate and the temperature sensor is provided.

Abstract: Embodiments are generally directed to a feedthrough for an implantable medical device. The feedthrough comprises an insulator having one or more conductors extending therethrough that is hermetically connected (joined) to a housing of the implantable medical device. More specifically, the housing includes an aperture and the insulator is configured be positioned in the aperture. Braze material is configured to be positioned in one or more indentations in at least one of the housing or the insulator such that the braze material is disposed in the indentations between the insulator and the housing.

Abstract: During implementing a composite metal part by compaction of an insert having reinforcing fibers in a metal body or container, gas used for compaction may enter the cavity formed in the container for receiving the insert between a lid covering the insert and the container, which can prevent or degrade compaction and diffusion welding of fiber sheaths of the insert therebetween and/or with walls of the cavity. To solve this problem, the present method includes initiating isostatic compaction by a phase including raising and maintaining temperature, followed by a phase including hot-feeding pressurized gas, and machining an assembly to obtain the part. The temperature raising phase includes a diffusion pre-welding of material rigidly connecting the pressure-adjusted walls of the lid and the container. The method can be used for designing parts having a tensile and compression resistance, such as parts for aircraft landing gear.

Abstract: Systems, methods, and devices that have a hermetic seal formed using reflow soldering are provided. The hermetic seal may protect electrical components within a packaging for use in downhole tools and/or other applications where the electrical components may be exposed to extreme environments. In one example, an electronic device includes a ceramic substrate having a plated ring. The electronic device also includes a metal lid. A high-temperature solder is disposed between the plated ring of the ceramic substrate and the metal lid. The electronic device includes a hermetically sealed cavity formed between the ceramic substrate and the metal lid. The hermetically sealed cavity is formed via a first bond between the plated ring of the ceramic substrate and the high-temperature solder, and via a second bond between the metal lid and the high-temperature solder. Moreover, the first and second bonds are formed using reflow soldering.

Abstract: The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.

Abstract: A process for manufacturing a metal part reinforced with ceramic fibers including machining at least one housing for an insert in a metal body having an upper face. At least one insert formed from ceramic fibers in a metal matrix is placed in the housing. The insert is covered with a cover. A vacuum is created in the interstitial space around the insert and the interstitial space is hermetically sealed under vacuum. The assembly, namely the metal body with the cover, is treated by hot isostatic pressure. The treated assembly is machined in order to obtain the part. The cover includes an element covering the insert in the slot and projecting from the upper face, and a sheet covering the upper face with said element. In particular, the insert is straight and the housing for the insert in the metal body forms a straight slot.

Abstract: Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.

Abstract: The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 ?m to 1.0 ?m and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. This metal paste preferably contains an additive such as a surfactant in accordance with the application method. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.

Abstract: A method for sealing the tempered vacuum glass comprises: first preparing metallized layer bonded with the glass plate on the edge surface of the tempered glass to be sealed by locally heating the metal slurry coating; then air-tightly sealing the edges of two glass plates by using the metal brazing technology, or air-tightly sealing the edges of two glass plates by air-tightly welding the metal sealing sheet between the metallized layers of two glass plates to be sealed. A tempered vacuum glass is also provided. The method makes the sealing part have firm connection, good air tightness and good thermal shock resistance. The sealing structure made of the metal sealing sheet is well compatible with the temperature deformation caused by the temperature difference between the internal and external glass plates of the vacuum glass.

Abstract: In accordance with particular embodiments, a method for packaging electronic devices includes melting solder for a solder jet. The method additionally includes depositing the melted solder from the solder jet in a pattern on a first substrate of a first component of an electronic device. The pattern comprises a plurality of individual dots of melted solder. The method also includes aligning a second substrate of a second component of the electronic device with the pattern deposited on the first substrate of the electronic device. The method further includes re-melting the solder deposited in the pattern on the first substrate. The method additionally includes, while the solder is re-melting, compressing the first and second substrates.

Abstract: A sealing assembly of a battery, a method for fabricating the sealing assembly and a lithium ion battery are provided. The sealing assembly may comprise: a ceramic ring having a receiving hole; a metal ring fitted over the ceramic ring; and a core column formed in the receiving hole, which comprises a metal-ceramic composite.

Abstract: A component assembly for use in living tissue comprises: a ceramic part; a metal part, e.g., a titanium metal; and a palladium (Pd) interlayer for bonding said ceramic part to the metal part. By applying sufficient heat to liquify a palladium-titanium interface, the Pd interlayer is used to braze the ceramic part to the titanium part to yield a hermetic seal.

Abstract: A ceramic discharge lamp in which an electric discharge gas is enclosed in an arc tube which is made up of a ceramic member and a metal member. The ceramic discharge lamp includes a first brazing material, which is formed so as to be fixed on a surface of the ceramic member without being covered with the metal member; a titanium layer, which is formed between the first brazing material and the ceramic member; and a second brazing material, which is continuously formed from the first brazing member, that covers part of the metal member so that the ceramic member and the metal member are airtightly joined to each other.

Abstract: A multi-layer seal arrangement includes a dissolution barrier between a braze alloy and a ceramic component. The inventive seal is useful for joining a ceramic component to another ceramic component or a metal component, for example. In one example, the braze comprises a gold alloy and the dissolution barrier comprises a layer of alumina on the order of 2-3 microns thick. A titanium wetting layer is provided between the alumina layer and the alloy. A metallization layer provided between the dissolution barrier and the ceramic component in one example comprises a layer of gold between two thin layers of titanium. In one particular example, a platinum mesh is included with the gold of the braze alloy to control braze flow during the brazing operation.

Abstract: Terminal pins comprising a refractory metal forming a full perimeter weld connected to a terminal block comprising a dissimilar metal incorporated into feedthrough filter capacitor assemblies are discussed. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

Abstract: A seal design provides positive compression to produce a hermetic seal around a feedthrough pin in a hermetically sealed device, including an implantable medical device. One embodiment of the seal design uses a plurality of “micro-flanges” placed along the length of a feedthrough pin, which micro-flanges grabs and compresses the insulator material to form a hermetic seal. Because the seal design produces positive compression of the insulator, the seal is relatively insensitive to changes in temperature and to differences in thermal expansion coefficients (“TCEs”) between the metal feedthrough and the insulator. It is therefore possible to use a wider variety of materials for the insulator and the feedthrough with the described sealing design, while achieving a superior hermetic seal.

Abstract: A seal design provides positive compression to produce a hermetic seal around a feedthrough pin in a hermetically sealed device, including an implantable medical device. One embodiment of the seal design uses a plurality of “micro-flanges” placed along the length of a feedthrough pin, which micro-flanges grabs and compresses the insulator material to form a hermetic seal. Because the seal design produces positive compression of the insulator, the seal is relatively insensitive to changes in temperature and to differences in thermal expansion coefficients (“TCEs”) between the metal feedthrough and the insulator. It is therefore possible to use a wider variety of materials for the insulator and the feedthrough with the described sealing design, while achieving a superior hermetic seal.

Abstract: An aluminum tubular unit for long-term, leak-free storage of fluids is formed in which an aluminum cap is ultrasonically welded to an end of the aluminum tube. The ultrasonic weld is formed from a device capable of producing a torsional vibration pattern. The ultrasonic welding of the cap to the tube eliminates the use of seals and pins to seal the cap to the tube and further eliminates the need for having a hole in the cap to mechanically couple the respective end cap to the cylindrical tube. Furthermore, since ultrasonic welding does not generate significant heat, highly volatile and flammable fluids can be present within the tube when the caps are ultrasonically welded to the cylindrical body. In addition, one or more fins used may also be welded to the outside diameter of the cylindrical body using a related ultrasonic welding process.

Abstract: A ceramic discharge lamp in which an electric discharge gas is enclosed in an arc tube which is made up of a ceramic member and a metal member. The ceramic discharge lamp includes a first brazing material, which is formed so as to be fixed on a surface of the ceramic member without being covered with the metal member; a titanium layer, which is formed between the first brazing material and the ceramic member; and a second brazing material, which is continuously formed from the first brazing member, that covers part of the metal member so that the ceramic member and the metal member are airtightly joined to each other.

Abstract: A closed container with a tight and mechanically strong seal having two fastened-together metal elements including a body and a cover. The body is essentially a cylindrical or prismatic shape having a base with one or more axial walls and an open top axial end. The cover has a more or less complex shape having one or more walls to be positioned at the top axial end of the body facing the axial wall(s) of the body. The fastening of the metal elements is via a butt weld, advantageously with no filler metal. The internal structure at the weld line includes a docking guide having a groove provided with at least one degassing chimney, and a chamfered end above or below the weld line, on the wall. The body and/or the cover include(s) at least one blanked off degassing vent.

Abstract: A die attach process employs a temperature gradient lead free soft solder metal sheet or thin film as the die attach material. The sheet or thin film is formed to a uniform thickness and has a heat vaporizable polymer adhesive layer on one surface, by which the thin film is laminated onto the back metal of the silicon wafer. The thin film is lead-free and composed of acceptably non-toxic materials. The thin film remains semi-molten (that is, not flowable) in reflow temperatures in the range about 260° C. to 280° C. The polymer adhesive layer is effectively vaporized at the high reflow temperatures during the die mount.

Abstract: A method of forming a sensor for sensing a physical property of a media. A substrate is provided having circuitry thereon including at least one electrical contact and a die is provided having disposed thereon corresponding electrical contacts and a sensing element for sensing a physical property of a media applied to said sensing element. One or more bonding ring or portions are arranged on the die. The die electrical contact(s) and bonding ring(s) can be bonded substantially simultaneously, with conductive bonding material, to the corresponding substrate electrical contact(s) and a surface of said substrate, respectively, to thereby form a sensor. The bonding ring(s) form a pressure seal. The substrate can include corresponding bonding ring(s). The die can include an ASIC for compensating temperature effects on said pressure sensor.

Abstract: A hermetic seal cover capable of inhibiting defects such as voids from generating in sealing a package, and a method of manufacturing the seal cover are provided. The hermetic seal cover comprises: a seal cover main body; a Ni plating layer applied onto a surface of the seal cover main body; and a Au—Sn brazing material layer fusion bonded to a surface of the Ni plating layer, and is characterized by a Ni—Sn ally layer disposed between the Ni plating layer and the Au—Sn brazing material layer. It is preferable if the Ni—Sn alloy layer has a thickness of 0.6-5.0 ?m. It is also preferable if Au—Sn brazing material layer has a Sn content of 20.65-23.5 wt %.

Abstract: Methods, formulations, and devices are provided for enhancing drug delivery from a medical device. The method is provided for increasing the rate or quantity of a drug formulation released from an implantable drug delivery device, which method comprises the step of providing a release-modifying agent within or proximate to the implantable drug delivery device, in a manner effective to inhibit gelation, aggregation, or precipitation of the drug formulation being released from the device. The drug formulation and the release-modifying agent may be stored together in at least one reservoir in the implantable drug deliver device. Alternatively, the release-modifying agent may be stored in one or more reservoirs separate from the drug formulation.

Abstract: An electrochemical cell, comprising: an encasement including a case having a bottom and a sidewall terminating at an open top and a cover disposed over the case open top and hermetically sealed to the case, the encasement defining an interior space for containing cell components; and an access port defining at least one lumen extending through any of the case bottom, the case sidewall or the cover for receiving a liquid electrolyte, the access port being sealed closed after receiving the liquid electrolyte using a fusion welding method in the presence of the electrolyte.

Abstract: A seal for a gas supply system of metal, in particular for sealing an airbag conduit, wherein, during operation, the gas supply system has a gas-conducting cross-section and a wall of metal, wherein in the area which seals the cross-section of the gas supply system, a layer of a plastically deformable material is at least partially inserted and the area with the plastically deformable material present therein is sealed in a gas-tight manner, wherein the area of the seal and the plastically deformable material present therein are mechanically interlaced one with the other.

Abstract: A method of bonding a ceramic part to a metal part by heating a component assembly including the metal part, the ceramic part, and a thin essentially pure interlayer material placed between the two parts heated at a temperature that is greater than the temperature of the eutectic formed between the metal part and the interlayer material, but that is less than the melting point of the interlayer material, the ceramic part or the metal part is disclosed. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the ceramic part and the metal part. The bonded assembly is optionally treated with acid to remove any residual free nickel and nickel salts to assure a biocompatible assembly for implantation in living tissue.

Abstract: Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to the active MEMS region are formed. A seal ring wetting layer is also formed on the substrate, the seal ring wetting layer surrounding the active MEMS region. A single piece solder preform is positioned on the bonding pads and on the seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region. The seal ring region is connected to the bonding pad region by a plurality of solder bridges. The method also includes heating the single piece solder preform to a temperature above the reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer and the bonding pads. A lid is coupled to the solder.

Abstract: A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.

Abstract: A method of braze bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a very thin substantially pure nickel foil filler material placed between the two parts and heated at a temperature that is greater than the temperature of the eutectic formed between the titanium part and the substantially pure nickel filler material, but that is less than the melting point of either the filler material, the stainless steel part, or the titanium part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the stainless steel part and the titanium part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly for implantation in living tissue.

Abstract: The invention includes a brazed ceramic ring that separates the positive and negative ends of the battery while still providing a leak-tight seal. The ceramic is aluminum oxide or zirconium oxide or zirconium oxide with 3% yttrium. The invention includes a brazing material, which is grater than 50% gold. The invention includes a titanium alloy case (Ti-6Al-4V) which is titanium with 6% aluminum and 4% vanadium as its major alloying elements. The case has the desirable properties of titanium such as high strength for a relatively low weight; and the case has the requisite ability and electro-activity to be used as a positive current carrying element where the battery's positive electrode exhibits more then 3.5 V vs. Li/Li+.

Abstract: A bonding method using a bonding agent is provided, which has the steps of forming an underlayer on a first member, providing a bonding agent on the underlayer, forming a contact member, different from the bonding agent, on a second member, bringing the bonding agent into contact with the contact member so that the first member and the second member are bonded to each other. In the method described above, the wettability of the bonding agent to the underlayer is superior to that of the bonding agent to a surface of the first member before the underlayer is formed thereon, and the bondability of the bonding agent to the contact member is superior to that of the bonding agent to a surface of the second member before the contact member is formed thereon.

Abstract: Braze and electrode wire assemblies, e.g., used with an implantable microstimulator, include a wire welded in the through-hole of an electrode, which electrode is brazed to a ceramic case that is brazed to a metal ring that is welded to a metal can. The braze joints are step or similar joints that self-center the case, provide lateral support during braze assembly, and provide increased surface area that prevents braze material from exuding from the joints. The end of the ceramic case that is brazed to the metal ring need not be specially machined. The shell has a reference electrode on one end and an active electrode on the other, and is externally coated on selected areas with conductive and non-conductive materials.

Abstract: This invention is an improved method for making a battery case feedthrough. It utilizes stainless steel or titanium metal clad with aluminum. The use of the clad metal enables the fabrication of the battery case and cover and feedthrough pin assembly where a high temperature ceramic-metal hermetic seal is needed between a stainless steel feedthrough pin and a ceramic insulator; and between a ceramic insulator and a surrounding hollow cylinder. A high temperature hermetic seal is also used to fasten the feedthrough pin assembly to the upper stainless steel part of the stainless steel-aluminum clad cover. Titanium can be substituted for stainless steel. Lower temperature metal-metal hermetic seals are needed between the aluminum-clad part of the cover and the aluminum battery casing.

Abstract: The specification teaches a device for use in the manufacturing of microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves the life and operation of the microdevice. In a preferred embodiment the invention includes a mechanical supporting base, and discrete deposits of gas absorbing or contaminant removing material on the base by a variety of techniques and a layer for temporary protection of the contaminant removing material on top of the contaminant removing material. Passages are created in the layer which expose the contaminant removing material to atmosphere. The device may be used as a covering for the microdevice as well.