With Shaping Patents (Class 228/141.1)
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Patent number: 11713842Abstract: Aspects of the present disclosure relates to methods of making a hybrid mechanically lined pipe, and apparatus thereof, such as lined pipe used for reeled pipe operations. In one implementation, a method of making a lined pipe for reeled pipe operations includes determining a minimum weld overlay length for a first pipe joint, and providing the first pipe joint. The first pipe joint includes a first end opposite of a second end, a central opening, and an inner surface. The method includes mechanically lining the inner surface of the first pipe joint with a first section of alloy. The method also includes weld overlaying a second section of alloy and a third section of alloy in the central opening and on both sides of the first section of alloy over the minimum weld overlay length to prevent excessive deformation of the mechanically bonded section during reeling operations.Type: GrantFiled: November 12, 2020Date of Patent: August 1, 2023Assignee: J Ray McDermott S.A.Inventors: Mathieu Boisne, Julie Ingram
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Patent number: 11469165Abstract: A semiconductor device package includes a carrier, a first conductive post and a first adhesive layer. The first conductive post is disposed on the carrier. The first conductive post includes a lower surface facing the carrier, an upper surface opposite to the lower surface and a lateral surface extended between the upper surface and the lower surface. The first adhesive layer surrounds a portion of the lateral surface of the first conductive post. The first adhesive layer comprises conductive particles and an adhesive. The first conductive post has a height measured from the upper surface to the lower surface and a width. The height is greater than the width.Type: GrantFiled: July 17, 2020Date of Patent: October 11, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Yu-Ying Lee
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Patent number: 11450785Abstract: A transfer carrier is adapted to be connected to an electrode of a micro light-emitting element and transfer the micro light-emitting element. A transfer carrier includes a transfer substrate and a plurality of metal bonding pads. The metal bonding pads are disposed on the transfer substrate, and every two metal bonding pads that are adjacent to each other are spaced apart from each other through a gap.Type: GrantFiled: January 25, 2021Date of Patent: September 20, 2022Assignee: PlayNitride Inc.Inventors: Tzu-Yu Ting, Sheng-Chieh Liang, Yu-Hung Lai
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Patent number: 11408457Abstract: A self-piercing rivet for joining workpieces comprises: a head defining a head diameter, and a shank which defining a shank diameter. The shank on a foot end opposite to the head, partially defines an axial recess which has an axial depth. The shank further includes a flat surface portion or a circular cutter on the foot end. And an axial circular recess is partially defined in a transition portion between the head and the shank.Type: GrantFiled: November 9, 2018Date of Patent: August 9, 2022Assignee: NEWFREY LLCInventors: Paul Bartig, Matthias Wissling
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Patent number: 10870166Abstract: Welded assemblies and related methods of making the welded assemblies include a first component of a first metal material, a second component of a second metal material that is different from the first metal material, and a transition material including one or more of a high entropy alloy, a pure element, and an alloy that is not a high entropy alloy, and that is arranged between and contacting the first component and the second component. An ultrasonic weld joins the transition material to the first component, and a fusion weld joins the first component to the second component. The fusion weld contact the first component, the second component, and the transition material. The amount or level of one or more of galvanic corrosion, intermetallic compounds, and solidification cracking in the fusion weld is less than if the first component was fusion welded directly to the second component.Type: GrantFiled: February 1, 2018Date of Patent: December 22, 2020Assignee: Honda Motor Co., Ltd.Inventor: Ryan M. Hahnlen
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Patent number: 9327437Abstract: A method of providing a mould with a conformal cooling passage includes rough machining a mould cavity generally corresponding to a moulded part shape using CAD data. Conformal cooling slots are cut in the mould cavity using the CAD data. The conformal cooling slots are welded shut using the CAD data to provide conformal cooling passages. A class A surface is machined over the conformal cooling passage and corresponds to a finished mould part shape using the CAD data.Type: GrantFiled: June 11, 2015Date of Patent: May 3, 2016Inventor: Ariel Andre Waitzman
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Publication number: 20150144602Abstract: A welding auxiliary joining part in the shape of a stud having a head, a shank and a tip is disclosed. The welding auxiliary joining part is driven into a component made of a non- or poorly weldable material by means of a setting method. A welding head is created during driving-in due to mechanical deformation such that subsequently the component can be connected by welding via the welding auxiliary joining part to a further component made of a weldable material.Type: ApplicationFiled: May 24, 2013Publication date: May 28, 2015Inventors: Torsten Draht, Sergej Hartwig-Biglau
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Patent number: 9004341Abstract: Provided is a method for producing a welded steel pipe having excellent buckling resistance. The method for producing a welded steel pipe according to the present embodiment includes steps of: preparing a welded pipe, and expanding the welded pipe over the entire length thereof by using a pipe expanding head such that an undulation wavelength ratio D defined by Formula (1) is not more than 0.8, or not less than 1.8: D=p/???(1), where p is an undulation wavelength in the axial direction of the welded steel pipe, and ? is a Timoshenko's buckling wavelength as defined by Formula (2): ?=3.44×(r×t)1/2 ??(2), where r is an inner radius of the welded steel pipe and t is a wall thickness of the welded steel pipe.Type: GrantFiled: August 30, 2012Date of Patent: April 14, 2015Assignee: Nippon Steel & Sumitomo Metal CorporationInventor: Hidenori Shitamoto
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Patent number: 8832933Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.Type: GrantFiled: September 15, 2011Date of Patent: September 16, 2014Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yung-Hsin Kuo, Wensen Hung, Po-Shi Yao
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Patent number: 8806737Abstract: Techniques for designing and creating energy efficient cookware are provided. In accordance with the techniques cookware can include a cookware base having a cooking surface and heating surface. The heating surface can have a pattern of fins forming heat exchange channels. The channel fins can improve energy transfer while providing even distribution throughout the cooking surface. Methods of making the energy efficient cookware are provided. Methods of direct forming channel fins by impact bonding and forging are disclosed.Type: GrantFiled: March 12, 2010Date of Patent: August 19, 2014Assignee: Eneron Inc.Inventor: Lee Lisheng Huang
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Publication number: 20130342986Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.Type: ApplicationFiled: June 26, 2012Publication date: December 26, 2013Inventors: Tsung-Yu Chen, Rebecca Shia
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Publication number: 20130334291Abstract: Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.Type: ApplicationFiled: February 6, 2013Publication date: December 19, 2013Applicant: Electronics and Telecommunications Research InstituteInventors: Yong Sung EOM, Kwang-Seong Choi, Jung Hyun Noh
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Patent number: 8586857Abstract: A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.Type: GrantFiled: November 4, 2008Date of Patent: November 19, 2013Assignee: MiasoleInventors: Shawn Everson, Steven T. Croft, Whitfield G. Halstead, Jason S. Corneille
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Patent number: 8517248Abstract: A method of providing a mould with a conformal cooling passage includes rough machining a mould cavity generally corresponding to a moulded part shape using CAD data. Conformal cooling slots are cut in the mould cavity using the CAD data. The conformal cooling slots are welded shut using the CAD data to provide conformal cooling passages. A class A surface is machined over the conformal cooling passage and corresponds to a finished mould part shape using the CAD data.Type: GrantFiled: August 27, 2010Date of Patent: August 27, 2013Inventor: Pascal Zaffino
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Publication number: 20130199767Abstract: A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.Type: ApplicationFiled: February 2, 2012Publication date: August 8, 2013Applicant: International Business Machines CorporationInventors: John P. Karidis, Mark D. Schultz
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Publication number: 20130147327Abstract: A box-frame housing for the installation of electronic modules has frame elements and side walls and provides a subdivision into sub-regions, which are limited by dividing walls. The frame elements and the side walls and dividing walls provide at least one recess and/or at least one edge projection. A projection engages in a recess and both are connected to one another by welding.Type: ApplicationFiled: August 3, 2011Publication date: June 13, 2013Applicant: ROHDE & SCHWARZ GMBH & CO. KGInventors: Hermann Muhr, Andreas Fischl, Wolfgang Kufer, Hans-Dieter Koenig, Helmut Hingrainer
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Publication number: 20130126053Abstract: The invention discloses a novel method to prepare the Ni(Sn, Sb)3 skutterudite compound. Skutterudite compounds are thermoelectric materials, which can transform heat into electric energy. Besides, the Ni(Sn, Sb)3 compound is also an anode material of Li ion battery. The solid state diffusion method is used to prepare the Ni(Sn1-x, Sbx)3 compound. Compared to traditional physical or chemical processes, the method disclosed in the invention is simpler and operates at a lower temperature. By the method according to the invention, the composition of the Ni(Sn, Sb)3 compound can be adjusted to fulfill variety requirements for different applications. It is noteworthy that the invention can prepare ternary compounds. In comparison with the frequently used binary compounds such as Ni3Sn4 or Cu6Sn5, the invention can produce materials with better performance.Type: ApplicationFiled: December 23, 2011Publication date: May 23, 2013Applicant: CHUNG YUAN CHRISTIAN UNIVERSITYInventors: Chih-chi Chen, Yue-Ting Chen
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Patent number: 8196802Abstract: A seal device for a rotary shaft includes a sleeve, a gland, a ring, a guide block, and a fixing member. The guide block has an outer block surface extending circumferentially and abutting against a portion of an inner gland surface of the gland, and an inner block surface extending circumferentially and opposite to the outer block surface. The outer block surface has two circumferentially opposite outer ends. The inner block surface has two circumferentially opposite inner ends. The guide block further has two opposite end faces each of which connects one of the outer ends to one of the inner ends. The inner ends subtend an angle of not larger than 90° at a center line of the gland. At least one of the end faces lies in a plane line that is substantially tangent to an outer peripheral face of the ring.Type: GrantFiled: December 30, 2009Date of Patent: June 12, 2012Assignee: Scenic Precise Element Inc.Inventor: Yi-Chieh Huang
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Publication number: 20110278264Abstract: A guide wire includes a first wire disposed on the distal side of the guide wire and a second wire disposed on the proximal side. The second wire has an elastic modulus larger than the first wire. The first wire is joined to the second wire at a welded portion by welding. A coil is disposed on the distal side of the first wire. A cover layer is formed on the outer peripheral surface of the wire member in such a manner as to cover at least the welded portion. The cover layer is made from a material capable of reducing the friction of the cover layer, for example, a fluorocarbon resin or a hydrophilic material, to thereby improve the sliding performance of the guide wire. Such a guide wire is excellent in operationality and kink resistance.Type: ApplicationFiled: July 21, 2011Publication date: November 17, 2011Applicant: Terumo Kabushiki KaishaInventors: Hiraku MURAYAMA, Akihiko Umeno, Jun Iwami, Yutaka Itou, Youki Aimi
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Publication number: 20110278349Abstract: Provided is a wire bonding apparatus including: a wire cutting unit configured to cut a wire by bonding the wire using a capillary and then moving the capillary and a first clamper upward while the first clamper remains closed; and a wire extending unit configured to extend a tail wire from a tip end of the capillary by moving the capillary upward and then moving the capillary and the first clamper upward in a state in which the first clamper is opened and a second clamper is closed. The wire bonding apparatus having such a structure effectively prevents the wire from falling out and bending.Type: ApplicationFiled: July 7, 2011Publication date: November 17, 2011Applicant: SHINKAWA LTD.Inventors: Shinsuke Tei, Toshihiko Toyama
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Publication number: 20110278063Abstract: Copper (Cu)-to-Cu bonding techniques are provided. In one aspect, a bonding method is provided. The method includes the following steps. A first bonding structure is provided having at least one copper pad embedded in a first insulator and at least one via in the first insulator over the copper pad, wherein the via has tapered sidewalls. A second bonding structure is provided having at least one copper stud embedded in a second insulator, wherein a portion of the copper stud is exposed for bonding and has a domed shape. The first bonding structure is bonded to the second bonding structure by way of a copper-to-copper bonding between the copper pad and the copper stud, wherein the via and the copper stud fit together like a lock-and-key. A bonded structure is also provided.Type: ApplicationFiled: May 14, 2010Publication date: November 17, 2011Applicant: International Business Machines CorporationInventors: Kuan-Neng Chen, Fei Liu
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Patent number: 8042723Abstract: Provided is a method of repair which method is capable of holding a molten brazing material at the bonding portion when a component is bonded with a brazing material to an inclined or to a curved surface. The method of repair repairs by brazing a repair portion in which a crack has developed and which needs repair, wherein a brazing material support (4) holding in the interior thereof a molten brazing material (5) is brought into contact with the repair portion, and under the condition that the brazing material support (4) is in contact with the repair portion, the molten brazing material (5) is solidified. Under the condition that the brazing material (5) in a powder form is brought into contact with the brazing material support (4), the brazing material (5) can be melted by heating to a temperature at or above the melting point of the brazing material (5).Type: GrantFiled: October 6, 2008Date of Patent: October 25, 2011Assignee: Mitsubishi Heavy Industries, LtdInventor: Shuji Holi
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Publication number: 20110156445Abstract: A motor vehicle is provided that includes, but is not limited to a structural car body column with a structural component. The structural component is realized in the form of a closed hollow profile and features at least one recess. The structural component is connected to at least one region of the car body of the motor vehicle that adjoins the structural car body column by means of at least one welding seam. The at least one welding seam is arranged on the opposite side of the structural component referred to the at least one recess.Type: ApplicationFiled: December 21, 2010Publication date: June 30, 2011Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Klaus LABBE, Juergen HULBERT
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Publication number: 20110096507Abstract: An improved thermal interface between an integrated circuit chip and a heat sink comprises a copper grid embedded in a layer of a solder material that has a fusion temperature higher than the maximum operating temperature of the semiconductor chip, and bonds to the semiconductor chip and the heat sink when heated to the fusion temperature of the solder material in the presence of a soldering flux. The copper grid has high thermal conductivity so that the amount of solder material needed for an efficient thermal interface is reduced and solder materials with less expensive components may be used. The copper grid also tends to mitigate local hot spots by enhancing lateral heat transfer, and inhibits solder spreading during formation of the thermal interface.Type: ApplicationFiled: September 2, 2010Publication date: April 28, 2011Applicant: Kester, Inc.Inventor: Brian Deram
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Patent number: 7905387Abstract: A method of manufacturing an expansion joint includes steps of: marking parts, which will form the expansion joint, on a piece of raw material, so that the original 360 degree shape of the expansion joint is equally divided by the parts, and cutting the marked parts from the raw material; welding the divided parts, so that opposing ends of the welded parts are separated from each other; bending the welded parts into the form of a cone using a bending roller, thereby welding and joining the opposing ends thereof; fixedly mounting the resultant structures on a press; shaping the mounted resultant structures into products using a mold having a desired shape and dimension; and butting a pair of the products against each other and welding the products in the outer radial direction.Type: GrantFiled: October 22, 2007Date of Patent: March 15, 2011Inventor: Yong Woo Kim
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Publication number: 20110000952Abstract: A method for joining a tube and tube plate for use in a tube-and-shell heat exchanger is disclosed. The method enables a joint between the tube and tube plate that is substantially hermetic and substantially corrosion-resistant. The method comprises providing an anvil inside the tube, wherein the anvil supports the tube wall during a friction-stir welding process used to join the tube and tube plate. The anvil facilitates formation of a reliable weld region and enables faster friction-stir welding.Type: ApplicationFiled: July 1, 2010Publication date: January 6, 2011Applicant: LOCKHEED MARTIN CORPORATIONInventors: Riki P. Takeshita, Randy J. Brown, Michael R. Eller, Duy N. Pham
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Publication number: 20100291399Abstract: As a replacement for high-temperature solder having a solidus temperature of at least 250° C. for bonding a package and a lid of a functional part, a solder paste formed by mixing a Cu-based metal powder with a solidus temperature of at least 400° C. and an Sn-based solder powder is applied to a lid of a difficult to solder material which was previously subjected to plating having good solderability and heated to obtain a solder layer comprising the Cu-based metal powder, Cu6Sn5 intermetallic compounds, and lead-free solder on the plated surface. The intermetallic compounds are bonded to the difficult to solder material and the intermetallic compounds are connected to each other, so the solder layer functions as a high-temperature solder. The problem of poor solderability of high-temperature solders is avoided by the present invention.Type: ApplicationFiled: September 3, 2007Publication date: November 18, 2010Inventors: Rikiya Kato, Mitsuo Zen
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Patent number: 7814730Abstract: The invention relates to a welded profile for fitting a digger with a hoe bucket or loading shovel, such as a boom or stanchion, comprising upper and lower webs and sidewalls cooperating therewith, whereby the sidewalls are provided with upper and lower profile reinforced end regions which form the corner regions for the upper and lower webs arranged between the end regions.Type: GrantFiled: December 2, 2003Date of Patent: October 19, 2010Assignee: Bucyrus HEX GmbHInventors: Armin Grobenstieg, Detlef Beckmann
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Publication number: 20100246099Abstract: A solid electrolytic capacitor includes a capacitor element, an external conduction member and a fuse conductor. The capacitor element includes a porous sintered body made of valve metal, an anode wire projecting from the porous sintered body, and a dielectric layer and a solid electrolyte layer covering the porous sintered body. The fuse conductor electrically connects the external conduction member and one of the anode wire and the solid electrolyte layer to each other. The fuse conductor is made of a metal containing one of Au—Su-based alloy, Zn—Al-based alloy, Sn—Ag—Cu-based alloy, Sn—Cu—Ni—based alloy and Sn—Sb—based alloy.Type: ApplicationFiled: March 17, 2010Publication date: September 30, 2010Applicant: ROHM CO., LTD.Inventors: Kentaro Naka, Takahiro Maeda
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Publication number: 20100221117Abstract: A method of manufacturing a blade (20) for a turbomachine by superplastic forming and diffusion bonding a first layer (18), a second layer (16) and a membrane (2), the membrane (2) being disposed between the first and second layers (18, 16), the method comprising: applying a stop-off material in a first predetermined pattern between the first layer (18) and the membrane (2) so as to prevent a diffusion bond from forming between the first layer and the membrane across said first predetermined pattern; wherein the first pattern is applied such that it defines one or more first strips (12) and one or more first dots (15), the first strips and first dots being void of the stop-off material, and wherein the first strips are arranged in a span-wise direction, and the first dots are located between the first strips and the blade tip edge, the first dots (15) being offset from a longitudinal axis of the first strips (12) in a chord-wise direction; and applying the stop-off material in a second predetermined pattern bType: ApplicationFiled: February 3, 2010Publication date: September 2, 2010Applicant: ROLLS-ROYCE PLCInventors: Phillip BRENNAND, Richard M. JONES
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Publication number: 20100108122Abstract: A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.Type: ApplicationFiled: November 4, 2008Publication date: May 6, 2010Inventors: Shawn Everson, Steven T. Croft, Whitfield G. Halstead, Jason S. Corneille
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Publication number: 20100035021Abstract: A substrate includes a base material, a first solder part disposed on a surface of the base material and used for connection to an electronic component, and a second solder part disposed on the surface of the base material and made of the same solder as that of the first solder part. The top surface of the first solder part is made to be a flat surface, and the maximum height of the second solder part from the surface of the base material is lower than the height of the flat surface of the first solder part from the surface of the base material. Thus, a substrate for which the kind of solder can be determined easily and with certainty, a device provided with this substrate, a method of manufacturing the substrate, and a determining method are provided.Type: ApplicationFiled: August 5, 2009Publication date: February 11, 2010Applicant: NEC Electronics CorporationInventor: Chiho Ogihara
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Patent number: 7617605Abstract: In a method for reducing “blow-out” of annular welds for attaching components in a fuel injector, a relief region is formed on radially-facing surfaces of the components. The relief region is adjacent to a press-fit region. The components are then pressed together, and a weld is made in the relief region. A sealed gap is thereby formed in the relief region between the weld and the press-fit region. The sealed gap provides for the expansion of trapped gases that could otherwise “blow out” the liquid weld bead.Type: GrantFiled: June 15, 2006Date of Patent: November 17, 2009Assignee: Continental Automotive Systems US, Inc.Inventors: James Paul Fochtman, Jack David Oliver
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Publication number: 20090214890Abstract: A laminate aluminum block for forming an article includes a series of aluminum laminate plates to collectively form a tool body for forming an article in a forming operation. A series of aluminum brazing layers are formed for brazing together adjacent aluminum laminate plates. The series of aluminum laminate plates and the series of aluminum brazing layers are deoxidized. Draining apertures are formed through a plurality of the series of aluminum laminate plates. The series of aluminum laminate plates are stacked alternating with the aluminum brazing layers between adjacent aluminum laminate plates without a flux. The stacked series of alternating aluminum plates and aluminum brazing layers are pressed. The stacked series of alternating aluminum plates and aluminum brazing layers are heated in a vacuum furnace to a temperature wherein the aluminum brazing layers braze the aluminum laminate plates together and excess braze material drains from the draining apertures.Type: ApplicationFiled: February 26, 2009Publication date: August 27, 2009Applicant: FLOODCOOLING TECHNOLOGIES, LLCInventors: Matthew T. Lowney, Michael Wasylenko, Anthony Nicholas Tanascu
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Patent number: 7571531Abstract: A method of fabricating a spherical cavitation. Depending upon the chamber's composition and wall thickness, chambers fabricated with the disclosed techniques can be used with either low or high pressure systems. During chamber fabrication, initially two spherical half portions are fabricated and then the two half portions are joined together to form the desired cavitation chamber. During the fabrication of each chamber half, the interior spherical surface is completed first and then the outer spherical surface. Prior to joining the two spherical cavitation chamber halves, the surfaces to be mated are finished, preferably to a surface flatness of at least 0.01 inches. Electron beam welding is used to join the chamber halves together. Preferably the electron beam welding operation is performed under vacuum conditions. During electron beam welding, the two chamber halves are aligned and held together while the electron beam forms a weld along the chamber seam.Type: GrantFiled: July 26, 2006Date of Patent: August 11, 2009Assignee: Impulse Devices, Inc.Inventor: Ross Alan Tessien
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Publication number: 20090186238Abstract: A method of processing a brazed article includes forming a braze joint with an aluminum component comprising a nano-grained aluminum alloy.Type: ApplicationFiled: January 23, 2008Publication date: July 23, 2009Inventor: Clifford C. Bampton
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Publication number: 20090137082Abstract: A manufacturing method for manufacturing an electronic device includes a first electronic component and a second electronic component; and a bond part for the first electronic component joined to another bond part for the second electronic component. In a first process of this manufacturing method, the metallic bond part for the first electronic component is placed directly against the metallic bond part for the second electronic component, pressure is applied to the first electronic component and the second electronic component and, after metallically joining the above two bond parts, the pressure applied to the first electronic component and the second electronic component is released. In a second process in the manufacturing method, a clamping member affixes the relative positions of the joined first electronic component and second electronic component, and heats the first electronic component and the second electronic component to maintain a specified temperature.Type: ApplicationFiled: November 18, 2008Publication date: May 28, 2009Applicant: NEC Electronics CorporationInventor: Yoichiro Kurita
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Patent number: 7419082Abstract: A friction welding process providing a workpiece having a weld surface, and a second workpiece having a weld surface. The workpieces being welded together at respective weld surfaces. Oscillatory motion is affected to the workpieces such that one weld surface moves across the other, thereby raising the temperature at the weld surfaces to create a weld interface. The oscillatory motion is ceased and the weld surfaces cool to weld the workpieces together at the interface. The workpiece has an extending portion, and the weld surface is provided on the extending portion. The extending portion includes an apex region, which engages the second workpiece's weld surface. A side face extends from the apex region to provide a gap between the side face and the second workpiece's weld surface. The gap allows weld flash material to pass from the weld interface through said gap.Type: GrantFiled: December 30, 2004Date of Patent: September 2, 2008Assignee: Rolls-Royce plcInventors: John B Brownell, Jonathan P Throssell, Simon E Bray
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Patent number: 7368035Abstract: An improved method for joining together the edge portions of first and second panels includes applying a heat curable adhesive along the edge portion of the first panel and then abutting the edge portion of the second panel with the edge portion of the first panel so that the adhesive is interposed between the edge portions of the first and second panels and the adhesive spaces the panels apart and provides a gap between the panels. A brazing material is melted and fills the gap and the heating of the panels by the brazing causes at least partial curing of the adhesive so that the panels are joined together by both brazing and adhesive bonding.Type: GrantFiled: January 27, 2006Date of Patent: May 6, 2008Assignee: GM Global Technology Operations, Inc.Inventors: Pei-Chung Wang, John D. Fickes, Anthony V. Minatel, Dean T. Quaderer
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Publication number: 20080041922Abstract: A hybrid resistance heating/ultrasonic welding method is used to join substrates. The resistance heating sufficiently softens or melts the substrates at an interface, and an ultrasonic wave is used solid state bond the substrates at the interface. The hybrid method can be used for both spot welding as well as continuous welding.Type: ApplicationFiled: July 13, 2006Publication date: February 21, 2008Inventors: Mariana G Forrest, Feng Lu, Stephen D. Logan
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Patent number: 6976309Abstract: An underbody for a vehicle includes a floorpan defining a part of an assembly, a rocker slidably engaged with the floorpan, and a rail slidably engaged with the floorpan. The assembly is formed as a unit about a first and a second bend axis.Type: GrantFiled: December 18, 2003Date of Patent: December 20, 2005Assignee: General Motors CorporationInventors: Robert R. Mayer, Anil K. Sachdev
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Patent number: 6956187Abstract: A steel plate splicing facility includes, a steel plate heating apparatus for retrieving and heating a preceding steel plate and a following steel plate, and a shear-joining apparatus for clamping a tail end portion of the preceding steel plate and a leading end portion of the following steel plate in an overlapping condition by a die and a clamp and shearing them with a punch, such that surfaces of the tail end portion and the leading end portion are newly formed and brought in contact with each other in order to them. The shear-joining apparatus joins the preceding and following steel plates at a temperature equal to or higher than 350° C. and at a percentage clearance c/t equal to or lower than 5%, c/t being defined by c/t=D/(t1+t2)×100 where D represents a distance between the punch and the die, and t1 and t2 represent a thickness of respective steel plates.Type: GrantFiled: June 18, 2003Date of Patent: October 18, 2005Assignees: Mitsubishi Heavy Industries, Ltd., Mitsubishi-Hitachi Metals Machinery, Inc.Inventors: Tsutomu Kawamizu, Ritsuo Hashimoto, Etsurou Hirai, Shoichi Hashimoto, Kanji Hayashi
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Patent number: 6955287Abstract: An upper shearing blade equipped with a protrusion of a triangle-columnar shape and a lower shearing blade equipped with a protrusion of the same shape are applied onto the overlapped portion of metal plates to be bonded, and then pressed into the metal plates in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates are not completely cut off. The operating loci of the upper, shearing blade and the lower shearing blade are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.Type: GrantFiled: December 14, 2000Date of Patent: October 18, 2005Assignees: Hitachi, Ltd., Pohang Iron and Steel Co., Ltd., Research Institution of Industrial Science and TechnologyInventors: Kenji Horii, Yasutsugu Yoshimura, Tadashi Nishino, Takashi Kamoshita, Takayoshi Tomino, Fuminori Ishikawa, Takao Funamoto, Takashi Mashiko, Kenjiro Narita, Jong-Keun Kim, Ki-Chol Kim, Jong-Sub Lee, Hwang-Kyu Hwang, Jung-Sik Lee, Jin-Hee Kim
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Patent number: 6948649Abstract: The high yield ratio problem intrinsic in high-strength steel pipes is solved and a method of producing a steel pipe, while securing the pipe roundness is provided. A steel pipe produced from a steel plate by forming and welding is subjected to 0.3 to 1.2% of expansion and then to 0.1 to 1.0% of reduction. The steel pipe produced by this method has a structure in which martensite and/or bainite accounts for more than 80% as expressed in terms of area percentage, and has a yield strength of not lower than 551 MPa and a yield ratio of not higher than 93%. The pipe reduction is desirably carried out at a lower work ratio as compared with the pipe expansion.Type: GrantFiled: September 20, 2002Date of Patent: September 27, 2005Assignee: Sumitomo Metal Industries, Ltd.Inventors: Nobuaki Takahashi, Akio Yamamoto, Tomoaki Ikeda, Tetsuya Fukuba
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Patent number: 6911632Abstract: A method for controlling the edges (7, 7?) of a foil strip guided in a shaping funnel of a device producing tubular bodies from the foil strip by an overlapping weld seam using a guide wedge, the strip being then welded. According to the invention, after welding, the method consists in using a linear infrared sensor for measuring and evaluating a temperature profile perpendicular to the overlapping weld seam. In case of variation relative to the specific real profile, a signal is automatically transmitted to rotate the shaping funnel with the guide wedge, the welding being produced by the high frequency (HF) and the temperature profile being measured directly after welding.Type: GrantFiled: September 9, 2002Date of Patent: June 28, 2005Assignee: Aisapack Holding SAInventor: Gerhard Keller
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Patent number: 6880742Abstract: Shown is a device and a process for the simultaneous separating and welding of foils or foil tubes (5) where the device comprises at least one welding terminal (2) and an opposing terminal (3), and at least a part of the surface of the opposing terminal (3) turned toward the welding terminal (2) is equipped with a flexible absorbing body (4). It is inventive that the surface of the absorbing body (6) turned toward the welding terminal consists of metal.Type: GrantFiled: May 30, 2003Date of Patent: April 19, 2005Assignee: Windmoeller & Hoelscher KGInventors: Hans-Ludwig Voss, Friedrich Goecker
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Patent number: 6837419Abstract: An annular recuperator for use with an annular combustor. The annular recuperator includes a frame and an enclosure provided about its frame that defines a recuperator chamber. A plurality of involute shaped sealed and open recuperators are received in the recuperator chamber.Type: GrantFiled: August 22, 2001Date of Patent: January 4, 2005Assignee: Elliott Energy Systems, Inc.Inventor: William R. Ryan
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Publication number: 20040256442Abstract: A coated cutting tool that comprises a body containing a pocket. The tool further includes a polycrystalline cubic boron nitride blank that is brazed into the pocket using a braze alloy. The braze alloy has a liquidus temperature of at least about 900 degrees Centigrade. There is a coating applied to the cutting tool.Type: ApplicationFiled: June 17, 2003Publication date: December 23, 2004Applicant: Kennametal Inc.Inventors: Alfred S. Gates, Edward J. Oles, Kent L. Reiner, William M. Alexander, Jean-Pierre Genain
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Publication number: 20040159545Abstract: The present invention relates to an improvement in the manufacture of metal blanks, discs, and sputtering targets by flattening only one of the two surfaces of a metal plate. The elimination of flattening the metal plate's second surface results in a significant cost reduction. The metal plate of the present invention preferably has a single-side flatness of 0.005 inches or less, which improves the reliability of the bond between the target blank and a backing plate. Preferred metals include, but are not limited to, tantalum, niobium, titanium, and alloys thereof. The present invention also relates to machining the first side of a metal plate, bonding the first side to a backing plate, and then optionally machining the second side of the metal plate.Type: ApplicationFiled: February 13, 2003Publication date: August 19, 2004Inventor: Christopher A. Michaluk
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Patent number: 6704981Abstract: A method of forming sheets of superplastically formable material into a three dimensional article, the sheets being joined together along diffusion bonds to form discrete cells, at least one gas path being provided through the bond between cells. The sheets are heated to a temperature at which they exhibit superplastic properties and a gas injected between the sheets to expand the cells, the gas paths allowing the injected gas to pass from cell to cell. The edges of the gas paths are locally heated to change the microstructure of the sheets in the edge areas, which reduces the flow resistance of the edges under superplastic forming conditions and thereby reduces the propensity of the diffusion bonds bordering the gas transfer holes to peel apart under the forces of the inert gas exerted on the sheets at the gas transfer paths.Type: GrantFiled: September 9, 2002Date of Patent: March 16, 2004Assignee: BAE Systems plcInventors: George Strickland, Adam B Marriott