With Shaping Patents (Class 228/141.1)
  • Patent number: 11713842
    Abstract: Aspects of the present disclosure relates to methods of making a hybrid mechanically lined pipe, and apparatus thereof, such as lined pipe used for reeled pipe operations. In one implementation, a method of making a lined pipe for reeled pipe operations includes determining a minimum weld overlay length for a first pipe joint, and providing the first pipe joint. The first pipe joint includes a first end opposite of a second end, a central opening, and an inner surface. The method includes mechanically lining the inner surface of the first pipe joint with a first section of alloy. The method also includes weld overlaying a second section of alloy and a third section of alloy in the central opening and on both sides of the first section of alloy over the minimum weld overlay length to prevent excessive deformation of the mechanically bonded section during reeling operations.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: August 1, 2023
    Assignee: J Ray McDermott S.A.
    Inventors: Mathieu Boisne, Julie Ingram
  • Patent number: 11469165
    Abstract: A semiconductor device package includes a carrier, a first conductive post and a first adhesive layer. The first conductive post is disposed on the carrier. The first conductive post includes a lower surface facing the carrier, an upper surface opposite to the lower surface and a lateral surface extended between the upper surface and the lower surface. The first adhesive layer surrounds a portion of the lateral surface of the first conductive post. The first adhesive layer comprises conductive particles and an adhesive. The first conductive post has a height measured from the upper surface to the lower surface and a width. The height is greater than the width.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: October 11, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Yu-Ying Lee
  • Patent number: 11450785
    Abstract: A transfer carrier is adapted to be connected to an electrode of a micro light-emitting element and transfer the micro light-emitting element. A transfer carrier includes a transfer substrate and a plurality of metal bonding pads. The metal bonding pads are disposed on the transfer substrate, and every two metal bonding pads that are adjacent to each other are spaced apart from each other through a gap.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: September 20, 2022
    Assignee: PlayNitride Inc.
    Inventors: Tzu-Yu Ting, Sheng-Chieh Liang, Yu-Hung Lai
  • Patent number: 11408457
    Abstract: A self-piercing rivet for joining workpieces comprises: a head defining a head diameter, and a shank which defining a shank diameter. The shank on a foot end opposite to the head, partially defines an axial recess which has an axial depth. The shank further includes a flat surface portion or a circular cutter on the foot end. And an axial circular recess is partially defined in a transition portion between the head and the shank.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: August 9, 2022
    Assignee: NEWFREY LLC
    Inventors: Paul Bartig, Matthias Wissling
  • Patent number: 10870166
    Abstract: Welded assemblies and related methods of making the welded assemblies include a first component of a first metal material, a second component of a second metal material that is different from the first metal material, and a transition material including one or more of a high entropy alloy, a pure element, and an alloy that is not a high entropy alloy, and that is arranged between and contacting the first component and the second component. An ultrasonic weld joins the transition material to the first component, and a fusion weld joins the first component to the second component. The fusion weld contact the first component, the second component, and the transition material. The amount or level of one or more of galvanic corrosion, intermetallic compounds, and solidification cracking in the fusion weld is less than if the first component was fusion welded directly to the second component.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: December 22, 2020
    Assignee: Honda Motor Co., Ltd.
    Inventor: Ryan M. Hahnlen
  • Patent number: 9327437
    Abstract: A method of providing a mould with a conformal cooling passage includes rough machining a mould cavity generally corresponding to a moulded part shape using CAD data. Conformal cooling slots are cut in the mould cavity using the CAD data. The conformal cooling slots are welded shut using the CAD data to provide conformal cooling passages. A class A surface is machined over the conformal cooling passage and corresponds to a finished mould part shape using the CAD data.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: May 3, 2016
    Inventor: Ariel Andre Waitzman
  • Publication number: 20150144602
    Abstract: A welding auxiliary joining part in the shape of a stud having a head, a shank and a tip is disclosed. The welding auxiliary joining part is driven into a component made of a non- or poorly weldable material by means of a setting method. A welding head is created during driving-in due to mechanical deformation such that subsequently the component can be connected by welding via the welding auxiliary joining part to a further component made of a weldable material.
    Type: Application
    Filed: May 24, 2013
    Publication date: May 28, 2015
    Inventors: Torsten Draht, Sergej Hartwig-Biglau
  • Patent number: 9004341
    Abstract: Provided is a method for producing a welded steel pipe having excellent buckling resistance. The method for producing a welded steel pipe according to the present embodiment includes steps of: preparing a welded pipe, and expanding the welded pipe over the entire length thereof by using a pipe expanding head such that an undulation wavelength ratio D defined by Formula (1) is not more than 0.8, or not less than 1.8: D=p/???(1), where p is an undulation wavelength in the axial direction of the welded steel pipe, and ? is a Timoshenko's buckling wavelength as defined by Formula (2): ?=3.44×(r×t)1/2 ??(2), where r is an inner radius of the welded steel pipe and t is a wall thickness of the welded steel pipe.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: April 14, 2015
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventor: Hidenori Shitamoto
  • Patent number: 8832933
    Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: September 16, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Hsin Kuo, Wensen Hung, Po-Shi Yao
  • Patent number: 8806737
    Abstract: Techniques for designing and creating energy efficient cookware are provided. In accordance with the techniques cookware can include a cookware base having a cooking surface and heating surface. The heating surface can have a pattern of fins forming heat exchange channels. The channel fins can improve energy transfer while providing even distribution throughout the cooking surface. Methods of making the energy efficient cookware are provided. Methods of direct forming channel fins by impact bonding and forging are disclosed.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: August 19, 2014
    Assignee: Eneron Inc.
    Inventor: Lee Lisheng Huang
  • Publication number: 20130342986
    Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.
    Type: Application
    Filed: June 26, 2012
    Publication date: December 26, 2013
    Inventors: Tsung-Yu Chen, Rebecca Shia
  • Publication number: 20130334291
    Abstract: Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.
    Type: Application
    Filed: February 6, 2013
    Publication date: December 19, 2013
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung EOM, Kwang-Seong Choi, Jung Hyun Noh
  • Patent number: 8586857
    Abstract: A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.
    Type: Grant
    Filed: November 4, 2008
    Date of Patent: November 19, 2013
    Assignee: Miasole
    Inventors: Shawn Everson, Steven T. Croft, Whitfield G. Halstead, Jason S. Corneille
  • Patent number: 8517248
    Abstract: A method of providing a mould with a conformal cooling passage includes rough machining a mould cavity generally corresponding to a moulded part shape using CAD data. Conformal cooling slots are cut in the mould cavity using the CAD data. The conformal cooling slots are welded shut using the CAD data to provide conformal cooling passages. A class A surface is machined over the conformal cooling passage and corresponds to a finished mould part shape using the CAD data.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: August 27, 2013
    Inventor: Pascal Zaffino
  • Publication number: 20130199767
    Abstract: A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.
    Type: Application
    Filed: February 2, 2012
    Publication date: August 8, 2013
    Applicant: International Business Machines Corporation
    Inventors: John P. Karidis, Mark D. Schultz
  • Publication number: 20130147327
    Abstract: A box-frame housing for the installation of electronic modules has frame elements and side walls and provides a subdivision into sub-regions, which are limited by dividing walls. The frame elements and the side walls and dividing walls provide at least one recess and/or at least one edge projection. A projection engages in a recess and both are connected to one another by welding.
    Type: Application
    Filed: August 3, 2011
    Publication date: June 13, 2013
    Applicant: ROHDE & SCHWARZ GMBH & CO. KG
    Inventors: Hermann Muhr, Andreas Fischl, Wolfgang Kufer, Hans-Dieter Koenig, Helmut Hingrainer
  • Publication number: 20130126053
    Abstract: The invention discloses a novel method to prepare the Ni(Sn, Sb)3 skutterudite compound. Skutterudite compounds are thermoelectric materials, which can transform heat into electric energy. Besides, the Ni(Sn, Sb)3 compound is also an anode material of Li ion battery. The solid state diffusion method is used to prepare the Ni(Sn1-x, Sbx)3 compound. Compared to traditional physical or chemical processes, the method disclosed in the invention is simpler and operates at a lower temperature. By the method according to the invention, the composition of the Ni(Sn, Sb)3 compound can be adjusted to fulfill variety requirements for different applications. It is noteworthy that the invention can prepare ternary compounds. In comparison with the frequently used binary compounds such as Ni3Sn4 or Cu6Sn5, the invention can produce materials with better performance.
    Type: Application
    Filed: December 23, 2011
    Publication date: May 23, 2013
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Chih-chi Chen, Yue-Ting Chen
  • Patent number: 8196802
    Abstract: A seal device for a rotary shaft includes a sleeve, a gland, a ring, a guide block, and a fixing member. The guide block has an outer block surface extending circumferentially and abutting against a portion of an inner gland surface of the gland, and an inner block surface extending circumferentially and opposite to the outer block surface. The outer block surface has two circumferentially opposite outer ends. The inner block surface has two circumferentially opposite inner ends. The guide block further has two opposite end faces each of which connects one of the outer ends to one of the inner ends. The inner ends subtend an angle of not larger than 90° at a center line of the gland. At least one of the end faces lies in a plane line that is substantially tangent to an outer peripheral face of the ring.
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: June 12, 2012
    Assignee: Scenic Precise Element Inc.
    Inventor: Yi-Chieh Huang
  • Publication number: 20110278264
    Abstract: A guide wire includes a first wire disposed on the distal side of the guide wire and a second wire disposed on the proximal side. The second wire has an elastic modulus larger than the first wire. The first wire is joined to the second wire at a welded portion by welding. A coil is disposed on the distal side of the first wire. A cover layer is formed on the outer peripheral surface of the wire member in such a manner as to cover at least the welded portion. The cover layer is made from a material capable of reducing the friction of the cover layer, for example, a fluorocarbon resin or a hydrophilic material, to thereby improve the sliding performance of the guide wire. Such a guide wire is excellent in operationality and kink resistance.
    Type: Application
    Filed: July 21, 2011
    Publication date: November 17, 2011
    Applicant: Terumo Kabushiki Kaisha
    Inventors: Hiraku MURAYAMA, Akihiko Umeno, Jun Iwami, Yutaka Itou, Youki Aimi
  • Publication number: 20110278349
    Abstract: Provided is a wire bonding apparatus including: a wire cutting unit configured to cut a wire by bonding the wire using a capillary and then moving the capillary and a first clamper upward while the first clamper remains closed; and a wire extending unit configured to extend a tail wire from a tip end of the capillary by moving the capillary upward and then moving the capillary and the first clamper upward in a state in which the first clamper is opened and a second clamper is closed. The wire bonding apparatus having such a structure effectively prevents the wire from falling out and bending.
    Type: Application
    Filed: July 7, 2011
    Publication date: November 17, 2011
    Applicant: SHINKAWA LTD.
    Inventors: Shinsuke Tei, Toshihiko Toyama
  • Publication number: 20110278063
    Abstract: Copper (Cu)-to-Cu bonding techniques are provided. In one aspect, a bonding method is provided. The method includes the following steps. A first bonding structure is provided having at least one copper pad embedded in a first insulator and at least one via in the first insulator over the copper pad, wherein the via has tapered sidewalls. A second bonding structure is provided having at least one copper stud embedded in a second insulator, wherein a portion of the copper stud is exposed for bonding and has a domed shape. The first bonding structure is bonded to the second bonding structure by way of a copper-to-copper bonding between the copper pad and the copper stud, wherein the via and the copper stud fit together like a lock-and-key. A bonded structure is also provided.
    Type: Application
    Filed: May 14, 2010
    Publication date: November 17, 2011
    Applicant: International Business Machines Corporation
    Inventors: Kuan-Neng Chen, Fei Liu
  • Patent number: 8042723
    Abstract: Provided is a method of repair which method is capable of holding a molten brazing material at the bonding portion when a component is bonded with a brazing material to an inclined or to a curved surface. The method of repair repairs by brazing a repair portion in which a crack has developed and which needs repair, wherein a brazing material support (4) holding in the interior thereof a molten brazing material (5) is brought into contact with the repair portion, and under the condition that the brazing material support (4) is in contact with the repair portion, the molten brazing material (5) is solidified. Under the condition that the brazing material (5) in a powder form is brought into contact with the brazing material support (4), the brazing material (5) can be melted by heating to a temperature at or above the melting point of the brazing material (5).
    Type: Grant
    Filed: October 6, 2008
    Date of Patent: October 25, 2011
    Assignee: Mitsubishi Heavy Industries, Ltd
    Inventor: Shuji Holi
  • Publication number: 20110156445
    Abstract: A motor vehicle is provided that includes, but is not limited to a structural car body column with a structural component. The structural component is realized in the form of a closed hollow profile and features at least one recess. The structural component is connected to at least one region of the car body of the motor vehicle that adjoins the structural car body column by means of at least one welding seam. The at least one welding seam is arranged on the opposite side of the structural component referred to the at least one recess.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 30, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Klaus LABBE, Juergen HULBERT
  • Publication number: 20110096507
    Abstract: An improved thermal interface between an integrated circuit chip and a heat sink comprises a copper grid embedded in a layer of a solder material that has a fusion temperature higher than the maximum operating temperature of the semiconductor chip, and bonds to the semiconductor chip and the heat sink when heated to the fusion temperature of the solder material in the presence of a soldering flux. The copper grid has high thermal conductivity so that the amount of solder material needed for an efficient thermal interface is reduced and solder materials with less expensive components may be used. The copper grid also tends to mitigate local hot spots by enhancing lateral heat transfer, and inhibits solder spreading during formation of the thermal interface.
    Type: Application
    Filed: September 2, 2010
    Publication date: April 28, 2011
    Applicant: Kester, Inc.
    Inventor: Brian Deram
  • Patent number: 7905387
    Abstract: A method of manufacturing an expansion joint includes steps of: marking parts, which will form the expansion joint, on a piece of raw material, so that the original 360 degree shape of the expansion joint is equally divided by the parts, and cutting the marked parts from the raw material; welding the divided parts, so that opposing ends of the welded parts are separated from each other; bending the welded parts into the form of a cone using a bending roller, thereby welding and joining the opposing ends thereof; fixedly mounting the resultant structures on a press; shaping the mounted resultant structures into products using a mold having a desired shape and dimension; and butting a pair of the products against each other and welding the products in the outer radial direction.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: March 15, 2011
    Inventor: Yong Woo Kim
  • Publication number: 20110000952
    Abstract: A method for joining a tube and tube plate for use in a tube-and-shell heat exchanger is disclosed. The method enables a joint between the tube and tube plate that is substantially hermetic and substantially corrosion-resistant. The method comprises providing an anvil inside the tube, wherein the anvil supports the tube wall during a friction-stir welding process used to join the tube and tube plate. The anvil facilitates formation of a reliable weld region and enables faster friction-stir welding.
    Type: Application
    Filed: July 1, 2010
    Publication date: January 6, 2011
    Applicant: LOCKHEED MARTIN CORPORATION
    Inventors: Riki P. Takeshita, Randy J. Brown, Michael R. Eller, Duy N. Pham
  • Publication number: 20100291399
    Abstract: As a replacement for high-temperature solder having a solidus temperature of at least 250° C. for bonding a package and a lid of a functional part, a solder paste formed by mixing a Cu-based metal powder with a solidus temperature of at least 400° C. and an Sn-based solder powder is applied to a lid of a difficult to solder material which was previously subjected to plating having good solderability and heated to obtain a solder layer comprising the Cu-based metal powder, Cu6Sn5 intermetallic compounds, and lead-free solder on the plated surface. The intermetallic compounds are bonded to the difficult to solder material and the intermetallic compounds are connected to each other, so the solder layer functions as a high-temperature solder. The problem of poor solderability of high-temperature solders is avoided by the present invention.
    Type: Application
    Filed: September 3, 2007
    Publication date: November 18, 2010
    Inventors: Rikiya Kato, Mitsuo Zen
  • Patent number: 7814730
    Abstract: The invention relates to a welded profile for fitting a digger with a hoe bucket or loading shovel, such as a boom or stanchion, comprising upper and lower webs and sidewalls cooperating therewith, whereby the sidewalls are provided with upper and lower profile reinforced end regions which form the corner regions for the upper and lower webs arranged between the end regions.
    Type: Grant
    Filed: December 2, 2003
    Date of Patent: October 19, 2010
    Assignee: Bucyrus HEX GmbH
    Inventors: Armin Grobenstieg, Detlef Beckmann
  • Publication number: 20100246099
    Abstract: A solid electrolytic capacitor includes a capacitor element, an external conduction member and a fuse conductor. The capacitor element includes a porous sintered body made of valve metal, an anode wire projecting from the porous sintered body, and a dielectric layer and a solid electrolyte layer covering the porous sintered body. The fuse conductor electrically connects the external conduction member and one of the anode wire and the solid electrolyte layer to each other. The fuse conductor is made of a metal containing one of Au—Su-based alloy, Zn—Al-based alloy, Sn—Ag—Cu-based alloy, Sn—Cu—Ni—based alloy and Sn—Sb—based alloy.
    Type: Application
    Filed: March 17, 2010
    Publication date: September 30, 2010
    Applicant: ROHM CO., LTD.
    Inventors: Kentaro Naka, Takahiro Maeda
  • Publication number: 20100221117
    Abstract: A method of manufacturing a blade (20) for a turbomachine by superplastic forming and diffusion bonding a first layer (18), a second layer (16) and a membrane (2), the membrane (2) being disposed between the first and second layers (18, 16), the method comprising: applying a stop-off material in a first predetermined pattern between the first layer (18) and the membrane (2) so as to prevent a diffusion bond from forming between the first layer and the membrane across said first predetermined pattern; wherein the first pattern is applied such that it defines one or more first strips (12) and one or more first dots (15), the first strips and first dots being void of the stop-off material, and wherein the first strips are arranged in a span-wise direction, and the first dots are located between the first strips and the blade tip edge, the first dots (15) being offset from a longitudinal axis of the first strips (12) in a chord-wise direction; and applying the stop-off material in a second predetermined pattern b
    Type: Application
    Filed: February 3, 2010
    Publication date: September 2, 2010
    Applicant: ROLLS-ROYCE PLC
    Inventors: Phillip BRENNAND, Richard M. JONES
  • Publication number: 20100108122
    Abstract: A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.
    Type: Application
    Filed: November 4, 2008
    Publication date: May 6, 2010
    Inventors: Shawn Everson, Steven T. Croft, Whitfield G. Halstead, Jason S. Corneille
  • Publication number: 20100035021
    Abstract: A substrate includes a base material, a first solder part disposed on a surface of the base material and used for connection to an electronic component, and a second solder part disposed on the surface of the base material and made of the same solder as that of the first solder part. The top surface of the first solder part is made to be a flat surface, and the maximum height of the second solder part from the surface of the base material is lower than the height of the flat surface of the first solder part from the surface of the base material. Thus, a substrate for which the kind of solder can be determined easily and with certainty, a device provided with this substrate, a method of manufacturing the substrate, and a determining method are provided.
    Type: Application
    Filed: August 5, 2009
    Publication date: February 11, 2010
    Applicant: NEC Electronics Corporation
    Inventor: Chiho Ogihara
  • Patent number: 7617605
    Abstract: In a method for reducing “blow-out” of annular welds for attaching components in a fuel injector, a relief region is formed on radially-facing surfaces of the components. The relief region is adjacent to a press-fit region. The components are then pressed together, and a weld is made in the relief region. A sealed gap is thereby formed in the relief region between the weld and the press-fit region. The sealed gap provides for the expansion of trapped gases that could otherwise “blow out” the liquid weld bead.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: November 17, 2009
    Assignee: Continental Automotive Systems US, Inc.
    Inventors: James Paul Fochtman, Jack David Oliver
  • Publication number: 20090214890
    Abstract: A laminate aluminum block for forming an article includes a series of aluminum laminate plates to collectively form a tool body for forming an article in a forming operation. A series of aluminum brazing layers are formed for brazing together adjacent aluminum laminate plates. The series of aluminum laminate plates and the series of aluminum brazing layers are deoxidized. Draining apertures are formed through a plurality of the series of aluminum laminate plates. The series of aluminum laminate plates are stacked alternating with the aluminum brazing layers between adjacent aluminum laminate plates without a flux. The stacked series of alternating aluminum plates and aluminum brazing layers are pressed. The stacked series of alternating aluminum plates and aluminum brazing layers are heated in a vacuum furnace to a temperature wherein the aluminum brazing layers braze the aluminum laminate plates together and excess braze material drains from the draining apertures.
    Type: Application
    Filed: February 26, 2009
    Publication date: August 27, 2009
    Applicant: FLOODCOOLING TECHNOLOGIES, LLC
    Inventors: Matthew T. Lowney, Michael Wasylenko, Anthony Nicholas Tanascu
  • Patent number: 7571531
    Abstract: A method of fabricating a spherical cavitation. Depending upon the chamber's composition and wall thickness, chambers fabricated with the disclosed techniques can be used with either low or high pressure systems. During chamber fabrication, initially two spherical half portions are fabricated and then the two half portions are joined together to form the desired cavitation chamber. During the fabrication of each chamber half, the interior spherical surface is completed first and then the outer spherical surface. Prior to joining the two spherical cavitation chamber halves, the surfaces to be mated are finished, preferably to a surface flatness of at least 0.01 inches. Electron beam welding is used to join the chamber halves together. Preferably the electron beam welding operation is performed under vacuum conditions. During electron beam welding, the two chamber halves are aligned and held together while the electron beam forms a weld along the chamber seam.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: August 11, 2009
    Assignee: Impulse Devices, Inc.
    Inventor: Ross Alan Tessien
  • Publication number: 20090186238
    Abstract: A method of processing a brazed article includes forming a braze joint with an aluminum component comprising a nano-grained aluminum alloy.
    Type: Application
    Filed: January 23, 2008
    Publication date: July 23, 2009
    Inventor: Clifford C. Bampton
  • Publication number: 20090137082
    Abstract: A manufacturing method for manufacturing an electronic device includes a first electronic component and a second electronic component; and a bond part for the first electronic component joined to another bond part for the second electronic component. In a first process of this manufacturing method, the metallic bond part for the first electronic component is placed directly against the metallic bond part for the second electronic component, pressure is applied to the first electronic component and the second electronic component and, after metallically joining the above two bond parts, the pressure applied to the first electronic component and the second electronic component is released. In a second process in the manufacturing method, a clamping member affixes the relative positions of the joined first electronic component and second electronic component, and heats the first electronic component and the second electronic component to maintain a specified temperature.
    Type: Application
    Filed: November 18, 2008
    Publication date: May 28, 2009
    Applicant: NEC Electronics Corporation
    Inventor: Yoichiro Kurita
  • Patent number: 7419082
    Abstract: A friction welding process providing a workpiece having a weld surface, and a second workpiece having a weld surface. The workpieces being welded together at respective weld surfaces. Oscillatory motion is affected to the workpieces such that one weld surface moves across the other, thereby raising the temperature at the weld surfaces to create a weld interface. The oscillatory motion is ceased and the weld surfaces cool to weld the workpieces together at the interface. The workpiece has an extending portion, and the weld surface is provided on the extending portion. The extending portion includes an apex region, which engages the second workpiece's weld surface. A side face extends from the apex region to provide a gap between the side face and the second workpiece's weld surface. The gap allows weld flash material to pass from the weld interface through said gap.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: September 2, 2008
    Assignee: Rolls-Royce plc
    Inventors: John B Brownell, Jonathan P Throssell, Simon E Bray
  • Patent number: 7368035
    Abstract: An improved method for joining together the edge portions of first and second panels includes applying a heat curable adhesive along the edge portion of the first panel and then abutting the edge portion of the second panel with the edge portion of the first panel so that the adhesive is interposed between the edge portions of the first and second panels and the adhesive spaces the panels apart and provides a gap between the panels. A brazing material is melted and fills the gap and the heating of the panels by the brazing causes at least partial curing of the adhesive so that the panels are joined together by both brazing and adhesive bonding.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: May 6, 2008
    Assignee: GM Global Technology Operations, Inc.
    Inventors: Pei-Chung Wang, John D. Fickes, Anthony V. Minatel, Dean T. Quaderer
  • Publication number: 20080041922
    Abstract: A hybrid resistance heating/ultrasonic welding method is used to join substrates. The resistance heating sufficiently softens or melts the substrates at an interface, and an ultrasonic wave is used solid state bond the substrates at the interface. The hybrid method can be used for both spot welding as well as continuous welding.
    Type: Application
    Filed: July 13, 2006
    Publication date: February 21, 2008
    Inventors: Mariana G Forrest, Feng Lu, Stephen D. Logan
  • Patent number: 6976309
    Abstract: An underbody for a vehicle includes a floorpan defining a part of an assembly, a rocker slidably engaged with the floorpan, and a rail slidably engaged with the floorpan. The assembly is formed as a unit about a first and a second bend axis.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: December 20, 2005
    Assignee: General Motors Corporation
    Inventors: Robert R. Mayer, Anil K. Sachdev
  • Patent number: 6956187
    Abstract: A steel plate splicing facility includes, a steel plate heating apparatus for retrieving and heating a preceding steel plate and a following steel plate, and a shear-joining apparatus for clamping a tail end portion of the preceding steel plate and a leading end portion of the following steel plate in an overlapping condition by a die and a clamp and shearing them with a punch, such that surfaces of the tail end portion and the leading end portion are newly formed and brought in contact with each other in order to them. The shear-joining apparatus joins the preceding and following steel plates at a temperature equal to or higher than 350° C. and at a percentage clearance c/t equal to or lower than 5%, c/t being defined by c/t=D/(t1+t2)×100 where D represents a distance between the punch and the die, and t1 and t2 represent a thickness of respective steel plates.
    Type: Grant
    Filed: June 18, 2003
    Date of Patent: October 18, 2005
    Assignees: Mitsubishi Heavy Industries, Ltd., Mitsubishi-Hitachi Metals Machinery, Inc.
    Inventors: Tsutomu Kawamizu, Ritsuo Hashimoto, Etsurou Hirai, Shoichi Hashimoto, Kanji Hayashi
  • Patent number: 6955287
    Abstract: An upper shearing blade equipped with a protrusion of a triangle-columnar shape and a lower shearing blade equipped with a protrusion of the same shape are applied onto the overlapped portion of metal plates to be bonded, and then pressed into the metal plates in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates are not completely cut off. The operating loci of the upper, shearing blade and the lower shearing blade are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: October 18, 2005
    Assignees: Hitachi, Ltd., Pohang Iron and Steel Co., Ltd., Research Institution of Industrial Science and Technology
    Inventors: Kenji Horii, Yasutsugu Yoshimura, Tadashi Nishino, Takashi Kamoshita, Takayoshi Tomino, Fuminori Ishikawa, Takao Funamoto, Takashi Mashiko, Kenjiro Narita, Jong-Keun Kim, Ki-Chol Kim, Jong-Sub Lee, Hwang-Kyu Hwang, Jung-Sik Lee, Jin-Hee Kim
  • Patent number: 6948649
    Abstract: The high yield ratio problem intrinsic in high-strength steel pipes is solved and a method of producing a steel pipe, while securing the pipe roundness is provided. A steel pipe produced from a steel plate by forming and welding is subjected to 0.3 to 1.2% of expansion and then to 0.1 to 1.0% of reduction. The steel pipe produced by this method has a structure in which martensite and/or bainite accounts for more than 80% as expressed in terms of area percentage, and has a yield strength of not lower than 551 MPa and a yield ratio of not higher than 93%. The pipe reduction is desirably carried out at a lower work ratio as compared with the pipe expansion.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: September 27, 2005
    Assignee: Sumitomo Metal Industries, Ltd.
    Inventors: Nobuaki Takahashi, Akio Yamamoto, Tomoaki Ikeda, Tetsuya Fukuba
  • Patent number: 6911632
    Abstract: A method for controlling the edges (7, 7?) of a foil strip guided in a shaping funnel of a device producing tubular bodies from the foil strip by an overlapping weld seam using a guide wedge, the strip being then welded. According to the invention, after welding, the method consists in using a linear infrared sensor for measuring and evaluating a temperature profile perpendicular to the overlapping weld seam. In case of variation relative to the specific real profile, a signal is automatically transmitted to rotate the shaping funnel with the guide wedge, the welding being produced by the high frequency (HF) and the temperature profile being measured directly after welding.
    Type: Grant
    Filed: September 9, 2002
    Date of Patent: June 28, 2005
    Assignee: Aisapack Holding SA
    Inventor: Gerhard Keller
  • Patent number: 6880742
    Abstract: Shown is a device and a process for the simultaneous separating and welding of foils or foil tubes (5) where the device comprises at least one welding terminal (2) and an opposing terminal (3), and at least a part of the surface of the opposing terminal (3) turned toward the welding terminal (2) is equipped with a flexible absorbing body (4). It is inventive that the surface of the absorbing body (6) turned toward the welding terminal consists of metal.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: April 19, 2005
    Assignee: Windmoeller & Hoelscher KG
    Inventors: Hans-Ludwig Voss, Friedrich Goecker
  • Patent number: 6837419
    Abstract: An annular recuperator for use with an annular combustor. The annular recuperator includes a frame and an enclosure provided about its frame that defines a recuperator chamber. A plurality of involute shaped sealed and open recuperators are received in the recuperator chamber.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: January 4, 2005
    Assignee: Elliott Energy Systems, Inc.
    Inventor: William R. Ryan
  • Publication number: 20040256442
    Abstract: A coated cutting tool that comprises a body containing a pocket. The tool further includes a polycrystalline cubic boron nitride blank that is brazed into the pocket using a braze alloy. The braze alloy has a liquidus temperature of at least about 900 degrees Centigrade. There is a coating applied to the cutting tool.
    Type: Application
    Filed: June 17, 2003
    Publication date: December 23, 2004
    Applicant: Kennametal Inc.
    Inventors: Alfred S. Gates, Edward J. Oles, Kent L. Reiner, William M. Alexander, Jean-Pierre Genain
  • Publication number: 20040159545
    Abstract: The present invention relates to an improvement in the manufacture of metal blanks, discs, and sputtering targets by flattening only one of the two surfaces of a metal plate. The elimination of flattening the metal plate's second surface results in a significant cost reduction. The metal plate of the present invention preferably has a single-side flatness of 0.005 inches or less, which improves the reliability of the bond between the target blank and a backing plate. Preferred metals include, but are not limited to, tantalum, niobium, titanium, and alloys thereof. The present invention also relates to machining the first side of a metal plate, bonding the first side to a backing plate, and then optionally machining the second side of the metal plate.
    Type: Application
    Filed: February 13, 2003
    Publication date: August 19, 2004
    Inventor: Christopher A. Michaluk
  • Patent number: 6704981
    Abstract: A method of forming sheets of superplastically formable material into a three dimensional article, the sheets being joined together along diffusion bonds to form discrete cells, at least one gas path being provided through the bond between cells. The sheets are heated to a temperature at which they exhibit superplastic properties and a gas injected between the sheets to expand the cells, the gas paths allowing the injected gas to pass from cell to cell. The edges of the gas paths are locally heated to change the microstructure of the sheets in the edge areas, which reduces the flow resistance of the edges under superplastic forming conditions and thereby reduces the propensity of the diffusion bonds bordering the gas transfer holes to peel apart under the forces of the inert gas exerted on the sheets at the gas transfer paths.
    Type: Grant
    Filed: September 9, 2002
    Date of Patent: March 16, 2004
    Assignee: BAE Systems plc
    Inventors: George Strickland, Adam B Marriott